JPH06334416A - Manufacture of dielectric filter - Google Patents

Abstract

PURPOSE:To attain mass-production of the filter in an inexpensive way. CONSTITUTION:A master board 52 with lots of base boards 22 formed thereon is formed. A boss 51 of a mount base 50 is inserted into a hole 53 of the master board 52 to set the master board 52 to an upper side of the mount base 50 to position the base board 22. Then the mount base 50 is set to an automatic mounting equipment and dielectric resonators and coupling boards being various components of the filter are positioned and arranged by the automatic mounting equipment with high precision. Then the mount base 50 with the master board placed thereon is subjected to reflow soldering. Then the master board 52 is removed from the mount base 50 and the unit base boards, that is, dielectric filters are separated from the master board 52. After each base board 22 is separated, a cover is covered to an upper side of the base board 22 and the cover is soldered to the base board 22. Then the manufacture is made complete.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to, for example, a car telephone,
The present invention relates to a method of manufacturing a dielectric filter used in mobile communication equipment such as a mobile phone.

[0002]

2. Description of the Related Art FIG. 5 is an exploded perspective view of a conventional dielectric filter, and FIG. 6 is a perspective view showing a state in which various parts are mounted. First, the overall structure of a conventional dielectric filter will be described. The dielectric filters shown in FIGS. 5 and 6 are used in mobile communication devices such as car phones and mobile phones, and are used in the microwave band, and are so-called antenna duplexers.

The dielectric filter has a band elimination filter on the transmitting side and a band pass filter on the receiving side. First, the overall structure of this surface mount type dielectric filter is shown in FIGS.
Will be described. Band elimination filter is 3
It has a multi-stage resonator configuration and has three quarter-wave dielectric coaxial resonators 1 to 3, and the bandpass filter has four-stage resonator configuration and four quarter-wave resonators. It has dielectric coaxial resonators 4 to 7.

In the dielectric coaxial resonators 1 to 7, the electrode film-shaped inner conductor formed on the inner peripheral surface of the dielectric hole 8 formed in the shape of a rectangular parallelepiped and the electrode formed on the side surface of the dielectric body. It is composed of a film-shaped outer conductor and a short-circuit conductor (not shown) formed on one of the end faces where the hole 8 is opened to short-circuit the inner conductor and the outer conductor, and resonates at a predetermined frequency. It is like this. Into the holes 8 of the dielectric coaxial resonators 1 to 7, metal connection terminals 9 whose one end side is formed in a substantially cylindrical shape are press-fitted from the open end sides of the dielectric coaxial resonators 1 to 7, respectively.
Conductivity is obtained by contacting the inner conductor inside. Connection terminal 9
The other end side is formed in a tongue shape, and is connected to the electrode films 14 to 17 formed on the upper surfaces of the capacitor substrates 10 to 12 and the coupling substrate 13 described later by soldering or the like. There is.

The capacitor substrates 10 to 12 are made of a dielectric material, and electrode films are formed on the upper and lower surfaces thereof to form capacitors. Further, a plurality of electrode films 14 to 17 are arranged in parallel on the upper surface of the coupling substrate 13 made of a dielectric material, and the electrode films 14 to 16 are formed in a comb-tooth shape at the opposing portions in order to increase the coupling capacitance. ing. Furthermore, electrode films are formed on both sides of the lower surface of the combined substrate 13. In addition, coil-shaped inductors L _{1 to} L ₃ are connected between the capacitor substrates 10 to 12. The inductors L _{1 to} L
Electrode films 19 and 20 are formed on the upper surface of a combined substrate 18 made of a dielectric material for mounting ₃ , and an electrode film serving as a ground electrode is formed on the entire lower surface of the combined substrate 18.

A base substrate 2 on which the above members are mounted on the upper surface.
Reference numeral 2 denotes an electrode film-shaped input / output terminal 23 connected to the antenna side and an electrode film-shaped input / output terminal 2 connected to the transmitter side.
4 and an input / output terminal 25 in the form of an electrode film to which the receiver side is connected
And are formed respectively. Further, an electrode film-shaped ground electrode 26 is formed on substantially the entire upper surface and lower surface of the base substrate 22. The base substrate 22 is made of a dielectric material or an insulating material. The combined substrate 13 mounted on the upper surface of the base substrate 22 includes two spacers 2.
The other spacer 21 is mounted on the upper surface of the input / output terminal 24 of the base substrate 22. The three spacers 21 are made of a conductive material such as metal.

Ground electrodes 26 are formed on the entire upper and lower surfaces of the base substrate 22 except for the input / output terminals 23 to 25. The ground electrodes 26 on the upper and lower surfaces are formed in a straight line in the horizontal direction. Conduction is obtained by a plurality of through holes 33. Further, the ground electrodes 26 on the upper and lower surfaces are also electrically connected through the electrode film formed on the end surface of the semicircular cutout 34 formed around the base substrate 22. Further, the input / output terminals 23 to 25 are also electrically connected to the upper and lower surfaces of the base substrate 22 via the electrode films formed on the end surfaces.

The cover 27 that covers the base substrate 22 is made of metal, and the top plate of the cover 27 is used for soldering the outer conductors of the upper surfaces of the dielectric coaxial resonators 1 to 7 and the cover 27. And an elongated hole 28 and a hole 29 for inserting a jig for adjusting the characteristics of the dielectric coaxial resonators 1 to 7 are formed. Further, a plurality of ground terminals 30 connected to the upper surface ground electrode 26 of the base substrate 22 are formed from the front portion of the lower edge of the cover 27. Notches 31 for exposing the input / output terminals 23 to 25 of the base substrate 22 are formed on the side plates of the cover 27, respectively. Further, as shown in FIG. 6, a label 32 is attached to the upper surface of the cover 27 and the hole 28
And 29 are covered.

In the above case, the case where the cover 27 is used has been described, but there are cases where the dielectric filter is formed without using the cover 27. The label 32 is made of a resin called Kapton (trade name). When the label 32 is made of resin, it does not serve as a shield, but when it has the function of a shield, it is made of metal.

Next, the arrangement of each member will be described. As shown in FIGS. 5 and 6, on the band elimination filter side, one spacer 21 is formed on the base substrate 2.
2 is mounted on the input / output terminal 24 and the combined substrate 1
8 is mounted on the ground electrode 26 between the input / output terminals 24 and 23 of the base substrate 22 and soldered. Furthermore,
The spacers 21 are mounted on the upper surfaces of the input / output terminals 23 and 25, and the combined substrate 13 is bridged and soldered on the upper surfaces of the two spacers 21 so that the electrode films on the lower surfaces are in contact with each other.

As shown in FIG. 6, one end of the inductor L ₁ is mounted on the upper surface of the spacer 21, the capacitor substrate 10 is mounted thereon, and the dielectric coaxial resonator 1 is mounted on the electrode film on the upper surface of the capacitor substrate 10. Is connected to the connection terminal 9. The other end of the inductor L ₁ is mounted on the electrode film 19 of the combined substrate 18, and the inductor L ₂ is connected to the combined substrate 1
8 is mounted between the electrode films 19 and 20. Then, the capacitor substrate 11 is placed on the connecting portion between the inductors L ₁ and L _2.
Is mounted, and the connection terminal 9 from the dielectric coaxial resonator 2 is connected to the electrode film on the upper surface of the capacitor substrate 11. One end of the inductor L ₃ is mounted on the electrode film 20 of the coupling substrate 18, and the other end is mounted on the input / output terminal 23. Also,
Capacitor board 1 above the connection between inductors L ₂ and L _3.
2 is mounted, and the connection terminal 9 from the dielectric coaxial resonator 3 is connected to the electrode film on the upper surface of the capacitor substrate 12.

The connection terminals 9 from the dielectric coaxial resonators 4 to 7 are connected to the electrode films 14 to 17 on the upper surface of the coupling substrate 13 mounted on the two spacers 21, respectively. There is.

FIG. 7 shows an equivalent circuit diagram of the dielectric filter constructed as described above. Capacitors C _{1 to} C ₃ on the band elimination filter side are electrode films above and below the capacitor substrates 10 to 12. The capacitor C ₄ is formed between the input / output terminal 24 and the ground electrode on the lower surface. The capacitors C ₅ and C ₆ are formed by the electrode films 19 and 20 on the upper surface and the electrode film on the lower surface of the combined substrate 18. Further, the capacitor C ₇ is connected to the input / output terminal 23.
And the ground electrode on the lower surface.

Further, the capacitor C ₈ on the side of the bandpass filter is formed between the electrode film 14 of the combined substrate 13 and the electrode film on the lower surface, and the capacitors C _{9 to} C ₁₀ are formed on the combined substrate 1.
3 between the electrode films 14 to 16. Further, the capacitor C ₁₁ is formed by the electrode film 16 on the upper surface and the electrode film (not shown) on the lower surface of the combined substrate 13. The electrode film on the lower surface is electrically connected to the right end spacer 21 in FIG. Further, the capacitor C ₁₂ is formed by the electrode film 17 on the upper surface and the electrode film on the lower surface of the combined substrate 13. The dielectric coaxial resonator 7 and the capacitor C ₁₂ form a trap circuit of a series resonance circuit.

[0015]

FIG. 8 is a diagram showing a conventional manufacturing method of such a dielectric filter, and a conventional manufacturing method will be described below. Bosses 41 are provided upright on both sides of the upper surface of the reflow jig 40, and the positioning holes 36 formed on both sides of the base substrate 22 are applied to the boss 41 to set the base substrate 22 on the upper surface of the reflow jig 40. . Then, the frame-shaped jig 42 is set on it.

Next, one end side (short-circuit end side) of the plurality of dielectric coaxial resonators 1 to 7 is placed on the base substrate 22 with the inner surface of one piece 43 of the frame-shaped jig 42 being contacted. Bonded substrate 13, 1
In contrast to the above, the coupling circuit elements such as 8 and the spacer 21 are arranged so as to be in contact with the inner surface of the other piece 44 of the frame-shaped jig 42. Then, reflow soldering is performed to mount various components such as the dielectric coaxial resonators 1 to 7 and the coupling substrate 13 on the base substrate 22 by soldering. Also, when covering the cover, after reflow soldering,
The frame-shaped jig 42 is removed, and the cover is mounted on the base substrate 22 by soldering or the like.

However, the conventional manufacturing method is suitable for manual work since it is carried out individually, but when the automatic mounting machine is used for mass production, the frame-shaped jig 42 is used. But it gets in the way. Further, there is a problem that it takes time (man-hours) to set the base substrate 22 and the frame-shaped jig 42. Furthermore, the frame-shaped jig 42 itself is expensive, and this is a costly construction method.

The present invention has been made in view of the above points, and provides a method of manufacturing a dielectric filter aiming at inexpensive mass production.

[0019]

The present invention provides a dielectric filter in which various components of a filter such as a dielectric coaxial resonator, a capacitor and an inductor are mounted on a base substrate.
A parent board having a plurality of base boards is provided, the parent board is set in an automatic mounting machine, and various component parts of the filter are arranged on each base board of the parent board by the automatic mounting machine. Reflow soldering every
After reflow soldering, the parent board is divided to form a single base board.

[0020]

According to the present invention, the dielectric filter can be mass-produced at low cost because various component parts of the filter are mounted on the parent substrate on which a plurality of base substrates are formed by the automatic mounting machine. Moreover, since a plurality of base boards are formed on the parent board, it is easy to introduce an automatic mounting machine, and the cost can be reduced. Further, it is possible to reduce the number of frame-shaped jigs used conventionally. Further, since it can be applied to different types of filters, it is highly versatile, and different types of filters can be manufactured on one parent substrate.

[0021]

Embodiments of the present invention will be described below with reference to the drawings. Since the structure of the dielectric filter itself is the same as that of the conventional one, the same parts are denoted by the same reference numerals as those of the conventional one, and the description thereof will be omitted.

As shown in FIG. 1, a large number of base substrates 22 are provided.
Then, the parent substrate 52 on which is formed is formed. In this example,
Although nine base substrates 22 are formed on the parent substrate 52,
Of course, the number of base substrates 22 is not limited to nine, and any number of base substrates 22 may be formed. At one end of the parent board 52,
A hole 53 for positioning the parent board 52 is punched,
Further, a boss 51 corresponding to the hole 53 is provided on the upper surface of the mount base 50 for positioning the parent board 52.

First, the boss 51 of the mount base 50 is inserted into the hole 53 of the parent board 52, the parent board 52 is set on the upper surface of the mount base 50, and the base board 22 is positioned. Next, the mount base 50 is set on an automatic mounter (not shown), and the dielectric coaxial resonators 1 to 7, which are various components of the filter, the coupling substrate 13 and the like (see FIG. 8) are moved by the automatic mounter. Position and arrange with accuracy.

Then, reflow soldering is performed together with the mount base 50. Then, the parent board 52 is removed from the mount base 50, and the parent board 52 is used as a single base board 2
2, that is, the dielectric filter is divided. Next, after the base substrate 22 is divided into individual pieces, the cover is provided on the upper surface of the base substrate 22, and the cover is soldered to the base substrate 22 to complete the process. When the cover is not provided, the base substrate 22 is separated from the parent substrate 52 to complete the dielectric filter.

Here, omitting the mount base 50,
The components may be mounted on the parent board 52 alone by an automatic mounting machine, and then reflow soldering may be performed. Further, the cover may be soldered to each base substrate 22 of the parent substrate 52 before the parent substrate 52 is divided, and then the base substrate 22 may be divided.

Next, a method of dividing the parent board 52 will be described. As a method of dividing the parent substrate 52, there are a cutting method using a dicer, a pushback method, and a method of forming a V-shaped groove on the base substrate and bending it. 2 and 3
Shows the push-back method, and as shown in FIG. 2, the base substrate 22 is once removed from the parent substrate 52, and then, as shown in FIG.
This is a method of returning the base substrate 22 to its original position as shown in FIG.
Then, the base substrate 22 can be easily divided from the parent substrate 52.

In FIG. 4, a V-shaped groove 54 is formed in the vertical and horizontal directions of the parent substrate 52, and the base substrates 22 on both sides are bent around the V-shaped groove 54 as shown by the arrows, whereby the parent substrate 52 is formed.
The base substrate 22 is divided from each.

Note that one type of filter may be formed on each base substrate 22 of the parent substrate 52, or different filters may be formed to manufacture a plurality of types of filters from one parent substrate 52. good.

Further, in the conventional example and the previous embodiment, the example of the antenna duplexer in which the bandpass filter and the band elimination filter are combined has been described as the filter configuration. However, the bandpass filter and the band elimination filter are described. The present invention can also be applied to the above single configuration, each of the other high pass filters and the low pass filters, or the combination of the filters. Further, the number of stages of the resonator is not limited.

[0030]

According to the present invention, in a dielectric filter in which various components of a filter such as a dielectric coaxial resonator, a capacitor and an inductor are mounted on a base substrate, a parent substrate having a plurality of base substrates is provided, The parent board is set in an automatic mounter, and various components of the filter are respectively placed on each base board of the parent board by the automatic mounter, and then reflow soldering is performed for each parent board, and the parent board is placed after reflow soldering. Since it is designed to be divided into a single base substrate, a large number of dielectric filters can be inexpensively mounted on the parent substrate on which multiple base substrates have been formed, in order to mount various filter components using an automatic mounting machine. Can be produced. Moreover, since multiple base boards are formed on the parent board, it is easy to introduce an automatic mounting machine,
The cost can be reduced. Further, it is possible to reduce the number of frame-shaped jigs used conventionally. Furthermore, since it can be applied to different types of filters, it is highly versatile, and it is possible to manufacture different types of filters on one parent substrate.

[Brief description of drawings]

FIG. 1 is a perspective view showing steps of a manufacturing method according to an embodiment of the present invention.

FIG. 2A is a perspective view showing a pushback method for dividing a parent board according to an embodiment of the present invention. (B) is a sectional view showing a push-back method in the case of dividing the parent board of the embodiment of the present invention.

FIG. 3A is a perspective view showing a pushback method for dividing a parent board according to an embodiment of the present invention. (B) is a sectional view showing a push-back method in the case of dividing the parent board of the embodiment of the present invention.

FIG. 4 is a perspective view of a main part showing a method using a V-shaped groove when dividing a parent board according to an embodiment of the present invention.

FIG. 5 is an exploded perspective view of an entire conventional dielectric filter.

FIG. 6 is a perspective view showing a mounted state of a conventional dielectric filter.

FIG. 7 is an equivalent circuit diagram of the dielectric filter shown in FIG. 5 of a conventional example.

FIG. 8 is a perspective view showing a method for manufacturing a conventional dielectric filter.

[Explanation of symbols]

 22 base board 50 mount base 52 parent board

Claims (1)

[Claims] 1. A dielectric filter in which various components of a filter such as a dielectric coaxial resonator, a capacitor, and an inductor are mounted on a base substrate, a parent substrate having a plurality of base substrates is provided, and the parent substrate is automatically mounted. Machine,
Various components of the filter are placed on each base board of the parent board by the automatic mounter, and then reflow soldering is performed for each parent board, and after the reflow soldering, the parent board is divided to form a single base board. A method of manufacturing a dielectric filter, characterized in that