JPH0631946U - Polishing jig - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a sticking plate for polishing a semiconductor substrate, which has a simple structure and has a long life. A polishing jig composed of a ceramic or quartz glass substrate attaching member having a convex shape with the attaching surface of the semiconductor substrate as a bottom surface, and a metal ring fitted to the protruding portion of the substrate attaching member, preferably the above A polishing jig for semiconductor substrates in which the outer peripheral side surface of the polishing jig is cut into a trapezoidal shape, an arc shape, or a cross-sectional shape that is a combination thereof.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a polishing jig used for polishing a semiconductor substrate.

[0002]

[Prior art]

 Generally, when polishing a semiconductor substrate (hereinafter referred to as a substrate), the substrate is attached to a circular plate made of ceramic or quartz glass whose surface is flat and smooth by using wax, and the circular plate (attached plate). That is, the polishing process is performed between the polishing plate and the polishing plate facing the substrate attachment surface.

In recent years, the automation of the substrate polishing process has progressed, and since a kind of robot performs the loading operation of the sticking plate on the polishing platen and the unloading after processing, it is an assistant for transferring the sticking plate. Functions need to be granted. The easiest way to give this function is to cut the outer peripheral side surface of the pasting plate shown in Fig. 2 into a trapezoidal or arcuate cross-section along the entire circumference. The claws, etc. of the equipment should be transported over these notches.

However, the above-mentioned conventional methods have the following drawbacks.

That is, when polishing a substrate, it is necessary to use a highly corrosive polishing agent or to heat the plate to near 100 ° C. when attaching the substrate. Alternatively, a quartz glass plate is used. Plates made of these materials have excellent corrosion resistance and thermal characteristics, but on the other hand, they have the drawback of being extremely brittle and fragile.

Therefore, the outer peripheral side surface of the plate having the notch is liable to be chipped or cracked due to contact with the tabs of the transfer system or contact with the unloading section, and the sticking plate due to mishandling or drop accident during transfer. It has been a cause of damage to equipment and increased danger to workers. Furthermore, since the life of the pasting plate is short, it is often necessary to supplement the plate, which is one of the reasons for the cost increase of the substrate.

[0007]

[Problems to be solved by the device]

 An object of the present invention is to solve the above-mentioned drawbacks of the prior art and to provide a sticking plate for polishing a semiconductor substrate, which has a simple structure and a long life.

[0008]

[Means for Solving the Problems]

 The above problems can be achieved by developing a polishing jig used for polishing a semiconductor substrate of the present invention.

That is, 1) it is composed of a ceramic or glass-made substrate sticking member having a convex shape with the sticking surface of the semiconductor substrate as a bottom surface, and a metal ring fitted to the protruding portion of the substrate sticking member. A polishing jig characterized in that

2) The polishing jig according to 1), wherein the outer peripheral side surface of the polishing jig is preferably cut into a trapezoidal shape, an arc shape or a cross-sectional shape obtained by combining the trapezoidal shapes.

Is achieved by

The skeleton of the present invention is used as a sticking plate by fitting a ceramic or quartz glass base plate sticking member and a metal ring on the outer circumference of the surface opposite to the sticking surface of the semiconductor substrate, to the board sticking member. The purpose is to give the attachment plate an auxiliary function for transportation.

The polishing jig used for polishing the semiconductor substrate of the present invention, that is, the sticking plate, improves the life of the sticking plate without basically changing the structure from the conventional sticking plate.

FIG. 1 is a sectional view showing a specific example of a polishing jig used for polishing a semiconductor substrate of the present invention, and FIG. 2 is a part of its front view.

The structure and operation will be described below with reference to FIGS. 1 and 2.

The sticking plate is composed of a sticking member 1 made of ceramics, a metal ring 2 for giving an auxiliary function for carrying the plate, and a set screw 3.

The flatness of the surface of the pasting member 1 on which the substrate 4 is pasted is 2 μm, and the surface roughness (Ra) is 0.03 to 0.07. Here, the material of the metal ring 2 is stainless steel.

A hole having a diameter slightly larger than that of the set screw 3 is formed on the outer periphery of the substrate attaching member 1 of the present invention, and a female ring having the same diameter as the set screw 3 is cut on the metal ring 2. . The attachment plate is assembled by fixing both the substrate attachment member 1 and the metal ring 2 with the set screw 3.

When the above-mentioned pasting plate, which is one specific example of the polishing jig used for polishing the semiconductor substrate of the present invention, is used, the pasting plate is not damaged by transportation, and its life is approximately tripled. became.

[0020]

[Effect of device]

 According to the present invention, the basic shape of the sticking plate is not changed at all, and therefore, the transfer system in the polishing process is not modified (1) The sticking plate is not damaged, and (2) The sticking plate is The life is about three times longer, and (3) the danger to the operator can be completely eliminated.

[Brief description of drawings]

FIG. 1 is a sectional view of an example of a polishing jig used for polishing a semiconductor substrate of the present invention.

FIG. 2 is a part of a front view of an example of a polishing jig used for polishing a semiconductor substrate of the present invention.

FIG. 3 is a sectional view of an example of a peripheral portion of the polishing jig of the present invention.

FIG. 4 is a sectional view of a typical example of a peripheral portion of a conventional polishing jig.

FIG. 5 is a sectional view of a typical example of a peripheral portion of a conventional polishing jig.

FIG. 6 is a sectional view of another example of the peripheral portion of the polishing jig of the present invention.

FIG. 7 is a sectional view of another example of the peripheral portion of the polishing jig of the present invention.

FIG. 8 is a sectional view of another example of the peripheral portion of the polishing jig of the present invention.

[Explanation of symbols]

 1 Board pasting member 2 Transport ring 3 Set screw 4 Board

Claims (2)

[Scope of utility model registration request] 1. A semiconductor substrate comprising a ceramic or quartz glass substrate attaching member having a convex surface as a bottom surface, and a metal ring fitted to a protruding portion of the substrate attaching member. A polishing jig to be used. 2. The polishing jig according to claim 1, wherein the outer peripheral side surface of the polishing jig is notched to have a trapezoidal shape, an arc shape or a cross-sectional shape formed by combining them.