JPH0634048Y2 - Automatic soldering equipment - Google Patents

Description

[Detailed Description of the Invention] (Industrial field of application) The present invention is suitable for soldering a work such as a sheet-like electric component such as a flexible printed wiring board which is easily separated from the circuit board to be joined. The present invention relates to an automatic soldering device.

(Prior Art) With respect to this invention, it is known that soldering is automatically performed using a unitized soldering machine (hereinafter referred to as a soldering machine unit).

For example, when soldering a flexible printed wiring board (hereinafter simply referred to as a wiring board) to a circuit board, the bending reaction force during assembly may cause the wiring board to float away from the circuit board, or internal surface stress may cause the board surface to float. May warp. In this way, if soldering is performed while the wiring board is floating, the wiring board may float before the solder is solidified and the bonding may fail or the joint may become extremely thin. Invite. In order to prevent this, it is advisable to press the wiring board against the circuit board so that they are in close contact with each other and maintain that state until the solder is completely solidified. Conventionally, this wiring board was manually held.

(Problems to be Solved by the Invention) It is not impossible to perform the work of holding the wiring board by holding it by hand instead of manually. For example, a jig for posture correction is provided on the side of the circuit board, and with this, it is easy to hold and hold the wiring board in an appropriate joining posture. Further, it is also possible to bring the wiring board into close contact with the circuit board by an automatic device provided separately from the soldering machine unit and maintain that state until the solder is solidified, without causing much difficulty to the left.

However, when using a jig for posture correction, there is a disadvantage that the jig must be set manually or by an automatic device, and if the posture of the wiring board is held by an automatic device, the whole soldering work requires. Device cost will increase.

The present invention has been proposed in view of the above, and a work holding means utilizing the soldering operation of an existing automatic soldering device is used to hold a work such as a wiring board with a constant pressing force and hold the wiring board. It is an object of the present invention to perform soldering work of a work, etc., reliably and accurately without damaging the work and at low cost.

(Means for Solving the Problem) In the present invention, a work holding means is provided in the fixing body of the automatic soldering device, and the work holding means holds and holds the work in an appropriate posture prior to the soldering operation. Even after completion, the work can be held and held until the solder is solidified.

Specifically, the solving means of the present invention is an automatic soldering device for automatically soldering a work, which is made up of electric components positioned and temporarily fixed on the circuit board, to the circuit board. A fixed machine body that moves up and down between a rising end position as a non-working state and a descending end position value as a work state above the work, and a vertical movement at the lower end of the fixed machine body to move back and forth with respect to the work. A soldering machine unit having a trowel chip for supplying molten solder to a work at a lower end, and the fixing machine body in a working state in which the soldering machine unit is located at a descending end position. Driving means for vertically moving the iron tip to a soldering position where it supplies molten solder to the work and descends to perform soldering, and a standby position which waits above it, and is provided in a hanging shape on the side of the fixed machine body. Be And a guide support member that extends in the vertical direction and has a locking portion that projects laterally on the lower side, and the above-mentioned engagement at the lower end position that is slidably supported by the guide support member in the vertical direction and that is lowered by its own weight. The stationary machine body has an engaging portion that is suspended by being engaged with the stopper, and the stationary machine body comes into contact with the work in advance while descending from the ascending end position, and contacts the work at the descending end position of the stationary machine body. A pressing body that slides up relative to the guide support member so that the engaging portion is separated from above the locking portion while being in contact, and the pressing body is urged downward to properly position the workpiece. And a spring for applying a predetermined pressing force to the work by the pressing body when the fixing machine body is located at the descending end position so as to be pressed and held.

Preferably, the guide support member is displaceably supported with respect to the fixed machine body in a use posture parallel to the solder machine unit and a retracted posture separated laterally from the solder machine unit.

(Operation) Accordingly, in the present invention, when the fixed machine body is lowered to the lower end position in order to perform the soldering work, the pressing body precedes the work piece in contact with the work piece during the downward movement, and the fixed body body does not further descend. Only the chisel descends to the descending end position. Along with that,
Under the guide of the guide support member, the pressing body slides upward relative to the stationary machine body against the biasing force of the spring, and at the lower end position of the stationary machine body, a predetermined pressing force is applied to the work by the spring. It is pressed and held in an appropriate posture under the action of. After that, the soldering machine unit can be lowered without any trouble, and it is lowered to the half attachment position to solder the work with the iron tip, and even after returning to the standby position above after the soldering, the pressing body keeps the work at a predetermined position during the return. The state in which the solder is pressed and held by the pressing force is continuously maintained, and the solder is surely solidified while the work is held in an appropriate posture.

In this way, when the fixing machine body is moved down from the non-working state to the working state, the pressing body is relatively slid and moved upward and is urged downward by the spring. Even after that, the work is pressed and held with a predetermined pressing force, so that the work can be reliably soldered in a proper posture without being damaged and without causing positional displacement, and this soldering work can be performed at low cost. It can be carried out.

(Embodiment) FIGS. 1 to 8 show an embodiment of the present invention.

In FIG. 4, the automatic soldering apparatus is configured so that a fixed machine body 1 supported by an operating means such as an industrial robot, a solder machine unit 2 vertically movably supported by a lower end portion of the fixed machine body 1, and a work W are properly arranged. It is composed of a work holding means 3 and the like that holds the work piece in a proper joining posture. The workpiece W to be joined is
A sheet-like electric component represented by a flexible printed wiring board, which is positioned and mounted on a circuit board, and one end of which is temporarily fixed by a screw 5. In this fixed state, the free end of the work W floats away from the plate surface of the substrate 4. The board 4 is assumed to be fixed at a predetermined position for soldering.

The soldering machine unit 2 is a commercially available product, and a trowel chip 8 is fixed by a chuck 9 to the lower end of a slide arm 7 containing a heater (not shown), and the solder wire 10 is directed toward the tip of the trowel chip 8. A guide pipe 11 for guiding feeding and an air blowing pipe 12 are arranged. A bracket 13 is fixed between the slide arm 7 and the chuck 9, and an L-shaped holder 14 supported by the bracket 13 so as to be vertically swingable supports both the tubes 11, 1.
Holds 2 in a fixed position. In order to facilitate the replacement work of the iron tip 8, the holder 14 can be flipped up and rocked as shown by an imaginary line in FIG. 15 is a stopper, 16
Is a spring for maintaining the posture.

The slide arm 7 is supported by the fixed machine body 1 so as to be vertically movable, and is vertically moved by a drive means 18 provided between both members 1 and 7. As shown in FIG. 5, an auxiliary frame 19 is fixed to the back surface of the stationary body 1, and an air cylinder 18a is fixed to the auxiliary frame 19.
One end of the driving means 18 consisting of is pivotally supported. And
Slide 20 fixed to bracket 13 and piston rod
18b is connected so that the soldering machine unit 2 can be operated up and down. The slide 20 is supported by a guide shaft 21 fixed to an auxiliary frame 19 so as to be vertically slidable.

In FIG. 4, the work holding means 3 includes a column 22 as a vertically extending guide support member provided in a hanging shape on the side of the stationary machine body 1, and a differential absorption mechanism 23 provided on the column 22. A pressing body 24 for holding and holding the work W, a spring 25 for urging the pressing body 24 downward through a differential absorption mechanism 23, and the like. The support column 22 is flipped up around a shaft 27 via a bracket 26 at the upper end and is swingably supported. The operation cylinder is provided between the bracket 26 and the stationary body 1.
By the 28, it is possible to perform switching operation between the use posture in which the support column 22 is parallel to the soldering machine unit 2 and the retracted posture in which the supporter 22 is separated laterally from the soldering machine unit 2 as shown by an imaginary line. 29 is a stopper for positioning.

The differential absorption mechanism 23 includes a frame 31 having a trapezoidal shape in a side view, a slide block 32 having a U-shaped cross section, and an L-shaped supporting arm that is vertically long.
33 is fixed, the slide block 32 is supported by the column 22 so as to be vertically slidable, and the receiving plate 34 as an engaging portion provided on the upper end of the frame 31 is a guide supported in parallel with the column 22. It is configured to be guided and supported by a shaft 35 so as to be vertically movable. The guide shaft 35 is supported by a pair of upper and lower bearings 37 and 38, a spring 25 is interposed between the upper bearing 37 and the receiving plate 34, and the lower bearing 38 lowers the receiving plate 34. A locking portion that restricts and locks the end position is configured.

The pressing body 24 is fixed to the lower end of the support arm 33 with two screws 39. The pressing body 24 is formed of a fluororesin to prevent the work W from being scratched, and a pressing arm 41 is provided so as to project downward from the tip of a base portion 40 fixed with a screw 39.
As shown in FIG. 5, a U-shaped escape groove 42 is formed on the lower end surface of the presser arm 41.

The operation during the soldering work will be described below. The work proceeds in the order of FIG. 4, FIG. 2, FIG. 1, and FIG.

When the substrate 4 and the work W are set at predetermined positions, first, the stationary machine body 1 is positioned at the non-working rising end position by an operating means (not shown) so that the iron tip 8 is positioned above the joint. At this time, in the pressing body 24, the receiving plate 34 has the bearing 38 on the lower side.
It is suspended by being locked to and is positioned below the iron tip 8 as shown in FIG.

When the stationary machine body 1 is lowered from this state to the lowered end position as the working state by the operation means, first, the pressing body 24 abuts the work W during the lowering operation and holds the work W in an appropriate joining posture. Further, the stationary machine body 1 is lowered, and the receiving plate 34 is separated upward from the lower bearing 38 as shown in FIG.
It stops descending when it reaches the upper half. That is, the stationary machine body 1 is lowered with the pressing body 24 held in the holding posture. The relative operation at this time is determined by the differential absorption mechanism.
23 is absorbed by sliding on the column 22.
In this state, the solder wire 10 is fed by an appropriate amount by a feeding device (not shown), and the molten solder is attached to the tip of the iron tip 8.

Then, as shown in FIG. 1, the soldering machine unit 2 is moved down to the soldering position by the driving means 18, the molten solder is supplied to the joining point, and the state of FIG. After that state is maintained until the solder liquid is semi-cured, the fixed machine body 1 is raised. Even after shifting to this ascending process, since the pressing body 24 is urged downward by the spring 25, it continues to press the work W, and is separated from the work W only when the receiving plate 34 contacts the lower bearing 38. Therefore, when the pressing body 24 separates from the work W, the solder is completely solidified, and the joining can be performed reliably. This state is shown in FIG.

When performing continuous soldering adjacent to the above-mentioned joining point, as shown in FIG. 7, set the rising end position of the fixing machine body 1 so that the trowel chip 8 is located above the new joining point. It is moved by the operating means and the above procedure is repeated. At this time, since the escape groove 42 is provided in the presser arm 41 of the pressing body 24, the work W can be surely pressed and held while avoiding the previous solder body, especially when the joining points are close to each other. However, it is possible to reliably hold the posture of the work W.

An air blow-out tube 12 is provided to forcibly remove solder residue and excess solder liquid adhering to the iron tip 8 to clean the tip of the tip. When performing this cleaning, as shown by the phantom line in FIG. 4, the work holding means 3 is switched to the retracted position at the rising end position of the stationary machine body 1 to push the pressing body.
Prevents solder residue from adhering to the top surface of 24. Also, the work holding means 3 is in the retracted posture even when the iron tip 8 is replaced.

According to the automatic soldering apparatus as described above, the work W is pressed and held in the proper posture by the pressing body 24 with a predetermined pressing force prior to the soldering machine unit 2, and is pressed even after the soldering of the soldering machine unit 2 is completed. The body 24 can be continuously maintained in the pressed posture, and the joining can be reliably performed with a simple structure.

(Modification) The pressing body 24 should be variously changed according to the shapes of the work W and the substrate 4, and is not limited to the shape of the above embodiment.
For example, the sewing machine for sewing may be formed in a material pressing plate shape.

(Effect of the Invention) As described above, in the present invention, the lowering operation of the stationary machine body from the non-working state to the working state is used to relatively slide up and accordingly the spring moves downward with a predetermined force. The biased pressing body allows the work to be held and held in an appropriate joining posture with a constant pressing force. Further, even after the soldering machine unit finishes soldering, the pressing body is maintained in the pressing posture so that the work W can be fixedly held until the solder is solidified. Therefore, it is possible to accurately and reliably hold the posture of the work with the work holding means having a simple structure without damaging the work, reduce the entire apparatus cost required for the soldering work, and further automate the soldering work. And productivity can be improved.

[Brief description of drawings]

1 to 8 show an embodiment of the present invention, FIG. 1 is a front view of only an essential part of an automatic soldering device, and FIGS. 2 and 3 are schematic front views showing an operating state, respectively. The figure shows the whole front view of the automatic soldering machine, and Fig. 5 shows the side view of the automatic soldering machine.
6 is a sectional view taken along the line AA in FIG. 4, FIG. 7 is a longitudinal sectional view of the pressing body, and FIG. 8 is a view taken in the direction of arrow B in FIG. 1 ... Fixed machine body, 2 ... Solder machine unit, 3 ... Work holding means, 4 ... Substrate, 8 ... Iron tip, 18 ... Driving means, 22 ... Strut, 23 ... Differential absorption mechanism , 24 ...... Pressing body, 25 ...... Spring, 34 ...... Retaining plate, 38 ...... Lower bearing, W ...
…work.

Claims (2)

[Scope of utility model registration request] 1. An automatic soldering device for automatically soldering to a circuit board a work consisting of electric components positioned and temporarily fixed on the circuit board, which is not working above the work. A fixed machine body that moves up and down between a rising end position as a state and a falling end position value as a working state, and a lower end portion of the fixed machine body that is vertically movable so as to advance and retreat with respect to the work, A soldering machine unit having a trowel chip for supplying molten solder to the work, and the fixing machine body in a working state in which the soldering machine unit is located at the lower end position Driving means for vertically moving to a soldering position for supplying molten solder and descending for soldering, and a standby position waiting above the soldering position; and a hanging means provided on a side portion of the fixed machine body and on a lower side. ~ side A vertically extending guide supporting member having a locking portion projecting in one direction, and slidably supported by the guide supporting member in the vertical direction, and engaging with the locking portion at the descending end position by descending by its own weight. The fixed machine body is in contact with the work while the fixed machine body is descending from the ascending end position, and the engaging machine is in contact with the work piece at the descending end position of the fixed machine body. A pressing body that slides up relative to the guide support member so that the portion is spaced above the locking portion, and the pressing body is urged downward to hold the workpiece in an appropriate posture. An automatic soldering device, comprising: a spring that applies a predetermined pressing force to the work by the pressing body when the fixed machine body is located at the lower end position. 2. The guide support member is supported so as to be displaceable with respect to the fixed machine body in a use posture parallel to the solder machine unit and a retracted posture which is separated laterally from the solder machine unit. 1) The automatic soldering device described above.