JPH06338028A - Thin film magnetic head and manufacture of it - Google Patents

Abstract

PURPOSE:To provide a thin film magnetic head with high inductance and a high output by respectively laminating the prescribed number of coil layers and insulation layers for insulating the coil layers on both sides of a gap layer. CONSTITUTION:A first coil layer 12, a second insulation layer 13, a second coil layer 14 are formed downward the gap layer 10 through a first insulation layer 11. A third insulation layer 15 is formed downward the layer 14, and a first magnetic pole 16 is formed so as to cover respective layers. On the other hand, a third coil layer 17 is formed upward the layer 10. Further, since the layer 17 is insulated from the layer 12 through the insulation layer 11 lying between both layers, no insulation layer is provided between the layer 10 and the layer 17. Then, a fourth insulation layer 18, a fourth coil layer 19, a fifth insulation layer 20 and a second magnetic layer 21 are formed upward the layer 17. Thus, two layers each are formed on both sides of the layer 10, and the total four layers are laminated, and then, the number of turns of coils are increased, and the thin film magnetic head with high inductance is obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film magnetic head used in a magnetic recording device such as an HDD or a computer, and a manufacturing method thereof.

[0002]

2. Description of the Related Art As an example of the structure of a conventional thin film magnetic head, for example, as shown in FIG. 6, a protective layer 2, a lower magnetic pole layer 3, a nonmagnetic material layer 4 serving as a gap portion are formed on an upper surface of a substrate 1. A predetermined number of coil layers 5 and an insulating layer 6, which covers the coil layers 5.
The upper magnetic pole layer 7 is sequentially laminated and arranged, and the lower magnetic pole layer 3 and the upper magnetic pole layer 7 are connected by a recess 7a formed at a predetermined position on the rear side of the upper magnetic pole layer 7 to form a yoke. . Further, a protective layer 8 is formed on the uppermost part so as to cover the above layers.

In order to manufacture a thin film magnetic head having such a structure, a plurality of magnetic head elements are formed on one wafer by laminating the above-mentioned layers having a predetermined shape on the substrate 1 in that order. To do. Then, one thin film magnetic head is manufactured by cutting and cutting a predetermined portion of the wafer.

To form each of the above layers, a semiconductor process is used, for example, the substrate 1 or another layer already formed is covered with a positive resist, and light is irradiated to a predetermined portion of the resist (projection exposure). Then, by developing, the resist in the exposed exposed portion is removed. Then, the hole formed by such removal is plated to form a layer having a predetermined pattern.

[0005]

However, the above-mentioned conventional devices have the following various problems. That is, there is a demand to increase the number of turns of the coil in order to obtain a high output in order to support a high density recording medium,
On the other hand, there is a contradictory need to reduce the planar shape of each layer in order to reduce the size of the thin film magnetic head. Therefore, as shown in the figure, the above two requirements are solved by forming the coil layer in two layers, or in three layers or more.

However, in the conventional manufacturing method, since each layer having a predetermined shape is successively stacked on the substrate 1, a step formed on the surface becomes closer to the subsequent step (when forming the upper layer). growing. Then, it becomes difficult to apply the resist thickly or uniformly.

Therefore, the thickness of the resist is reduced, and the thickness of each layer is inevitably reduced. Then, the desired film thickness cannot be obtained, and the coil layer 5 has a small cross-sectional area, which increases the resistance, and the insulating layer 6 has a low dielectric strength voltage. Therefore, it is not possible to increase the number of coil layers to be laminated. If the number of layers to be formed is further increased, the film itself cannot be formed.

The present invention has been made in view of the above background, and an object of the present invention is to provide a thin film magnetic head capable of increasing the number of coil layers to be laminated while obtaining a desired withstand voltage and coil resistance. It is to provide the manufacturing method.

[0009]

In order to achieve the above object, in a thin film magnetic head according to the present invention, a predetermined number of coil layers and insulating layers covering the coil layers are sequentially provided on both sides of the gap layer as a reference. Laminated. Then, a pole layer was provided further outside the outermost insulating layers laminated on both sides of the gap layer, and a protective layer was formed outside the both pole layers. Further, one of the both protective layers is connected to a predetermined surface of the slider.

In the method of manufacturing the thin film magnetic head described above, a predetermined number of coil layers and insulating layers are sequentially formed on one surface of the temporary substrate, and the first magnetic pole layer is formed so as to cover the first magnetic pole layer and the insulating layer. The first protective layer is formed, the surface of the protective layer is polished, and the substrate is formed on the polished surface.
Then, the temporary substrate is removed, a gap layer is formed on the surface exposed by the temporary substrate, a predetermined number of coil layers and insulating layers are sequentially formed on the surface of the gap layer, and then the upper portion is covered. Then, the second magnetic pole layer and the second protective layer are formed.

[0011]

Since a predetermined number of coil layers and insulating layers for insulating the coil layers are laminated on both sides of the gap layer, it is possible to form the coil layers with the limit of the number of layers in the manufacturing process on both sides. For example, in the thin film magnetic head as a whole, a coil layer having twice the limit can be formed, and a thin film magnetic head with high inductance and high output is manufactured while maintaining quality such as withstand voltage.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a thin film magnetic head and a method of manufacturing the same according to the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 shows an embodiment of a thin film magnetic head according to the present invention. In this embodiment, a thin film magnetic head having a four-layer (coil layer) structure is shown. As shown in the same figure, the substrate (pole layer) is conventionally formed by sequentially laminating each layer on the substrate.
While a predetermined number of coil layers and insulating layers are formed on the gap layer formed on top of the gap layer, two coil layers are formed on each of the upper and lower sides of the gap layer 10 in this example. .

That is, a first coil layer 12 is formed below the gap layer 10 via a first insulating layer 11, and a second insulating layer is formed below the first coil layer 12. The second coil layer 14 is formed via the layer 13. Then, a third insulating layer 15 is formed below the second coil layer 14, and a first magnetic pole layer 16 is formed below the third insulating layer 15 so as to cover these layers.

On the other hand, a third coil layer 17 is formed above the gap layer 10. Since the insulation between the third coil layer 17 and the first coil layer 12 is obtained via the first insulating layer 11 interposed therebetween, the gap layer 10 and the third coil layer 12 are separated from each other. No insulating layer is provided between the insulating layer and the insulating layer. Then, similarly to the above, the third coil layer 17
On the fourth insulating layer 18, the fourth coil layer 19, the fifth
The insulating layer 20 is sequentially formed, and the second magnetic pole layer 21 is formed so as to cover them.

Then, outside the both magnetic pole layers 16 and 21,
The first and second protective layers 22 and 23 are respectively formed and the surfaces are flattened. Further, a substrate 24 is formed below the first protective layer 22, and this substrate 24 functions as a slider.

That is, as is apparent from the drawing, the layers 17 to 21 on the upper side of the gap layer 10 and the layers 11 to 11 on the lower side of the gap layer 10.
Since each of 16 can be formed by a conventional manufacturing process, assuming that the number of coil layers that can be stacked while maintaining a predetermined performance (insulation performance, etc.) is two,
In the present invention, two layers (12, 14 and 17, 19), which are the limits, can be formed on both sides of the gap layer 10, and they can be laminated at least twice, that is, four layers in total. Therefore, while using conventional process technology,
The number of turns of the coil can be increased, and the thin film magnetic head has high inductance.

Further, conventionally, two magnetic pole layers had to be formed on one side because they were laminated on one side as shown in FIG. 6, but in the present example, the two magnetic pole layers 16 and 21 are formed.
Since it is necessary to form one on each side of the gap layer 10, it is possible to reduce the film thickness by one pole layer. Therefore, it is possible to further increase the number of laminated coil layers by one layer, and even if the number of coil layers is not increased, it is possible to form each layer with a margin, so that high quality stabilization can be achieved.

Next, as a preferred embodiment of the method of manufacturing the thin film magnetic head according to the present invention, a method of manufacturing the thin film magnetic head having the structure shown in FIG. 1 will be described. First,
As shown in FIG. 2A, the wax 26 is applied to one surface of the temporary substrate 25. As the temporary substrate 25, for example, an AlTiC substrate which has been conventionally used as a substrate for a thin film magnetic head of this type may be used. However, the temporary substrate 25 is finally removed so that it has a certain degree of hardness. The material is not particularly limited as long as it has heat resistance and acid resistance. The wax 26 is used to facilitate the process of peeling off the temporary substrate 25 in a later step, and has a melting point of 270 to 320 ° C., for example.

Then, the first insulating layer 11 is formed on the surface of the temporary substrate 25 on which the wax 26 is applied (FIG. 2B). The first insulating layer 11 is patterned (resist coating, exposure / development, etc.) by a method similar to the conventional one.
And formed into a predetermined shape (hereinafter, the formation of each layer is the same, and therefore omitted). Next, the first coil layer 12 having a predetermined shape is formed on the upper surface of the first insulating layer 11 (FIG. 7C). Then, the second insulating layer 13 is formed so as to cover the first coil layer 12 and on the exposed surface of the first insulating layer 11 (FIG. 8D).

Next, by repeating the same steps, the second coil layer 14 is formed on the second insulating layer 13, and the third coil layer 14 is covered with the third coil layer 14 to form the third coil layer 14.
The insulating layer 15 is formed (FIGS. 2A and 2B). In this way, when the two coil layers 12 and 14 are laminated while being insulated from each other, the first magnetic pole layer 16 is formed so as to cover these layers 11 to 15. Then, both ends 16a and 16b of the first magnetic pole layer 16 are made to reach the surface on which the wax 26 is formed (FIG. 7C). Further, a first protective layer 22 is formed on the upper surface of the temporary substrate 25 (wax 26) so as to cover the first magnetic pole layer 16 and other layers (FIG. 8D).

Then, after the surface of the first protective layer 22 is polished and planarized, AlTiC is attached to the surface to form the substrate 24. This substrate 24 becomes the substrate (slider) in the final thin film magnetic head (FIG. 4).
(A)). As a result, the film formation process on the one side (first half) is completed.

Next, the substrate is turned over so that the temporary substrate 25 is placed on the upper side, and the wax 26 is softened (melted) by heating, and the temporary substrate 25 is removed. Then, the exposed first insulating layer 11,
The surfaces of the first magnetic pole layer 16 and the first protective layer 22 are polished to completely remove the wax 26 and flatten it (FIG. 6B). Note that the layers 11 and 16 and the first protective layer 22 are slightly shaved due to this polishing process. Therefore, when manufacturing in each of the above-described steps, the polishing amount is taken into consideration in advance to form a thicker layer.

The gap layer 1 is formed on the polished surface.
Form 0. At this time, the opening 1 is formed at a predetermined position of the gap layer 10 facing one end 16a of the first pole layer 16.
0a, and the end 16a is formed through the opening 10a.
Are exposed (Fig. (C)).

Then, the third coil layer 17, the fourth insulating layer 18, the fourth coil layer 19 and the fifth insulating layer 20 are formed on the exposed surface of the gap layer 10 by using a normal manufacturing process. The layers are sequentially formed (FIGS. 5A and 5B). Then, the second magnetic pole layer 21 is formed so as to cover each of the layers 17 to 20. Both ends 21a and 21b of the second magnetic pole layer 21 are also made to reach the surface on which the gap layer 10 is formed (FIG. 7C). As a result, the one end 21a of the second magnetic pole layer 21 enters the opening 10a formed in the gap layer 10 and the first magnetic pole layer 1 is formed.
6 is connected to one end 16a of the first magnetic pole layer 6, and the other end 21b of the second magnetic pole layer 21 faces the other end 16b of the first magnetic pole layer 16 at a predetermined distance via the gap layer 10. This constitutes a yoke.

After that, a second protective layer 22 is formed so as to cover the second magnetic pole layer 21 and other layers (FIG. 7 (D)), and the surface of the protective layer 22 is polished and flattened. By doing so, a thin film magnetic head as shown in FIG. 1 is constructed. In each of the above-mentioned drawings, the manufacturing process of each layer corresponding to one thin-film magnetic head is shown for the sake of convenience. A thin film magnetic head having a predetermined shape is manufactured by manufacturing a wafer on which a large number of head elements are formed, and then cutting a predetermined portion of the wafer or performing a predetermined cutting and polishing process. Since it is the same as the conventional one, the description thereof will be omitted.

In each of the embodiments of the thin film magnetic head and the method of manufacturing the thin film magnetic head described above, an example in which two coil layers are formed on both sides of the gap layer is shown, but the present invention is not limited to this. However, the number of layers formed on both sides is arbitrary.

[0027]

As described above, in the thin film magnetic head and the method of manufacturing the same according to the present invention, a predetermined number of coil layers and insulating layers for insulating the coil layers are formed on both sides of the gap layer. Therefore, only one magnetic pole layer needs to be formed on one side, and the coil layers can be formed on both sides so that the number of laminated layers is limited in the manufacturing process. It is possible to increase while maintaining the quality such as. Therefore, the number of turns can be easily increased, high inductance,
A high output thin film magnetic head can be manufactured.

[Brief description of drawings]

FIG. 1 is a sectional view showing a preferred embodiment of a thin film magnetic head according to the present invention.

FIG. 2 is a diagram showing a part of the manufacturing process of a preferred embodiment of the method of manufacturing a thin-film magnetic head according to the present invention.

FIG. 3 is a diagram showing a part of the manufacturing process of a preferred embodiment of the method of manufacturing a thin-film magnetic head according to the present invention.

FIG. 4 is a diagram showing a part of the manufacturing process of a preferred embodiment of the method of manufacturing a thin-film magnetic head according to the present invention.

FIG. 5 is a diagram showing a part of the manufacturing process of a preferred embodiment of the method of manufacturing a thin-film magnetic head according to the present invention.

FIG. 6 is a sectional view showing an example of a conventional thin film magnetic head.

[Explanation of symbols]

 10 Gap Layer 11 1st Insulating Layer 12 1st Coil Layer 13 2nd Insulating Layer 14 2nd Coil Layer 15 3rd Insulating Layer 16 1st Magnetic Pole Layer 17 3rd Coil Layer 18 4th Insulation Layer 19 Fourth coil layer 20 Fifth insulating layer 21 Second magnetic pole layer 22 First protective layer 23 Second protective layer 24 Substrate 25 Temporary substrate 26 Wax

Claims (2)

[Claims] 1. A predetermined number of coil layers and insulating layers covering the coil layers are sequentially laminated on both sides of the gap layer with respect to the gap layer, and outermost insulating layers laminated on both sides of the gap layer. A thin film magnetic head in which a magnetic pole layer is further provided on the outer side, a protective layer is formed on the outer side of both magnetic pole layers, and one of the two protective layers is connected to a predetermined surface of a slider. 2. A predetermined number of coil layers and insulating layers are sequentially laminated on one surface side of the temporary substrate, and a first magnetic pole layer and a first protective layer are formed so as to cover the upper side thereof, and at the same time, The surface of the protective layer is polished, a substrate is formed on the polished surface, the temporary substrate is removed, and a gap layer is formed on the surface exposed by the removal of the temporary substrate. A method of manufacturing a thin-film magnetic head, wherein a coil layer and an insulating layer are sequentially laminated, and then a second magnetic pole layer and a second protective layer are formed so as to cover the coil layer and the insulating layer.