JPH0635200A - Photosensitive transfer sheet and forming method for resist pattern - Google Patents

Abstract

PURPOSE:To obtain a photosensitive transfer sheet having a photosensitive resin layer and a temporary supporting body which is free from deposition of dust or the like on the photosensitive resin layer when the temporary supporting body is peeled from a laminated body consisting of the photosensitive transfer sheet and a supporting body to which the photosensitive resin layer is to be transferred. CONSTITUTION:This photosensitive transfer sheet consists of a synthetic resin temporary supporting body 2, a barrier-type peeling layer 3 or a peeling layer and barrier layer, and an alkali-developing photosensitive resin layer 4 in this order laminated on the supporting body 2. The temporary supporting body 2 has <=10<13>OMEGA/square surface electric resistance. A resist pattern is formed by using this photosensitive transfer sheet 1 and transferring the photosensitive resin layer 4 on a supporting body.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is mainly used in semiconductor integrated circuits, photomasks, liquid crystal displays, plasma displays and other transparent electrodes (ITO) and wiring, and alkali development type used for patterning wiring of printed wiring boards. And a method for forming a resist pattern using this photosensitive transfer sheet. INDUSTRIAL APPLICABILITY The photosensitive transfer sheet and the pattern forming method of the present invention are particularly useful for forming an etching resist for producing a transistor circuit, a transparent electrode film (ITO film or the like) in the field of electronic materials.

[0002]

2. Description of the Related Art Conventionally, semiconductor integrated circuits, photomasks,
In the field of manufacturing electronic materials such as liquid crystal displays, plasma displays and printed wiring boards, ITO is used for patterning transparent electrodes (ITO) and wiring.
A method has been adopted in which a photosensitive resin (photoresist) layer is formed by coating on a substrate provided with a film or a metal film, the resist is patterned by a photolithography method, and then the ITO film or the metal film is etched.

In this method, the coating of the photosensitive resin layer forming liquid on the substrate is generally carried out by a spin coating method, but most of the photosensitive resin layer forming liquid is shaken off during the spin coating. The amount of the photosensitive resin layer forming liquid actually coated on the substrate is several wt% of the total amount of the supplying forming liquid.
Nothing more than. As a result, the expensive photosensitive resin layer forming liquid is almost wasted, which is a big problem in terms of cost.

In order to solve the above problems, a photosensitive transfer sheet having a release layer and a photosensitive resin layer provided on a temporary support is used, and the substrate and the photosensitive resin layer are bonded together to form a transfer sheet. A method of forming a laminate with a substrate and peeling a temporary support from the laminate to transfer and form a photosensitive resin layer on the substrate is disclosed in JP-A-46-2121 and JP-B-4.
6-1011, Japanese Patent Publication No. 56-40824, and the like.

However, the methods using these photosensitive transfer sheets also have the following problems. That is, after the substrate and the photosensitive resin layer are bonded together, when the temporary support is peeled off, the substrate on which the temporary support and the photosensitive resin layer are bonded is peeled and charged, and dust and the like existing in the surrounding It is attracted and adheres to the transferred photosensitive resin layer.
If the photosensitive resin layer is exposed to light and developed while dust is still attached, defects such as pinholes are generated in the formed resist pattern, resulting in deterioration of product yield. Also,
When the temporary support is peeled off with a finger, the human body may be electrically charged and receive an unpleasant electric shock.

Further, when a substrate (underlayer) having microscopic unevenness (about ± 0.5 μm) is used as in the case of forming a semiconductor circuit, when the photosensitive resin layer is transferred onto the substrate, Bubbles remaining due to the unevenness are generated between the substrate and the photosensitive resin layer, and the residual bubbles cause a missing resist pattern. Further, when exposure is performed through the peeling layer, if the thickness of the peeling layer is large, light scattering occurs in the peeling layer, so-called baking blur occurs, and sufficient resist resolution is not obtained.

[0007]

An object of the present invention is to peel a temporary support from a laminate obtained by laminating a photosensitive transfer sheet having a photosensitive resin layer and a support to which the photosensitive resin layer is to be transferred. An object of the present invention is to provide a photosensitive transfer sheet in which dust or the like does not adhere to the photosensitive resin layer when the sheet is processed. Another object of the present invention is to provide a photosensitive transfer sheet which does not leave bubbles between the support and the photosensitive resin layer even when the photosensitive resin layer is transferred to the support having a surface having irregularities. To provide. Still another object of the present invention is to provide a photosensitive transfer sheet capable of forming a resist pattern with high resolution. Still another object of the present invention is to provide a method for forming a resist pattern of excellent quality using such a photosensitive transfer sheet.

[0008]

According to the present invention, a barrier release layer or a release layer and a barrier layer, and an alkali development type photosensitive resin layer are laminated in this order on a temporary support made of synthetic resin. In the photosensitive transfer sheet, the temporary support has a surface electric resistance value of 10 ¹³ Ω / □ or less.

According to another aspect of the present invention, the above-mentioned photosensitive transfer sheet of the present invention is laminated on the surface of the photosensitive resin layer on a support to which the photosensitive resin layer is to be transferred under heating to form a laminate. A step of removing the temporary support by peeling from the laminate, a step of removing the barrier release layer or the release layer and the barrier layer from the laminate if desired, exposing through a photomask having a predetermined pattern And a step of forming a latent image on the photosensitive resin layer, and a step of developing the photosensitive resin layer to form a resist pattern on the support, thereby forming a resist pattern.

The preferred embodiments of the present invention are as follows.

(1) The photosensitive resin layer is a positive photosensitive resin layer containing an alkali-soluble resin and a quinonediazide compound, or a positive photosensitive resin layer containing an alkali-soluble resin, a silyl ether and a photoacid-generating compound. The above-mentioned photosensitive transfer sheet characterized by being present.

(2) The temporary support is formed of a synthetic resin containing a material having conductivity, or is a temporary support having a surface layer formed of a material having conductivity. The photosensitive transfer sheet as described above.

(3) The above-mentioned photosensitive transfer sheet, wherein the barrier release layer or release layer has a softening point in the range of 10 to 80 ° C.

(4) The above-mentioned photosensitive transfer sheet, characterized in that any one of the barrier release layer, the release layer and the barrier layer contains a photo-bleaching compound.

(5) The above-mentioned photosensitive transfer sheet, characterized in that a protective layer is laminated on the above-mentioned photosensitive resin layer.

(6) The adhesion between the release layer and the barrier layer is
The above-mentioned photosensitive transfer sheet, which is smaller than the adhesive force between the barrier layer and the photosensitive resin layer.

The photosensitive transfer sheet of the present invention will be described in detail with reference to the accompanying drawings. The photosensitive transfer sheet of the present invention has a constitution in which a barrier release layer or a release layer and a barrier layer, and an alkali development type photosensitive resin layer are laminated in this order on a temporary support made of synthetic resin. However, the adhesive force between the temporary support and the barrier release layer or the release layer is smaller than the adhesive force between the other layers, and the temporary support has 10 ¹³ Ω /
□ It is characterized by having the following surface electric resistance value.

In the photosensitive transfer sheet of the present invention, the synthetic resin temporary support is 10 ¹³ Ω / □ or less, preferably 10 ¹³ Ω / □ or less.
^{It has} a surface electric resistance value of ¹² Ω / □ or less, and such a temporary support is a temporary support formed of a synthetic resin containing a material having conductivity, and the conductivity is provided only in the vicinity of the surface. A temporary support containing a material having 10 ¹³
Any of a temporary support having a surface electrical resistance value larger than Ω / □, in which a conductive layer is laminated on at least one surface of a temporary support body, a temporary support in which these configurations are combined, and the like. It may be one.

FIG. 1 is a sectional view schematically showing a section of one embodiment of the photosensitive transfer sheet of the present invention. In FIG. 1, the photosensitive transfer sheet 1 comprises a temporary support 2 having a barrier release layer 3 laminated on one side thereof, a photosensitive resin layer 4 laminated thereon, and a protective layer 5 further laminated thereon. Is configured.

The temporary support 2 is formed of a synthetic resin containing a material having conductivity and has a surface electric resistance value of 10 ¹³ Ω / □ or less. As the synthetic resin for forming the temporary support 2, a chemically and thermally stable synthetic resin, which is conventionally used as a temporary support material for a photosensitive transfer sheet, preferably a thermoplastic resin can be used. Polyethylene terephthalate, which is particularly preferable
Polycarbonate or the like.

The conductive material to be contained in the temporary support 2 is not particularly limited and may be a known material per se, but particularly preferable are fine particles of a conductive metal oxide and an antistatic agent. is there. The fine particles of the conductive metal oxide and the antistatic agent may each be a single component or a mixture. Further, fine particles of a conductive metal oxide and an antistatic agent may be used in combination.

Preferable examples of the conductive metal oxide are at least one selected from zinc oxide, titanium oxide, tin oxide, aluminum oxide, indium oxide, silicon oxide, magnesium oxide, barium oxide, molybdenum oxide and the like. Examples thereof include fine particles mainly composed of a crystalline metal oxide and / or a composite oxide thereof. The fine particles of the conductive metal oxide are 10 ⁷ Ω · cm or less, especially 10 ⁵ Ω · cm or less.
It is preferable to have a volume resistance value of Ω · cm or less, and the particle size thereof is 0.01 to 0.7 μm.
m, particularly preferably 0.02 to 0.5 μm.

A method for producing fine particles of a conductive metal oxide is described in detail, for example, in JP-A-56-143430. The following is a brief description of them.
To heat-treat the metal oxide fine particles in the presence of heteroatoms for improving conductivity, and secondly to add the heteroatoms for improving conductivity when producing the metal oxide fine particles by baking. There are a method of coexistence, a third method of introducing oxygen defects by lowering the oxygen concentration in the atmosphere when producing the metal fine particles by firing.

Examples of the heteroatoms contained in the conductive metal oxide include, for example, ZnO, Al, In, etc. and Ti.
Nb, Ta, etc. for O ₂ and S for SnO ₂ .
b, Nb, a halogen element, etc. are mentioned. The addition amount of the heteroatom is preferably in the range of 0.01 to 30 mol%,
The range of 10 mol% is particularly preferable.

Preferable examples of the above antistatic agent include alkyl phosphate-based anionic surfactants (for example, Electrostripper A manufactured by Kao Co., Ltd., Elenone No. 19 manufactured by Dai-ichi Kogyo Seiyaku Co., Ltd.) and the like. Betaine-based agents (for example, Amogen K manufactured by Dai-ichi Kogyo Seiyaku Co., Ltd.) and polyoxyethylene fatty acid ester-based agents as nonionic surfactants (for example, Nitsusan Nonion L manufactured by NOF CORPORATION). , Polyoxyethylene alkyl ether type (for example, Emulgen 106, 1 of Kao Corporation)
20, 147, 420, 220, 905, 910, Nitsusan Nonion E manufactured by NOF CORPORATION, etc.). In addition, polyoxyethylene alkylphenol ether-based surfactants, polyhydric alcohol fatty acid ester-based surfactants, polyoxyethylene sorbitan fatty acid ester-based surfactants, polyoxyethylene alkylamine-based surfactants, and the like are also useful as nonionic surfactants.

The thickness of the temporary support 2 is preferably in the range of 5 μm to 300 μm, particularly preferably 20 μm.
It is within the range of 150 μm. If the thickness of the temporary support 2 is smaller than the above range, wrinkles are likely to occur when the photosensitive transfer sheet is attached to the support to be transferred, and if the thickness is larger than the above range, It is easy to generate dust during sheet cutting. Further, various known release treatments may be performed on the temporary support 2 from the viewpoint of releasability. Further, in order to improve the slipperiness or prevent the inconvenient adhesion of the photosensitive resin layer to the back surface of the temporary support, a known fine particle-containing slip composition or a silicone compound is applied to the back surface of the temporary support. It is also useful to apply the release agent composition or the like contained therein.

FIG. 2 is a sectional view schematically showing a section of another embodiment of the photosensitive transfer sheet of the present invention. In FIG. 2, the photosensitive transfer sheet 11 includes a temporary support body 12 composed of a temporary support body 12a and a conductive layer 12b provided on one surface thereof, and the temporary support body 12 is provided with the conductive layer 12b. The barrier release layer 13 is laminated on the surface not covered, the photosensitive resin layer 14 is laminated thereon, and the protective layer 1 is further formed thereon.
5 are laminated and configured.

The temporary support body 12a is formed of a chemically and thermally stable synthetic resin (particularly preferably polyethylene terephthalate, polycarbonate or the like) which is conventionally used as a temporary support material for a photosensitive transfer sheet. It is a sheet-shaped support. There is no particular need to consider the surface electric resistance value of the temporary support body 12a, 10 ¹³ Ω / □
It may be the above or smaller.

The conductive layer 12b is a layer containing a conductive material and a binder or polymer. The material having conductivity is not particularly limited, but fine particles of conductive metal oxide that can be contained in the temporary support 2 are particularly preferable.

The content of the fine particles of the conductive metal oxide in the conductive layer 12b is such that the temporary support body 12a and the conductive layer 12 are fine.
The surface electric resistance value of the temporary support 12 including b is 10 ¹³
Ω / □ or less, conductive metal oxide,
The binder or polymer, the electrical resistance value of the temporary support body, etc., the thickness of the conductive layer 12b and the temporary support body 12a, etc., but generally 0.05 g / m ^{2 to 20} g / m ^2.
2 is preferable, and 0.1 g / m ^{2 to} 10 g / m
Especially preferred is ² .

As the binder to be contained in the conductive layer 12b, for example, gelatin, cellulose nitrate,
Cellulose triacetate, cellulose diacetate,
Cellulose esters such as cellulose acetate butyrate, cellulose acetate propionate, etc .; including vinylidene chloride, vinyl chloride, styrene, acrylonitrile, vinyl acetate, alkyl (preferably alkyl groups having 1 to 4 carbon atoms) acrylate, vinylpyrrolidone, etc. Homopolymers or copolymers of monomers; soluble polyesters, polycarbonates, soluble polyamides and the like can be used.

As the polymer to be contained in the conductive layer 12b, a thermoplastic resin which can be used as a material of the temporary support body 12a, the above-mentioned binder, and a polymer arbitrarily selected from the other thermoplastic resins are used. be able to.

The conductive layer 12b is formed, for example, by applying a conductive layer forming coating liquid in which conductive fine particles are dispersed in a binder in a solvent, if necessary, on the surface of the temporary support body 12a, for example, by using a roller. A method of coating by a method such as a coat, an air knife coat, a gravure coat, a bar coat and a curtain coat and then drying, and an undercoat layer as described below is provided on the surface of the temporary support body 12a, and conductive fine particles are formed thereon. The conductive layer 12b is formed on the temporary support body 12a by co-extruding the deposition method, the composition of the conductive fine particles and the polymer during extrusion molding of the temporary support body 12a.
Can be performed by a method such as a method of providing. Particularly, according to the method of providing the conductive layer 12b by co-extrusion, the conductive layer 12b having excellent adhesiveness and scratch resistance can be formed, and it is not necessary to provide a hydrophobic polymer layer as described later. preferable.

When the conductive particles are dispersed in the binder to prepare the coating liquid for forming the conductive layer, a dispersant such as a titanium-based dispersant or a silane-based dispersant may be added to the coating liquid. Good. Moreover, you may add a binder crosslinking agent etc. as needed.

As the titanium-based dispersant, US Pat.
No. 069,192, No. 4,080,353, etc., titanate coupling agents,
And Plane Act (trade name: manufactured by Ajinomoto Co., Inc.) and the like. Examples of the silane-based dispersant include vinyltrichlorosilane, vinyltriethoxysilane, vinyltris (β-methoxyethoxy) silane, and γ.
-Glycidoxypropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane and the like can be mentioned, and those commercially available from Shin-Etsu Chemical Co., Ltd. as "silane coupling agents" can also be used. .

Examples of the binder crosslinking agent include epoxy type crosslinking agents, isocyanate type crosslinking agents, aziridine type crosslinking agents, epoxy type crosslinking agents and the like.

As shown in FIG. 2, when the conductive layer 12b is provided on the surface of the temporary support body 12a opposite to the surface on which the barrier release layer 13 is provided, good scratch resistance is obtained. For this purpose, it is preferable to further provide a hydrophobic polymer layer (not shown) on the conductive layer 12b. In this case, the hydrophobic polymer layer can be formed by applying a solution of the hydrophobic polymer in an organic solvent or an aqueous latex and then drying. The coating amount of this hydrophobic polymer is preferably about 0.05 g / m ² to ¹ g / m ² as a dry weight.

Examples of the hydrophobic polymer include vinyl polymers produced from monomers including cellulose ester (eg, nitrocellulose, cellulose acetate), vinyl chloride, vinylidene chloride, vinyl acrylate, organic solvent-soluble polyamide, polyester and the like. Mention may be made of polymers.

It is permissible to add a slipping agent for imparting a slip property, such as an organic carboxylic acid amide described in JP-A-55-79435, to the hydrophobic polymer layer. There is no problem in adding a matting agent or the like. Even if such a hydrophobic polymer layer is provided, the function and effect of the conductive layer 12b are not substantially affected.

When an undercoat layer is provided, it is disclosed in JP-A-51-1.
35526, U.S. Pat. Nos. 3,143,421, 3,586,508, and 2,69.
No. 8,235, 3,567,452 and the like, vinylidene chloride copolymers,
JP-A-51-114120, US Pat. No. 3,61
Diolein-based copolymers such as butadiene as described in Japanese Patent No. 5,556, JP-A-51-5846
Glycidyl acrylate- or glycidyl methacrylate-containing copolymers as described in JP-A-9-
Polyamide / epichlorohydrin resins as described in JP-A-48-24923, JP-A-50-
A maleic anhydride-containing copolymer as described in Japanese Patent No. 39536 can be used.

In the photosensitive transfer sheet of the present invention, there are also disclosed in JP-A-56-82504 and JP-A-56-14.
3443, JP-A-57-104931, JP-A-57-118242, JP-A-58-6264.
A temporary support provided with a conductive layer, as disclosed in JP-A No. 7 and JP-A No. 60-258541, can be appropriately used.

Thickness of the temporary support 12 (main body 12a of the temporary support)
And the total thickness of the conductive layer 12b) is 5 μm to 300 μm.
Is preferably in the range of 20 μm, and particularly preferably 20 μm.
It is within the range of m to 150 μm. If the thickness of the temporary support 12 is smaller than the above range, wrinkles are likely to occur when the photosensitive transfer sheet is attached to the support to be transferred, and if the thickness is larger than the above range, It is easy to generate dust during sheet cutting. When the temporary support 12 is composed of the temporary support body 12a and the conductive layer 12b, the thickness of the conductive layer 12b is 0.01 to.
The thickness is preferably 10 μm.

The conductive layer 12b is used as the temporary support body 1
It may be provided on the surface of 2a on which the barrier release layer 13 is provided, or on both surfaces of the temporary support body 12a.

The barrier release layer 3 in FIG. 1 is included in the photosensitive resin layer forming coating liquid when the photosensitive resin layer 4 is formed by coating in the production of the photosensitive transfer sheet 1. It has a function of protecting the temporary support 2 and / or the barrier release layer 3 itself against a component such as a solvent and facilitating the release of the temporary support 2 when forming a resist pattern. Further, the barrier release layer 3 has a property that it can be easily removed from the photosensitive resin layer 4 before exposure with water or an alkaline aqueous solution at the time of forming a resist pattern, or can be easily removed at the time of developing the photosensitive resin layer 4. I have it. In the conventionally known photosensitive transfer sheet, a barrier release layer having the above-mentioned functions is known, and in the photosensitive transfer sheet of the present invention, the conventionally known barrier release layer is not particularly limited. It can be used without.

The material of the barrier release layer 3 is preferably a resin which dissolves or swells in water or an alkaline aqueous solution and has resistance to the solvent contained in the coating solution for forming the photosensitive resin layer. Alkali-soluble resins, alkali-swellable resins, or various water-soluble resins [eg,
Organic polymer compounds described in "Plastic Performance Handbook" (edited by Japan Plastics Industry Federation, All Japan Plastics Molding Federation, published by Industrial Research Board, issued October 25, 1968). it can.

Specific examples of the material of the barrier release layer 3 include JP-A-46-2121 and JP-B-56-4.
No. 0824, polyvinyl ether / maleic anhydride polymer, water-soluble salt of carboxyalkyl cellulose, water-soluble cellulose ethers, water-soluble salt of carboxyalkyl starch, polyvinyl alcohol, polyvinylpyrrolidone, various polyacrylamides, various Water-soluble polyamides, water-soluble salts of polyacrylic acid, gelatin, ethylene oxide polymers, water-soluble salts of various starches and their analogues, styrene / maleic acid copolymers, maleate resins and the like. These resins may be only one kind, or may be a combination of two or more kinds.

As described above, the photosensitive transfer sheet of the present invention is used for transferring a photosensitive resin layer to a support (sometimes referred to as a substrate) which forms a resist pattern. In order to transfer the photosensitive resin layer onto the surface of the support so that no bubbles remain between the layer and the surface of the support, it is important that the barrier release layer 3 has thermoplasticity. Particularly, the barrier release layer 3 of the photosensitive transfer sheet for transferring the photosensitive resin layer to a support having fine irregularities (for example, a step of a circuit) such as an intermediate product of a circuit board is 10 It preferably has a softening point in the range of -80 ° C. In order to form the barrier release layer 3 having such a softening point, the barrier release layer may be formed of a thermoplastic resin having a softening point of 10 to 80 ° C., or a thermoplastic resin having a high softening point. By adding various plasticizers compatible with this resin to the resin,
You may form with the resin which adjusted the substantial softening point in the said range. Specific examples of preferable plasticizers include polypropylene glycol, polyethylene glycol, dioctyl phthalate, diheptyl phthalate, dibutyl phthalate, tricresyl phosphate, cresyl diphenyl phosphate, biphenyl diphenyl phosphate, and glycerin derivatives. .

In order to facilitate the peeling of the temporary support 2 during the formation of the resist pattern, the adhesion between the temporary support 2 and the barrier release layer 3 is different from that of the barrier release layer 3 and the photosensitive resin layer 4. It must be less than the adhesion between the two. In order to adjust the adhesion between the temporary support 2 and the barrier release layer 3, various other polymers, adhesion improvers, surfactants, release agents, etc. are added to the barrier release layer 3. Good.

The barrier release layer 3 is formed by, for example, applying the barrier release layer forming coating solution obtained by dissolving the components constituting the barrier release layer 3 described above in a solvent to the surface of the temporary support 2. For example, it can be carried out by a method of applying it on the surface by a method such as roller coating, air knife coating, gravure coating, bar coating, curtain coating, and then drying.

The thickness of the barrier release layer 3 is preferably adjusted appropriately according to the surface shape of the support on which the resist pattern is formed. In the photosensitive transfer sheet 1 for transferring the photosensitive resin layer 4 to the support having fine irregularities on the surface, the barrier release layer 3 has a thickness of 2 μm to
The thickness is preferably 50 μm, and when a support having excellent surface smoothness is to be transferred, the barrier release layer 3 may have a thickness smaller than 2 μm.

Further, in order to improve the resolution of the resist pattern formed by using the photosensitive transfer sheet 1, a photo-bleaching compound may be added to the barrier release layer 3.
The barrier release layer containing the photo-bleaching compound also acts as a so-called contrast enhancing layer, resulting in an increase in the resolution of the resist. Known compounds described in JP-A-49-88466 can be used as the photo-decolorizable compound. Specific photo-bleaching compounds include:
Examples thereof include nitrone dye, diazonium salt and stilbazolium salt.

The photosensitive resin layer 4 may be a positive type photosensitive resin layer or a negative type photosensitive resin layer, but a positive type photosensitive resin layer containing an alkali-soluble resin and a quinonediazide compound, or an alkali type It is preferably a positive photosensitive resin layer containing a soluble resin, a silyl ether and a photoacid-generating compound.

The alkali-soluble resin used in the photosensitive resin layer 4 is preferably an alkali-soluble resin having a melting point of 50 ° C. to 100 ° C., and specific examples thereof include
Novolak resins commonly used for positive photoresists such as phenol novolac resins, co-condensed novolac resins of phenol and cresol, co-condensed novolac resins of cresol and xylenol, and condensation of phenols and formaldehyde using metal oxides as catalysts. Among the so-called high ortho type novolac resins and the like obtained in this manner, those having a melting point of 50 ° C. to 100 ° C. can be mentioned. Further, a part of the alkali-soluble resin may be replaced with a resol-type phenol resin, pyrogallol-acetone resin, or the like within a composition range showing a melting point in the above range. A condensate of formaldehyde and phenol or cresol substituted with an alkyl group having a prime number of 3 to 8 such as t-butylphenol-formaldehyde resin may be used in combination with the above novolak resin. Further, carboxyl group-containing polyacrylate, polymethacrylate, polyester, polyurethane, polyamide and the like can be used in combination. The melting point of the alkali-soluble resin is 50 ° C
When it is below, the photosensitive resin layer 4 is slightly sticky at room temperature, and foreign matter is easily attached to the surface of the photosensitive resin layer 4,
There is a possibility that transfer failure may occur. Further, when the melting point of the alkali-soluble resin is 100 ° C. or higher, the photosensitive resin layer 4 is less likely to be softened at the time of transfer and the adhesiveness to the support to be transferred tends to be poor.

The above quinonediazide compounds include
2,4-Dihydroxybenzophenone ο-naphthoquinonediazide sulfonate, 2,3,4-Trihydroxybenzophenone ο-naphthoquinonediazide sulfonate, 2,3,4,4′-Tetrahydroxybenzophenone ο-naphthoquinonediazide Examples include quinonediazide compounds commonly used for positive photoresists such as sulfonates, quinonediazide esters of phenolic resins, quinonediazide esters of cumylphenol, quinonediazide esters of bisphenols, and quinonediazide esters of pyrogallol / acetone resins. .

Examples of the silyl ether compound include the silyl ether compounds described in JP-A No. 63-236028. The silyl ether compound is decomposed by the acid generated from the photo-acid generator to convert the alkali-insoluble resin into the alkali-soluble resin.

As the above-mentioned photo-acid generator, JP-A-63-
Known compounds described in JP-A-236028 can be mentioned. Specific examples include trihalomethyltriazine compounds, trihalomethyloxadiazole compounds, iodonium salts, sulfonium salts, disulfone derivatives, and imidosulfonate derivatives.

Various kinds of conventionally used surfactants, adhesion improvers, sensitizers, dyes, etc. can be added to the photosensitive resin layer 4.

The photosensitive resin layer 4 is formed by, for example, applying the photosensitive resin layer-forming coating liquid prepared by dissolving the above-mentioned components constituting the photosensitive resin layer 4 in a solvent to the barrier release layer 3.
It can be carried out by, for example, a method of coating on the surface of the above by a method such as roller coating, air knife coating, gravure coating, bar coating, curtain coating, and then drying.

A protective layer 5 is provided on the photosensitive resin layer 4 to protect the photosensitive resin layer 4 from contamination and damage when the photosensitive transfer sheet 1 is stored. The protective layer 5 may be made of the same or similar material as the synthetic resin forming the temporary support 1, but it is required that it can be easily separated from the photosensitive resin layer 4. Suitable protective layers 5 are, for example, silicone-coated paper, polyolefin or polytetrafluoroethylene sheets or films.
The thickness of the protective layer 5 is preferably about 5 to 100 μm. A particularly preferred protective layer 5 is a polyethylene film or a polypropylene film having a thickness of 10 to 30 μm.
In the photosensitive transfer sheet of the present invention, the protective layer 5 may be omitted, but it is preferably provided for safety during handling, transportation and storage of the photosensitive transfer sheet.

In the photosensitive transfer sheet 1, a barrier release layer 3 is formed by applying a coating liquid for forming a barrier release layer on a temporary support 2 and then drying it, and then forming a barrier layer on the barrier release layer 3. A coating solution for forming a photosensitive resin layer containing a solvent that does not dissolve the hydrophilic release layer 3 is applied and dried. Finally, the protective layer 5 is provided on the photosensitive resin layer 4 to manufacture the photosensitive transfer sheet 1.

Further, the photosensitive resin layer 4 is provided on the protective layer 5 to make a sheet-like material, while the barrier release layer 3 is provided on the temporary support 2 to make another sheet-like material. The photosensitive transfer sheet 1 can also be manufactured by laminating the strip-shaped material so that the barrier release layer 3 and the photosensitive resin layer 4 are in contact with each other.

In the photosensitive transfer sheet 11 shown in FIG. 2, the barrier release layer 13, the photosensitive resin layer 14 and the protective layer 15 are the barrier release layers in the photosensitive transfer sheet 1 shown in FIG. 3, photosensitive resin layer 4 and protective layer 5
And can be formed in the same manner as described for the photosensitive transfer sheet 1. The photosensitive transfer sheet 11 can be manufactured in the same manner as the photosensitive transfer sheet 1.

FIG. 3 is a sectional view schematically showing a section of another embodiment of the photosensitive transfer sheet of the present invention. In FIG. 3, the photosensitive transfer sheet 21 is formed by laminating a release layer 23, a barrier layer 24, a photosensitive resin layer 25, and a protective layer 26 on one surface of a temporary support 22.

In the photosensitive transfer sheet 21 shown in FIG. 3, the temporary support 22, the photosensitive resin layer 25 and the protective layer 26 are provided.
Are the same as the temporary support 2, the photosensitive resin layer 4, and the protective layer 5 in the photosensitive transfer sheet 1 shown in FIG. 1, respectively.

In the photosensitive transfer sheet 21 shown in FIG. 3, the peeling layer 23 and the barrier layer 24 are formed by dividing the functions of the barrier peeling layer 3 shown in FIG. is there. That is, the peeling layer 23 has a function of facilitating the peeling of the temporary support 22 when forming the resist pattern, and the barrier layer 24 is the photosensitive transfer sheet 2.
1 has a function of protecting the peeling layer 23 against components such as a solvent contained in the photosensitive resin layer forming coating liquid when the photosensitive resin layer 25 is formed by coating in the production of 1. . Further, the peeling layer 23 and the barrier layer 24 can be easily removed from the photosensitive resin layer 25 before exposure by water or an alkaline aqueous solution at the time of forming a resist pattern.
Alternatively, it has a property that it can be easily removed during the development processing of the photosensitive resin layer 25. In the conventionally known photosensitive transfer sheet, the release layer 23 and the barrier layer 24 having the above-mentioned functions are also known, and in the photosensitive transfer sheet of the present invention, the conventionally known release layer and barrier layer are also known. Can be used without particular limitation.

The material of the peeling layer 23 is preferably a resin which can be dissolved or swollen in water or an alkaline aqueous solution.
As the material of the release layer 23, the above-mentioned photosensitive transfer sheet 1 is used.
The materials exemplified as the barrier release layer 3 can be used, and since it is not necessary to have a function as a barrier layer, a saponified product of ethylene and an acrylate copolymer, styrene and (meth) Saponified acrylic ester copolymer, saponified vinyl toluene and (meth) acrylic ester copolymer, poly (meth) acrylic ester, (meth) acrylic acid such as butyl (meth) acrylate and vinyl acetate Materials such as saponified products such as ester copolymers can also be used.

In order to transfer the photosensitive resin layer 25 to the surface of the support so that no bubbles remain between the photosensitive resin layer 25 and the surface of the support to which the photosensitive resin layer is to be transferred, the peeling layer 23 is used.
It is important that is thermoplastic. In particular, fine irregularities such as intermediate products of circuit boards (for example,
The release layer 23 of the photosensitive transfer sheet for transferring the photosensitive resin layer to the support having the circuit step) is 10
It preferably has a softening point in the range of -80 ° C. In order to form the release layer 23 having such a softening point, the barrier release layer may be formed of a thermoplastic resin having a softening point of 10 to 80 ° C., or a thermoplastic resin having a high softening point. Various plasticizers compatible with this resin may be added to form a resin whose substantial softening point is adjusted within the above range. Specific examples of preferable plasticizers include those described for the barrier release layer 3.

In order to facilitate the peeling of the temporary support 22 at the time of forming the resist pattern, the adhesion between the temporary support 22 and the peeling layer 23 should be the same as that between the peeling layer 23 and the barrier layer 24. It must be smaller than the adhesion between the barrier layer 24 and the photosensitive resin layer 25. In order to adjust the adhesion between the temporary support 22 and the release layer 23, various other polymers, adhesion improvers, surfactants, release agents, etc. may be added to the release layer 23.

The release layer 23 is formed, for example, by coating the surface of the temporary support 22 with a release layer-forming coating solution obtained by dissolving the above-mentioned components constituting the release layer 23 in a solvent. , Air knife coat, gravure coat,
It can be carried out by a method of applying after a method such as bar coating or curtain coating and then drying.

The thickness of the peeling layer 23 is preferably adjusted appropriately according to the surface shape of the support on which the resist pattern is formed. Photosensitive transfer sheet 2 for transferring photosensitive resin layer 25 to a support having fine irregularities on the surface
In the first aspect, the thickness of the peeling layer 23 is preferably 2 μm to 50 μm, and when a support having excellent surface smoothness is used as a transfer target, the thickness of the peeling layer 23 may be smaller than 2 μm. Absent.

Further, in order to improve the resolution of the resist pattern formed by using the photosensitive transfer sheet 21,
You may add the above-mentioned photo-bleaching compound to the peeling layer 23.

As the material of the barrier layer 24, those exemplified as the material of the barrier release layer 3 of the photosensitive transfer sheet 1 can be used. Various other polymers, adhesion improvers, surfactants, release agents and the like may be added to the barrier layer 24.

The adhesion between the peeling layer 23 and the barrier layer 24 is preferably smaller than the adhesion between the barrier layer 24 and the photosensitive resin layer 25. By setting the adhesive force between the temporary support and each layer as described above, in the exposure step after transferring the photosensitive resin layer 25 to the support,
Depending on the resolution of the photosensitive resin layer 25, the pattern can be exposed from above the release layer 23, or only the release layer 23 can be released to expose the pattern from above the barrier layer 24.

The barrier layer 24 is formed by, for example, applying the barrier layer-forming coating liquid obtained by dissolving the components constituting the barrier layer 24 in a solvent onto the surface of the release layer 23 as described above. It can be carried out by a method of coating and then drying.

For the purpose of protecting the peeling layer 23 only, the thickness of the barrier layer 24 is about 0.1 to 5 μm, particularly 0.1 to 2 μm. By making the film thinner than the peeling layer 23, the exposure operation depending on the resolution of the photosensitive resin layer 25 as described above (selecting whether to expose through the peeling layer 23 and the barrier layer 24 or only through the barrier layer 24 is performed. Function), the function of the barrier layer 24 is further exerted. However, the thickness of the barrier layer 24 does not need to be determined by itself, and the release layer 2
It is preferable that the total thickness of 3 and the barrier layer 24 is determined by the relative relationship with the thickness of the release layer 23 so that the total thickness of the 3 and the barrier layer 24 is approximately the same as the thickness of the barrier release layer 3 of the photosensitive transfer sheet 1. For example, in the photosensitive transfer sheet 21 for transferring the photosensitive resin layer 25 to the support having fine irregularities on the surface, the thickness of the peeling layer 23 is reduced, and instead of the barrier layer 24, The thickness may be increased so that the total thickness of the release layer 23 and the barrier layer 24 is 2 μm to 50 μm.

In order to improve the resolution of the resist pattern formed using the photosensitive transfer sheet 21,
The photobleaching compound as described above may be added to the barrier layer 24.

FIG. 4 is a sectional view schematically showing a section of another embodiment of the photosensitive transfer sheet of the present invention. In FIG. 4, the photosensitive transfer sheet 31 includes a temporary support body 32 composed of a temporary support body 32a and a conductive layer 32b provided on one surface thereof, and the temporary support 32 is provided with the conductive layer 32b. The peeling layer 33 is laminated on the surface not covered with the barrier layer 34, the photosensitive resin layer 35, and the protective layer 36 on the peeling layer 33.

In the photosensitive transfer sheet 31 shown in FIG. 4, the temporary support 32 has a two-layer structure like the temporary support 12 of the photosensitive transfer sheet 11 shown in FIG. The barrier layer 34, the photosensitive resin layer 35, and the protective layer 36 are the same as the release layer 23, the barrier layer 24, the photosensitive resin layer 25, and the protective layer 26 of the photosensitive transfer sheet 21 shown in FIG. 3, respectively. . Therefore, the detailed contents of the photosensitive transfer sheet 31 will be apparent from the above description without repeating the description.

Next, the resist pattern forming method of the present invention will be described. The resist pattern forming method of the present invention is the same as the conventional resist pattern forming method using a photosensitive transfer sheet, except that the photosensitive transfer sheet of the present invention is used as the photosensitive transfer sheet. Is similar to the conventional resist pattern forming method.

That is, first, when a photosensitive transfer sheet provided with a protective layer (having a barrier release layer) is used, the protective layer is removed in advance, and the photosensitive resin layer is also pressurized if necessary. Then, the photosensitive resin layer is laminated on the support to be transferred under heating to form a laminate. A conventionally known laminator or a vacuum laminator can be used for this bonding, and an autocut laminator can also be used to further improve productivity. Then, after removing the temporary support from this laminate by peeling, a predetermined mask is used to expose through the barrier release layer to form a latent image on the photosensitive resin layer, and then the latent image is developed, or After peeling off the temporary support, the barrier release layer is dissolved and removed, similarly exposed, and then developed. When a photosensitive transfer sheet having a release layer and a barrier layer is used, it is exposed through the release layer and the barrier layer at the time of exposure, or with water or an alkaline aqueous solution which does not affect the photosensitive resin layer. The procedure is the same as that of using a photosensitive transfer sheet having a barrier release layer, except that the release layer or the release layer and the barrier layer are removed by dissolution.

The development is carried out by a known method by immersing in a solvent or an aqueous developing solution, particularly an aqueous alkali solution, or applying a spray of the developing solution from a spray, and further rubbing with a brush or treating while irradiating with ultrasonic waves. Done.

The alkaline developing solution for the photosensitive resin layer of the present invention is a dilute aqueous solution of an alkaline substance, but it also includes a solution containing a small amount of an organic solvent miscible with water.

Suitable alkaline substances are alkali metal hydroxides (eg sodium hydroxide, potassium hydroxide),
Alkali metal carbonates (eg sodium carbonate, potassium carbonate), alkali metal bicarbonates (sodium hydrogen carbonate, potassium hydrogen carbonate), alkali metal silicates (sodium silicate, potassium silicate) alkali metal metasilicates (metasilicic acid) Sodium, potassium metasilicate), triethanolamine, diethanolamine, monoethanolamine, morpholine, tetraalkylammonium hydroxides (eg tetramethylammonium hydroxide) or trisodium phosphate.
The concentration of the alkaline substance is 0.01% to 30% by weight.
And the pH is preferably 8-14.

Suitable water-miscible organic solvents are methanol, ethanol, 2-propanol, 1-propanol, butanol, diacetone alcohol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono n-butyl ether, Benzyl alcohol, acetone, methyl ethyl ketone, cyclohexanone, ε-caprolactone, γ-butyrolactone, dimethylformamide, dimethylacetamide, hexamethylphosphoramide, ethyl lactate, methyl lactate, ε-caprolactam, N-methylpyrrolidone. The concentration of water-miscible organic solvent is 0.1% by weight
It is 30% by weight. Further, a known surfactant can be added. Surfactant concentration is 0.01% by weight
-10 wt% is preferable.

Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited thereto.

Examples 1 to 6 (A) Preparation of Photosensitive Transfer Sheet A photosensitive transfer sheet having a layer structure as shown in FIG. 2 was prepared by the following procedure.

(Preparation of temporary support) Preparation of temporary support (a) 65 parts by weight of stannic chloride hydrate and 1.5 parts of antimony trichloride.
A part by weight was dissolved in 1000 parts by weight of ethanol to obtain a uniform solution. A 1N aqueous sodium hydroxide solution was added dropwise to this solution to adjust its pH to 3 to coprecipitate the colloidal stannic oxide and antimony oxide, and allowed to stand at 50 ° C. for 24 hours to form a reddish brown colloidal precipitate. Obtained.

The precipitate was separated by centrifugation. To remove excess ions, water was added to the precipitate and washed by centrifugation. This operation was repeated 3 times to remove excess ions.

100 parts by weight of this precipitate was mixed with 1,000 parts by weight of water, and the mixed solution was sprayed into a firing furnace heated to 650 ° C. to obtain bluish conductive particles having an average particle size of 0.15 μm. It was

The above conductive fine particles having the following formulation were dispersed for 5 hours using a paint shaker (manufactured by Toyo Seiki Seisakusho Co., Ltd.) to prepare a dispersion liquid of conductive fine particles. 200 parts by weight of the above conductive particles Vinylidene chloride copolymer (Saran F-310 manufactured by Asahi Kasei Kogyo KK) 10 parts by weight Methyl ethyl ketone 150 parts by weight

Using the dispersion liquid of the conductive fine particles, a coating liquid for forming a conductive layer having the following formulation was prepared. Dispersion of the above conductive fine particles 15 parts by weight Saran F-310 3 parts by weight Methyl ethyl ketone 100 parts by weight Cyclohexanone 20 parts by weight m-cresol 5 parts by weight

The conductive layer-forming coating solution was applied to have a thickness of 10
A 0 μm polyethylene terephthalate film (temporary support body) was coated on one side so that the dry coating amount was 1.3 g / m ² and dried at 130 ° C. for 2 minutes to prepare a temporary support having a conductive layer. did.

Next, a liquid having the following formulation was applied on the conductive layer so that the dry coating amount was 0.2 g / m ^2, and
A hydrophobic polymer layer was formed by drying at 30 ° C. for 1 minute to prepare a temporary support (a). Cellulose triacetate 1 part by weight Methylene dichloride 60 parts by weight Ethylene dichloride 40 parts by weight Erucamide amide 0.01 parts by weight

The surface electric resistance value of this temporary support (a) was measured with an insulation resistance measuring device (VE-30 type manufactured by Kawaguchi Electrode Co., Ltd.), and was 7 × 10 ⁸ Ω / □ at 25 ° C. and 25% RH. there were. Preparation of temporary supports (b) to (f)

Except for changing the addition amount of the conductive fine particles in the formulation of the dispersion liquid of the conductive fine particles, the temporary electric resistance values shown in Table 1 below were obtained in the same manner as in the preparation of the temporary support (a). Supports (b) to (f) were prepared.

[0096]

[Table 1]

(Formation of Barrier Release Layer) On the surface of the temporary support (a) opposite to the surface on which the conductive layer is provided,
A coating liquid for forming a barrier release layer having the following formulation A was applied and then dried to form a barrier release layer having a dry film thickness of 1.6 μm.

Formula A: Polyvinyl alcohol (PVA205 manufactured by Kuraray Co., Ltd., saponification rate = 80%) 130 parts by weight Polyvinylpyrrolidone (PVP manufactured by GAF Corporation, K-90) 60 parts by weight Fluorine-based surfactant (Asahi Glass Co., Ltd. ), Surflon S-131) 10 parts by weight Distilled water 3350 parts by weight

(Formation of Photosensitive Resin Layer) On the barrier release layer, a positive resist solution manufactured by Fuji Hunt Electro Technology Co., Ltd., FH2130 (the main component of which is a novolac resin having a melting point of 50 ° C. to 65 ° C.) is used. Quinonediazide photosensitive material) and then dried to form a photosensitive resin layer having a dry film thickness of 2.0 μm.

(Formation of Protective Layer) A polypropylene (thickness: 12 μm) film was pressure-bonded on the photosensitive resin layer to form a protective layer, to prepare a photosensitive transfer sheet of Example 1.

Instead of the temporary support (a), the temporary support (b)
The photosensitive transfer sheets of Examples 2 to 6 were prepared in the same manner as the preparation of the photosensitive transfer sheet of Example 1 except that (1) to (f) were used.

(B) Formation of Resist Pattern Using the photosensitive transfer sheets of Examples 1 to 6 obtained as described above, the transparent conductive film (ITO) was patterned as follows.

The surface of the photosensitive resin layer exposed by peeling off the protective layer of the photosensitive transfer sheet is used as an ITO film (resistor formed by sputtering on a transparent glass substrate which is a support to which the photosensitive resin layer is to be transferred). A laminator (VP-II manufactured by Taisei Laminator Co., Ltd.) is applied to the surface having a value of 30Ω / □ under pressure (0.8 kg / cm ² ) under heating (130 ° C.) to bond the laminated product. Formed. Subsequently, the temporary support was removed from the laminate by peeling at the interface between the temporary support of the laminate and the barrier release layer.

Next, exposure is performed through a predetermined photomask (light source: ultra-high pressure mercury lamp, exposure condition: 100 mj / cm).
² ) and developed with 0.24N sodium hydroxide aqueous solution to remove unnecessary portions, and a resist pattern was formed on the glass substrate.

When any of the photosensitive transfer sheets of any of the examples was used, peeling electrification did not occur when the temporary support was peeled off, adhesion of foreign matters to the surface of the barrier release layer was not observed, and a resist pattern having no omission Was formed. In these cases, the minimum resolution (line & space = 1: 1) was 3 μm.

Further, when the ITO on the transparent glass substrate was etched with a predetermined ITO etching solution and the resist was peeled off, an ITO pattern free from disconnection was obtained.

Comparative Example 1 A barrier release layer, a photosensitive resin layer and a protective layer were prepared in the same manner as in Example 1 except that a 100 μ thick polyethylene terephthalate film having no conductive layer was used as a temporary support. The layers were laminated to form a photosensitive transfer sheet. Using this photosensitive transfer sheet, a resist pattern was formed on the ITO substrate by the same method as in Example 1. In this case, peeling electrification occurred when the temporary support was peeled off, adhesion of foreign matter was observed on the surface of the barrier release layer on the substrate, and the obtained pattern had many defects. Subsequently, when the ITO was etched and the resist was peeled off, a short circuit occurred in the obtained ITO pattern.

Example 7 Using the photosensitive transfer sheet of Example 1, a photosensitive resin layer was laminated on the ITO film surface of the transparent glass substrate in the same manner as in Example 1 to form a laminate. did. No peeling charge was generated when the temporary support was peeled from this laminate, and no foreign matter was attached to the surface of the barrier release layer.

Then, after removing the barrier release layer by washing with water, exposure and development were carried out in the same manner as in Example 1 to form a resist pattern, and a resist pattern without omission was formed. The minimum resolution in this case (line & space = 1: 1) was 2 μm.

Further, IT is performed with a predetermined ITO etching solution.
When O was etched and the resist was peeled off, an ITO pattern having no disconnection was obtained.

[Examples 8-13] (A) Preparation of photosensitive transfer sheet A photosensitive transfer sheet having a layer structure as shown in FIG. 4 was prepared by the following procedure.

(Preparation of Temporary Support) Examples 1 to 6
The temporary supports (a) to (f) were prepared in the same manner as in.

(Formation of Release Layer) On each surface of the temporary supports (a) to (f) opposite to the surface provided with the conductive layer, a release layer-forming coating solution having the following formulation B was applied. After coating, it was dried to form a release layer having a dry film thickness of 10 μm. Formulation B: methyl methacrylate / 2-ethylhexyl acrylate / benzyl methacrylate / methacrylic acid copolymer (copolymerization composition ratio (molar ratio) = 55 / 28.8 / 11.7 / 4.5, weight average molecular weight = 90000) 15 Parts by weight polypropylene glycol diacrylate (average molecular weight = 822) 6.5 parts by weight tetraethylene glycol dimethacrylate 1.5 parts by weight p-toluenesulfonamide 0.5 parts by weight benzophenone 1.0 parts by weight methyl ethyl ketone 30 parts by weight

(Formation of Barrier Layer) A coating for forming a barrier layer having the same composition (formulation A) as the coating liquid for forming a barrier releasing layer used in Examples 1 to 6 was formed on each of the obtained release layers. After applying the liquid, it is dried to obtain a dry film thickness of 1.
A 6 μm barrier layer was formed.

(Formation of Photosensitive Resin Layer) A positive resist solution made by Fuji Hunt Electro Technology Co., Ltd., FH2130, was applied onto the barrier layer and then dried to give a photosensitive resin layer having a dry film thickness of 2.0 μm. Was formed.

(Formation of Protective Layer) A polypropylene (thickness: 12 μm) film is pressure-bonded onto the photosensitive resin layer to form a protective layer, and the steps corresponding to the temporary supports (a) to (f) are performed. Photosensitive transfer sheets of Examples 8 to 13 were prepared.

(B) Formation of Resist Pattern Using the photosensitive transfer sheets of Examples 8 to 13 obtained as described above, unevenness of ± 0.1 μm was formed as a support to which the photosensitive resin layer was transferred. A resist pattern was formed in the same manner as in Example 1 except that the transparent glass substrate provided with the ITO film was used.

No matter which example of the photosensitive transfer sheet was used, no peeling charge was generated when the temporary support was peeled off, no foreign matter was attached to the surface of the barrier release layer, and no resist pattern was found. Was formed. Further, at the time of transferring the photosensitive resin layer, no air bubbles remained due to the irregularities of the transparent glass substrate. The minimum resolution (line & space = 1: 1) was 10 μm.

Further, when the ITO on the transparent glass substrate was etched with a predetermined ITO etching solution and the resist was peeled off, an ITO pattern having no disconnection was obtained.

Example 14 Photosensitive transfer was performed in the same manner as in Example 8 except that the barrier layer-forming coating solution of the following formulation C was used in place of the barrier layer-forming coating solution of the formulation A. Created a sheet. Prescription C: Polyvinyl alcohol (PVA205 manufactured by Kuraray Co., Ltd., saponification rate = 80%) 130 parts by weight Polyvinylpyrrolidone (PVP, K-90 manufactured by GAF Corporation) 60 parts by weight Fluorine-based surfactant (manufactured by Asahi Glass Co., Ltd.) Surflon S-131) 10 parts by weight 4-N, N dimethylaminobenzene-diazonium trifluoromethanesulfonate 80 parts by weight Distilled water 3350 parts by weight

Using the photosensitive transfer sheet obtained as described above, a resist pattern was formed in the same manner as in Example 1. No peeling charge was generated during peeling of the temporary support, no foreign matter was attached to the surface of the barrier release layer, and a resist pattern having no omission was formed. Also,
The minimum resolution (line & space = 1: 1) was 2 μm.

Further, the ITO on the transparent glass substrate was etched with a predetermined ITO etching solution, and the resist was peeled off to obtain an ITO pattern having no disconnection.

[Examples 15 to 28] Positive resist FH213 manufactured by Fuji Hunt Electro Technology Co., Ltd. which was used as the coating liquid for forming the photosensitive resin layer in Examples 1 to 14.
The photosensitive transfer sheets of Examples 15 to 28 were prepared in the same manner as in Examples 1 to 14 except that a coating solution for forming a photosensitive resin layer having the following formulation D was used in place of 0. It was created. Formulation D Reaction product of bis (2-hydroxyethyl) 2,4-tolylene dicarbamate and dichlorodimethylsilane 110 parts by weight Cresol-formaldehyde novolac resin 50 parts by weight 2- (p-methoxyphenyl) 4,6-bistrichloro Methyl-s-triazine 2 parts by weight Methyl ethyl ketone 500 parts by weight Methyl cellosolve 1500 parts by weight

When the resist patterns were formed in the same manner as in Example 1 using the photosensitive transfer sheets of Examples 15 to 28, no peeling electrification occurred at the time of peeling the temporary support, and the barrier property was obtained. No adhesion of foreign matter to the surface of the release layer was observed, a resist pattern having no omission was formed, and an ITO pattern having no disconnection was obtained.

[0125]

INDUSTRIAL APPLICABILITY The photosensitive transfer sheet of the present invention does not cause peeling charge when the temporary support is peeled off from the laminate in which the photosensitive resin layer is bonded to the support to be transferred. ,
The remarkable effect is that dust and the like do not adhere to the photosensitive resin layer. In addition, the photosensitive transfer sheet of the present invention does not cause air bubbles to remain between the support and the photosensitive resin layer even when the photosensitive resin layer is transferred to the support having the irregularities formed on the surface thereof. There is a remarkable effect that the resist pattern can be formed with the resolution.

[Brief description of drawings]

FIG. 1 is a cross-sectional view schematically showing a cross section of an example of a photosensitive transfer sheet of the present invention.

FIG. 2 is a cross-sectional view schematically showing a cross section of another embodiment of the photosensitive transfer sheet of the present invention.

FIG. 3 is a cross-sectional view schematically showing a cross section of another example of the photosensitive transfer sheet of the present invention.

FIG. 4 is a cross-sectional view schematically showing a cross section of another embodiment of the photosensitive transfer sheet of the present invention.

[Explanation of symbols]

 1 Photosensitive Transfer Sheet 2 Temporary Support 3 Barrier Release Layer 4 Photosensitive Resin Layer 5 Protective Layer 11 Photosensitive Transfer Sheet 12 Temporary Support 12a Temporary Support Main Body 12b Conductive Layer 13 Barrier Release Layer 14 Photosensitive Resin Layer 15 Protective layer 21 Photosensitive transfer sheet 22 Temporary support 23 Release layer 24 Barrier layer 25 Photosensitive resin layer 26 Protective layer 31 Photosensitive transfer sheet 32 Temporary support 32a Temporary support body 32b Conductive layer 33 Release layer 34 Barrier layer 35 Photosensitive resin layer 36 Protective layer

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location H01L 21/027 H05K 3/06 J 6921-4E

Claims (2)

[Claims] 1. A photosensitive transfer sheet comprising a synthetic resin temporary support, a barrier release layer or a release layer and a barrier layer, and an alkali-developable photosensitive resin layer laminated in this order. A photosensitive transfer sheet, wherein the temporary support has a surface electric resistance value of 10 ¹³ Ω / □ or less. 2. The photosensitive transfer sheet according to claim 1,
On the surface of the photosensitive resin layer, a step of forming a laminate by bonding the photosensitive resin layer to a support to be transferred under heating, a step of removing the temporary support by peeling from the laminate, and optionally the laminate Of a barrier release layer or a release layer and a barrier layer from an object, a step of forming a latent image on the photosensitive resin layer by exposing through a photomask having a predetermined pattern, and developing the photosensitive resin layer A method for forming a resist pattern, which comprises a step of processing to form a resist pattern on a support.