JPS60254693A - Method of forming coverlay of flexible printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to a method of forming a coverlay of a flexible printed wiring board (hereinafter abbreviated as F'PC) used for electronic equipment tubes.

"Prior Art" FIG. 8 shows an example of IF'E)O. This F
In the POI, a wiring pattern 3 made of a copper foil conductor is placed on a highly flexible base film 2 such as a polyester film or polyimide film with a thickness of about 20 to 100 μm.
are attached in close contact.

Conventionally, the following method has been used to form a coverlay 4 serving as an insulating protective film on the wiring pattern 3 of such an FPCtl. First, a coverlay film 5 as shown in FIG. 9 is used. This coverlay film 5 is coated to a thickness of 20 to 30 μm on one side of an insulating film 6 made of a polyester film, a polyimide film, etc. with a thickness of about 20 to 40 μm, which will become the coverlay 4.
An adhesive layer 7 is formed, and a release paper 8 such as silicone resin-treated paper is pasted onto this adhesive layer 7. Then, after forming holes 9 corresponding to the wiring patterns 30, soldering parts and contact parts on such a coverlay film 5, the release paper 8 is peeled off from the coverlay film 5, and then adhesive is applied. After aligning the layer 7 to the wiring pattern 3 of the FPCI so that the insulating film 60 hole 9 is in the predetermined position,
Temporarily adhere with a heated roller, etc., and then final adhere with a hot plate press.

"Problems to be Solved by the Invention" However, in this method of forming the coverlay 4, the thin and stiff insulating film 6 must be aligned after the release paper 8 is peeled off. However, there were problems in that handling of the insulating film 6 was troublesome, positioning was difficult, and workability was poor.

"Means for Solving the Problems" In order to solve the above-mentioned problems, the present invention provides an elongated insulating film having a contact layer on one side and a release paper on the other side. Ka(-ray film and long FPC
F' while driving intermittently in the same direction.
The process of aligning the PC and the cut-lay film, the process of pasting them together when not running, and the process of peeling off the release paper from the coverlay film when running are performed in sequence.

"Function" In the present invention, the coverlay film is aligned and attached to the FPC in a firm state where it is lined with release paper, and the alignment process, the adhesion process, and the peeling process are performed. The process is performed continuously.

``Example'' An example of the present invention will be described below with reference to FIGS. 1 to 7.

First, the film and device used to carry out the present invention will be explained.

! As shown in FIG. 2, the coverlay film 11 is formed by forming an adhesive layer 7 on one side of an insulating film 6, which becomes the coverlay 4, and pasting a release paper 12 on the other side. The release paper 12 is made of stiff paper or plastic film with a thickness of approximately 100 to 150 μm, and when used as the coverlay film 11, the LK coverlay film 11 as a whole is stiff and has a plate shape.

A thin adhesive layer 13 is formed on the surface of the release paper 12 that is in contact with the insulating film 6, and the release paper 12 and the insulating film 6 are made to adhere to each other. In addition, a non-adhesive, non-adhesive silicone resin coating layer 14 is formed on the surface of the release paper 12 opposite to the insulating film 6, and this film 11 is wound into a μ-ru shape as described below. Sometimes, the adhesive layer 7 and the release paper 12 do not adhere to each other.

On the other hand, as shown in FIG. 1, the device applied to the implementation of the present invention includes a first delivery drum 15 for winding a long coverlay film 11 in a roll shape, and a first A long F
A second delivery drum 17 is provided for winding the PCI into a roll, and this second delivery drum 17
The hole is made between the press machine 1 and the first delivery drum 15.
8 are provided between the second delivery drum 17 and the winder 16 in order of proximity to the second delivery drum 17: a hot plate press 19, a cooler 20, a peeler 21. The structure includes 22 cutting machines.

The press machine 18 is used to make holes in the coverlay film 11 corresponding to bar-holes (feeding holes) used in the alignment process, etc. to be described later, contact parts of the FPCI, etc. Ray film 11
A support plate 23 on which the press board 23 is placed, a press plate 24 provided above the support plate 23 so as to be movable up and down so as to move toward and away from the support plate 23, and a press plate 24 projecting downward from the press plate 24. A large number of punch-like holes are formed by a tool 25 and feed rows 226 provided before and after the support base 23 in the direction of the arrow in FIG. 1 (running direction to be described later).

The hot plate press machine 19 presses the coverlay film 11 and F
A mounting table 27 having a heat insulating layer on the upper surface, and a heating plate provided above the mounting table 27 so as to be movable up and down so as to move toward and away from the mounting table 27. 2B, a large number of guide pins 29 provided on the upper surface of the mounting table 27 so as to be freely retractable, a positioning roller 30 provided at the rear of the mounting table 27 and in front of the cooler 20, and the outer peripheral surface of this positioning roller 30. A large number of feed teeth 31 are provided at a pitch in the circumferential direction and mesh with the par 7 orientation.

The cooler 20 cools the coverlay film 11 and FPCI heated by the hot plate press 19, and includes a plurality of blower nozzles 32 that send cold air toward the coverlay film 11.

The peeling machine 21 peels off the release paper 12 from the coverlay film 11 attached to the FPC 1.
2 and a guide roller 34 that guides the release paper 12.

The cutting a22 is performed by punching out the long FPC on which the coverlay 4 is formed into short pieces, and includes a cutting table 35 for fixing the F'PC, and a cutting table 35 placed above the cutting table 35.
A mold blade 36 is provided so as to be able to move up and down so as to move toward and away from the mold blade 36.
, a positioning pin 37 provided on the upper surface of the cutting table 35 so as to be freely retractable, a positioning row 238 provided before and after the cutting table 350, a feed dog 31 provided on the outer peripheral surface of this positioning row 238, and a mold blade. A transfer device (not shown) that transports the punched TPO short material to the outside of the cutting table 35
It consists of.

In addition, in the figure, numerals 39 and 40 are take-up rollers, and numerals 41
is a guide roller.

Then, using the device thus configured.

To explain the method of forming a coverlay of the present invention, a long coverlay film 11 is wound around a first delivery drum 15 with its adhesive layer 7 facing inside, and accumulated in a roll. The FPO 1 on which long circuit formation has been completed is wound around a delivery drum 17 with the wiring pattern 3 facing outside, and stored in a roll.

On the other hand, three long guide films are prepared, and the starting end of one of them is pulled out from the take-up roller 39 to the guide roller 41 through all the above-mentioned devices.
6, and its terminal end is connected to the tip of the insulating film 6 of the coverlay film 11. In addition, the starting end of the other guiding film is pulled out from the hot plate press 4fi19 to the guiding row 241 via the cooling machine 20, take-up roller 40, and cutting machine 22 under the guiding film of the cocoon. and connect it to the winder 16, and connect its terminal end to the tip of the FP (Il).Furthermore, the starting end of the remaining guide film is connected to the take-up row 239 above the guide film. Press machine 18 is used to make holes.
, a hot plate press machine 19, and a cooling machine 2θ° to a take-up roller 40 [connected to a peeling machine 21, and the terminal end is connected to the release paper 12 of the coverlay film 11.

Then, the entire apparatus is driven from the stand-up state, and the coverlay film 11 and FI'01 are pulled out from both delivery drums 15 and 17 with each guide film leading the way, and directed toward the winder 16 as shown in FIG. While running in the direction of the arrow, from the leading edge to the trailing edge (described in detail below)
1) Perform steps from M to Sequentially.

(i) Holes are drilled on the first delivery drum 15 by the process take-off row 239.
The coverlay film 11 is continuously pulled out from the support base 23.
The coverlay film 11 is intermittently drawn onto the support stand 23 by both feed rollers 26 by a fixed length, and when the coverlay film 11 is stationary (not traveling), the press plate 24 is lowered to give the coverlay film 11 a fixed length as shown in FIG. A par 7 oration 42, hole 9, etc. as shown in FIG.

(11) Positioning process hole drilling is performed on the processed coverlay film 11 and the second
The FPC+1 wound on the delivery drum 17 is placed on the mounting table 2.
The coverlay film 11 is intermittently pulled onto the mounting table 27 by the positioning roller 30 in front of the coverlay film 11 at regular intervals.
The two parts 11S1 are overlapped with the adhesive layer 7 of the FPCI facing the wiring pattern 3 of the FPCI. At the time of this retraction (during running), the feed teeth 31 of both the alignment rows 230 at the front and rear of the mounting table 27 are moved so that the cover lay film 11 is moved as shown in FIG.
Par 7 oration 42 and the same pitch as PP
It is inserted into the par 7 oration 43 previously drilled in the Cl, and aligned so that the hole 9 of the coverlay film 11 is exactly at the position of the soldering part or contact part of the FPOI.

(110) A guide pin 29 that protrudes from the top surface of the mounting table 27 and can be inserted freely during non-travel after positioning in the adhesion process is protruded, and this guide pin 29 is
9 into the perforation 42.43 of the coverlay film 11 and 11)01, and place both 411.1 on the mounting table 2.
7 and then lower the heating plate 28 to place the coverlay film 11 between the heating plate 28 and the mounting table 27.
and FPCI are heated and pressurized at a predetermined temperature for a predetermined time. That is, the adhesive layer 7 of the coverlay film 11 is heated and softened to heat-seal the coverlay film 11 and FPCl, and the adhesive layer 7 is further heated and softened.
is cured to form a coverlay 4 between the release paper 12 and FPol as shown in FIG.

Rei Peeling process While the FPC with the 111141 paper 12 is intermittently taken in the direction of the arrow in FIG.
The take-up drum 33 is driven intermittently in accordance with the take-up roller 40, and the cover paper 12 is wound onto the take-up drum 33, so that the release paper 12 is peeled off from the FPO as shown in FIG. Obtain FPO44 with Ray.

(V) Cutting process FI' is set by the positioning row 238 in front of the cutting table 35.
044 is intermittently pulled onto the cutting table 35 by a fixed length, and the positioning bin 37, which can protrude and sneak in freely from the top surface of the cutting table 35 when not running, is inserted into the perforation 42,
Insert into (43).

After that, the metal part blade 36 is lowered and a short lPP0 material 45 is punched out from the long PI"044 as shown in FIG.

In addition, in the illustration and explanation, the method is shown in which the FP○ short material 45 is cut into rectangular sheet shapes, but of course IPF (3
It is also possible to cut the external shape into various deformed shapes that match the circuit shape, and then punch it out on the underside of the cutting table.

6/Cloudy Winding process After transferring the FPC short length material 45 from the cutting table 35 to another location, the remaining PP0 from which the VPC'II length material 45 was collected 45
The edge portion of 44 is wound up by the winding machine 16 and accumulated.

In the method of forming such an FPO coverlay,
Align the coverlay film 11 and PPCl,
In addition, when pasting, the coverlay film 11 is in a firm plate-like layer with the outbuilding paper 12 not yet peeled off, so that the positioning process and the pasting process can be performed smoothly and accurately. . Further, the steps (+) to - are performed while the long coverlay film 11 and the long FPCI are intermittently run from the i-th, H2 delivery drum toward the winder 16. Since the steps are carried out sequentially, the workability of forming the coverlay can be improved. In addition, in this embodiment, the hot plate press machine 19 is used to perform the pasting process S (heating and pressing process) intermittently, so that, for example, if a trouble occurs during the work, It is possible to stop the intermittent running and interrupt the work at a time when the heating and pressurizing process is not being performed.

In the above embodiment, the take-up roller 39 and the take-up machine 16 were driven continuously, but the take-up roller 39
Feed row: 1iF26 and winder 16
may be driven intermittently in accordance with the positioning row 238.

"Effects of the Invention" As explained above, according to the present invention, the following vague effects can be obtained.

■When aligning the coverlay film and FPC,
When adhering to each other, since the coverlay film is in the form of a plate, alignment and adhesion can be carried out smoothly and accurately using guide pins.

(2) Since the coverlay film and FPO are moved in the same direction and the steps for forming the coverlay are performed continuously along the travel path, the workability of forming the coverlay can be improved.

■Since the adhesion process is performed intermittently while the coverlay film and FPC are intermittently running, the work can be easily interrupted by stopping the intermittent running and taking into consideration the times when no adhesion occurs. I can do it.

[Brief explanation of drawings]

Fig. 1 is a schematic diagram showing a state in which a coverlay film and FPO are attached to an apparatus applied to carry out the present invention, and Fig. 2 is a schematic diagram of a coverlay film applied to carry out the present invention. The sectional views and FIGS. 3 to 7 show an embodiment of the present invention in the order of steps. FIGS. 3 and 7 are perspective views, and FIGS. 4 to 6 are schematic sectional views, and FIGS. 8
The figure is a schematic sectional view showing an example of an FPC, and FIG. 9 is a schematic sectional view showing an example of a coverlay used in a conventional coverlay forming method. DESCRIPTION OF SYMBOLS 1... FPo, 2... Base film, 3... Wiring pattern, 4... Coverlay, 6... Insulating film, 7... Adhesive layer, 11... Coverlay film,
12... release paper, 15... first sending drum,
16... Winding machine, 17... Second delivery drum, 18... Press machine for hole punching, 19... Hot plate press machine, 21... Peeling machine, 22... Cutting machine , 30...
Positioning roller, 31... feed 9t1M, 42.43
...Par 7 oration. Applicant Fujikubi - Motai Shiki Company Figure 2 Figure 3 Figure 4 / Figure 5 Figure 7 Figure 8 Figure 9

Claims (1)

[Claims] A long flexible printed wiring board (1) and an insulating film (6) serving as a coverlay (4) for this flexible printed wiring board are coated with an adhesive layer (7) on one side and a release paper (on the other side). 12) is intermittently run in the same direction with the adhesive layer of the coverlay film facing the flexible printed wiring board. A step of mutually aligning the flexible printed circuit board and the coverlay film, a step of adhering the flexible printed wiring board and the coverlay film during non-travel, and a step of peeling the release paper from the coverlay film during travel are sequentially performed. 1. A method of forming a coverlay for a flexible printed wiring board, the method comprising: