JPH06336211A - Method and apparatus for producing carrier tape for electronic parts - Google Patents

Abstract

PURPOSE:To eliminate adhesive defects of an upper tape on a base, by pressing and heating the upper tape in turn by both plane and curved irons to force the upper tape to get in contact with the base at the plane or points in the section, when sticking the tape on the upper face of base. CONSTITUTION:In order to form a carrier tape (a), at first, electronic parts (h) are charmed in containing holes (b) arranged with equal intervals on a base (c). Next, an upper tape (d) is superposed on the base (c) so that a thermally adhesive layer attached on the face may be stuck. A plane iron 2 having a plane iron face is used to press the upper tape from the rear side to press and heat the upper tape (d) in the plane contact thereof to stick it on the base (c). Subsequently, a curved face iron 3 having a curved iron face is used to press and heat and stick to the base (C). In this way, non-adhesion points on the upper tape (d) are appropriately decreased and hence, unexpected exfoliation of the upper tape (c) can be prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a carrier tape for electronic parts and an apparatus used therefor.

[0002]

2. Description of the Related Art Small electronic components such as chip resistors, chip capacitors and leadless diodes are taped and shipped. As shown in FIG. 1, a general carrier tape a for taping is provided with a carrier tape base c in which a plurality of storage holes b are formed at equal intervals.
The electronic component h is loaded into each of the storage holes b, and the opening of the storage hole b is sealed with the upper surface tape d.

As the carrier tape base c having the storage holes b, as shown in FIG. 2, a tape base material made of paper or the like in which window holes for forming the storage holes b are provided in a penetrating manner at equal intervals. A lower surface tape e for sealing the lower opening of each window hole is attached to the lower surface of the window, and as a result, a bottomed storage hole b
Or a thin resin film having a storage hole b formed in an embossed shape, which is not shown. As shown in FIG.
As shown in FIG.
Are formed.

An electronic component h is loaded in the storage hole b of the carrier tape base c thus formed. As a method of loading the electronic component, for example, the electronic component h is dropped into the accommodation hole b while the carrier tape base c is intermittently fed.

Then, the opening of the storage hole b of the carrier tape base c in which the electronic component h is loaded is sealed by the upper surface tape d. In this way, the carrier tape a in which the electronic component h is stored is wound in a roll shape and then shipped. On the user side of the electronic component, the upper surface tape d is peeled off while pulling out the carrier tape a wound in a roll shape, and the electronic component h in the storage hole b is picked up and mounted on a predetermined circuit board.

For example, the operation of adhering the upper surface tape d on the upper surface of the carrier tape base c in which such a storage hole b is formed is performed as follows.

First, on one surface of the upper surface tape d,
A resin adhesive layer is provided. As the resin adhesive used for this resin adhesive layer, a resin adhesive that remains solid at room temperature and has fluidity and tackiness when heated is adopted. The top tape d thus formed
As shown in FIGS. 7 to 9, the guides 1 and the like are stacked with the surface on which the resin adhesive layer is provided facing down and along the upper surface of the carrier tape base c. The carrier tape base c on which the upper surface tape d is stacked is intermittently conveyed, and the flat iron member 2 having two parallel elongated flat iron surfaces along the conveying direction is applied from the back surface of the upper surface tape d. As a result, heat is applied to the resin adhesive layer to bond the upper surface tape d.
The plane ironing member 2 is arranged such that the two rows of flat ironing surfaces are located on the upper surface tape d straddling the storage hole b of the carrier tape base c, and the lower surface of the carrier tape base c is placed on the upper surface tape d. The carrier tape base c and the upper surface tape d superposed on the carrier tape base c can be moved up and down between a backup member (not shown) for backup.

[0008]

However, as described above, the carrier tape base c is formed by the flat iron surface as described above.
When the upper surface tape d is attached to the above, there is a problem that a desired adhesive portion of the upper surface tape d partially has an unbonded portion.

That is, the carrier tape base c is made of paper, resin film or the like, and the surface thereof has irregularities,
The concavo-convex portion may become larger due to deformation due to expansion and contraction of the material due to external factors such as humidity and temperature. Moreover, since the carrier tape base c has a thickness enough to provide the storage hole b, if the above-mentioned external factors are different between the upper surface and the lower surface, the expansion / contraction ratio will be different and the uneven portion will be larger.

When the flat ironing member 2 is applied in this state, the flat ironing surface and the upper surface tape d are brought into surface contact with each other as shown in FIG. The concave portion on the surface of the carrier tape base c is the upper surface tape d
Therefore, an unbonded portion g is inevitably partially formed between the carrier tape base c and the upper surface tape d. When the unbonded portion g is formed, the inner taper and the outer taper of the carrier tape a have different curvatures when the carrier tape a whose taping has been completed is wound in a roll, and the peeling of the upper surface tape d is promoted, so that the carrier tape a is peeled off. The unbonded portion g between the tape base c and the upper surface tape d expands, and the electronic component h stored when the user pulls out the carrier tape a pops out of the carrier tape a. There is fear.

The present invention was discovered under the current state of the art as described above, and an object thereof is to eliminate defects due to non-adhesion of an upper surface tape for sealing in a carrier tape.

[0012]

In order to achieve the above object, the present invention is to mount an electronic component in the storage hole of a carrier tape base for an electronic component having storage holes at equal intervals, On the carrier tape base, an upper surface tape having a resin adhesive layer that can be adhered to one surface by heating is stacked so that the resin adhesive layer contacts, and a flat iron surface is provided from the back surface of the upper surface tape. Sealing the storage hole of the carrier tape base by pressing the flat iron member and then pressing the curved iron member having a curved ironing surface to attach the upper surface tape to the carrier tape base. Is characterized by.

Further, according to the present invention, an upper surface tape having a resin adhesive layer which can be adhered to one surface by heating is attached to the upper surface of a carrier tape base for electronic parts in which storage holes are provided at equal intervals. A device for forming a carrier tape for an electronic component for encapsulating an electronic component loaded in the storage hole, comprising a mechanism for transporting the carrier tape base, and a carrier in which the electronic component is loaded in the storage hole. A mechanism for attaching the upper surface tape to the upper surface of the tape base, and a flat iron member having a flat iron surface that is pressed against the back surface of the upper tape attached to the upper surface of the carrier tape base,
And a curved iron member having a curved iron surface pressed against the back surface of the upper surface tape pressed by the flat iron member.

[0014]

[Function] A flat ironing member presses and heats the upper surface tape in a surface contact state to adhere it to a carrier tape base, and then a curved ironing member having a curved ironing surface further makes point contact with the cross-section point. Press and heat in the state.
Then, the unbonded portion remains in the concave portion of the surface of the carrier tape base due to the sticking with the flat iron member, and the curved surface shape of the curved iron member is adhered to the unbonded portion during the subsequent sticking with the curved iron member. The ironing surface of will enter and press, and the unbonded part will be appropriately eliminated.

When pressed by the curved surface iron member, the resin adhesive layer provided on the upper surface tape maintains a state in which the adhesive action is increased by the heating by the flat surface iron member. Therefore, even if pressing and heating are performed in a cross-section point contact state with a curved iron surface, the above-mentioned unbonded portion can be bonded without reducing the transport speed of the carrier tape base and the upper surface tape. It will be sufficiently attached to the carrier tape base.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in more detail below with reference to the drawings.

According to the present invention, as shown in FIGS. 1 and 2, the upper surface tape d is attached to the upper surface of the carrier tape base c in which a plurality of storage holes b opened on the upper side are formed at equal intervals, and the storage holes are formed. In this method, the upper opening of b is sealed to form the carrier tape a containing the electronic component h.

The carrier tape base c is used in the same manner as conventionally used for carrier tapes for electronic parts. For example, a paper material having a predetermined thickness and a predetermined width is formed into a strip shape, and is usually rectangular. A lower surface tape e is attached to the lower side of the tape base material having a plurality of through holes formed therein, and the lower opening of the window hole is closed to form a plurality of storage holes b. Further, feed holes f for conveyance are formed on the side portions of the carrier tape base c at equal intervals corresponding to the pitch forming the window holes. In the present invention, the carrier tape base c may be formed by embossing the storage hole b in a thin resin film.

The upper surface tape d is used in the same manner as conventionally used for carrier tapes for electronic parts. For example, paper or resin is adhered to one surface of a tape-shaped film made of resin such as polyester. An agent layer is provided. As the resin adhesive used for this resin adhesive layer, a resin adhesive that is solid at room temperature and melts (fluidizes) when heated to increase its tackiness is adopted. For example, polyethylene is the main raw material. An adhesive or the like may be used. The width of the upper surface tape d is sufficient to seal the respective storage holes b of the carrier tape base c. However, it goes without saying that the width is set so that the feed hole f formed in the carrier tape base c is not blocked.

3 to 6 are explanatory views of an embodiment of the present invention.

As shown in FIG. 3, the carrier tape base c fed from the roll state is intermittently fed at a constant size by an intermittent feeding mechanism. The feed hole f of the carrier tape base c is engaged with a feed sprocket (not shown) arranged at a proper position in the conveying path, and the intermittent feed is achieved by driving the feed sprocket to rotate intermittently. It The intermittent feeding can also be performed by a mechanism using a feed claw.

On the other hand, the upper surface tape d, which is also unwound from the roll state, is placed so that the resin adhesive layer faces the upper surface of the carrier tape base c in which the electronic component h is loaded in the storage hole b. For that purpose, the guide 1 arranged in a proper place is used.

As shown in FIGS. 3 and 4, the carrier tape base c and the upper surface tape d attached to the carrier tape base c are flat irons having two parallel elongated flat plane ironing surfaces along the transport direction. The flat iron surface, which is conveyed to the lower part of the member 2 and set to a predetermined temperature, is adhered to each other by being pressed from the back surface of the upper surface tape d. The plane ironing member 2 is arranged such that the two rows of flat ironing surfaces are located on the upper surface tape d straddling the storage hole b of the carrier tape base c, and the lower surface of the carrier tape base c is placed on the upper surface tape d. The carrier tape base c and the upper surface tape d can be vertically moved so as to be sandwiched between the carrier tape base c and a backup member (not shown) for backup.

The lengthwise dimension of the ironing surface of the flat ironing member 2 corresponds to the feed pitch of the intermittent feed mechanism. The plane iron member 2 is provided with a pressing position where the ironing surface is pressed against the back surface of the upper surface tape d and a retracting position where the ironing surface is retracted from the pressing position by a reciprocating actuator such as an air cylinder. Has become.

In the above structure, when the carrier tape base c and the upper surface tape d attached to the carrier tape base c are stopped, the plane iron member 2 moves from the retracted position to the pressed position, and the ironing surface is Pressed on the backside of the top tape for a predetermined time. At this time, the heat from the ironing surface reaches the resin adhesive layer of the upper surface tape d, and the upper surface tape d is attached to the carrier tape base c. As shown in FIG. 5, the thus-applied upper surface tape d cannot be said to be sufficiently bonded at this point because the unbonded portion g partially exists between it and the carrier tape base c.

In the present invention, the carrier tape base c and the upper surface tape d thus bonded by the flat iron member 2 are curved surfaces having curved iron surfaces as shown in FIGS. 3 to 6. It is used for the iron member 3. The curved iron member 3 includes two roller-shaped members, such as bearings, which are arranged to face each other at intervals corresponding to the pressing portions of the flat iron members 2 by the two rows of flat iron surfaces. The surrounding surface is a curved iron surface. Curved iron member 3
The front side of the plane iron member 2, that is, the carrier tape so that its ironing surface sandwiches the carrier tape base c and the upper surface tape d with a backup member (not shown) that backs up the lower surface of the carrier tape base c. It is arranged on the side of the base c and the upper surface tape d in the transport direction.

When the plane iron member 2 is moved to the retracted position and is intermittently fed by a certain size, the carrier tape base c and the upper surface tape d adhered by the plane ironing member 2 are intermittently fed by the intermittent feeding. And the curved iron surface of the roller-shaped member that is rotatable with the conveyance of the upper surface tape d, is heated from the back surface of the upper surface tape d and presses the resin adhesive layer thereof, so that the unbonded portion g Some or all of them are eliminated, and a good adhesive state between the carrier tape base c and the upper surface tape d can be obtained. Since the carrier tape base c and the upper surface tape d pressed by the plane ironing member 2 in this way are provided to the curved ironing member 3 at the time of transportation, they can be processed without reducing the transportation speed, and the productivity can be improved from the conventional one. It can be done without change.

Further, by appropriately selecting the temperature of the ironing surface of the curved iron member 3, the adhesive strength of the upper surface tape d, in other words, the peel strength can be adjusted more finely. For example, when the temperature of the ironing surface of the flat ironing member 2 is set to 130 ° C., which is the melting temperature of the resin adhesive,
When the ironing surface of the curved ironing member 3 is set to a temperature slightly lower than that of 110 to 120 ° C., the peeling strength when peeling the upper surface tape for picking up the electronic component h from the carrier tape a by the automatic mounter is moderate. Experiments have shown that this can be done.

As described in detail above, in the present invention, both the flat iron member and the curved iron member are used. However, when the upper surface tape is attached using only the curved iron member, the curved iron member is used. Since the surface is in point contact with the upper surface tape at the time of pressing and heating, it takes a long time for sufficient heat to be transferred to the adhesive layer, which is not practical.

[0030]

According to the present invention, since the upper surface tape can be accurately attached to the carrier tape base, when the obtained carrier tape is wound into a roll or when the rolled carrier tape is pulled out. In addition, the electronic component stored by peeling off the upper surface tape does not fly out of the carrier tape at all.

Further, according to the present invention, the adhesive strength or peel strength of the upper surface tape can be finely adjusted, and the obtained carrier tape can be favorably applied to an automatic mounting machine.

[Brief description of drawings]

FIG. 1 is a perspective view of a carrier tape.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a schematic side view of a carrier tape sticking device according to an embodiment of the present invention.

FIG. 4 is a perspective view of a main part of a carrier tape sticking device according to an embodiment of the present invention.

FIG. 5 is a contact state diagram of a curved iron member and a carrier tape.

6 is a sectional view taken along line BB of FIG.

FIG. 7 is a schematic side view of a conventional carrier tape sticking device.

FIG. 8 is a contact state diagram of a flat iron member and a carrier tape.

9 is a cross-sectional view taken along line CC of FIG.

[Explanation of symbols]

 2 Plane ironing member 3 Curved ironing member a Carrier tape b Storage hole c Carrier tape base d Top tape g Unbonded part h Electronic component

Claims (2)

[Claims] 1. A carrier tape base for an electronic component, which has storage holes at equal intervals, is loaded with electronic components in the storage holes, and one surface of the electronic component can be bonded to the carrier tape base by heating. An upper surface tape having an adhesive layer is stacked so that the adhesive layer contacts, a flat iron member having a flat iron surface is pressed from the back surface of the upper tape, and then a curved iron having a curved iron surface. A method for forming a carrier tape for electronic parts, comprising: pressing a member to attach an upper surface tape to the carrier tape base to seal a storage hole of the carrier tape base. 2. An upper surface tape having an adhesive layer capable of being adhered to one surface by heating is attached to the upper surface of a carrier tape base for electronic parts in which housing holes are provided at equal intervals, and the housing hole is provided in the housing hole. An electronic component carrier tape forming apparatus for accommodating electronic components, comprising: a mechanism for conveying the carrier tape base; and an upper surface of the carrier tape base having the electronic components loaded in the accommodating holes. A mechanism for attaching the tape, a plane iron member having a flat iron surface pressed against the back surface of the top tape attached to the top surface of the carrier tape base, and a top tape pressed by the plane iron member. An apparatus for forming a carrier tape for electronic parts, comprising: a curved iron member having a curved iron surface that is pressed against the back surface.