JPH06314874A - Solder carrier device - Google Patents

Abstract

PURPOSE:To prevent solder bridging in an area near a drive roller introduction part by boring a hole in the central part of a fixed guide and enabling a lower part pipe of a solder guide to move up and down freely and engaging a weight running through the center of the fixed guide. CONSTITUTION:The central part of a fixed guide 18 fixed with a holding fitting extended from a base is bored while a lower part pipe 20 of a solder guide 19 is arranged to move freely. Therefore, the lower part pipe 20 floats an opening 21 of the fixed guide 18 upwardly when driving force is added by the rotation of a drive roller in the arrow direction and solder is piled up in an inner space of the solder guide 19 or not capable of passing through easily there. At the same time, a weight 17 floats up in a similar manner since it is engaged with the solder guide 19. This eases the resistance of a drive roller emission part 16. This construction makes it possible to reduce the generation of loss in soldering work since it is possible to prevent a zigzag state of solder generated in an area near the drive roller emission part.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder transfer device used in a device for mounting and soldering electronic parts and the like on a circuit board which constitutes an electronic device.

[0002]

2. Description of the Related Art When mounting electronic parts such as resistors and integrated circuit elements that constitute electronic equipment on a circuit board, the circuit board and the lead terminals of the electronic parts are soldered. Automatic soldering equipment is used, which can be easily moved to suit the production of, while maintaining the soldering speed and reliable reliability.

As a soldering device used for this,
There is one in which a working head is attached to the tip of a driving arm that can be moved vertically and horizontally. The work head is provided with a soldering iron having a built-in heater and a soldering nozzle arranged along the soldering iron. The soldering nozzle allows the thread-like solder to face the tip of the soldering iron. It is supplied and forms a solder melting part, and soldering is performed so that the tip of the soldering iron faces the terminals of the circuit board on which the parts to be mounted and mounted on the opposing table are placed. It is done. At this time, the work head is driven so that the tip of the soldering iron comes into contact with the soldered portion of the circuit board to melt the solder and also heats the soldered portion of the circuit board. The soldering operation and work is performed by driving a movable driving arm, driving a solder feeding mechanism that is interlocked with a working head, and further repeating soldering on a portion to be soldered, thereby making Soldering is performed.

FIG. 3 shows an example of a conventional solder feeding mechanism. In the drawing, the solder feeding mechanism is provided with a thread-shaped solder supply source 2 held in a solder holding portion through an extension guide 3 for linearly aligning the solder. A driving force is applied by passing the solder through a pair of rollers including the driving roller 14 and the compression roller 13. A suitable driving force is applied by an L-shaped metal fitting 6 which is rotatable about a pivot shaft 5 and a spring 4 which springs in the direction of the drive roller 14. Next, the solder guide 8 fixed by the holding metal fitting 7 extending from the base 1 located immediately above enters the solder guide 8, and further passes through the tubular member 9 to reach the solder nozzle 11 at the tip of the work head. There is. The working head is provided with a soldering iron 12 having a heater (not shown) and a solder nozzle 11 for sending the solder along the soldering iron. Are supplied so as to face the tip of the soldering iron to form a solder melting portion. The enlarged view shown by the arrow shows the case where the solder meanders in the compression roller discharge portion 16.

[0005]

In the continuous use for a long period of time, the flux contained in the thread-shaped solder at the tip of the soldering iron is deteriorated due to the high temperature, which is caused by the growth of the carbonized polymer substance. In some cases, the heat conduction deteriorates and the transported solder does not melt. Even if this state is quickly sensed, the stop of the solder feeding mechanism is delayed because the solder is a flexible and flexible member, and the solder itself is in the transporting state. For this reason, the solder is clogged inside the tubular member, and since the solder guide is fixed by the guide set screw, the stagnation of the transfer of the solder spreads to the progressive feed and becomes a meandering state in the vicinity of the drive roller discharge part, and finally the drive is completed. Entangled on the roller itself. Once the entanglement occurs, the soldering work is stopped during that time, so that the loss is not only enormous, but also a lot of time is required for the restoration. Therefore, the present invention is intended to provide a solder transport device which is effective in preventing entanglement near the drive roller introducing portion.

[0006]

SUMMARY OF THE INVENTION Therefore, according to the present invention, the weight of the solder guide is placed on the upper portion of the fixed guide so that the solder guide is in a free state in which it is not fixed by the guide set screw, and the solder guide is surrounded and locked. When the solder is transported even though the melting of the solder has deteriorated, the weight body locked to the solder guide rises from the fixed guide for at least a certain period of time and resistance is applied to the discharge part of the drive roller. Without solder, the solder guide is configured to rise in a straight line.

[0007]

When the fixing of the solder guide to the base is released and the conveying force of the driving roller and the weight of the weight body locked to the solder guide are balanced, for example, solder clogging of the tubular member occurs and the driving roller The solder is bent by the driving force generated by the rotation of
It is possible to prevent meandering and entanglement in the drive roller discharge portion.

Further, if a switch or the like that operates by contacting with the weight in a floating state is additionally provided, the supply of solder can be stopped by turning on the switch when the transfer of solder is different from the normal state.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The same reference numerals are given to those having the same function as the conventional example.

FIG. 1 shows an embodiment of the present invention. In the figure, there is a solder supply source 2 such as a filamentous solder under a base 1 which forms a solder conveying device, and the vertically unwound solder passes through a guide 3 and between a compression roller 13 and a drive roller 14. In addition, the work head is placed on the fixed guide 18 locked to the base 1 by being given a conveying force, and further passes through the center of the weight body 17 locked to the solder guide 19 and passes through the tubular member 9 to work head. Is supplied to the solder nozzle in.

FIG. 2 shows an essential part of the embodiment. The central portion of the fixed guide 18 fixed by a holding metal fitting extended from the base is bored so that the lower pipe portion 20 of the solder guide 19 can be freely moved. Therefore, when the driving force is applied by the rotation of the driving roller 14 in the direction of the arrow and the solder stagnates in the inner space of the solder guide 19 or cannot pass easily,
The lower pipe portion 20 floats above the opening 21 of the fixed guide 18. At the same time, since the weight 17 is locked to the solder guide 19, it also floats. As a result, the resistance of the drive roller discharge portion 16 is reduced.

Since the weight of the weight resists the rise of the solder, it is preferable to lift the weight slightly in the entangled state.

The weight 17 is not limited to a conical shape, and various shapes can be selected as long as the weight 17 has a mechanism of penetrating the solder guide 19 at its center. For example, a triangular pyramid or the like can be used.

The weight 17 has a solder guide 19 so that the weight can be easily exchanged depending on the thickness of the solder to be conveyed.
It is also possible to adopt a structure in which the groove through which the holes pass is opened from the outside of the weight 17 toward the center. As a result, the weight can be quickly replaced even during the work.

A micro switch or the like which operates by contacting the weight 17 in a floating state may be additionally provided. As a result, the supply of solder can be stopped by turning on the switch when the solder is conveyed in a state different from the normal state.

These are merely examples, and various modifications and improvements are possible without departing from the scope of the present invention, and are not necessarily limited to the form shown here.

[0017]

EFFECT OF THE INVENTION The solder conveyed to the soldering iron does not melt,
Moreover, when the solder itself is in the transporting state, it is possible to prevent the meandering state of the solder that occurs in the vicinity of the drive roller discharging portion, so that not only the loss of soldering work is reduced but also the repair time is reduced. Has a great effect.

[Brief description of drawings]

FIG. 1 is an example of the present invention.

FIG. 2 is a diagram showing a main part of the embodiment.

FIG. 3 is an example of a conventional soldering device.

[Explanation of symbols]

 1 Base 2 Support 3 Solder Source 9 Tubular Member 13 Compression Roller 14 Drive Roller 17 Weight 18 Fixed Guide 19 Solder Guide 20 Lower Pipe 21 Opening.

Claims (1)

[Claims] 1. A solder supply source 2 such as a filamentous solder is provided under a base 1 which forms a solder conveying device, and the vertically unwound solder passes through a guide 3 between a compression roller 13 and a drive roller 14. In what is given a conveying force through
The center portion of the fixed guide 18 is bored, the lower pipe portion 20 of the solder guide 19 is freely movable up and down, and the weight body 17 penetrating the center is locked by the solder guide 19 and placed on the fixed guide 18. A solder transfer device having a configuration capable of performing.