JPH06328323A - Mounting machine and transfer device for electronic part - Google Patents

Abstract

PURPOSE:To provide an electronic part mounting machine capable of correctly photographing and identifying the grasping condition of an electronic part. CONSTITUTION:A movable mirror transfer mechanism 40 is provided on the electronic part mounting mechanism 1 of an electronic part mounting machine, and the grasping condition of an electronic part by the electronic part mounting mechanism 1 is photographed and identified by a camera via a movable mirror 3 etc. In the movable mirror transfer mechanism 40, when the movement of the direction X1 of the electronic part mounting mechanism is stopped, the inertia force of the direction X1 of a movable mirror 3, a ball screw shaft 44, and a ball screw 42 is applied to a belt 48b, the inertia force of the direction X1 of a mass body 52 is applied to the belt 48b, and pulleys 46a and 45b are not rotated to effectively restrain the movement of the movable mirror 3 along the ball screw 42. Consequently the grasping condition of an electronic part can be correctly photographed and identified to be corrected.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a moving device having a moving portion such as an electronic component mounting machine for mounting electronic components at a predetermined position on a printed board, and more particularly to a moving device gripped by an absorption nozzle or the like. The present invention relates to a moving device having a moving unit such as an electronic component mounting machine that accurately captures and verifies a suction state of an electronic component.

[0002]

2. Description of the Related Art In automatic assembly of a printed board, an electronic component mounter is used to mount (place) electronic components such as IC devices, minute capacitors, and resistors at predetermined positions on the printed board. . The electronic component mounting machine, for example, sucks the electronic component placed in the electronic component storage, and moves to a predetermined position of the printed board on which the electronic component should be mounted,
The electronic component is configured to be placed at the predetermined position. To accurately mount the electronic component on the specified position of the printed board, identify the exact position of the printed board. Must be identified. Regarding the latter identification of the suction state, for example, in the case of an IC device, the pins of the IC device cannot be correctly inserted into the holes of the printed board if there is a suction position shift or an angle shift.
The adsorption state is imaged using a camera or the like, and the adsorption position or angle of the IC device is adjusted using the imaging result, and then the IC device is mounted on the printed board.

FIG. 6 (A) is a perspective view of an entire conventional electronic component mounting machine of the related art, and FIG. 6 (B) is a partially enlarged sectional view of FIG. 6 (A). In FIG. 6A, the electronic component mounting machine includes an X-axis moving mechanism 24 and Y-axis moving mechanisms 20 and 22. An electronic component mounting mechanism 71 is mounted on the X-axis moving mechanism 24 and moved in the X-axis direction of the X-axis moving mechanism 24. X
The axis moving mechanism 24 moves in the Y direction along the Y axis moving mechanisms 20 and 22.
It is moved in the axial direction, and along with this movement, the electronic component mounting mechanism 7
1 is also moved in the Y-axis direction.

In this electronic component mounting machine, the electronic component storage 2
When mounting an electronic component such as an IC device mounted on the printed circuit board 6 on the printed circuit board 28, first, an electronic component mounting mechanism 71
Is moved to the electronic component storage 26 by the X-axis moving mechanism 24 and the Y-axis moving mechanisms 20 and 22. At this time, the movable mirror 3 that is fixed to the ball screw 74 and moves in accordance with the movement of the ball screw 74 has the ball screw shaft 7 driven by the servomotor 73, as shown in FIG. 6B.
In accordance with the rotation of 2, the interior is hollow and is moved in the horizontal H direction away from the fixed mirror 2 to a position where it does not come into contact with the rotating part 71c connected to a vacuum suction device (not shown) and the electronic component 82. Then, the rotating unit 80 rotates and the tip thereof descends to the position of the electronic component 82 placed in the electronic component storage 26, and the electronic component 82 is vacuum-sucked by the suction nozzle provided at the tip of the rotating unit 80. . When the electronic component 82 is sucked, the electronic component mounting mechanism 71 causes the X-axis moving mechanism 2 to move.
It is moved to a predetermined position above the printed circuit board 28 by the 4 and Y-axis moving mechanisms 20, 22. While the electronic component mounting mechanism 71 is moved to a position above the printed circuit board 28, the rotating part 71 is raised and the electronic component 82 sucked by the suction nozzle is raised to a predetermined position.

The movable mirror 3 is moved while the electronic component mounting mechanism 71 is moved to a position above the printed circuit board 28.
Is a horizontal H that approaches the fixed mirror 2 in accordance with the rotation of the ball screw shaft 72 caused by the rotation drive of the servomotor 73.
The image of the suction state of the electronic component 82 is picked up by the cameras 14, 15 and 16 via the fixed mirror 2 and the movable mirror 3, and the suction state of the electronic component 82 with respect to the suction nozzle is detected. Then, the angle of the rotating unit 80 is adjusted according to the detection result to correct the suction state of the electronic component 82, and the corrected electronic component 82 is placed at a predetermined position on the printed circuit board 28.

In this electronic component mounting machine, the electronic components mounting mechanism 71 sucks the electronic components placed in the electronic component storage 26, and mounts them on the printed circuit board 28 at a predetermined position. Electronic component 82 imaged by 18
It is possible to detect and adjust the suction position shift or the angle shift of the electronic component sucked by the suction nozzle based on the image of the suction state of the electronic component 82, and the electronic component 82 can be accurately placed at a predetermined position of the printed circuit board 28. it can.

[0007]

However, in the above-described conventional electronic component mounting machine, the electronic component mounting by the X-axis moving mechanism 24 is performed while the suction state of the electronic component with respect to the suction nozzle is being imaged or detected. The movement of the mechanism 71 in the X direction in the X direction is stopped, and the inertial force of the direction X1 of the movable mirror 3 generated by the movement of the X axis moving mechanism 24 in the direction X1 causes the ball screw shaft 72 to rotate and the ball screw 74 to face. It may move to X1. This is because movement of the movable mirror 3 via the ball screw 74 is performed using the servo motor 73 via the ball screw shaft 72, and the servo motor 73 is moved to a position deviated from the commanded position whose position is controlled. For the first time, the servo motor 73 should return to the original control position.
The resilience works. Since the restoring force actually works after the movable mirror 3 is displaced due to the inertial force of the movable mirror 3, a slight displacement of the movable mirror 3 via the ball screw 74 is unavoidable.

The cameras 14, 15 and 16 are mounted on the movable mirror 3
And the electronic component 82 is imaged via the fixed mirror 2,
While detecting the suction state of the electronic component 82 with respect to the suction nozzle, if the ball screw 74 moves in the direction X1 with respect to the ball screw shaft 72 and shifts as described above, that is, the movable mirror 3 is fixed. If the camera moves in the direction X1 with respect to the mirror 2 and shifts, the cameras 14, 15, 16 cannot capture an accurate image of the electronic component 82, and the suction state of the electronic component 82 with respect to the suction nozzle is accurate. As a result, the electronic component mounting machine cannot accurately adjust the suction position or the suction angle of the electronic component 82, and the electronic component 82 cannot be accurately placed on the printed board. There are cases. Such a problem occurs not only in the electronic component device machine but also in a device having a moving part similar to that of the electronic component mounting machine, and the same problem as described above occurs.

The present invention solves the above problems and provides an electronic component mounting machine capable of accurately capturing and identifying the gripped state of an electronic component, and a moving device having a moving part similar to the electronic component mounting machine. The purpose is to provide.

[0010]

In order to achieve the above-mentioned object, the electronic component mounting machine of the present invention can be used as a second moving unit by moving the electronic component mounting unit as the first moving unit with respect to the base. The movement of the mirror is effectively suppressed by using a mechanism having a mass body that cancels out the inertial force generated in the mirror.

In the electronic component mounting apparatus of the present invention, a mass body provided in the electronic component mounting means and having a predetermined mass is left in the moving direction of the movable mirror when the electronic component mounting means is stopped after the movement. And a movable mirror fine movement suppressing means for exerting an inertial force on the mass body so as to cancel the inertial force of the movable mirror.

Further, the movable mirror fine movement suppressing means of the electronic component mounting machine of the present invention specifically includes at least two pulleys arranged in a line in a direction substantially the same as the moving direction of the movable mirror, A belt that is stretched around a pulley and runs in conjunction with the rotation of the pulley, and the movable mirror and the mass body move in the belt in opposite directions when the pulley rotates. It is attached as follows.

Further, the electronic component mounting means of the electronic component mounting machine of the present invention is, in particular, a drive unit for rotationally driving the ball screw shaft, and rolls in response to the rotation of the ball screw shaft, and the movable mirror. And a ball screw for moving.

Further, the mass body of the electronic component mounting machine of the present invention is characterized in that it has substantially the same mass as the total sum of the masses of the movable mirror and the ball screw.

Further, the moving device of the present invention is provided in the first moving portion, the second moving portion which is provided in the first moving portion and moves in a predetermined direction, and the first moving portion. A mass body having a predetermined mass and the mass body so as to cancel out the inertial force of the second moving section remaining in the moving direction of the second moving section when the movement of the first moving section is stopped. And a means for preventing the movement of the second moving portion by exerting an inertial force on the.

[0016]

According to the electronic component mounting machine of the present invention, the electronic component is gripped by the gripping means provided in the electronic component mounting means, and the electronic component mounting means is moved to the position where the electronic component is placed. The movable mirror and the mass body also move, and an inertial force is generated in the movable mirror and the mass body due to the movement. During the movement of the electronic component mounting means, the grasping state of the electronic component is imaged by the image capturing means, but during the image capturing, the movement of the electronic component mounting means may change. When the movement of the electronic component mounting means changes, the inertial force remaining on the movable mirror due to the movement may act in a direction to move the movable mirror with respect to the gripping means and the electronic component. At this time, the movable mirror fine movement suppression means causes the inertial force remaining on the mass body to act on the inertial force remaining on the movable mirror, thereby canceling out the inertial force remaining on the movable mirror. As a result, the movement of the movable mirror is suppressed, and the imaging unit accurately captures the suction state of the electronic component via the movable mirror, and accurately detects the grip position deviation or the angular deviation based on the imaging result. The electronic components can then be accurately placed in place.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an overall perspective view of an electronic component mounting machine according to an embodiment of the present invention. FIG. 2 is a partially enlarged view of FIG. FIG. 3 is a partially enlarged sectional view of FIG. In FIG. 1, the electronic component mounting machine of this embodiment includes an X-axis moving mechanism 24 and Y-axis moving mechanisms 20 and 22. The electronic component mounting mechanism 1 is mounted on the X-axis moving mechanism 24, and the electronic component mounting mechanism 1 is moved in the X-axis direction by the X-axis moving mechanism 24. The X-axis moving mechanism 24 is moved in the Y-axis direction along the Y-axis moving mechanisms 20 and 22, and along with this movement, the electronic component mounting mechanism 1 is also moved in the Y-axis direction.

In FIG. 2, the electronic component mounting mechanism 1 includes:
Fixed mirror 2, movable mirror 3, half mirror block 8, rotary lifting suction mechanism 7, camera 1 as image pickup means
4, 15 and 16, and a movable mirror moving mechanism 40 are mounted. As shown in FIG. 5A, the half mirror block 8 is provided with half mirrors 30 to 32.
These half mirrors 30 to 32 are the cameras 1 above them.
The image from the fixed mirror 2 is transmitted to 4 to 16. The cameras 14 to 16 have different magnifications, and are set to appropriate magnifications for image recognition of the suction state according to the size of the electronic component sucked by the suction nozzle 5.

In FIG. 3, the rotary lifting / lowering suction mechanism 7 includes:
A rotating portion 11 which is hollow and is connected to a vacuum suction device (not shown) is attached to the lower portion thereof, and the rotating lifting and lowering suction mechanism 7 causes the rotating portion 11 to rotate and move up and down. A light emitting box 10 is fixedly provided at a position facing the optical axis of the camera 14 at a lower portion of the rotary lifting / lowering adsorption mechanism 7, and the rotating portion 11 penetrates the light emitting box 10.
A light-transmitting plate 6 is fixed to the rotating portion 11 below the light-emitting box 10, and a suction nozzle 5 as a means for gripping an electronic component is fixed to the tip below the light-transmitting plate 6. It is installed.

The light emitting box 10 is a container in which light sources 10a and 10b as light emitting means are provided. Light source 10
For example, light emitting diodes are used as a and 10b. The bottom surface 10d of the light emitting box 10 is made of a light-shielding member, and is formed on the bottom surface 10d.
Light from the light sources 10a and 10b is emitted from the circular opening 10c in a region including the electronic component 4 from the side facing the camera 14 in parallel along the optical axis of the camera 14.

The light-transmitting plate 6 has, for example, a disc shape having a through-hole at the center thereof through which the rotating portion 11 is inserted, and has a light-transmitting property.
For example, Delrin (trade name: American EI. Du Pont
DeNemours & Co. Inc), which is composed of milky white resin such as polyacetal. The transparent plate 6 makes the light intensity of the light from the light sources 10a and 10b uniform and irradiates the electronic component 4 with the light. In this way, the light from the light sources 10a and 10b is evenly applied to the electronic component 4 from a position facing the tip of the suction nozzle 5 that has sucked the electronic component 4 through the light emitting portion 6b, so that the electronic component 4 is illuminated. It is possible to increase the brightness of the background of the image, and it is possible to prevent an unnecessary image of the object existing in the background of the electronic component 4a from being displayed in the image captured by the camera 14. The image of the electronic component 4a is reflected by the movable mirror 3 and the fixed mirror 2 as shown in FIG.
The reflected image is captured by the cameras 14, 15, 16.

The movable mirror moving mechanism 40 for moving the movable mirror 3 in the horizontal H direction will be described in detail. Figure 4
FIG. 3 is an enlarged view of a portion related to a movable mirror moving mechanism 40 of the electronic component mounting mechanism shown in FIG. 2. The movable mirror moving mechanism 40 is a mechanism for moving the movable mirror 3 in the horizontal H direction shown in FIGS. 2 and 4, and is the X of the electronic component mounting mechanism 1 by the X-axis moving mechanism 24 as described in the related art. This is a mechanism that can prevent the movable mirror 3 from moving against the locking force of the servo motor 50 shown in FIG. 4 when the movement in the direction is stopped. Movable mirror moving mechanism 40
Is composed of a mounting portion 54, a ball screw 42, a ball screw shaft 44, pulleys 46a and 46b, a belt 48, a servo motor 50, and a mass body 52.

The attachment portion 54 is fixedly attached to the movable mirror 3 and the ball screw 42, and moves the movable mirror 3 in conjunction with the rolling of the ball screw 42. The servomotor 50 rotationally drives the ball screw shaft 44. The ball screw shaft 44 is formed with a spiral groove for allowing the ball of the ball screw 42 to pass, and is driven by a servo motor 50 to rotate. The ball screw 42 is internally provided with a ball passing through a groove formed in the ball screw shaft 44, and rolls in accordance with the rotation of the ball screw shaft 44 to move in the horizontal H direction.

The pulleys 46a and 46b are formed at positions along the ball screw shaft 44 and rotate in association with the running of the belt 48. The belt 48 is attached to the pulleys 46a and 46b with a predetermined tension. The ball screw 42 is fixedly attached to the belt 48,
It travels in conjunction with the movement of the ball screw 42. Further, in the belt 48, the mass body 52 is fixed to the upper belt 48a, and the ball screw 42 is fixed to the lower belt 48b. The mass body 52 has a mass corresponding to the total mass of the movable mirror 3, the mounting portion 54, and the ball screw 42.

The movable mirror moving mechanism 40 has a direction X of the electronic component mounting mechanism 1 by the X-axis moving mechanism 24 shown in FIG.
When the movement of 1 stops, it works as follows. When the electronic component mounting mechanism 1 moves in the direction X1, the above-described components of the movable mirror 3 and the movable mirror moving mechanism 40 also move in the direction X1 with this movement, and an inertial force in the direction X1 is generated in these components. Orientation X of electronic component mounting mechanism 1
When the movement of No. 1 is stopped, the inertial force in the direction X1 accompanying the above movement remains in the above-described constituent elements of the movable mirror 3 and the movable mirror moving mechanism 40. The inertial force of the mass body 52 in the X1 direction acts on the belt 48a, and the inertial force of the movable mirror 3, the mounting portion 54 and the ball screw 42 in the X1 direction acts on the belt 48b.
Do not rotate 6a and 46b.

That is, since the movable mirror 3, the mounting portion 54, the ball screw 42 and the mass body 52 are interlocked with the electronic component mounting mechanism 1, they have the same speed in the same direction, and the movable mirror 3, the mounting portion 54 and the ball screw 42. Since the total sum of the masses of the mass body 52 and the mass body 52 is almost the same,
The inertial force of 2 and the inertial force of the movable mirror 3, the mounting portion 54, and the ball screw 42 have the same magnitude in the direction X1. As a result, the pulley 46a, via the belts 48a, 48b,
The rotational force applied to 46b balances the pulleys 46a, 4
6b does not rotate, the electronic component 4 of the movable mirror moving mechanism 40.
Is effectively suppressed. Therefore, when the movement of the electronic component mounting mechanism 1 in the direction X1 is stopped, the movable mirror 3 does not move with respect to the electronic component 4, and the electronic component 4 is accurately imaged. Even when the electronic component mounting mechanism 1 moves in the direction opposite to the direction X1, the movable mirror moving mechanism 40 described above effectively suppresses the movement of the movable mirror 3 with respect to the electronic component 2.

The operation of the electronic component mounting machine according to this embodiment will be described below with reference to FIGS. 1 to 4 and 5A to 5C. 5A to 5C show an example in which the electronic component 4 is mounted on the printed board 28. When the suction nozzle 5 mounts the electronic component 4, the X-axis moving mechanism 24 first moves the Y-axis moving mechanism 20, 2.
2 is positioned in the Y-axis direction, and then the electronic component mounting mechanism 1 is positioned in the X-direction by the X-axis moving mechanism 24. As a result, the suction nozzle 5 mounted on the electronic component mounting mechanism 1 is positioned in the X and Y directions of the electronic component storage 26 where the electronic components to be mounted are placed. X, Y
When positioned in the direction, as shown in FIG.
The rotary unit 11 is lowered by the rotary lift suction mechanism 7, the suction nozzle 5 attached to the tip of the rotary unit 11 is lowered to the component position in the electronic component storage 26, and the electronic component 4 is vacuum-sucked. When the suction nozzle 5 sucks the electronic component 4, the suction nozzle 5 starts moving to the mounting position of the printed circuit board 28 by the movement of the electronic component mounting mechanism 1 in the X direction and the movement of the X axis moving mechanism 24 in the Y direction.

When the electronic component 4 is vacuum-sucked by the suction nozzle 5, as shown in FIG.
Is moved by the height H1 while the movable mirror moving mechanism 40 is moved.
The movable mirror 3 is thereby moved to the right in the figure. The movement of the movable mirror 3 is performed so as not to collide with the sucked electronic component 4. The rise of the suction nozzle 5 is determined by recognizing the sucked electronic component 4 through the half mirror 30 and the camera 14 to recognize the electronic component 4. In other words, the lifting operation of the suction nozzle 5 that has sucked the electronic component 4 is performed by the rotary lifting suction mechanism 7 from a state in which the camera 14 does not recognize it to a state in which it recognizes it. At this raised position, the suction state of the electronic component 4 in the horizontal direction is identified, that is, the suction state of the electronic component 4 viewed from the horizontal H direction is identified by an image processing unit (not shown) based on the image data from the camera 14. Be seen.

When the suction state of the electronic component 4 is recognized through the camera 14 and the raising of the suction nozzle 5 is stopped, the half mirror 30 and the camera 14 identify the exact suction state of the electronic component 4 by the camera 14. In this case, the component suction state is identified by the optical system of the movable mirror 3, the fixed mirror 2, the half mirror 30, and the camera 14.

Identification by the optical system is performed by referring to FIGS.
As shown in (B), the light from the light sources 10 a and 10 b provided in the light emitting box 10 emits light from the bottom surface 1 of the light emitting box 10.
The transparent plate 6 is emitted from the opening 10c formed in 0d.
To enter. Then, the light input to the translucent plate 6 is made uniform by the translucent plate 6, and is made parallel to the electronic component 4 along the optical axis of the camera 14 from the opposite side of the side where the camera 14 captures the electronic component 4. Is irradiated. Then, the image of the electronic component 4 is taken by the camera 14 via the movable mirror 3 and the fixed mirror 2, and the electronic component 4 is identified by the image processing unit (not shown) based on the image data from the camera 14.
Is recognized in the horizontal direction, that is, the suction state of the electronic component 4 viewed from the horizontal H direction is identified. When the identification of the component suction state is completed, the movable mirror 3 is moved back to the original position indicated by the broken line by the movable mirror moving mechanism 40.

In this way, the suction nozzle 5 is moved up, the movable mirror 3 is moved, and the suction state of the electronic component 4 is identified.
This is performed while moving to the mounting position of the printed circuit board 28 due to the movement in the direction and the movement in the Y direction of the X-axis moving mechanism 24. The movement of the electronic component mounting mechanism 1 in the X direction by the X-axis movement mechanism 24 may stop during the operation. At this time, as described above, the movable mirror moving mechanism 40 balances the inertial force of the movable mirror 3, the mounting portion 54, and the ball screw 42 with the inertial force of the mass body 52 to move the movable mirror 3 with respect to the electronic component 4. Is suppressed, the suction state of the electronic component 4 is accurately imaged and identified by the camera 14 via the movable mirror 3 and the fixed mirror 2, and the suction position and the suction angle are appropriately corrected.

When the suction nozzle 5 sucking the electronic component 4 is lowered to the upper part of the mounting position of the printed board 28,
As shown in FIG. 5C, the electronic component 4 is mounted on the printed circuit board 2
8 is mounted at the mounting position. That is, the suction nozzle 5 is moved down by the rotary lifting suction mechanism 7 until the electronic component 4 comes into contact with the mounting position of the printed circuit board 28, and the suction of the electronic component 4 is released. As a result, the electronic component 4 is placed at a predetermined position on the printed board 28. At this time, as described above, since the suction state of the electronic component 4 to the suction nozzle is appropriately corrected, the electronic component 4 is accurately placed at a predetermined position on the printed board 28. When the electronic component 4 is placed on the printed board 28, the suction nozzle 5 is rotated and lifted up and down.
It is lifted by the electronic component mounting mechanism 1, X again.
The shaft moving mechanism 24 is driven to move the suction nozzle 5 to the electronic component storage 26.

The image processing section for controlling the above operation and identifying the component suction state is realized by, for example, a microcomputer. That is, position control of the X-axis moving mechanism 24, Y
Position control of the axis moving mechanisms 20 and 22, rotary lifting suction mechanism 7
Rotation, lifting and lowering, suction control, movement control of the movable mirror moving mechanism 40, component rising position detection, identification of electronic component suction state,
The rotational position adjustment of the electronic component, which is performed as needed, is performed by the microcomputer.

As described above, in the electronic component mounting machine of the present invention,
Even when the movement of the electronic component mounting mechanism 1 in the X direction by the X-axis moving mechanism 24 is stopped during the imaging and identification of the suction state of the electronic component 4 by the camera 14, the movable mirror moving mechanism 40 is used. The movement of the movable mirror 3 due to the inertial force generated in the movable mirror 3 can be effectively suppressed, and the adsorption state of the electronic component 4 by the camera 14 can be accurately imaged and identified. as a result,
The electronic component 4 can be accurately placed at a predetermined position on the printed circuit board 28 by accurately adjusting the suction position or the angle of the electronic component 4.

The invention is not limited to the embodiments described above. In particular, the movable mirror moving mechanism 40 is described above as long as the movable mirror moving mechanism 40 has a configuration in which the inertial forces generated on the movable mirror 3 and the mass body 52 by the movement of the electronic component mounting mechanism 1 are exerted in opposite directions. It is not limited to the configuration. Further, in the above-described embodiment, the movable mirror 3,
The case where the total mass of the mounting portion 54 and the ball screw 42 and the mass of the mass body 52 are substantially the same has been described.
The relationship between the total mass of the movable mirror 3, the mounting portion 54, and the ball screw 42 and the mass of the mass body 52 may be adjusted in consideration of friction generated between the ball screw 42 and the ball screw shaft 44. Further, the gripping means is
The suction nozzle is not limited to the above-mentioned suction nozzle, and includes not only vacuum suction and magnetic suction but also gripping and the like.

[0036]

As described above, according to the electronic component mounting machine and the moving device of the present invention, the electronic component mounting means is moved with respect to the base during the imaging and identification of the suction state of the electronic component. Even when the change occurs, the movement of the mirror can be effectively suppressed, and the gripped state of the electronic component can be accurately imaged and identified. Therefore, the grip position or angle of the electronic component can be accurately adjusted, and the electronic component can be accurately placed on the printed circuit board, etc., and the reliability of the electronic component mounting machine and the moving device and the placement accuracy of the electronic component can be improved. It is possible to improve.

[Brief description of drawings]

FIG. 1 is an overall configuration perspective view of an electronic component mounting machine according to an embodiment of the present invention.

FIG. 2 is an enlarged perspective view of the electronic component mounting mechanism of FIG.

3 is a partially enlarged cross-sectional view of the electronic component mounting mechanism of FIG.

FIG. 4 is a partially enlarged portion of the electronic component mounting mechanism of FIG.

5A and 5B are diagrams showing an operation mode of the electronic component mounting machine of the present embodiment, FIG. 5A is an operation mode at the time of starting the suction of the electronic component, and FIG. (C) is an operation mode when the electronic component is mounted on the printed circuit board.

6A is an overall perspective view of a conventional electronic component mounting machine, and FIG. 6B is a partially enlarged perspective view of FIG.

[Explanation of symbols]

 1, 71 ··· Electronic component mounting mechanism 2 · · Fixed mirror 3 · · Movable mirror 4 · 82 · · Electronic component 5 · · Suction nozzle 6 · · Transparent plate 7 · · Rotating lifting suction mechanism 8 · · Half mirror Block 9-Movable mirror moving mechanism 10-Light emitting box 10a, 10b-Light source 11, 80-Rotating unit 14, 15, 16, 56-Camera 20, 22-Y-axis moving mechanism 24-X-axis Moving mechanism 26. Electronic component storage 28. Printed circuit board 30, 31, 32. Mirror 40. Movable mirror moving mechanism 42, 74 .. Ball screw 44, 72 .. Ball screw shaft 46a, 46b .. Pulley 48 .. Belts 50, 73 ··· Servo motor 52 · · Mass 54 · · Mounting part

Claims (5)

[Claims] 1. A gripping means provided on a movable electronic component mounting means grips an electronic component and moves the electronic component mounting means with respect to the gripping means provided on the electronic component mounting means. In an electronic component mounting machine that captures an image of a gripped state of the electronic component via a movable mirror that is movable, a mass body having a predetermined mass provided in the electronic component mounting means; An electronic component mounting machine comprising: a movable mirror fine movement suppressing means for exerting an inertial force on the mass body so as to cancel out an inertial force of the movable mirror remaining in the moving direction of the movable mirror when stopped after the movement. 2. The movable mirror fine movement suppressing means includes at least two pulleys arranged in a line in a direction substantially the same as the moving direction of the movable mirror, and is tensioned to the pulleys and interlocked with the rotation of the pulleys. 7. A belt that travels around, wherein the movable mirror and the mass body are attached to the belt so as to move in opposite directions when the pulley rotates. The electronic component mounting machine described in 1. 3. The electronic component mounting means includes a drive unit that rotationally drives a ball screw shaft, and a ball screw that rolls according to the rotation of the ball screw shaft to move the movable mirror. Item 1. An electronic component mounting machine according to item 1 or 2. 4. The electronic component mounting machine according to claim 1, wherein the mass body has substantially the same mass as the total mass of the movable mirror and the ball screw. 5. A first moving part, a second moving part provided on the first moving part and moving in a predetermined direction, and a mass body provided on the first moving part and having a predetermined mass. And when the movement of the first moving unit is stopped, an inertial force is exerted on the mass body so as to cancel out the inertial force of the second moving unit remaining in the moving direction of the second moving unit, A moving device having means for preventing movement of the second moving portion.