JPH06323940A - Capacitance-type sensor - Google Patents

Capacitance-type sensor

Info

Publication number
JPH06323940A
JPH06323940A JP13948193A JP13948193A JPH06323940A JP H06323940 A JPH06323940 A JP H06323940A JP 13948193 A JP13948193 A JP 13948193A JP 13948193 A JP13948193 A JP 13948193A JP H06323940 A JPH06323940 A JP H06323940A
Authority
JP
Japan
Prior art keywords
electrode
electrostatic
electrostatic force
diaphragm
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13948193A
Other languages
Japanese (ja)
Inventor
Toshihiko Omi
俊彦 近江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp, Omron Tateisi Electronics Co filed Critical Omron Corp
Priority to JP13948193A priority Critical patent/JPH06323940A/en
Publication of JPH06323940A publication Critical patent/JPH06323940A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To provide an electrostatic-force servo-type pressure sensor whose structure is simplified and whose manufacturing process is simple. CONSTITUTION:A single-crystal silicon wafer is etched anisotropically, and a frame 3 which supports a diaphragm 4 so as to be capable of being freely rocket is made. A movable electrode 7 is formed in the center of the diaphragm 4, and an electrode 9 for electrostatic-force generation is formed to be a frame shape at its outer circumference. A cover 2 in which a hollow 11 is formed in such a way that the diaphragm 4 can be micro-scopically deformed freely in its thickness direction is made of another single-crystal silicon wafer. A fixed electrode 8 is formed in the center of the hollow 11 so as to face the movable electrode 7, and another electrode 10, for electrostatic-force ] generation, so as to face the electrode 9, for electrostatic-force generation, on the diaphragm 4 is formed at its outer circumference. In addition, introduction ports 5 which introduce a fluid such as air or the like are made in the cover 2, the frame 3 is bonnet to the surface of the cover 2 by a low-temperature bonding technique or the like, and a pressure sensor 1 is manufactured.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、静電容量式センサに関
する。具体的には、検知部の変位に比例して生じる静電
容量の変化を検出して、自動車の加速度や空気等のゲー
ジ圧を測定するために用いられる静電容量式センサに関
する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a capacitance type sensor. More specifically, the present invention relates to a capacitance sensor used to detect a change in capacitance that occurs in proportion to the displacement of a detection unit and to measure the acceleration of a vehicle or the gauge pressure of air or the like.

【0002】[0002]

【従来の技術】従来、静電力サーボを利用した静電容量
式のセンサには、例えば、「Thechnical Digest of the
11th Sensor Symposium,1992,p.47-50」に記載されて
いるような構造のものがある。この加速度センサ51
は、図4に示すように、シリコン基板よりなる角枠状を
したフレーム52の中央にマス部53が配設されてお
り、マス部53は多数の軸棒状のビーム54によりフレ
ーム52の枠内全面に支持されている。マス部53はビ
ーム54の弾性によってマス部53の厚さ方向に自由に
微小変位できるようになっており、その上面には可動電
極55が形成されている。
2. Description of the Related Art Conventionally, for example, "Thechnical Digest of the
11th Sensor Symposium, 1992, p.47-50 ”. This acceleration sensor 51
As shown in FIG. 4, a mass portion 53 is arranged at the center of a frame 52 made of a silicon substrate and having a rectangular frame shape. The mass portion 53 is formed within the frame 52 by a large number of shaft-bar-shaped beams 54. It is fully supported. The mass portion 53 can be freely minutely displaced in the thickness direction of the mass portion 53 by the elasticity of the beam 54, and a movable electrode 55 is formed on the upper surface thereof.

【0003】フレーム52の上下面にはガラス基板5
6,57が重ねられ、ガラス基板56,57の周辺部は
陽極接合によりフレーム52に接着されている。フレー
ム52上側のガラス基板56の内面には、マス部53の
可動電極55と微小なギャップを隔てて固定電極58が
設けられており、可動電極55と固定電極58とによっ
て検知用コンデンサが構成されている。また、マス部5
3の下面及びフレーム52下側のガラス基板57の内側
には静電力発生用電極59,60がそれぞれ設けられて
いる。
A glass substrate 5 is provided on the upper and lower surfaces of the frame 52.
6, 57 are stacked, and the peripheral portions of the glass substrates 56, 57 are bonded to the frame 52 by anodic bonding. A fixed electrode 58 is provided on the inner surface of the glass substrate 56 on the upper side of the frame 52 with a small gap from the movable electrode 55 of the mass portion 53, and the movable electrode 55 and the fixed electrode 58 constitute a detection capacitor. ing. Also, the mass section 5
Electrodes 59 and 60 for electrostatic force generation are provided on the lower surface of 3 and the inside of the glass substrate 57 below the frame 52, respectively.

【0004】加速度センサ51において、検知用コンデ
ンサの静電容量はフレーム52上に集積された検知回路
61により検知されていて、検知回路61は静電容量の
大きさを周波数に変換する静電容量−周波数変換(C−
f変換)を行ない、当該コンデンサの静電容量に応じた
周波数信号を出力する。次いでフレーム52上に集積さ
れた静電力発生回路62は、出力された周波数信号の周
波数と基準周波数とを比較して、周波数信号の周波数と
基準周波数とが一致するように、マス部53の下面及び
フレーム52下側のガラス基板57の内面に設けた静電
力発生用電極59,60に電圧を印加して、マス部53
がフレーム52中央の常に一定した位置にあるように調
整している。
In the acceleration sensor 51, the capacitance of the detection capacitor is detected by a detection circuit 61 integrated on the frame 52, and the detection circuit 61 converts the magnitude of the capacitance into a frequency. -Frequency conversion (C-
f conversion) is performed and a frequency signal corresponding to the capacitance of the capacitor is output. Next, the electrostatic force generation circuit 62 integrated on the frame 52 compares the frequency of the output frequency signal and the reference frequency, and the bottom surface of the mass portion 53 so that the frequency of the frequency signal matches the reference frequency. Also, a voltage is applied to the electrostatic force generating electrodes 59 and 60 provided on the inner surface of the glass substrate 57 below the frame 52 to move the mass portion 53.
Is adjusted so that it is always at a constant position in the center of the frame 52.

【0005】しかして、加速度センサ51に加速度が加
わると、マス部53が変位してマス部53の変位量に応
じて可動電極55と固定電極58の間のギャップ量が変
化して静電容量が変わる。静電容量が変化すると、静電
力発生回路62が静電力発生用電極59,60に印加す
る電圧も変化する。したがって、この静電力発生用電極
59,60に印加する電圧を検出することにより、加速
度センサ51に加わった加速度の大きさを知ることがで
きる。
However, when acceleration is applied to the acceleration sensor 51, the mass portion 53 is displaced, the gap amount between the movable electrode 55 and the fixed electrode 58 is changed according to the displacement amount of the mass portion 53, and the capacitance is changed. Will change. When the electrostatic capacitance changes, the voltage applied by the electrostatic force generating circuit 62 to the electrostatic force generating electrodes 59 and 60 also changes. Therefore, by detecting the voltage applied to the electrostatic force generating electrodes 59, 60, the magnitude of the acceleration applied to the acceleration sensor 51 can be known.

【0006】しかしながら、このような構成の静電容量
式の加速度センサ51においては、静電力発生用電極5
9,60を設けるために、固定電極58を設けたガラス
基板56とは別にさらにガラス基板57を設け、ガラス
−シリコン−ガラスの3層構造にしなければならず、コ
ストが高くなっていた。また、検知用コンデンサを構成
するための可動電極55と静電力発生用電極59とをマ
ス部53の上下面にそれぞれ形成しなければならなかっ
たので、マス部53を両面から精度よく形成させる必要
があり、マス部53の作製プロセスが非常に困難であっ
た。さらに、加速度センサ51は3層構造をしているた
めに、ガラス基板56,57をフレーム52に2回も接
合させなければならず、加速度センサ51の作製の工程
に手間が掛っていた。
However, in the capacitance type acceleration sensor 51 having such a configuration, the electrostatic force generating electrode 5 is used.
In order to provide 9, 60, it is necessary to provide a glass substrate 57 in addition to the glass substrate 56 provided with the fixed electrode 58 to form a three-layer structure of glass-silicon-glass, resulting in high cost. Further, since the movable electrode 55 and the electrostatic force generating electrode 59 for forming the detection capacitor have to be formed on the upper and lower surfaces of the mass portion 53, respectively, the mass portion 53 needs to be accurately formed from both sides. Therefore, the manufacturing process of the mass portion 53 was very difficult. Further, since the acceleration sensor 51 has a three-layer structure, the glass substrates 56 and 57 have to be bonded to the frame 52 twice, and thus the process of manufacturing the acceleration sensor 51 is troublesome.

【0007】[0007]

【発明が解決しようとする課題】本発明は叙上の従来例
の欠点に鑑みてなされたものであり、その目的とすると
ころは、静電容量式センサを構成する基板を2枚にする
ことで、静電容量式センサの構造を簡単にし、作製プロ
セスを簡略化することにある。
SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks of conventional examples, and an object of the present invention is to provide two substrates constituting an electrostatic capacitance type sensor. The purpose is to simplify the structure of the capacitance type sensor and simplify the manufacturing process.

【0008】[0008]

【課題を解決するための手段】本発明の静電容量式セン
サは、検知部を支持基板に弾性的に支持させ、前記支持
基板のいずれか一方の面に固定基板を接合し、前記検知
部の内面に設けた可動電極と対向させて前記固定基板の
内面に固定電極を設け、前記可動電極及び前記固定電極
により検知用コンデンサを構成した静電容量式センサに
おいて、前記検知用コンデンサの静電容量を一定容量に
保持する静電力を発生させるための静電力発生用電極を
前記検知部の内面に設け、前記検知部に設けた静電力発
生用電極と対向させて固定基板の内面に対となる静電力
発生用電極を設けたことを特徴としている。
According to another aspect of the present invention, there is provided a capacitance type sensor, wherein a detecting portion is elastically supported by a supporting substrate, and a fixed substrate is bonded to one surface of the supporting substrate. In the capacitance type sensor in which a fixed electrode is provided on the inner surface of the fixed substrate so as to face the movable electrode provided on the inner surface of the fixed substrate, and the movable electrode and the fixed electrode constitute a detection capacitor, the electrostatic capacitance of the detection capacitor An electrostatic force generating electrode for generating an electrostatic force for holding the capacitance at a constant capacity is provided on the inner surface of the detection unit, and is opposed to the electrostatic force generation electrode provided on the detection unit to form a pair on the inner surface of the fixed substrate. It is characterized in that an electrostatic force generating electrode is provided.

【0009】また、測定対象が空気のような流体の圧力
であって、固定基板に空気等の流体を導入するための導
入口を設けることにしてもよい。
Further, the object of measurement is the pressure of a fluid such as air, and an inlet for introducing a fluid such as air may be provided in the fixed substrate.

【0010】[0010]

【作用】本発明の静電容量式センサは、検知用コンデン
サの静電容量を一定容量に保持する静電力を発生させる
ための静電力発生用電極を、可動電極が形成された検知
部と固定電極が形成された固定基板の内面にそれぞれ対
向するように設けているので、従来3枚の基板により構
成されていた静電力サーボ型の静電容量式センサを、支
持基板および固定基板の2枚の基板によって構成するこ
とができる。このため、静電力サーボ型のセンサの構造
を簡単にすることができる。
According to the electrostatic capacity sensor of the present invention, the electrostatic force generating electrode for generating the electrostatic force for holding the electrostatic capacity of the detecting capacitor at a fixed capacity is fixed to the detecting portion having the movable electrode. Since the electrodes are provided so as to face the inner surface of the fixed substrate on which the electrodes are formed, the electrostatic force servo type capacitive sensor, which is conventionally composed of three substrates, is used as a support substrate and a fixed substrate. It can be configured by the substrate. Therefore, the structure of the electrostatic force servo type sensor can be simplified.

【0011】また、静電力発生用電極と可動電極は、支
持基板のいずれか一方の面に形成するだけで済み、支持
基板と固定基板との接合も一度で済ませることができる
ので、作製プロセスを簡略化することができ、従来の非
静電力サーボ型の静電容量式センサと同様の工程で、静
電力サーボ型のセンサを作製することが可能になる。
Further, since the electrostatic force generating electrode and the movable electrode only have to be formed on one of the surfaces of the supporting substrate and the supporting substrate and the fixed substrate can be joined at once, the manufacturing process can be performed. It can be simplified, and the electrostatic force servo sensor can be manufactured by the same process as the conventional non-electrostatic force servo capacitive sensor.

【0012】また、流体を導入するため導入口を設けた
固定基板を支持基板に接合して、測定対象が空気のよう
な流体の圧力である圧力センサを作製することができ
る。
Also, a fixed substrate having an inlet for introducing a fluid can be bonded to a supporting substrate to manufacture a pressure sensor whose measurement target is the pressure of a fluid such as air.

【0013】[0013]

【実施例】本発明の一実施例である静電力サーボ型の圧
力センサの断面図を図1に、その平面図を図2に示す。
圧力センサ1は、測定対象たる空気等を導入するための
導入口5を設けたカバー2の上面に、角枠状の枠内全面
に薄膜状のダイヤフラム4を摺動自在に支持させたフレ
ーム3が重ねられ、カバー2の周辺部は低温接合技術等
によりフレーム3に接合されている。
1 is a sectional view of an electrostatic force servo type pressure sensor according to an embodiment of the present invention, and FIG. 2 is a plan view thereof.
The pressure sensor 1 includes a frame 3 in which a thin film diaphragm 4 is slidably supported on the entire surface of a rectangular frame on the upper surface of a cover 2 provided with an inlet 5 for introducing air to be measured. And the peripheral portion of the cover 2 is joined to the frame 3 by a low temperature joining technique or the like.

【0014】フレーム3及びダイヤフラム4は、単結晶
シリコンウエハから水酸化カリウム溶液による異方性エ
ッチングにより一体として形成され、ダイヤフラム4は
電気化学エッチングストップ技術により任意の厚さに精
度よく作製されている。フレーム3及びダイヤフラム4
は表面保護用の酸化膜6が形成されていて、ダイヤフラ
ム4の中央には可動電極7が形成され、可動電極7の外
周には静電力発生用電極9が額縁状に、アルミニウムな
どのスパッタリングによって形成されている。
The frame 3 and the diaphragm 4 are integrally formed from a single crystal silicon wafer by anisotropic etching with a potassium hydroxide solution, and the diaphragm 4 is accurately manufactured to an arbitrary thickness by an electrochemical etching stop technique. . Frame 3 and diaphragm 4
Has an oxide film 6 for surface protection, a movable electrode 7 is formed in the center of the diaphragm 4, and an electrostatic force generating electrode 9 is formed in a frame shape on the outer periphery of the movable electrode 7 by sputtering aluminum or the like. Has been formed.

【0015】カバー2は単結晶シリコンウエハにドライ
エッチングを施して作製されており、カバー2の内面に
はダイヤフラム4が弾性変形して厚さ方向に自由に微小
変位できるように窪み11が設けられている。また、導
入口5は水酸化カリウム溶液による異方性エッチングに
よりカバー2に形成されている。窪み11にはダイヤフ
ラム4の可動電極7と微小なギャップを隔てて固定電極
8がアルミニウムなどのスパッタリングによって形成さ
れており、可動電極7と固定電極8との間に検知用コン
デンサが形成されている。また、固定電極8の外周に
は、ダイヤフラム4の静電力発生用電極9と対向して別
な静電力発生用電極10が同様にして形成され、固定電
極8及び静電力発生用電極10は、イオン注入法等によ
ってカバー2に形成された導電路(図示せず)を介して
カバー2上面に設けられた電極パッド12a,13aへ
それぞれ引き出されている。
The cover 2 is produced by dry etching a single crystal silicon wafer, and a recess 11 is provided on the inner surface of the cover 2 so that the diaphragm 4 can be elastically deformed and freely displaced in the thickness direction. ing. The inlet 5 is formed in the cover 2 by anisotropic etching with a potassium hydroxide solution. A fixed electrode 8 is formed in the recess 11 with a small gap from the movable electrode 7 of the diaphragm 4 by sputtering of aluminum or the like, and a detection capacitor is formed between the movable electrode 7 and the fixed electrode 8. . Further, another electrostatic force generating electrode 10 is similarly formed on the outer periphery of the fixed electrode 8 so as to face the electrostatic force generating electrode 9 of the diaphragm 4, and the fixed electrode 8 and the electrostatic force generating electrode 10 are It is drawn out to the electrode pads 12a and 13a provided on the upper surface of the cover 2 via conductive paths (not shown) formed in the cover 2 by an ion implantation method or the like.

【0016】カバー2の窪み11内には接続パッド14
が突出して設けられ、接続パッド14は、p+領域16
によってカバー2上面の別な電極パッド13bと電気的
に接続されている。フレーム3の下面には別な接続パッ
ド15が設けられ、接続パッド15は静電力発生用電極
9と接続されている。接続パッド14,15はカバー2
及びフレーム3の接合により互いに圧着され、接続パッ
ド14,15は電気的に接続されている。このようにし
てダイヤフラム4の静電力発生用電極9はカバー2上面
の電極パッド13bへ引き出されている。また、ダイヤ
フラム4の可動電極7も同様にしてカバー2上面の別な
電極パッド12bへ引き出されている。
A connection pad 14 is provided in the recess 11 of the cover 2.
Are provided so as to project, and the connection pad 14 is connected to the p + region 16
Is electrically connected to another electrode pad 13b on the upper surface of the cover 2. Another connection pad 15 is provided on the lower surface of the frame 3, and the connection pad 15 is connected to the electrostatic force generating electrode 9. The connection pads 14 and 15 are covers 2
And the frame 3 are pressure-bonded to each other by the bonding of the frame 3, and the connection pads 14 and 15 are electrically connected. In this way, the electrostatic force generating electrode 9 of the diaphragm 4 is pulled out to the electrode pad 13b on the upper surface of the cover 2. In addition, the movable electrode 7 of the diaphragm 4 is similarly drawn to another electrode pad 12b on the upper surface of the cover 2.

【0017】図3は、圧力センサ1の動作説明図であ
る。以下、図3にしたがって、圧力センサ1の動作を説
明する。圧力センサ1において、当該コンデンサの静電
容量はカバー2上面の電極パッド12a,12bに接続
された発振回路21によって検知される。発振回路21
は、静電容量の大きさを周波数に変換する静電容量−周
波数変換(C−f変換)回路からなっていて、当該コン
デンサの静電容量に応じた周波数信号を比較器22に出
力する。次いで、比較器22は入力された周波数信号の
周波数と、静止状態にある圧力センサ1の静電容量に応
じた周波数信号の周波数(基準周波数)とを比較し、入
力された周波数信号と基準周波数とが等しくなるよう
に、つまり、可動電極7と固定電極8との間の静電容量
の変化を生じないように、フィルタ増幅器23及びドラ
イバ回路24を介して静電力発生用電極9,10間に適
当な電圧を印加している。
FIG. 3 is a diagram for explaining the operation of the pressure sensor 1. The operation of the pressure sensor 1 will be described below with reference to FIG. In the pressure sensor 1, the capacitance of the capacitor is detected by the oscillation circuit 21 connected to the electrode pads 12a and 12b on the upper surface of the cover 2. Oscillator circuit 21
Is a capacitance-frequency conversion (Cf conversion) circuit that converts the magnitude of the capacitance into a frequency, and outputs a frequency signal according to the capacitance of the capacitor to the comparator 22. Next, the comparator 22 compares the frequency of the input frequency signal with the frequency (reference frequency) of the frequency signal corresponding to the capacitance of the pressure sensor 1 in the stationary state, and inputs the frequency signal and the reference frequency. Between the movable electrode 7 and the fixed electrode 8 so as not to change the electrostatic capacitance between the movable electrode 7 and the fixed electrode 8 via the filter amplifier 23 and the driver circuit 24. An appropriate voltage is applied to.

【0018】しかして、導入口5から空気が窪み11内
に導入されると、導入された空気の圧力によりダイヤフ
ラム4が変位し、ダイヤフラム4に生じた変位により当
該コンデンサの静電容量が変化する。この静電容量の変
化は、発振回路21により出力された周波数信号の周波
数と基準周波数との差として比較器22により検知さ
れ、フィルタ増幅器23及びドライバ24を通じて静電
力発生用電極9,10間に印加する電圧を変化させる。
したがって、この電圧の変化を検知することにより、圧
力センサ1に加えられた空気の圧力を知ることができ
る。
When air is introduced into the depression 11 from the inlet 5, the pressure of the introduced air causes the diaphragm 4 to be displaced, and the displacement of the diaphragm 4 changes the capacitance of the capacitor. . This change in capacitance is detected by the comparator 22 as the difference between the frequency of the frequency signal output by the oscillation circuit 21 and the reference frequency, and is applied between the electrostatic force generating electrodes 9 and 10 through the filter amplifier 23 and the driver 24. The applied voltage is changed.
Therefore, the pressure of the air applied to the pressure sensor 1 can be known by detecting the change in this voltage.

【0019】このような構造をした静電力サーボ式の圧
力センサ1にあっては、2枚のシリコンウエハを接合す
ることにより簡単に作製が可能となり、その製造工程を
簡略化することができる。しかも、検出される電圧の変
化はダイヤフラム4のバネ定数には依存しないため、ダ
イヤフラム4の形状等のバラツキによっては圧力センサ
1の測定精度は影響を受けなくなり、圧力センサ1の信
頼性を高めることができる。
The electrostatic force servo pressure sensor 1 having such a structure can be easily manufactured by bonding two silicon wafers, and the manufacturing process thereof can be simplified. Moreover, since the change in the detected voltage does not depend on the spring constant of the diaphragm 4, the measurement accuracy of the pressure sensor 1 is not affected by variations in the shape of the diaphragm 4 and the reliability of the pressure sensor 1 is improved. You can

【0020】[0020]

【発明の効果】本発明の静電容量式センサによれば、検
知用コンデンサの静電容量を一定に保持するための静電
力を発生させるための静電力発生用電極を、当該コンデ
ンサが構成されたシリコン製の支持基板及び固定基板に
設けているので、支持基板及び固定基板の2枚のシリコ
ン基板によりセンサを構成でき、従来3枚の基板が必要
であった静電力サーボ型センサの構造を簡単にすること
ができる。
According to the capacitance type sensor of the present invention, the capacitor is constituted by the electrostatic force generating electrode for generating the electrostatic force for keeping the electrostatic capacitance of the detecting capacitor constant. Since it is provided on the supporting substrate and the fixed substrate made of silicon, the sensor can be configured with two silicon substrates, the supporting substrate and the fixed substrate, and the structure of the electrostatic force servo type sensor, which conventionally required three substrates, is provided. Can be easy.

【0021】また、2枚の基板で構成しているので接合
が一回ですみ、しかも、静電力発生用電極を支持基板の
一方の面に可動電極と同時に形成し、固定基板にも固定
電極と同時に静電力発生用電極を形成できるので、製造
プロセスを簡単にすることができ、従来の非静電力サー
ボ型の静電容量式センサと同様の工程で、静電力サーボ
型のセンサを作製することが可能になる。
Further, since it is composed of two substrates, the bonding is required only once, and furthermore, the electrostatic force generating electrode is formed on one surface of the supporting substrate at the same time as the movable electrode, and the fixed substrate is fixed electrode. At the same time, the electrostatic force generating electrode can be formed, so that the manufacturing process can be simplified, and the electrostatic force servo type sensor is manufactured in the same process as the conventional non-electrostatic force servo type capacitive sensor. It will be possible.

【0022】また、流体を導入するための孔状の導入口
を設けた固定基板を支持基板の上面に接合して、測定対
象が空気のような流体の圧力である圧力センサを作製す
ることができる。
Further, a fixed substrate provided with a hole-shaped inlet for introducing a fluid may be bonded to the upper surface of the support substrate to manufacture a pressure sensor whose measurement target is the pressure of a fluid such as air. it can.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例である圧力センサの断面図で
ある。
FIG. 1 is a cross-sectional view of a pressure sensor that is an embodiment of the present invention.

【図2】同上の圧力センサの平面図である。FIG. 2 is a plan view of the above pressure sensor.

【図3】同上の圧力センサの動作説明図である。FIG. 3 is an operation explanatory view of the above pressure sensor.

【図4】従来例である圧力センサの断面図である。FIG. 4 is a cross-sectional view of a conventional pressure sensor.

【符号の説明】[Explanation of symbols]

4 ダイヤフラム 5 導入口 7 可動電極 9,10 静電力発生用電極 14,15 接続パッド 22 比較器 4 Diaphragm 5 Inlet 7 Movable Electrode 9,10 Electrostatic Force Generation Electrode 14,15 Connection Pad 22 Comparator

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 検知部を支持基板に弾性的に支持させ、
前記支持基板のいずれか一方の面に固定基板を接合し、
前記検知部の内面に設けた可動電極と対向させて前記固
定基板の内面に固定電極を設け、前記可動電極及び前記
固定電極により検知用コンデンサを構成した静電容量式
センサにおいて、 前記検知用コンデンサの静電容量を一定容量に保持する
静電力を発生させるための静電力発生用電極を前記検知
部の内面に設け、前記検知部に設けた静電力発生用電極
と対向させて固定基板の内面に対となる静電力発生用電
極を設けたことを特徴とする静電容量式センサ。
1. A detection substrate is elastically supported on a support substrate,
A fixed substrate is bonded to one of the surfaces of the supporting substrate,
In the electrostatic capacitance type sensor in which a fixed electrode is provided on the inner surface of the fixed substrate so as to face the movable electrode provided on the inner surface of the detection unit, and the movable electrode and the fixed electrode constitute a detection capacitor, the detection capacitor An electrostatic force generating electrode for generating an electrostatic force for holding the electrostatic capacity of the fixed capacity is provided on the inner surface of the detection unit, and the inner surface of the fixed substrate is opposed to the electrostatic force generation electrode provided on the detection unit. An electrostatic capacitance sensor, which is provided with an electrode for generating electrostatic force to form a pair.
【請求項2】 測定対象が空気のような流体の圧力であ
って、前記固定基板に空気等の流体を導入するための導
入口を設けたことを特徴とする請求項1に記載の静電容
量式センサ。
2. The electrostatic capacitance according to claim 1, wherein the object of measurement is the pressure of a fluid such as air, and an inlet port for introducing a fluid such as air is provided in the fixed substrate. Capacitive sensor.
JP13948193A 1993-05-17 1993-05-17 Capacitance-type sensor Pending JPH06323940A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13948193A JPH06323940A (en) 1993-05-17 1993-05-17 Capacitance-type sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13948193A JPH06323940A (en) 1993-05-17 1993-05-17 Capacitance-type sensor

Publications (1)

Publication Number Publication Date
JPH06323940A true JPH06323940A (en) 1994-11-25

Family

ID=15246262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13948193A Pending JPH06323940A (en) 1993-05-17 1993-05-17 Capacitance-type sensor

Country Status (1)

Country Link
JP (1) JPH06323940A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013235002A (en) * 2012-05-10 2013-11-21 Rosemount Aerospace Inc Separation mode capacitor for sensor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013235002A (en) * 2012-05-10 2013-11-21 Rosemount Aerospace Inc Separation mode capacitor for sensor

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