JPH0631720Y2 - Semiconductor manufacturing equipment - Google Patents

Description

[Detailed Description of the Invention] Industrial Field of the Invention The present invention is to adsorb a semiconductor wafer to apply a photoresist, and to transfer the semiconductor wafer to an adsorption table for performing liquid treatment such as development, etching and cleaning, and scrubbing. Alternatively, the present invention relates to a semiconductor manufacturing apparatus which is carried out from the suction table.

2. Description of the Related Art During a semiconductor wafer manufacturing process, when a photoresist solution is applied to the surface, or an etching solution or the like is sprayed to perform a liquid treatment or scrubbing, a rotary suction table called a spinner shown in FIG. According to this processing apparatus, the semiconductor wafer (3) is first transferred from the load side transfer belt (2) to the suction table (1) and vacuum-sucked. Then, the treatment liquid (4) such as a photoresist liquid or an etching liquid is dropped or sprayed onto the surface of the wafer while rotating the suction table (1). Then, the processing liquid (4)
Is subjected to a predetermined process by being spread over the entire surface of the wafer by centrifugal force, and then the semiconductor wafer (3) is unloaded from the suction table (1) to the unloading side transfer belt (5) and sent to the next step.

At this time, when the semiconductor wafer (3) is transported from the transport belt (2) to the suction platform (1) and is unloaded from the suction platform (1) to the transport belt (5), the slider (6) shown in FIG. 5 is used. A transfer jig called is used. The slider (6) is
As shown in the figure, a mounting base (7) formed by integrating two rod-shaped supports (7a) (7b) and (8a) (8b) in a stepwise manner.
The upper support (7a) (8a) and the lower support (7b) are formed by connecting (8) a little wider than the suction table (1) and horizontally connecting them in parallel.
The peripheral edge of the semiconductor wafer (3) is placed on (8b), and the feed pin (9) is planted near the lower step. Then, the mounting plates (11) and (12) mounted on the connecting plates (10) of the mounting bases (7) and (8) are held horizontally by the slider holding shaft (15) shown in FIG. 3) is conveyed to or taken out from the adsorption table (1).

The sixth operation for carrying and carrying out the semiconductor wafer (3)
The following will be made with reference to FIGS. The above-mentioned carrying and carrying-out operations are usually carried out simultaneously, and as shown in FIG. 6, after the semiconductor wafer (3a) is sent from the load side carrying belt (2), it is also processed on the suction table (1). There is a semiconductor wafer (3b). Then, as shown in FIG. 6, first, the slider (6) is directed to the upper support bodies (7a) and (8a) toward the conveyor belt, and is moved to a position slightly lower than the conveyor surface and horizontally moved to the vicinity thereof. The semiconductor wafer (3a) is dropped onto the upper stage supports (7a) and (8a) by driving the transport belt (2). Next, the wafer suction surface of the suction table (1) is slightly lower than the mounting surface of the upper support (7a) (8a) and slightly higher than the mounting surface of the lower support (7b) (8b). , As shown in FIG. 7, the platform (7)
The slider (6) is horizontally moved to the suction table (1) side (X direction) so that the suction table (1) passes between (8). Then, as the slider (6) moves horizontally, the semiconductor wafer (3b) on the suction table (1) is locked by the feed pin (9) and pushed out from the suction table (1), as shown in FIG. As shown, the semiconductor wafer (3a) on the lower supports (7b) and (8b) falls on the upper supports (7a) and (8a) at the same time as being located above the suction table (1). Therefore, when the lifter (13) is lifted from below the lower supports (7b) (8b) on the carry-out side through the spaces between the supports, the semiconductor wafer (3b) is lifted from the lower supports (7b) (8b) to the lifter (7). 13)
Can be replaced. At the same time, the upper support (7a) on the transport side
The stopper (14) is raised through the space (8a) to lock the peripheral side edge of the semiconductor wafer (3a) located above the suction platform (1). Then, as shown in FIG. 9, when the slider (6) is returned horizontally while vacuum adsorbing the semiconductor wafer (3a), the semiconductor wafer (3a) is locked by the stopper (14) and the slider (6). When the lifter (13) is moved down and the lifter (13) is lowered, the semiconductor wafer (3a) is sucked onto the suction table (1) as shown in FIG. The semiconductor wafer (3b) is unloaded on the unloading side transfer belt (5). At this time, since the slider (6) has returned to the vicinity of the original load-side transfer belt (5), the semiconductor wafer (3) is returned in the same manner as above.
Transporting the same to the suction table (1) and carrying it out from it are repeated.

Problems to be Solved by the Invention By the way, when the semiconductor wafer (3) is carried out from the suction table (1) by the slider (6) described above, the suction table (1)
The semiconductor wafer (3) mounted on the substrate is locked by the feed pin (9) and pushed out from the suction table (1). Therefore, the semiconductor wafer (3) slides on the suction surface until it is separated from the suction table (1), and the back surface of the wafer has dust, dirt, and scratches, and in particular, a resist film or the like is formed on the back surface. If they are, they will be scratched and the yield will be reduced.

MEANS FOR SOLVING PROBLEMS The present invention is directed to a suction table for sucking a semiconductor wafer and having a diameter smaller than that of the semiconductor wafer, and a mounting table 2 having upper and lower stages in a stepwise manner.
The slider is provided with a space slightly wider than the suction table, and the sliders are horizontally connected in parallel and support the peripheral portions of the semiconductor wafers in the upper and lower stages, respectively. In the held posture, the wafer tilts up and down diagonally with respect to the suction table by a certain angle, and when tilted upward, the lower support section supports the wafer on the suction table so that it is picked up from below and carries it out. The support unit conveys the next wafer to above the suction table.

Function When a semiconductor wafer is sucked onto the suction table and the slider is tilted vertically and vertically so that the suction table passes between the mounting tables, the semiconductor wafer moves away from the suction table without sliding on the suction table. It can be transferred to the platform.

Embodiment An embodiment of the present invention will be described below with reference to FIGS. The same reference numerals as those in FIGS. 4 to 10 indicate the same things, (1) is a suction table, (3) is a semiconductor wafer, and (6)
Is a slider, (7b) and (8b) are lower supports of the slider (6), and (9) is a feed pin, as shown by a chain line in FIG.
The slider drive unit (16) for driving the slider (6) moves up and down by a certain angle with respect to the suction table (1) with the lower supports (7b) and (8b) held in a posture parallel to the suction table (1). It is remodeled to move diagonally (A).

The operation of the present invention based on the above configuration will be described below. First, the first
As shown in the figure, the semiconductor wafer (3) is attached to the suction table (1).
When the semiconductor wafer (3) is carried out by the slider (6) from the suction table (1) to the unloading side transfer belt after the suction is processed, the slider (6) is slanted from below the suction table (1). It is tilted in the upper direction (A) to approach the suction table (1). Then, when the suction table (1) passes between the lower supports (7b) and (8b) of the slider (6) and is further tilt-driven, as shown in FIG. 2, the lower supports (7b) and (8b) are
The semiconductor wafer (3) approaches b). When the slider (6) subsequently tilts in the (A) direction, as shown in FIG. 3, the semiconductor wafer (3) does not slide on the suction surface, and the lower support (7b) (8b) does not slide. ) And move away from the suction table (1). Then, at this time, the semiconductor wafer (3) is transferred from the slider (6) to the unload-side transfer belt and the semiconductor wafer (3) is transferred from the load-side transfer belt to the suction platform (1) by the slider (6). Is performed by the same operation as the conventional one.

In the implementation of the present invention, the slider holding shaft (15) shown in FIG.
It can be remodeled by slightly shifting the unloading side upwards as in 6). Along with this, it is necessary to adjust the height of the suction table (2) and the conveyor belts (2) and (5) and the stroke of the lifter (13). Further, in some cases, it may be necessary to change the steps of the mounts (7) and (8) of the slider (6).

Advantageous Effects of Invention According to the present invention, when a semiconductor wafer is carried out from a suction table that sucks and processes the semiconductor wafer, the semiconductor wafer is carried out without sliding on the suction surface. It is possible to prevent attached dust, dirt, scratches, etc. and improve the yield.

[Brief description of drawings]

1 to 3 are side views of main parts in the order of operation showing one embodiment of a semiconductor manufacturing apparatus according to the present invention, and FIG. 4 is a schematic side view showing a semiconductor wafer processing apparatus using a spinner. 5 is a perspective view of a slider included in the processing apparatus of FIG. 4,
6 to 10 are side views of essential parts in the order of operation of carrying and carrying out the semiconductor wafer by the slider of FIG.
The figure is a perspective view of the slider drive unit. (1) …… Suction table, (3) …… Semiconductor wafer, (6) …… Slider, (7) (8) …… Platform, (7a) (8a) …… Upper support, (7b) ( 8b) …… Lower support, (9) …… Feed pin.

Claims (1)

[Scope of utility model registration request] 1. A suction table for sucking a semiconductor wafer and having a diameter smaller than that of the semiconductor wafer, and two mounting tables having upper and lower steps in a staircase pattern, which are slightly wider than the suction table and horizontally. A slider is provided which is connected in parallel and supports the peripheral portions of the semiconductor wafers in the upper and lower stages, respectively, and the slider tilts vertically and obliquely at a certain angle with respect to the suction table in a posture in which the mounting table is held in parallel with the suction table. However, the upper supporting section carries out the wafer while supporting it so that the wafer on the suction table is picked up from below at the time of diagonally moving upward, and the upper supporting section carries the next wafer to above the suction table. Semiconductor manufacturing equipment.