JPH06349894A - Electronic component equipment - Google Patents

Abstract

PURPOSE:To accurately position an integrated circuit parts on a board, and improve workability at the time of mounting, when the integrated circuit parts is mounted on the board. CONSTITUTION:Bumps 25 for position alignment which largely protrude more downward than each bump 24 for signal are formed on the lower side surface of a chip 21, and each land 27 is formed in the position corresponding with each of the bumps 25 for position alignment on a board 26. When the chip 21 is mounted on the board 26, a connection part 25B of each of the bumps 25 for position alignment is heated and fused. By the effect of the surface tension of the connection parts 25B turned into the state of liquid, the chip 21 is positioned accurately on the board 26.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component device suitably used for mounting integrated circuit components such as LSI and VLSI on a land of a substrate.

[0002]

2. Description of the Related Art Generally, an integrated circuit component such as an LSI is mounted on each land of a substrate by a bonding method such as fusion bonding or solid phase diffusion bonding.

Therefore, FIGS. 17 and 18 show an electronic component device using fusion bonding as a first conventional technique.

In the figure, 1 indicates a chip as an integrated circuit component, and the chip 1 is a chip body 2, a circuit portion 3, which will be described later.
It is composed of each bump 4. Then, the chip 1 is electrically connected to a substrate 5 described later through each bump 4.

Reference numeral 2 denotes a chip body, which is formed in a square shape from an insulating material such as ceramic or resin and has a circuit portion 3 therein. And the chip body 2
The central portion of the lower surface serves as a circuit mounting portion 2A to which the circuit portion 3 is attached, and the circuit portion 3 is generally composed of a large number of semiconductor elements and wirings (not shown) for connecting them to each other.

Reference numerals 4, 4, ... Depict bumps provided as electrodes on the lower surface of the chip body 2 and connected to the circuit portion 3. Each of the bumps 4 is surrounded from the outside of the circuit mounting portion 2A. They are provided on the lower surface of the chip body 2 with a minute interval (for example, about 150 μm). Each of the bumps 4 is composed of a base end side electrode portion 4A and a tip end side connection portion 4B, and the electrode portion 4A is formed of a conductive material in a thin flat plate shape having a diameter of about 80 μm. ing. The connecting portion 4B of each bump 4 is formed in a hemispherical shape by a conductive material such as solder that melts at a relatively low temperature of about 150 degrees, and protrudes from the lower surface of the chip 2 toward the substrate 5. There is.

Reference numeral 5 denotes a substrate formed in a thin plate shape with an insulating material such as a ceramic material, a glass material or a resin material, and a wiring portion formed with a conductive material such as copper on the surface of the substrate 5 (see FIG. (Not shown). 6, 6, ...
Indicates a land formed on the wiring portion, and each land 6
Is formed at a position corresponding to each bump 4 of the chip 1 with an area approximately equal to the surface of the electrode portion 4A of each bump 4.

The electronic component device according to the prior art has the structure as described above. Next, a work procedure for mounting the chip 1 on the substrate 5 will be described.

First, flux is applied to each land 6 on the substrate 5 and its periphery, and the chip 1 is positioned on the substrate 5 so that each bump 4 of the chip 1 abuts each land 6 of the substrate 5. Then, in this state, the connection portion 4B of each bump 4 is melted by heating from the surroundings and bonded to each land 6. After joining, the flux and dust adhering during mounting work are cleaned.

With the above-described work procedure, the chip 1
The bumps 4 are electrically connected to the lands 6 of the substrate 5, and the chip 1 is mounted on the substrate 5.

The first prior art described above has exemplified the case where fusion bonding is adopted for bonding each bump 4 and each land 6, but solid phase diffusion is carried out for bonding each bump 4 and each land 6. Bonding may be adopted, and in this case, a conductive material having a high melting point is used for the connecting portion 4B of each bump 4. Then, when performing solid phase diffusion bonding, the chip 1 is pressed onto the substrate 5 using a bonding tool (not shown) so that each bump 4 of the chip 1 is brought into contact with each land 6 of the substrate 5, In this state, each bump 4 and each land 6 is heated from the outside.
The chips 1 and the substrate 5 are connected to each other by solid-phase diffusion bonding so as to be in close contact with each other.

Next, the second conventional technique will be described with reference to FIGS.
It shows in 0.

In the figure, reference numeral 11 denotes a flat package as an integrated circuit component, and the flat package 11 is a package body 12 formed in a square shape from a resin material or the like.
And a circuit portion 13 provided in the package body 12
And lead terminals 14, 14 as electrodes provided so as to project from the package body 12 to the front, rear, left, and right.
It consists of and.

The lead terminals 14 are arranged in a large number of rows with the lead terminals 14 adjacent to each other with a minute gap, and an intermediate portion thereof is bent toward a substrate 15 described later,
The tip portion is bent outward with respect to the package body 12,
It is an abutting portion 14A for each land 16. The base end side of each lead terminal 14 is electrically connected to each input / output terminal (not shown) of the circuit section 13 inside the package body 12.

Reference numeral 15 denotes a substrate formed of an insulating material such as a ceramic material, a glass material or a resin material, and a wiring portion (not shown) is provided on the surface of the substrate 15 with a conductive material such as copper. , The lead terminals 14 in the wiring portion
The land 16, 16, ...
Are formed.

The second prior art has the above-mentioned structure. Next, the mounting operation of the flat package 11 on the substrate 15 will be described.

First, the solder paste is applied to each land 16 of the substrate 15, and the flat package 11 and the substrate 15 are positioned so that the contact portion 14A of each lead terminal 14 contacts each corresponding land 16. To do. Then, in that state, the solder paste is melted by heating from the surroundings to bond the lead terminals 14 and the lands 16 to each other.

[0018]

In the first prior art, the mounting work of the chip 1 on the substrate 5 is performed by using a component mounting device such as a flip chip bonder. However, since the interval between the bumps 4 of the chip 1 is as small as 150 μm, it is difficult to accurately position and mount the chip 1 on the substrate 5, and the chip 1 and the substrate 5 are misaligned and mounted. Causes mounting failure.

That is, the chip 1 is mounted on the substrate 5 by fusion bonding.
If the chip 1 is slightly displaced from the substrate 5 in the process before the chip 1 is bonded to the substrate 5, the bump 4 corresponds to the predetermined bump 4 as shown in FIG. There is a problem that it is difficult to bond the land 6 and the adjacent land 6 to each other in a normal bonding state as shown in FIG.

Even in the case of solid phase diffusion bonding, the chip 1
If the position of the chip 1 with respect to the substrate 5 deviates even slightly during the mounting work on the substrate 5, the tip portion of the bump 4 is located between the land 6 and the land 6 adjacent to the bump 6, as shown in FIG. There is a problem that defective bonding occurs.

Further, also in the second conventional technique, a defect occurs in which the lead terminals 14 are not accurately joined to the corresponding lands 16 respectively, and the yield is deteriorated during the production of the electronic component device, and the productivity is improved. There is a problem that it cannot be improved.

On the other hand, in order to prevent the positional displacement between the chip 1 or the flat package 11 and the substrate 5 or the substrate 15, a highly accurate component mounting device (for example, a mounting error of ± 50 μm or less) is used. Alternatively, if the flat package 11 is mounted on the substrate 5 or the substrate 15, the occurrence of mounting defects can be reduced. However, in this case, since a high-precision component mounting apparatus is used, the cost is high and the production cost of the electronic component apparatus is high.

The present invention has been made in view of the above-mentioned problems of the prior art. The present invention automatically mounts integrated circuit components on a substrate when the integrated circuit components such as chips and flat packages are mounted on the substrate. It is an object of the present invention to provide an electronic component device which can be positioned and which greatly simplifies mounting work.

[0024]

In order to solve the above-mentioned problems, the invention of claim 1 is directed to an integrated circuit component provided with a large number of electrodes and an integrated circuit component for mounting the integrated circuit component. In an electronic component device including an insulating substrate on which a wiring portion having a large number of lands corresponding to each electrode is formed, at least three or more electrodes separated from each other among the respective electrodes of the integrated circuit component, It employs a configuration characterized in that it is formed as a positioning electrode that projects more toward the substrate side than the other electrodes, and that each positioning electrode is made of a conductive material that melts when heated.

According to the second aspect of the present invention, an integrated circuit component provided with a large number of electrodes and a wiring having a large number of lands corresponding to each electrode of the integrated circuit component for mounting the integrated circuit component. In an electronic component device including an insulative substrate on which parts are formed, at least three or more lands separated from each other among the lands of the substrate largely protrude toward the integrated circuit component side, and melt when heated. The structure adopts a feature that a connection portion made of a conductive material is provided.

[0026]

With the above structure, according to the invention of claim 1, at the time of mounting work of the integrated circuit component on the substrate, each positioning electrode of the integrated circuit component is brought into contact with each land of the corresponding substrate, and this state is maintained. When each of the positioning electrodes is heated and melted by, the molten positioning electrodes are automatically closest to the position of the corresponding land due to the surface tension of the material, and the position of the integrated circuit component with respect to the substrate is increased. The gap can be corrected automatically.

According to the second aspect of the invention, at the time of mounting the integrated circuit component on the substrate, each electrode of the integrated circuit component is brought into contact with each connecting portion of the substrate, and each connecting portion is melted in that state. By doing so, the respective connection portions in the molten state are automatically closest to the corresponding land positions due to the surface tension of the material, and the positional deviation of the integrated circuit component with respect to the substrate can be automatically corrected.

[0028]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

1 to 6 show a first embodiment of the present invention. In this embodiment, a case where a chip is used as an integrated circuit component will be described as an example. Further, as a method of joining each electrode and each land of the substrate, fusion bonding is used as an example.

In the figure, reference numeral 21 denotes a chip as an integrated circuit component, and the chip 21 is composed of a chip body 22, a circuit portion 23, signal bumps 24 and positioning bumps 25 which will be described later. Then, the chip 21 is mounted on the substrate 26.

Reference numeral 22 denotes a chip body, and the chip body 2
Reference numeral 2 is formed in a rectangular shape with an insulating material such as ceramic or resin, and has a circuit portion 23 built therein. The central portion of the lower side surface of the chip body 22 serves as a circuit mounting portion 22A to which the circuit portion 23 is attached. It is configured.

Reference numerals 24, 24, ... Show signal bumps as electrodes provided on the lower surface of the chip body 22. The signal bumps 24 are similar to the bumps 4 described in the prior art. It is composed of a portion 24A and a connecting portion 24B, and is arranged in multiple rows so as to surround the circuit mounting portion 22A of the chip body 22 from the outside. Also, the electrode portion 24A
Are electrically connected to the circuit portion 23, and each signal bump 24 serves as an input / output terminal of the circuit portion 23.

Denoted by 25, 25, ... are positioning bumps as four positioning electrodes, which are located outside each signal bump 24 and are provided at four corners of the lower surface of the chip body 22 at a distance from each other. Although each positioning bump 25 is composed of an electrode portion 25A and a connection portion 25B in the same manner as each signal bump 24, each positioning bump 25 has a connection portion 25B connected to each signal bump 24. Part 24B
It is formed so as to largely project toward the substrate 26. The electrode portion 25A of the positioning bump 25 is electrically connected to the circuit portion 23 and also functions as an input / output terminal of the circuit portion 23.

Reference numeral 26 denotes a substrate, which is made of an insulating material in substantially the same manner as the first prior art substrate 5. A wiring portion (not shown) made of a conductive material is provided on the substrate 26.

Denoted by 27, 27, ... are lands provided in the middle of the wiring portion. The lands 27 are provided at positions corresponding to the signal bumps 24 and the positioning bumps 25, respectively. The bumps 24 and the positioning bumps 25 are formed to have substantially the same area as the surfaces of the electrode portions 24A, 24A.

The electronic component device according to this embodiment has the above-mentioned structure. Next, the procedure for mounting the chip 21 on the substrate 26 will be described with reference to FIGS.

First, as shown in FIG. 3, flux 28 is applied to each land 27 of the substrate 26 and its periphery, and then the connecting portion 25B of each positioning bump 25 is brought into contact with each corresponding land 27. The chip 21 is placed on the substrate 26 so as to be. At this time, each positioning bump 2
5 and the respective lands 27 corresponding thereto may be positioned by contacting the protruding end side of the connection portion 25B of each positioning bump 25 with a part of the corresponding land 27, and not necessarily the connection portion 25B. Each land 27 corresponding to the protruding end side
Does not have to be accurately brought into contact with the central portion of each (in FIG. 3, the state where each positioning bump 25 is slightly displaced from each corresponding land 27 is intentionally shown). .

Next, the chip 21 and the substrate 26 are heated from the surroundings to a temperature at which the connecting portion 25B of each positioning bump 25 melts. Then, each positioning bump 2
When the connection portion 25B of No. 5 is melted, the connection portion 25B of each positioning bump 25 becomes liquid and surface tension is generated, so that the electrode portion 25A of each positioning bump 25 faces the corresponding land 27. , The chip 21 is moved toward a predetermined correct position. At this time, as shown in FIG. 4, the chip 21 is automatically positioned and accurately positioned with respect to the substrate 26.

After that, the chip 21 and the substrate 26 are further heated from the outside, and the connection portions 24B of the signal bumps 24 are formed.
When the chip 21 is pressed against the substrate 26 so as to be melted, the connection portions 24B of the signal bumps 24 and the corresponding lands 27 are melt-bonded as shown in FIG. After that, the flux 28 and dusts attached during the mounting work are cleaned.

Thus, according to this embodiment, the chip 21
Positioning bumps 25 are formed on the lower surface of the lower surface so as to project more toward the substrate 26 than the signal bumps 24, and when the chip 21 is mounted on the substrate 26, the chips are heated and melted from the outside. Connection part 25B of the positioning bump 25
Since the position of the chip 21 is adjusted by utilizing its surface tension and the chip 21 is automatically positioned with respect to the substrate 26,
The chip 21 can be accurately positioned and mounted on the substrate 26, and it is not necessary to use a high-precision component mounting device during mounting work, and the cost can be reduced.

Therefore, in the present embodiment, when the electronic component device is manufactured, mounting defects of the chips 21 can be greatly reduced, the yield can be improved, and the productivity can be surely enhanced.

In the first embodiment, the positioning bumps 25 are provided on the lower side of the chip 21 at four corners.
However, the present invention is not limited to this, and three or more positioning bumps may be provided. For example, three positioning bumps are provided on the lower surface of the chip 21 as in the modification shown in FIG. You may make it the structure which provides 25 ', 25', 25 '.

In the first embodiment, the method of joining the signal bumps 24 and the lands 27 is explained by fusion joining, but the present invention is not limited to this.
Alternatively, solid-phase diffusion bonding may be used as the method of bonding the land 4 and each land 27. In this case, of the signal bumps 24, a conductive material having a high melting point may be used for the connection portions 24B of the signal bumps 24. Even in this case, the mounting work of the chip 21 on the substrate 26 is There is no particular difference from the mounting work of the first embodiment except that the signal bumps 24 are solid-phase diffusion bonded to the corresponding lands 27.

Next, FIGS. 7 to 11 show a second embodiment of the present invention. In this embodiment, a case where a flat package is used as an integrated circuit component will be described as an example.

In the figure, reference numeral 41 denotes a flat package as an integrated circuit component. The flat package 41 is used as a package main body 42, a circuit portion 43 and an electrode as in the flat package 11 described in the second prior art. Of the lead terminals 44, 44, ..., Each of the lead terminals 44 is formed with an abutting portion 44A that abuts on each of the signal lands 47 of the substrate 46 described later.

45 is a package main body 42.
A plurality of positioning bumps serving as positioning electrodes are provided on the lower side surface of each of the positioning bumps 45, and each positioning bump 45 has an electrode portion 45A, similar to each positioning bump 25 described in the first embodiment. It is composed of a connecting portion 45B. The electrode portion 45A is electrically connected to the circuit portion 43 and also functions as an input / output terminal of the circuit portion 43.

Reference numeral 46 denotes a substrate formed of an insulating material in a thin plate shape, and a wiring portion (not shown) made of a conductive material such as copper is provided on the surface of the substrate 46. And
The contact portion 44 of each lead terminal 44 is provided in the middle of the wiring portion.
The signal lands 47, 47, ... Are provided at positions corresponding to A, and the positioning lands 48, 48 ... Are provided at positions corresponding to the respective positioning bumps 45.

The electronic component device according to this embodiment has the above-mentioned structure. Next, the mounting operation of the flat package 41 on the substrate 46 will be described with reference to FIGS.

First, as shown in FIG. 9, solder paste 49 is arranged on each signal land 47 of the substrate 46, and flux 50 is applied to each positioning land 47. And
The flat package 41 is positioned with respect to the substrate 46 so that the connecting portions 45B of the positioning bumps 45 contact the corresponding positioning lands 48, respectively.

Next, as shown in FIG. 10, the flat package 41 and the substrate 46 are heated from the surroundings to melt the positioning bumps 45. Then, the displacement of the flat package 41 with respect to the substrate 46 is corrected by the surface tension of each of the positioning bumps 45 which have become liquid.

Further, the flux 50 is added to each signal land 47, and the solder paste 4 on each signal land 47 is added.
9 is melted and each lead terminal 44 and each signal land 47 is melted.
And are melt-bonded as shown in FIG.

Thus, according to the present embodiment, each positioning bump 45 is provided on the lower surface of the flat package 41, and each mounting bump 45 is melted in advance when mounting the flat package 41 on the substrate 46. By using the surface tension, the flat package 41 is automatically adjusted in position with respect to the substrate 46.
The flat package 41 can be accurately positioned and mounted on the substrate 46 without using a high-accuracy component mounting apparatus, and the same effects as those of the first embodiment can be obtained.

Next, FIGS. 12 to 16 show the third embodiment of the present invention.
In this embodiment, the same components as those in the second embodiment described above are designated by the same reference numerals, and the description thereof will be omitted.

In the figure, reference numerals 61, 61, ... Show a plurality of positioning electrode portions provided on the lower surface of the flat package 41, and each electrode portion 61 is formed of a conductive material in a thin circular flat plate shape. ing. Each of the electrode portions 61 is electrically connected to the circuit portion 43 and also functions as an input / output terminal of the circuit portion 43.

Reference numerals 62 and 62 denote connection portions provided on the respective positioning lands 48 on the substrate 46, and the respective connection portions 62.
Is formed of a conductive material such as solder that melts at a low temperature, and protrudes toward the flat package 41 side.

The electronic component device according to the present embodiment has the above-described structure. Next, the procedure for mounting the flat package 41 on the substrate 46 having the connecting portions 62 will be described with reference to FIG.
It will be described with reference to FIGS.

First, as shown in FIG. 14, the flat package 41 and the substrate 46 are positioned so that the electrode portions 61 are brought into contact with the connecting portions 62 of the substrate 46.

Next, as shown in FIG. 15, the flat package 41 and the substrate 46 are externally heated to melt the connecting portion 62 provided on the positioning land 48 of the substrate 46. At this time, the melted connecting portions 62 adjust the position of the flat package 41 on the substrate 46 by the surface tension so that the electrode portions 61 of the flat package 41 come close to each other, and the positional deviation between the two is automatically corrected. It

Further, the solder paste 63 is applied to each of the signal lands 47 in a heated and melted state, and each lead terminal 44 and each of the signal lands 47 are joined together as shown in FIG.

Thus, also in this embodiment, the substrate 46
The respective connecting portions 62 made of solder or the like are provided on the respective positioning lands 48, and the flat package 41 can be accurately positioned and mounted on the substrate 46 by the surface tension when the respective connecting portions 62 are melted. It is possible to obtain substantially the same operational effect as the second embodiment.

In each of the above embodiments, each positioning bump 25 (45) or electrode portion 61 is connected to the circuit portion 23 (4).
3) is electrically connected to function as an input / output terminal of the circuit portion 23 (43), but the present invention is not limited to this, and each positioning bump 25 (45) or each electrode portion. 61 may not be electrically connected to the circuit section 23 (43) but may be used only for positioning.

[0062]

As described above in detail, according to the first aspect of the invention, among the many electrodes provided in the integrated circuit component, at least three or more electrodes separated from each other are provided on the substrate side more than the other electrodes. Since each of the positioning electrodes is formed of a conductive material that melts when heated, each positioning electrode that is heated and melted is mounted when the integrated circuit component is mounted on a substrate. Due to the surface tension of, the integrated circuit component can be accurately positioned on the substrate, and the workability at the time of mounting can be greatly improved.

According to the second aspect of the present invention, among a large number of lands provided on the substrate, at least three or more lands spaced apart from each other greatly protrude toward the integrated circuit component side, and are electrically conductive to melt when heated. Since the connecting portion made of the material is provided, when mounting the integrated circuit component on the substrate,
Due to the surface tension of each connection portion that is heated and melted, the integrated circuit component can be accurately positioned on the substrate, and the workability during mounting can be reliably improved.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional view showing a state before a chip according to a first embodiment of the present invention is mounted on a substrate.

FIG. 2 is a perspective view of the chip shown in FIG.

FIG. 3 is a vertical cross-sectional view showing a state before positioning a chip on a substrate.

FIG. 4 is a vertical cross-sectional view showing a state in which a chip is positioned with respect to a substrate.

FIG. 5 is a vertical cross-sectional view showing a state where mounting of a chip on a substrate is completed.

FIG. 6 is a perspective view showing a modified example of a chip on which three positioning bumps are formed.

FIG. 7 is a vertical cross-sectional view showing a state before the flat package according to the second embodiment is mounted on a substrate.

FIG. 8 is a perspective view of the flat package shown in FIG.

FIG. 9 is a vertical cross-sectional view showing a state before positioning the flat package on the substrate.

FIG. 10 is a vertical cross-sectional view showing a state in which the flat package is positioned with respect to the substrate.

FIG. 11 is a vertical cross-sectional view showing a state where mounting of a flat package on a substrate is completed.

FIG. 12 is a vertical cross-sectional view showing a state before the flat package according to the third embodiment is mounted on a substrate.

13 is a perspective view of the flat package shown in FIG.

FIG. 14 is a vertical cross-sectional view showing a state before positioning the flat package on the substrate.

FIG. 15 is a vertical cross-sectional view showing a state in which the flat package is positioned with respect to the substrate.

FIG. 16 is a vertical cross-sectional view showing a state where mounting of a flat package on a substrate is completed.

FIG. 17 is a vertical cross-sectional view showing a state before the chip according to the first conventional technique is mounted on the substrate.

FIG. 18 is a perspective view of the chip shown in FIG.

FIG. 19 is a vertical cross-sectional view showing a state before a flat package according to a second conventional technique is mounted on a substrate.

20 is a perspective view of the flat package shown in FIG. 19. FIG.

FIG. 21 is an enlarged view of an essential part showing a state in which a bump is melt-bonded to a land.

FIG. 22 is an enlarged view of an essential part showing a defective state when the bump is melt-bonded to the land.

FIG. 23 is an enlarged view of an essential part showing a defective state when the bump is solid-phase diffusion bonded to the land.

[Explanation of symbols]

 Reference Signs List 21 chip (integrated circuit part) 24 signal bump (electrode) 25 positioning bump (positioning electrode) 25A, 45A, 61 electrode part 25B, 45B, 62 connection part 26 substrate 27 land 41 flat package (integrated circuit part) 44 Lead terminal (electrode) 45 Positioning bump (positioning electrode) 46 Substrate 47 Signal land 48 Positioning land

Claims (2)

[Claims] 1. An insulating property having an integrated circuit component provided with a large number of electrodes and a wiring portion having a large number of lands corresponding to each electrode of the integrated circuit component for mounting the integrated circuit component. In the electronic component device including the substrate, at least three electrodes separated from each other among the electrodes of the integrated circuit component are formed as positioning electrodes that protrude more largely toward the substrate than other electrodes. An electronic component device, wherein each of the positioning electrodes is formed of a conductive material that melts when heated. 2. An insulating property having an integrated circuit component provided with a large number of electrodes and a wiring portion having a large number of lands corresponding to each electrode of the integrated circuit component for mounting the integrated circuit component. In the electronic component device including the substrate, at least three or more lands separated from each other among the lands of the substrate are connected to each other by a conductive material that largely protrudes toward the integrated circuit component side and melts when heated. An electronic component device having a section.