JPH06334282A - Green sheet for ceramic multilayer substrate - Google Patents

Green sheet for ceramic multilayer substrate

Info

Publication number
JPH06334282A
JPH06334282A JP5121264A JP12126493A JPH06334282A JP H06334282 A JPH06334282 A JP H06334282A JP 5121264 A JP5121264 A JP 5121264A JP 12126493 A JP12126493 A JP 12126493A JP H06334282 A JPH06334282 A JP H06334282A
Authority
JP
Japan
Prior art keywords
resin
green sheet
ceramic powder
substrate
binder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5121264A
Other languages
Japanese (ja)
Inventor
Shigetoshi Segawa
茂俊 瀬川
Yasuyuki Baba
康行 馬場
Yasukazu Fukunaga
靖一 福永
Hiroshi Ochi
博 越智
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP5121264A priority Critical patent/JPH06334282A/en
Publication of JPH06334282A publication Critical patent/JPH06334282A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To simplify debinder process for manufacturing a substrate by using polypropylenecaronate resin, etc., for ceramic powder as main constituents and then a slurry where a material obtained by adding acryl resin as a dispersant is prepared as resin for binder. CONSTITUTION:The main constituent of binder resin is constituted by polypropylene carbonate resin or polyethylenecarbonate resin. Since the resins are completely subjected to thermal composition in air until temperature reaches 300 deg.C, debinder can be performed quickly and easily. The polypropylenecarbonate resin, etc., have relatively large molecular weight. Therefore, when a green sheet is formed only with the resins, the dispersion property of ceramic powder is poor so that the surface state of the green sheet becomes an island style or is cracked. Therefore, by adding acryl resin with a relatively small molecular weight, the dispersion property of the ceramic powder is improved to obtain the improved green sheet.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はセラミック多層基板用グ
リーンシートに関するものであり、特に基板製造上の脱
バインダープロセスを簡易にしたことを特徴とするもの
である。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a green sheet for a ceramic multi-layer substrate, and is particularly characterized by simplifying a debinding process for producing a substrate.

【0002】[0002]

【従来の技術】近年、電子機器の小型化及び回路のデジ
タル化に伴い、高密度なセラミック多層基板が要求され
てきている。特に低インピーダンスの導体であるAg、
Cuもしくはそれらに準ずる材料を使用でき、低誘電
率、低線膨張係数を持つ低温焼成セラミック基板に注目
が集まっている。
2. Description of the Related Art In recent years, with the miniaturization of electronic devices and the digitization of circuits, there has been a demand for high-density ceramic multilayer substrates. In particular, Ag, which is a low-impedance conductor,
Attention has been focused on a low-temperature fired ceramic substrate having a low dielectric constant and a low linear expansion coefficient, which can use Cu or a material similar thereto.

【0003】セラミック多層基板の従来の製造工程は、
各セラミックグリーンシートに配線パターンをそれぞれ
印刷したものを複数枚積層して、これらを数十時間を費
やしてグリーンシート中の有機成分を除去(脱バインダ
ー)した後に基板を焼成し、その基板表面に導体ペース
トをスクリーン印刷し、外層導体を焼成することにより
行われていた。
The conventional manufacturing process of a ceramic multilayer substrate is as follows.
Laminate multiple ceramic green sheets with wiring patterns printed on them, spend several tens of hours to remove (remove binder) the organic components from the green sheets, and then bake the substrate, This is done by screen-printing a conductor paste and firing the outer conductor.

【0004】一般的にグリーンシート用バインダーに
は、エチルセルロース系等の樹脂(熱分解温度:350
℃以上)が使用されており、セラミック粉末には、コー
ジェライト系ガラスセラミックス等が使用されてきた。
Generally, the binder for the green sheet is a resin such as ethyl cellulose (thermal decomposition temperature: 350).
(° C or higher) is used, and cordierite glass ceramics and the like have been used as the ceramic powder.

【0005】[0005]

【発明が解決しようとする課題】しかしながら上記従来
のセラミック多層基板の製造工程では、グリーンシート
積層体中の有機成分を除去するために、基板焼成工程前
に脱バインダー工程を設けなければならず、この工程に
は数十時間と非常に長い時間を必要とし、そのプロファ
イルも非常に繊細なものであった。
However, in the conventional manufacturing process of the above-mentioned ceramic multilayer substrate, in order to remove the organic component in the green sheet laminate, a binder removal process must be provided before the substrate baking process. This process required a very long time of several tens of hours, and its profile was also very delicate.

【0006】これはグリーンシート中に多量に含まれる
バインダー樹脂の熱分解温度が350℃以上あるためで
あり、バインダー樹脂を完全に除去するには、かなりの
時間とそれに伴う電気代が必要となり、大幅なコストア
ップにつながっていた。
This is because the thermal decomposition temperature of the binder resin contained in a large amount in the green sheet is 350 ° C. or higher, and it takes a considerable amount of time and an associated electricity bill to completely remove the binder resin. It led to a significant cost increase.

【0007】本発明はこの様な問題点を解決し、基板製
造上の脱バインダー工程を簡易にし、より低コストで作
製できるセラミック多層基板を提供することを目的とす
る。
It is an object of the present invention to solve the above problems and to provide a ceramic multi-layer substrate which can be manufactured at a lower cost by simplifying the debinding process for producing the substrate.

【0008】[0008]

【課題を解決するための手段】上記課題を解決するため
に本発明のセラミック多層基板用グリーンシートは、セ
ラミック粉末に対して、ポリプロピレンカーボネート樹
脂もしくはポリエチレンカーボネート樹脂のいずれかを
主成分とし、アクリル樹脂を分散剤として添加したもの
をバインダー用樹脂として調整したスラリーを用いて作
製したことを特徴とするものである。
Means for Solving the Problems In order to solve the above problems, a green sheet for a ceramic multilayer substrate of the present invention contains, as a main component, either a polypropylene carbonate resin or a polyethylene carbonate resin with respect to a ceramic powder, and an acrylic resin. Is prepared by using a slurry prepared by adding as a dispersant to a resin for binder.

【0009】[0009]

【作用】上記構成によれば、グリーンシート中に含まれ
るバインダー樹脂の主成分を、ポリプロピレンカーボネ
ート樹脂もしくはポリエチレンカーボネート樹脂で構成
している。これらの樹脂は、空気中にて300℃までに
完全に熱分解してしまうために、脱バインダーが短時間
で容易に行えるようになる。これまでの基板焼成前の特
別な脱バインダー工程を省略することもできるので、ベ
ルト連続焼成炉での基板焼成工程中で、同時に脱バイン
ダーを行うことも可能になる。
According to the above construction, the main component of the binder resin contained in the green sheet is polypropylene carbonate resin or polyethylene carbonate resin. Since these resins are completely thermally decomposed up to 300 ° C. in air, debinding can be easily performed in a short time. Since it is possible to omit the special debinding process before the substrate baking, it is possible to simultaneously perform the binder removal during the substrate baking process in the belt continuous baking furnace.

【0010】ここでバインダーにアクリル樹脂を加えて
いる理由は、ポリプロピレンカーボネート樹脂もしくは
ポリエチレンカーボネート樹脂は分子量が比較的大きく
(約50000)、この樹脂のみではグリーンシートを
成形した場合に、セラミック粉の分散性が悪く、完成し
たグリーンシートの表面状態が島模様になったりクラッ
クが入るため、良好なグリーンシートが得られない。そ
こで、比較的分子量の小さい(10000以下)アクリ
ル樹脂を加えることにより、セラミック粉の分散性を上
げ良好なグリーンシートが得られる様にしているのであ
る。
The reason why acrylic resin is added to the binder here is that polypropylene carbonate resin or polyethylene carbonate resin has a relatively large molecular weight (about 50,000), and when this resin alone is used to disperse the ceramic powder when a green sheet is molded. Since the surface properties of the finished green sheet are poor and have an island pattern or cracks, a good green sheet cannot be obtained. Therefore, by adding an acrylic resin having a relatively small molecular weight (10,000 or less), the dispersibility of the ceramic powder is increased and a good green sheet is obtained.

【0011】[0011]

【実施例】以下、本発明の実施例について図面を参照し
ながら説明する。表1は一実施例におけるセラミック多
層基板用グリーンシートを成形する際のスラリーの組成
を示し、表2にはその際使用したセラミック粉末の組成
を示す。
Embodiments of the present invention will be described below with reference to the drawings. Table 1 shows the composition of the slurry when molding the green sheet for a ceramic multilayer substrate in one example, and Table 2 shows the composition of the ceramic powder used at that time.

【0012】[0012]

【表1】 [Table 1]

【0013】[0013]

【表2】 [Table 2]

【0014】上記組成のスラリーにて、図2に示すよう
に、ドクターブレード法により200μmの厚みの各グ
リーンシート6を形成し乾燥させる。次にこのグリーン
シート6にNCパンチング装置にてVia孔4を形成
し、このVia孔4に導電性ペーストを充填、乾燥す
る。そしてスクリーン印刷法にて内層導体2を形成し乾
燥する。この様にしてできた各層を積層機にて熱圧着を
行い一体化し、グリーンシート積層体を完成させる。
As shown in FIG. 2, a green sheet 6 having a thickness of 200 μm is formed from the slurry having the above composition by a doctor blade method and dried. Next, a via hole 4 is formed in the green sheet 6 by an NC punching device, and the via hole 4 is filled with a conductive paste and dried. Then, the inner layer conductor 2 is formed by screen printing and dried. The respective layers thus formed are thermocompression-bonded by a laminating machine to be integrated to complete a green sheet laminated body.

【0015】このグリーンシート積層体を特別な脱バイ
ンダー工程を設けることなく、ベルト連続焼成炉で図3
に示すプロファイルにてトータル120分、900℃
キープ20分にて基板焼成を行う。
This green sheet laminate was subjected to a belt continuous firing furnace without a special debinding process, as shown in FIG.
120 minutes at 900 ° C with the profile shown in
The substrate is baked for 20 minutes.

【0016】そして導体ペーストを用いてスクリーン印
刷法にて、誘電体層1の表面に最外層導体3を形成し、
乾燥、焼成を行った後に、抵抗体ペーストを用いて抵抗
体5をスクリーン印刷法により形成し、乾燥、焼成を行
い、図1に示すセラミック多層基板を完成する。
Then, the outermost conductor 3 is formed on the surface of the dielectric layer 1 by a screen printing method using a conductor paste,
After drying and firing, the resistor 5 is formed by a screen printing method using a resistor paste, followed by drying and firing to complete the ceramic multilayer substrate shown in FIG.

【0017】なお本実施例では内層導体2を銀、最外層
導体3を銀/白金を主成分とする導体で形成している。
又、抵抗体5を酸化ルテニウムを主成分とする抵抗体で
形成している。又、本実施例におけるセラミック多層基
板の基板特性を表3に示す。
In this embodiment, the inner layer conductor 2 is made of silver, and the outermost layer conductor 3 is made of a conductor whose main component is silver / platinum.
Further, the resistor 5 is formed of a resistor whose main component is ruthenium oxide. Table 3 shows the substrate characteristics of the ceramic multilayer substrate of this example.

【0018】[0018]

【表3】 [Table 3]

【0019】なお上記実施例の他に、バインダー樹脂と
してポリプロピレンカーボネート樹脂を主成分とし、ア
クリル樹脂を分散剤として添加して調整したスラリーを
用いたグリーンシートによっても、同様に脱バインダー
工程を簡略化することができる。
In addition to the above examples, a green sheet using a slurry prepared by adding a polypropylene carbonate resin as a binder resin as a main component and adding an acrylic resin as a dispersant also simplifies the debinding process. can do.

【0020】[0020]

【発明の効果】以上の様に、本発明のセラミック多層基
板用グリーンシートによれば、セラミック多層基板の製
造工程において、特別な脱バインダー工程を設けること
なく、ベルト連続焼成炉を用いて短時間での基板焼成が
可能になり、その製造が容易に行えるだけではなく、こ
れによりセラミック多層基板のコストダウンに寄与する
ことも明らかである。
As described above, according to the green sheet for a ceramic multilayer substrate of the present invention, in the manufacturing process of the ceramic multilayer substrate, a belt continuous firing furnace is used for a short time without providing a special debinding process. It is clear that not only can the substrate be fired in the above-described manner and the manufacturing thereof can be easily performed, but this also contributes to cost reduction of the ceramic multilayer substrate.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例におけるセラミック多層基板
用グリーンシートを用いたセラミック多層基板の断面図
FIG. 1 is a sectional view of a ceramic multilayer substrate using a green sheet for a ceramic multilayer substrate according to an embodiment of the present invention.

【図2】同セラミック多層基板の一製造工程における断
面図
FIG. 2 is a cross-sectional view in one manufacturing process of the ceramic multilayer substrate.

【図3】同セラミック多層基板の基板焼成プロファイル[FIG. 3] Substrate firing profile of the same ceramic multilayer substrate

【符号の説明】[Explanation of symbols]

1 誘電体層 2 内層導体 3 外層導体 4 Via孔 5 抵抗体 6 グリーンシート 1 Dielectric Layer 2 Inner Layer Conductor 3 Outer Layer Conductor 4 Via Hole 5 Resistor 6 Green Sheet

フロントページの続き (72)発明者 越智 博 香川県高松市寿町2丁目2番10号 松下寿 電子工業株式会社内Front page continuation (72) Inventor Hiroshi Ochi 2-10, Shoucho, Takamatsu City, Kagawa Prefecture Matsushita Electronic Industry Co., Ltd.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 セラミック粉末に対して、ポリプロピレ
ンカーボネート樹脂もしくはポリエチレンカーボネート
樹脂のいずれかを主成分とし、アクリル樹脂を分散剤と
して添加したものをバインダー用樹脂として調整したス
ラリーを用いて作製したことを特徴とするセラミック多
層基板用グリーンシート。
1. A slurry prepared by using, as a binder resin, a slurry containing, as a main component, either a polypropylene carbonate resin or a polyethylene carbonate resin and an acrylic resin added as a dispersant to a ceramic powder. Characteristic green sheet for ceramic multi-layer substrate.
JP5121264A 1993-05-24 1993-05-24 Green sheet for ceramic multilayer substrate Pending JPH06334282A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5121264A JPH06334282A (en) 1993-05-24 1993-05-24 Green sheet for ceramic multilayer substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5121264A JPH06334282A (en) 1993-05-24 1993-05-24 Green sheet for ceramic multilayer substrate

Publications (1)

Publication Number Publication Date
JPH06334282A true JPH06334282A (en) 1994-12-02

Family

ID=14806954

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5121264A Pending JPH06334282A (en) 1993-05-24 1993-05-24 Green sheet for ceramic multilayer substrate

Country Status (1)

Country Link
JP (1) JPH06334282A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012188297A (en) * 2011-03-08 2012-10-04 Sumitomo Seika Chem Co Ltd Resin composition for sinter-forming ceramic
CN107406669A (en) * 2015-03-30 2017-11-28 住友精化株式会社 Adhesive resin composition
KR20180133407A (en) 2016-04-08 2018-12-14 스미토모 세이카 가부시키가이샤 Aliphatic polycarbonate resin for forming barrier ribs, barrier rib material, substrate and manufacturing method thereof, manufacturing method of wiring board and wiring forming method
KR20180136444A (en) 2016-04-08 2018-12-24 스미토모 세이카 가부시키가이샤 Aliphatic polycarbonate resin, barrier rib material, substrate and manufacturing method thereof, manufacturing method of wiring board, and wiring forming method
US10748866B2 (en) * 2016-03-23 2020-08-18 Nitto Denko Corporation Thermal bonding sheet, thermal bonding sheet with dicing tape, bonded body production method, and power semiconductor device
WO2024029328A1 (en) * 2022-08-02 2024-02-08 株式会社村田製作所 Multilayer ceramic electronic component precursor and method for producing multilayer ceramic electronic component

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012188297A (en) * 2011-03-08 2012-10-04 Sumitomo Seika Chem Co Ltd Resin composition for sinter-forming ceramic
CN107406669A (en) * 2015-03-30 2017-11-28 住友精化株式会社 Adhesive resin composition
US10457607B2 (en) 2015-03-30 2019-10-29 Sumitomo Seika Chemicals Co., Ltd. Binder resin composition
TWI683853B (en) * 2015-03-30 2020-02-01 日商住友精化股份有限公司 Adhesive resin composition
US10748866B2 (en) * 2016-03-23 2020-08-18 Nitto Denko Corporation Thermal bonding sheet, thermal bonding sheet with dicing tape, bonded body production method, and power semiconductor device
KR20180133407A (en) 2016-04-08 2018-12-14 스미토모 세이카 가부시키가이샤 Aliphatic polycarbonate resin for forming barrier ribs, barrier rib material, substrate and manufacturing method thereof, manufacturing method of wiring board and wiring forming method
KR20180136444A (en) 2016-04-08 2018-12-24 스미토모 세이카 가부시키가이샤 Aliphatic polycarbonate resin, barrier rib material, substrate and manufacturing method thereof, manufacturing method of wiring board, and wiring forming method
US11084902B2 (en) 2016-04-08 2021-08-10 Sumitomo Seika Chemicals Co., Ltd. Aliphatic polycarbonate resin, partition material, substrate and production method therefor, production method for wiring substrate, and wiring forming method
US11142611B2 (en) 2016-04-08 2021-10-12 Sumitomo Seika Chemicals Co., Ltd. Aliphatic polycarbonate resin for forming partition, partition material, substrate and production method therefor, production method for wiring substrate, and wiring forming method
WO2024029328A1 (en) * 2022-08-02 2024-02-08 株式会社村田製作所 Multilayer ceramic electronic component precursor and method for producing multilayer ceramic electronic component

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