JPH06349930A - Finger collision detector of wafer transfer robot - Google Patents

Finger collision detector of wafer transfer robot

Info

Publication number
JPH06349930A
JPH06349930A JP16499993A JP16499993A JPH06349930A JP H06349930 A JPH06349930 A JP H06349930A JP 16499993 A JP16499993 A JP 16499993A JP 16499993 A JP16499993 A JP 16499993A JP H06349930 A JPH06349930 A JP H06349930A
Authority
JP
Japan
Prior art keywords
finger
transfer robot
wafer
collision detection
wafer transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16499993A
Other languages
Japanese (ja)
Inventor
Hitoshi Kono
等 河野
Atsushi Okuno
敦 奥野
Hiroshi Nagashima
洋 永島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Co Ltd
Original Assignee
Shinko Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Co Ltd filed Critical Shinko Electric Co Ltd
Priority to JP16499993A priority Critical patent/JPH06349930A/en
Publication of JPH06349930A publication Critical patent/JPH06349930A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To stop a robot quickly detecting if the finger of the robot collides against other members by a method wherein signals detected by a collision detecting means are transmitted by wireless through an antenna and received by a sequence control device. CONSTITUTION:An elastic member 8a such as a spring or the like is mounted on the end of a finger 4 connected with a wafer transfer robot main body, wherein the elastic member 8a is deformed when the finger 4 collides against some other members. A detection circuit 12 which is actuated to transmit detection signals by a limit switch 8b actuated corresponding to the deformation of the elastic member 8a and a wireless transmission circuit, 13 are provided. Detection signals outputted from the wireless transmission circuit 13 are transmitted through an antenna 13a by radio and received by a receiver 11. If the finger collides against the other member, signals of the limit switch 8b are transmitted from the radio transmitter 13 and received by a control device to stop the robot main body. Therefore, an actual collision can be detected without fail.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は化学気相成長法(CVD
法)により半導体デバイスを製造するのに使用され、一
般にCVD装置と称される半導体製造装置に関し、特に
ウエ−ハ移載装置としての移載ロボットのフィンガの衝
突を検知する装置に関する。
BACKGROUND OF THE INVENTION The present invention relates to a chemical vapor deposition method (CVD).
The present invention relates to a semiconductor manufacturing apparatus which is used for manufacturing a semiconductor device by a method) and is generally called a CVD apparatus, and more particularly to an apparatus which detects a collision of fingers of a transfer robot as a wafer transfer apparatus.

【0002】[0002]

【従来の技術】半導体製造装置には、ウエ−ハをウエ−
ハキャリアからウエ−ハボ−ト等の処理部分へ移載する
ウエ−ハ移載装置としての移載ロボットが含まれる。以
下の説明においては、場合により移載ロボットを単にロ
ボットとし、ロボット本体を単に本体として記載する。
移載ロボットには、真空吸着などの手段によりその上に
ウエ−ハを載せて移動させるためのフィンガ(別名ペ
ン)が設けられているが、これが何等かの理由でウエ−
ハやウエ−ハキャリア、或いはボ−ト等に衝突すること
があり、ウエ−ハ自体や装置の損傷、場合によっては作
業者などの障害を招くことがある。
2. Description of the Related Art A semiconductor manufacturing apparatus is equipped with a wafer.
A transfer robot as a wafer transfer device for transferring from a carrier to a processing part such as a wafer boat is included. In the following description, the transfer robot is simply referred to as a robot, and the robot body is simply referred to as a body in some cases.
The transfer robot is provided with fingers (also called pens) for placing and moving the wafer on it by means such as vacuum suction. For some reason, this is a finger.
It may collide with a wafer, a wafer carrier, a boat, or the like, which may cause damage to the wafer itself or an apparatus, and in some cases, cause an obstacle for an operator or the like.

【0003】図7、図8は、それぞれ、上記の移載ロボ
ット1の平面図、側面図であり、簡略化のため昇降装置
は図示を省略してある。これらの図を参照しウエ−ハ移
載動作を、例えばウエ−ハキャリアからウエ−ハ7を受
け取りボ−トに移す場合の操作について説明する。先
づ、ロボット本体2の第1の軸3を回転させフィンガ4
を右側のウエ−ハキャリアに向け、第1のア−ム5、第
2のア−ム6を伸ばして図示しない昇降装置により上昇
させてウエ−ハ7を受け取り、次いで第1と第2のア−
ム5,6を縮めて第1の軸3を回転させ、フィンガ4を
左側のボ−トに向け第1と第2のア−ム5と6を伸ばし
て下降させ、ウエ−ハ7をボ−トに載せる。この動作中
に、例えばア−ム5と6を伸ばした場合、フィンガ4が
キャリア、或いはボ−ト等に衝突した時は、衝突検知手
段8(図9参照)の弾性部材としてのばね8aが、図示
しないガイドに案内されるフィンガ4に押されてリミッ
トスイッチ8bが作動し、信号が別に設置される制御装
置に送られ移載ロボット1の動作を停止させる。
7 and 8 are a plan view and a side view, respectively, of the transfer robot 1 described above, and the lifting device is omitted for simplification. With reference to these figures, the wafer transfer operation will be described, for example, when the wafer 7 is received from the wafer carrier and transferred to the boat. First, the first shaft 3 of the robot body 2 is rotated to move the fingers 4
Toward the wafer carrier on the right side, the first arm 5 and the second arm 6 are extended and lifted by a lifting device (not shown) to receive the wafer 7, and then the first and second arms are received. A
The arms 5 and 6 are contracted and the first shaft 3 is rotated, the finger 4 is directed toward the left side boat, the first and second arms 5 and 6 are extended and lowered, and the wafer 7 is moved. -Place it on the toe. During this operation, for example, when the arms 5 and 6 are extended, when the finger 4 collides with the carrier or the boat, the spring 8a as the elastic member of the collision detection means 8 (see FIG. 9) is The limit switch 8b is actuated by being pressed by the finger 4 guided by a guide (not shown), and a signal is sent to a separately installed control device to stop the operation of the transfer robot 1.

【0004】[0004]

【発明が解決しようとする課題】上記のリミットスイッ
チ8bからの信号を伝える導線9は、図8に示すように
衝突検出手段8から、第3の回転軸6a、第2ア−ム
6、第2の回転軸5a、第1のア−ム5、第1の回転軸
3、本体2までの間を屈曲した内部を通過して導かれる
ようになっているが、この屈曲の多い通路内を、各回転
軸の回転に耐えるように導く必要があり、そのため導線
9には耐屈曲性が要求され、耐屈曲性線でも場合によっ
ては捩じ切れてしまうこともある。これに代わる方法と
して導線をア−ムや回転軸の外に出して配線する方法も
あるが、この配線方法では配線関係に付着している微小
異物、又は配線のこすれにより微小粒子が発生するなど
環境のクリ−ン保持の点から好ましくない。
The conductor 9 for transmitting the signal from the limit switch 8b is provided by the collision detecting means 8 to the third rotating shaft 6a, the second arm 6, and the second arm 6, as shown in FIG. The two rotary shafts 5a, the first arm 5, the first rotary shaft 3, and the main body 2 are guided through the curved interior. It is necessary to guide the rotary shafts so as to withstand the rotation of the rotary shafts. Therefore, the conductive wire 9 is required to have bending resistance, and the bending resistance wire may be twisted off in some cases. As an alternative method, there is also a method in which the conductor wire is taken out of the arm or the rotating shaft to be wired, but in this wiring method, minute foreign matter adhered to the wiring relationship or minute particles are generated due to the rubbing of the wiring, etc. It is not preferable in terms of keeping the environment clean.

【0005】[0005]

【課題を解決するための手段】本発明では、問題となる
導線を、検出手段からロボット本体に到る間をア−ムや
回転軸などの内部に挿通して導く代りに、以下に示す3
種の手段により課題を解決した。 1)第1の手段として、検知手段で検知された信号を同
手段内からアンテナを通じ無線送信し別に設置される制
御装置内のシ−ケンス制御装置等で受信する。また無線
送信用のバッテリは所定の時間間隔で放電点検のための
信号を発し、この信号が発信されなくなったことでバッ
テリの放電と判断する。 2)第2の手段として、ロボット本体の内部又は外部に
振動センサまたは加速度センサ設置し、これらのセンサ
の検知による出力信号がある設定値(スレッシュホ−ル
ド・限界信号)を超えた場合を衝突として検知する。 3)第3の手段として、ロボット本体内に真空スイッチ
を備え、この真空スイッチとフィンガ保持部との間のア
−ムと回転軸とに空気通路を設け、真空スイッチとフィ
ンガ保持部とを連通させフィンガ保持部の空気通路開口
をフィンガの衝突による移動によって閉止するか、又は
開放することにより前記の真空スイッチを作動させて検
知信号を発信させる。
According to the present invention, instead of guiding the problematic lead wire by inserting it through the inside of the arm, rotating shaft, etc. between the detecting means and the robot body, the following 3
The problem was solved by means of seeds. 1) As a first means, a signal detected by the detecting means is wirelessly transmitted from inside the means through an antenna and received by a sequence control device or the like in a control device separately installed. The battery for wireless transmission emits a signal for discharge check at a predetermined time interval, and it is determined that the battery is discharged because the signal is no longer transmitted. 2) As a second means, a vibration sensor or an acceleration sensor is installed inside or outside the robot body, and when the output signal detected by these sensors exceeds a certain set value (threshold or limit signal), it is regarded as a collision. Detect. 3) As a third means, a vacuum switch is provided in the robot body, an air passage is provided in the arm and the rotary shaft between the vacuum switch and the finger holding portion, and the vacuum switch and the finger holding portion are communicated with each other. Then, by closing or opening the air passage opening of the finger holding portion by the movement of the fingers, the vacuum switch is actuated to transmit the detection signal.

【0006】[0006]

【作用】第1の手段の場合は、フィンガが衝突するとリ
ミットスイッチの信号が無線発信器から制御装置に受信
されてロボット本体の作動を停止するようにされ、従来
技術のように導線をア−ムや回転軸内を挿通させるため
の損傷の懸念がないので導線の損傷による故障発生の恐
れがない。また、定期的にバッテリの放電の有無をチェ
ックするので、バッテリの放電により実際に起こった衝
突を検知し損うことがない。第2の手段中振動センサに
よる場合、信号出力が図6に示すように設定値(スレッ
シュホ−ルド値、または閾値)の範囲内の場合は、正常
状態としてロボットの作動はそのまま続行されるが、フ
ィンガが衝突した場合は勿論のこと、それ以外の部分が
衝突しても、図示のように限界信号以上の出力となって
制御装置にロボット停止の信号を与える。加速度センサ
を使用する場合については、図示はしないが、図6の縦
軸が加速度になって同様な加速度曲線となり、限界加速
度値を越すと制御装置にロボット停止の信号を与える。
第3の手段による場合は、フィンガが衝突するとフィン
ガ保持部の空気通路開口が閉じるか、又は開放されるか
のどちらかを選択し、真空スイッチが閉じた場合または
開放された場合にONになるように設定して置けば、そ
れらの設定に応じ信号が制御装置に送られてロボットを
停止させる。
In the case of the first means, when the fingers collide with each other, the signal from the limit switch is received by the control device from the radio transmitter to stop the operation of the robot main body. Since there is no concern about damage due to insertion into the shaft or inside the rotary shaft, there is no risk of failure due to damage to the conductor. Further, since the presence or absence of discharge of the battery is regularly checked, the collision actually caused by the discharge of the battery will not be missed. In the case of using the vibration sensor in the second means, if the signal output is within the range of the set value (threshold value or threshold value) as shown in FIG. 6, the robot operation is continued as it is as a normal state, Not only when the fingers collide, but also when the other portions collide, the output exceeds the limit signal as shown in the figure and the robot stop signal is given to the control device. Although not shown, when the acceleration sensor is used, the vertical axis in FIG. 6 is acceleration and a similar acceleration curve is obtained, and when the limit acceleration value is exceeded, a robot stop signal is given to the control device.
In the case of the third means, it is selected whether the air passage opening of the finger holding portion is closed or opened when the fingers collide, and it is turned on when the vacuum switch is closed or opened. If the setting is made as described above, a signal is sent to the control device according to those settings to stop the robot.

【0007】[0007]

【実施例】図1は本発明によるウエ−ハ移載ロボットの
フィンガ衝突検知装置の第1実施例を示し、従来技術と
して示した図7中の部材と同じ部材または部品には同じ
符号を付けて説明する。この実施例の装置は、衝突検知
手段10と、別に設置されている制御装置に設けられた
受信器11とから成り、衝突検知手段10には図9に示
した部品の他に検知回路12、無線発信回路13、アン
テナ13a、バッテリ14及び図示しないがバッテリ1
4から所定の間隔でバッテリの放電を点検する信号を発
信する回路が含まれる。この装置の作動を説明すると、
フィンガ4がキャリア、ボ−ト、又はウエ−ハ等に衝突
すると、弾性部材であるばね8aが押されてリミットス
イッチ8bが作動し検知回路12を経て無線発信回路1
3のアンテナ13aから信号が送られ、別に設置される
制御装置の受信器11に受けられ、制御装置によってロ
ボットが停止される。
FIG. 1 shows a first embodiment of a finger collision detection apparatus for a wafer transfer robot according to the present invention, and the same members or parts as those shown in FIG. Explain. The apparatus of this embodiment comprises a collision detection means 10 and a receiver 11 provided in a separately installed control device. The collision detection means 10 includes a detection circuit 12 in addition to the components shown in FIG. The wireless transmission circuit 13, the antenna 13a, the battery 14, and the battery 1 (not shown)
A circuit is included which emits a signal to check the discharge of the battery at predetermined intervals from 4. To explain the operation of this device,
When the finger 4 collides with a carrier, a boat, a wafer, or the like, the spring 8a, which is an elastic member, is pushed and the limit switch 8b is actuated.
A signal is sent from the antenna 13a of No. 3 and is received by the receiver 11 of the control device installed separately, and the robot is stopped by the control device.

【0008】図2は第2実施例の側面図であり、振動発
信器15がロボット本体2の外側に取り付けられている
ものとして図示したが、ロボット本体2の内部に取り付
けてもよい。この振動発信器15は、別に設置される制
御装置とは導線17で連結されフィンガ保持部16には
検知手段がないので簡単な角形ブロックでよく、17a
は移載ロボット用モ−タ等の導線である。この実施例の
場合は図6に示すように、限界値を超す出力信号により
衝突と判断されて、制御装置によりロボットを停止させ
る。図6を参照して説明すると、図中で高低差の少ない
波形の部分は正常の動作による振動出力を示す部分であ
り、高低差の少ない波形の部分から突出したピ−クPは
異常値を示す一例である。図中の一点鎖線は、スレッシ
ュホ−ルド値または閾値と呼ばれる限界信号であり、こ
の信号値をNとし、このNを超えて検知された振動出力
を衝突によるものとし、Sで示せばS/N比は振動発信
器15がフィンガ4に近い程大きくなるが、導線を導き
通す必要をなくすために、フィンガ4から離して本体2
に取り付けられるので、これによりフィンガ以外での衝
突も検知できる利点がある。第3実施例は、第2実施例
の振動発信器15の代わりに加速度発信器18を使用す
るもので、取付、作動共に第2実施例と同様なので図示
を省略する。
FIG. 2 is a side view of the second embodiment, and the vibration transmitter 15 is illustrated as being attached to the outside of the robot body 2, but may be attached to the inside of the robot body 2. This vibration transmitter 15 may be a simple rectangular block because it is connected to a separately installed control device by a conductive wire 17 and the finger holding portion 16 has no detection means.
Is a conducting wire for a transfer robot motor or the like. In the case of this embodiment, as shown in FIG. 6, an output signal exceeding the limit value determines that a collision has occurred, and the controller stops the robot. Explaining with reference to FIG. 6, the portion of the waveform having a small difference in height is a portion showing the vibration output by normal operation, and the peak P protruding from the portion of the waveform having a small difference in height has an abnormal value. It is an example shown. The dashed-dotted line in the figure is a limit signal called a threshold value or a threshold value, this signal value is N, and the vibration output detected beyond this N is due to a collision. The ratio increases as the vibration transmitter 15 is closer to the finger 4, but is separated from the finger 4 in order to eliminate the need to guide the lead wire.
This has the advantage that collisions other than fingers can be detected. In the third embodiment, an acceleration transmitter 18 is used instead of the vibration transmitter 15 of the second embodiment, and the mounting and operation are the same as those in the second embodiment, so the illustration thereof is omitted.

【0009】図3は真空スイッチによる場合の実施例と
しての側面図を示し、フィンガ4のウエ−ハ移載ロボッ
トの本体に接続される側の端部には保持部20が設けら
れ、この保持部20中の取付部材21がフィンガ4に直
接取付られ、この取付部材21の下面は開閉部材22の
上面に沿って滑動可能にされ、取付部材21はフィンガ
4に対し反対側の面が弾性部材としてのばね23により
常時フィンガ4に向かって押圧され、従ってフィンガ4
は衝突の場合にはばね23に抗して移動される。一方、
本体2内に真空スイッチ24が取り付けられ、この真空
スイッチ24と開閉部材22とが、各ア−ム及び回転軸
を貫通する空気通路25で連通され、開閉部材22のス
ライド面22aに開口26が設けられ、また真空スイッ
チ24の出口側は空気通路27により真空ポンプへ、導
線28により制御装置へ接続される。真空ポンプは常時
運転され、空気は開閉部材22にある開口26から吸い
込まれるが、フィンガ4が衝突により図で左方へ動くと
取付部材21により開口26が塞がり、真空度が上昇し
て真空スイッチ24がONになって移載ロボット停止の
信号が制御装置へ送られる。
FIG. 3 shows a side view as an embodiment in the case of using a vacuum switch. A holding portion 20 is provided at the end of the finger 4 on the side connected to the main body of the wafer transfer robot. A mounting member 21 in the portion 20 is directly mounted on the finger 4, a lower surface of the mounting member 21 is slidable along an upper surface of the opening / closing member 22, and the mounting member 21 has an elastic member on a surface opposite to the finger 4. Is always pressed against the finger 4 by the spring 23 as
Is moved against the spring 23 in case of a collision. on the other hand,
A vacuum switch 24 is attached to the inside of the main body 2, the vacuum switch 24 and the opening / closing member 22 are communicated with each other by an air passage 25 penetrating each arm and a rotary shaft, and an opening 26 is formed in a slide surface 22 a of the opening / closing member 22. An air passage 27 connects the outlet side of the vacuum switch 24 to the vacuum pump and a lead wire 28 to the controller. The vacuum pump is constantly operated, and air is sucked in through the opening 26 in the opening / closing member 22, but when the finger 4 moves to the left in the figure due to a collision, the opening 26 is blocked by the mounting member 21 and the degree of vacuum rises and the vacuum switch When 24 is turned on, a signal for stopping the transfer robot is sent to the control device.

【0010】図4は、前記第4実施例と同様真空スイッ
チを使用する別の実施例としての第5実施例の側面図を
示し、第4実施例と異るのはフィンガ保持部20aの開
口26が通常塞がっていることで、衝突によりフィンガ
4が図で左方へ動くと開口26が開放され、真空度が低
下して真空スイッチ24aがONになる。図5は、さら
に別の実施例としての第6実施例のフィンガ保持部20
bの側面図であり、これ以外は図3と同様である。取付
部材21aの一側面にはフィンガ4が1枚、反対側に5
枚が取り付けられた双方向方式であり、弾性部材として
のばね23aも両側に備えられ開閉部材22bにある開
口26aは通常塞がれていて、この構造ではどちらの側
のフィンガが衝突しても第5実施例と同様に作動するこ
とができる。
FIG. 4 is a side view of a fifth embodiment as another embodiment using a vacuum switch similar to the fourth embodiment. The difference from the fourth embodiment is the opening of the finger holding portion 20a. Since 26 is normally closed, when the finger 4 moves to the left in the drawing due to a collision, the opening 26 is opened, the degree of vacuum is lowered, and the vacuum switch 24a is turned on. FIG. 5 shows a finger holding portion 20 of a sixth embodiment as yet another embodiment.
It is a side view of b, and is the same as that of FIG. 3 except this. One finger 4 is provided on one side of the attachment member 21a, and five fingers 4 are provided on the opposite side.
This is a two-way type in which sheets are attached, springs 23a as elastic members are also provided on both sides, and the opening 26a in the opening / closing member 22b is normally closed. In this structure, even if fingers on either side collide. It can operate as in the fifth embodiment.

【0011】[0011]

【発明の効果】上記の通り本発明によるウエ−ハ移載ロ
ボットのフィンガ衝突検知装置によれば、ロボットのア
−ム及び回転軸の中を電線を引き通す困難な作業を省く
とともに、屈曲した通路内に挿通して導かれ導線が捩れ
切れるような事故を防止することができる。
As described above, according to the finger collision detection device for a wafer transfer robot according to the present invention, it is possible to eliminate the difficult work of pulling an electric wire through the arm and the rotary shaft of the robot and to bend it. It is possible to prevent an accident in which the lead wire is inserted through the passage and is twisted.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明によるウエ−ハ移載ロボットのフィンガ
衝突検知装置の第1実施例の概要構成を示す平面図であ
る。
FIG. 1 is a plan view showing a schematic configuration of a first embodiment of a finger collision detection device for a wafer transfer robot according to the present invention.

【図2】第2実施例及び第3実施例を取り付けたロボッ
トの側面図である。
FIG. 2 is a side view of a robot to which the second embodiment and the third embodiment are attached.

【図3】第4実施例を取り付けたロボットの側面説明図
である。
FIG. 3 is a side view of a robot equipped with a fourth embodiment.

【図4】第5実施例を取り付けたロボットの側面説明図
である。
FIG. 4 is a side view of a robot to which the fifth embodiment is attached.

【図5】第6実施例のフィンガ保持部の側面図である。FIG. 5 is a side view of a finger holding portion according to a sixth embodiment.

【図6】第2実施例の振動センサによる出力曲線のグラ
フである。
FIG. 6 is a graph of an output curve of the vibration sensor according to the second embodiment.

【図7】従来のフィンガ衝突検知装置を取り付けたロボ
ットの平面図である。
FIG. 7 is a plan view of a robot equipped with a conventional finger collision detection device.

【図8】図7の側面図である。FIG. 8 is a side view of FIG. 7.

【図9】図7に示すフィンガ保持部の詳細平面図であ
る。
9 is a detailed plan view of the finger holder shown in FIG.

【符号の説明】[Explanation of symbols]

1 ウエ−ハ移載ロボット 2 本体 4 フィンガ 8a,23,23a 弾性部材 8b リミットスイッチ 10 衝突検知装置 11 受信器 12 検知回路 13 無線発信回路 13a アンテナ 14 バッテリ 15 振動発信器 17,17a 導線 18 加速度発信器 20 保持部 21 取付部材 22 開閉部材 24,24a 真空スイッチ 25 空気通路 26 開口 28 導線 DESCRIPTION OF SYMBOLS 1 Wafer transfer robot 2 Main body 4 Fingers 8a, 23, 23a Elastic member 8b Limit switch 10 Collision detection device 11 Receiver 12 Detection circuit 13 Wireless transmission circuit 13a Antenna 14 Battery 15 Vibration transmitter 17, 17a Conductor 18 Acceleration transmission Container 20 Holding part 21 Mounting member 22 Opening / closing member 24, 24a Vacuum switch 25 Air passage 26 Opening 28 Conductor wire

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 化学気相成長法により半導体デバイスを
製造する装置のウエ−ハキャリアとウエ−ハボ−トとの
間でウエ−ハを授受して移送するウエ−ハ移載ロボット
の本体のフィンガが他の部材と衝突したのを検知する衝
突検知手段と、この衝突検知手段からの信号に応じウエ
−ハ移載ロボットのそれ以上の運動を停止させる制御装
置とを有するウエ−ハ移載ロボットの衝突検知装置にお
いて、 前記衝突検知装置が、前記フィンガのウエ−ハ移載ロボ
ットの本体との接続端部側に装着されてフィンガの衝突
により変形するばねなどの弾性部材と、この弾性部材の
変形に応じて作動するリミットスイッチにより作動して
検知信号を発する検知回路と無線発信回路とを含む検知
・発信回路と、前記無線発信回路からの検知信号を無線
発信するアンテナと、前記の発信された検知信号を受信
する受信器とから成るウエ−ハ移載ロボットのフィンガ
衝突検知装置。
1. A main body of a wafer transfer robot for transferring and transferring a wafer between a wafer carrier and a wafer boat of an apparatus for manufacturing a semiconductor device by a chemical vapor deposition method. Wafer transfer having a collision detection means for detecting the collision of the finger with another member, and a control device for stopping further movement of the wafer transfer robot in response to a signal from the collision detection means. In a collision detection device for a robot, the collision detection device is attached to the connection end side of the finger with the main body of the wafer transfer robot, and an elastic member such as a spring that is deformed by the collision of the finger, and this elastic member. A detection / transmission circuit including a detection circuit and a wireless transmission circuit that operate by a limit switch that operates according to the deformation of the wireless communication circuit and that emits a detection signal, and an alarm signal that wirelessly transmits the detection signal from the wireless transmission circuit. And Tena, weather consisting of a receiver for receiving the originating on a detection signal - finger shock sensor Ha transfer robot.
【請求項2】 前記検知回路と無線発信回路とが所定の
時間間隔で信号を発するバッテリを電源として作動され
て、衝突検知信号を発するとともに前記の所定の時間間
隔で発信される信号の停止をバッテリの放電として継続
的に点検することを特徴とする請求項1記載のウエ−ハ
移載ロボットのフィンガ衝突検知装置。
2. The detection circuit and the wireless transmission circuit are operated by using a battery as a power source that emits a signal at a predetermined time interval to issue a collision detection signal and stop the signal transmitted at the predetermined time interval. The finger collision detection device for a wafer transfer robot according to claim 1, wherein the inspection is continuously performed as the discharge of the battery.
【請求項3】 化学気相成長法により半導体デバイスを
製造する装置のウエ−ハキャリアとウエ−ハボ−トとの
間でウエ−ハを授受して移送するウエ−ハ移載装置のフ
ィンガが他の部材と衝突したのを検知する衝突検知手段
と、この衝突検知手段からの信号に応じウエ−ハ移載ロ
ボットのそれ以上の運動を停止させる制御装置とを有す
るウエ−ハ移載ロボットにおいて、 前記衝突検知手段が前記ウエ−ハ移載ロボットの本体の
外部または内部に装着された振動発信器または加速度発
信器であり、前記発信器と制御装置との間が導線により
接続されることを特徴とするウエ−ハ移載ロボットのフ
ィンガ衝突検知装置。
3. A finger of a wafer transfer device for transferring and transferring a wafer between a wafer carrier and a wafer boat of a device for manufacturing a semiconductor device by a chemical vapor deposition method. A wafer transfer robot having a collision detection means for detecting a collision with another member and a controller for stopping further movement of the wafer transfer robot in response to a signal from the collision detection means. The collision detection means is a vibration transmitter or an acceleration transmitter mounted on the outside or inside of the main body of the wafer transfer robot, and the transmitter and the control device are connected by a conductor. Characteristic finger collision detection device for wafer transfer robot.
【請求項4】 化学気相成長法により半導体デバイスを
製造する装置のウエ−ハキャリアとウエ−ハボ−トとの
間でウエ−ハを授受して移送するウエ−ハ移載ロボット
のフィンガが他の部材と衝突したのを検知する衝突検知
手段と、この衝突検知手段からの信号に応じて、ウエ−
ハ移載ロボットのそれ以上の運動を停止させる制御装置
とを有するウエ−ハ移載ロボットにおいて、 前記衝突検知手段は、前記フィンガのウエ−ハ移載ロボ
ットの本体と接続される側に装着され、前記フィンガの
衝突により移動するフィンガ取付部材とこの取付部材と
の相対移動により空気流入口を閉又は開とする開閉部材
とから成る保持部と、前記ウエ−ハ移載ロボット本体の
内部に装着され常時真空ポンプにより減圧され減圧度の
所定値以上の増減によりONとなる真空スイッチと、こ
の真空スイッチと前記開閉部材との間を連通させる空気
通路とを有し、前記開閉部材による空気流入口の開また
は閉による前記空気通路系内の減圧度の増減による真空
スイッチのON動作が、検知信号として導線により前記
制御装置に送られることを特徴とするウエ−ハ移載ロボ
ットのフィンガ衝突検知装置。
4. A finger of a wafer transfer robot for transferring and transferring a wafer between a wafer carrier and a wafer boat of an apparatus for manufacturing a semiconductor device by a chemical vapor deposition method. A collision detection means for detecting a collision with another member and a wafer in response to a signal from the collision detection means.
In a wafer transfer robot having a controller for stopping further movement of the transfer robot, the collision detection means is mounted on the side of the finger connected to the main body of the transfer robot. , A holding portion including a finger mounting member that moves due to the collision of the fingers and an opening / closing member that closes or opens the air inlet by relative movement of the mounting member, and is mounted inside the wafer transfer robot body. A vacuum switch that is constantly depressurized by a vacuum pump and is turned on when the degree of depressurization is increased or decreased by a predetermined value or more, and an air passage that connects the vacuum switch and the opening / closing member to each other. The ON operation of the vacuum switch due to the increase or decrease in the degree of pressure reduction in the air passage system due to the opening or closing of the valve is sent to the control device by a conductor as a detection signal. Finger collision detection device for wafer transfer robot.
【請求項5】 請求項4記載のフィンガ衝突検知装置に
おいて、前記フィンガ取付部材は、その一方側に単数の
フィンガが、他方側に複数のフィンガが装着され、その
一方側と他方側が弾性部材により対向する方向に押圧さ
れて空気流入口が閉または開にされた状態で平衡状態に
保たれていることを特徴とするウエ−ハ移載ロボットの
フィンガ衝突検知装置。
5. The finger collision detection device according to claim 4, wherein the finger mounting member is provided with a single finger on one side thereof and a plurality of fingers on the other side thereof, and one side and the other side thereof are made of elastic members. A finger collision detection device for a wafer transfer robot, wherein the finger collision detection device is maintained in an equilibrium state with the air inlets closed or opened by being pressed in opposite directions.
JP16499993A 1993-06-11 1993-06-11 Finger collision detector of wafer transfer robot Pending JPH06349930A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16499993A JPH06349930A (en) 1993-06-11 1993-06-11 Finger collision detector of wafer transfer robot

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16499993A JPH06349930A (en) 1993-06-11 1993-06-11 Finger collision detector of wafer transfer robot

Publications (1)

Publication Number Publication Date
JPH06349930A true JPH06349930A (en) 1994-12-22

Family

ID=15803925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16499993A Pending JPH06349930A (en) 1993-06-11 1993-06-11 Finger collision detector of wafer transfer robot

Country Status (1)

Country Link
JP (1) JPH06349930A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997043784A1 (en) * 1996-05-10 1997-11-20 Komatsu Ltd. Wafer cassette mounting device and wafer inspection device equipped with the same
WO1999065652A1 (en) * 1998-06-19 1999-12-23 Tregaskiss Ltd. Wireless safety clutch
US6282459B1 (en) 1998-09-01 2001-08-28 International Business Machines Corporation Structure and method for detection of physical interference during transport of an article
JP2002507846A (en) * 1998-03-20 2002-03-12 ブルックス オートメーション インコーポレイテッド Substrate transfer method with different holding end effectors
KR20040017614A (en) * 2002-08-22 2004-02-27 동부전자 주식회사 Wafer Transferring Method
JP2010023153A (en) * 2008-07-17 2010-02-04 Kawasaki Heavy Ind Ltd Robot finger and robot hand equipped with the same
JP2010157612A (en) * 2008-12-26 2010-07-15 Ihi Corp Flotation conveyance device and flotation conveyance method
JP2012211780A (en) * 2011-03-30 2012-11-01 Fuji Heavy Ind Ltd Pressed article inspection device
JP2015013329A (en) * 2013-07-04 2015-01-22 キヤノン株式会社 Production apparatus
CN110576455A (en) * 2019-08-02 2019-12-17 浙江大学 Multi-degree-of-freedom modular collision detection and protection device for image robot
WO2020157967A1 (en) * 2019-02-01 2020-08-06 株式会社Kokusai Electric Substrate processing device and method for manufacturing semiconductor device

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997043784A1 (en) * 1996-05-10 1997-11-20 Komatsu Ltd. Wafer cassette mounting device and wafer inspection device equipped with the same
JP2016154248A (en) * 1998-03-20 2016-08-25 ブルックス オートメーション インコーポレイテッド Substrate transfer device with different holding end effectors
JP2002507846A (en) * 1998-03-20 2002-03-12 ブルックス オートメーション インコーポレイテッド Substrate transfer method with different holding end effectors
JP2010287902A (en) * 1998-03-20 2010-12-24 Brooks Automation Inc Device for transferring substrates with different holding end effectors
WO1999065652A1 (en) * 1998-06-19 1999-12-23 Tregaskiss Ltd. Wireless safety clutch
US6282459B1 (en) 1998-09-01 2001-08-28 International Business Machines Corporation Structure and method for detection of physical interference during transport of an article
KR20040017614A (en) * 2002-08-22 2004-02-27 동부전자 주식회사 Wafer Transferring Method
JP2010023153A (en) * 2008-07-17 2010-02-04 Kawasaki Heavy Ind Ltd Robot finger and robot hand equipped with the same
JP2010157612A (en) * 2008-12-26 2010-07-15 Ihi Corp Flotation conveyance device and flotation conveyance method
JP2012211780A (en) * 2011-03-30 2012-11-01 Fuji Heavy Ind Ltd Pressed article inspection device
JP2015013329A (en) * 2013-07-04 2015-01-22 キヤノン株式会社 Production apparatus
WO2020157967A1 (en) * 2019-02-01 2020-08-06 株式会社Kokusai Electric Substrate processing device and method for manufacturing semiconductor device
JPWO2020157967A1 (en) * 2019-02-01 2021-10-14 株式会社Kokusai Electric Manufacturing method of substrate processing equipment and semiconductor equipment
CN110576455A (en) * 2019-08-02 2019-12-17 浙江大学 Multi-degree-of-freedom modular collision detection and protection device for image robot
CN110576455B (en) * 2019-08-02 2024-04-09 浙江大学 Modularized collision detection and protection device for multi-degree-of-freedom image robot

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