JPH06334338A - Manufacture of heat sink built-in type circuit molded object - Google Patents

Abstract

PURPOSE:To provide a manufacturing method of a new heat sink built-in type circuit molded object wherein the manufacturing work efficiency of a circuit molded body provided with a heat sink is improved and miniaturization is easily attain. CONSTITUTION:In the manufacturing method of a circuit molded body provided with a heat sink 2 for dissipating the heat of a mounting components 6, the heat sink 2 which is previously formed in a specified shape is arranged in a metal mold, and filled it with resin 1 or the like, thereby forming an injection- molded object 3 wherein the heat sink 2 is built in a unified body. After that, a necessary circuit is formed on the surface of the injection-molded object 3, and a mounting components 6 is fixed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a circuit molded body in which a radiator for a mounting component is integrally molded by injection molding.

[0002]

2. Description of the Related Art Conventionally, printed wiring boards are often provided with a radiator for radiating heat from mounted components.
This is also applied to a three-dimensionally formed circuit molded body as it is. The radiator is made of a metal having a high thermal conductivity such as copper or aluminum, and is attached in close contact with a mounted surface of a component such as hardware to be mounted. Also, the range is from as simple as a flat plate of metal that bolts the heat-generating components to as complex as a system that uses thermal feedback sensors to control the cooling fluid flowing through the tubes surrounding the components. There are even those that have a shape that imitates the fin configuration.

[0003]

However, the conventional heat radiator used in the printed wiring board is
When used for a circuit molded body formed in three-dimensionally various shapes, the degree of freedom in the shape and size is small, which is one constraint condition when designing the circuit molded body.
For example, when designing a small circuit molded body, considering the installation method of this heat sink, etc., it is inevitable that a certain amount of installation space will be required due to the mounting position, size of the mounting bolts, etc. It was difficult to make the body smaller. Further, although the heat radiator is supposed to be manually attached, since the circuit molded body has a three-dimensional structure, the efficiency of the work is hindered as the heat radiator attached becomes smaller.

Therefore, the present invention has been devised to effectively solve this problem, and the object thereof is to easily improve the manufacturing work efficiency and miniaturize the circuit molded body having a heat radiator. It is intended to provide a novel method of manufacturing a heat radiator integrated circuit molded body.

[0005]

A first invention for solving the above-mentioned problems is a method for manufacturing a circuit molded body provided with a radiator for radiating heat of a mounted component, which is formed in a predetermined shape in advance. After disposing the radiated heat-dissipating body in a mold, a resin is filled into the mold to form an injection-molded body integrally provided with the heat-dissipating body, and thereafter, a surface required for the injection-molded body is formed. A second aspect of the present invention provides a circuit formed body and the mounting component. The second invention is a method for manufacturing a circuit molded body including a radiator for radiating the heat of the mounting component. And a circuit forming part are integrally injection-molded to form an injection-molded body, and then a metal layer is applied to the surface of the injection-molded body to form a heat-dissipating body and a necessary circuit and the mounting component is provided. Is.

[0006] That is, as a method for producing this heat sink integrated circuit forming body, after a heat sink (particularly, a cooling fin portion) is formed in advance, it is put in a mold and the periphery thereof is covered with resin by injection molding. , To form the desired injection molded body. Next, conductivity is imparted to the circuit portion on the surface of this molded body to prepare a heat radiator integrated circuit molded body. In these steps, there is no problem as it is generally used for the heat radiator. Further, there is used a method in which the fin portion is formed using the same base material as the circuit portion on the surface and then the surface is metalized by a plating method. At that time, holes or mounting portions for mounting the mounting components are simultaneously formed. As the base material used for the circuit molded body, a resin called engineering plastic is used in consideration of rigidity, dimensional stability, electric characteristics and thermal characteristics. As the method of forming the surface circuit after molding, as in the conventional method, a two-color forming method is used in which a resin containing a plating catalyst and a resin without a catalyst are combined. After applying the catalyst on the surface, cover the part other than the circuit with a permanent mask. A plating method or the like is used.

[0007]

As described above, in the manufacturing method of the first invention, the preformed radiator is arranged in the mold and integrally molded with the other circuit portion, and in the manufacturing method of the second invention, Since the radiator is also injection-molded using the same base material as the circuit part on the surface, there is no need to attach the radiator later, unlike the conventional method, and the number of molded parts such as bolts and adhesives can be reduced and It is possible to make the compact compact and improve work efficiency.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

(Example 1) As shown in FIG. 1 (A), a molding resin 1 made of polyether sulfone, which is one of engineering plastics, was used, and a commercially available radiator 2 was put in a mold. After that, a three-dimensional injection molded body 3 was created by injection molding. Next, as shown in FIG. 1 (B), the surface of the injection molded body 3 is subjected to a pre-plating treatment for forming a plating film, and then a plating catalyst is applied to a circuit forming portion to form a metal layer 4. Then, a circuit is formed by electroless plating, and thereafter, as shown in FIG. 1C, the mounting component 6 is inserted into the through hole 5 of the injection molded body 3 provided with the heat radiator 2 and the lead wire 7 Was soldered 8 to the circuit, the mounting component 6 was attached, and the circuit molded body was created.

(Example 2) As shown in FIG. 2 (A), a primary molding resin 9 made of a liquid crystal polyester resin containing a catalyst was used.
After molding the injection molded body 3 including the radiator 2 having cooling fins and the circuit forming portion by using a, as shown in FIG.
As shown in (B), a portion of the injection molded body 3 outside the circuit formation is covered with a secondary molding resin 9b made of a polyphenylene sulfide resin without a catalyst, and the circuit portion is subjected to a pretreatment for plating for forming a plating film. After that, as shown in FIG. 2 (C), the metal layer 4 is provided on the circuit portion and the fin portion by electroless plating to form the radiator 2, and then, as shown in FIG.
As shown in (D), the mounting component 6 is inserted into the through hole 5 of the injection molded body 3 provided with the radiator 2, and the lead wire 7 is soldered 8 to the circuit to mount the component 6 and the radiator. 2 was thermally connected to form a circuit molded body.

As a result of actually using the circuit molded bodies obtained in Examples 1 and 2, a good heat radiation effect was exhibited as in the conventional circuit molded body having a radiator mounted later. In addition, since the heat sink can be integrally obtained at the same time as the other circuit forming parts, there is no need for molded parts for attaching the heat sink or manual work, which is much larger than the conventional manufacturing method. Since the manufacturing efficiency is improved and the mounting position and size of the heat radiator can be freely set, the degree of freedom in mounting is increased and the miniaturization can be easily achieved.

[0012]

In summary, according to the present invention, since manual work for retrofitting a radiator is not required, the manufacturing efficiency is greatly improved as compared with the conventional manufacturing method, and the cost reduction is achieved. Further, since the mounting position and size of the heat radiator can be freely set, the flexibility of mounting is increased and miniaturization can be easily achieved.

[Brief description of drawings]

FIG. 1 is a process drawing showing an embodiment of the first invention.

FIG. 2 is a process drawing showing an embodiment of the second invention.

[Explanation of symbols]

 1,9a, 9b Molded resin 2 Heat sink 3 Injection molded body 4 Metal layer 5 Through hole 6 Mounting component 7 Lead wire 8 Soldering

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Ryo Sato 5-1-1 Hidakacho, Hitachi City, Ibaraki Hitachi Power Systems Co., Ltd. (72) Inventor Hideki Asano 5 Hidakacho, Hitachi City, Ibaraki Prefecture 1-1-1 Hitachi Cable Co., Ltd. Power Systems Research Center

Claims (2)

[Claims] 1. A method for manufacturing a circuit molded body having a radiator for radiating heat of a mounted component, wherein a radiator formed in a predetermined shape is placed in a mold, and then the inside of the mold is placed. A resin is filled with resin to form an injection-molded body integrally provided with the heat-dissipating body, and then a necessary circuit is formed on the surface of the injection-molded body and the mounting component is provided. A method for manufacturing a body-integrated circuit molded body. 2. A method for manufacturing a circuit molded body provided with a radiator for radiating heat of a mounted component, wherein a fin portion serving as the radiator and a circuit forming portion are integrally injection molded to form an injection molded body. After the formation, a metal layer is applied to the surface of the injection-molded body to form a heat-dissipating body and a necessary circuit, and the mounting component is provided, and a method for manufacturing a heat-dissipating body-integrated circuit-molding body.