JPH05304359A - Solder suck-up device - Google Patents

Abstract

PURPOSE:To provide a solder suck-up device which completely removes, with ease, useless solders remained stuck within a through hole at one operation. CONSTITUTION:The first soldering iron 4 from the end surface of which high temperature gas far melting a solder blows off, the second soldering iron 9 which is placed facing, approximately, the top of the first soldering iron 4 and sucks both the high temperature gas blown off from the top surface of the first soldering iron 4 and the solder melted by the high temperature gas and a soldering iron driving mechanism 11 which relatively moves the first soldering iron 4 and the second soldering iron 9 back and forth are provided. So both sides are heated, and remaining stuck solder is melted. And the molten solder is pushed out by the high temperature gas being blown off on one side, and the pushed out molten solder is sucked up, as a result, the useless solder within a through hole is easily removed altogether.

Description

Detailed Description of the Invention

[Object of the Invention]

[0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder sucking device, and more particularly to a solder sucking device suitable for removing solder clogging the through holes of a printed wiring board.

[0003]

2. Description of the Related Art A multilayer printed wiring board having a so-called through hole has been widely put to practical use in various electronic devices for the purpose of making the circuit mechanism light and thin. By the way, the through hole is generally used for electrical connection between the circuit patterns on both main surfaces or between the circuit pattern on the main surface and the inner layer circuit pattern. Often, it is inserted and soldered to make an electrical connection. In addition, in mounting / mounting such a circuit component, if there is an error in the mounting / mounting position or an error in the circuit component, it is necessary to remove or replace the circuit component. It is also necessary to remove the solder inside.

However, the solder removal in the through hole is generally performed as follows. That is, FIG.
As shown in a side view of the embodiment, the tip of the soldering iron 1 configured to be capable of sucking molten solder is brought into contact with the through hole 3 of the printed wiring board 2 in which the solder remains, and the soldering iron 1 is used to form the through hole 3 While melting the solder that remains inside,
The soldering iron 1 is sucked and removed through the suction passage 1a attached to the soldering iron 1.

[0005]

However, the above-mentioned means has the following problems. That is, when the printed wiring board 2 is made thicker in multiple layers for the purpose of making it thinner and lighter, in other words, when the length of the through hole 3 is long, or when the heat capacity of the through hole 3 portion is large, the heating by the soldering iron 1 is not sufficient. The suction removal of the solder is proceeded while the remaining residual solder on the back surface side is not sufficiently melted. Therefore, it is difficult to completely remove the solder remaining on the rear surface of the printed wiring board 2, and the same processing must be performed again from the rear surface, which not only complicates the operation but also causes non-mass production. There is a problem of being a target.

The present invention has been made in view of the above circumstances, and provides a solder sucking device capable of easily and entirely removing unnecessary solder remaining in the through holes by a single operation. For the purpose of provision.

[Constitution of Invention]

[0008]

A solder sucking apparatus according to the present invention is arranged such that a first soldering iron ejecting a high-temperature gas capable of melting solder from a tip surface and a tip of the first soldering iron are substantially opposed to each other. The second soldering iron which is arranged and sucks the high-temperature gas ejected from the tip surface of the first soldering iron and the molten solder due to this high-temperature gas, and the first soldering iron and the second soldering iron are relatively advanced and retracted. And a soldering iron driving mechanism.

[0009]

According to the solder sucking device having the above-mentioned structure, the residual adhered solder is melted by being heated from both sides, while the molten solder is extruded by the high temperature gas jetted and the extruded molten solder is sucked. The unnecessary solder in the through hole can be removed easily and entirely.

[0010]

Embodiments of the present invention will be described below with reference to FIGS.

FIG. 1 is a side view and FIG. 2 is a plan view showing an example of the essential parts of a solder sucking device according to the present invention. In FIG. 4, hot gas capable of melting solder is jetted from the tip surface. This is the first soldering iron. Thus, the first soldering iron 4 is provided with a heat source (for example, a resistance heating element) capable of holding a temperature of, for example, about 350 ° C., while the solder supplied by the high temperature gas supply passage 4a is meltable at 350 ° C. A nozzle 4b for ejecting a high temperature gas is provided at the tip of the support guide rod 5.
It is supported by an arm 6 which moves back and forth in the vertical direction. 7 is a base for supporting the support guide bar 5,
A spring 8 has one end fixed to the base 7 and the other end fixed to the arm 6 and serves to pull the arm 6 downward.

A second soldering iron 9 is arranged on the surface of the base 7 so as to be substantially opposed to the tip of the first soldering iron 4, and the second soldering iron 9 is, for example, 350. While having a heat source (for example, a resistance heating element) capable of maintaining a temperature of about 0 ° C., it has a function of sucking high-temperature gas ejected from the tip surface of the nozzle 4b of the first soldering iron 4. That is,
The through holes of the printed wiring board can be heated from the back surface side, and also have a role of sucking the solder melted by the high-temperature gas that is heated and jetted by the first soldering iron 4.

Further, 10 is a first soldering iron 4 driving mechanism provided with a heating power source for the first soldering iron 4, a high temperature gas supply source, and drive control means in the vertical direction, and 11 is the second soldering iron 4. It is a second soldering iron 9 driving mechanism including a heating power source for the soldering iron 9 and a high temperature gas suction means. The drive mechanisms 10 and 11 are integrally provided on the base 7, and are configured to perform a required operation by turning the switch 12 on and off.

Next, the operation or use of the solder sucking device having the above structure will be described. First, a printed wiring board having solder to be removed in the through holes is prepared, and this printed wiring board is attached to the tip of the first soldering iron 4 and the second soldering iron 4.
The soldering iron 9 is positioned between the surfaces facing the tip of the soldering iron 9. When the switch 12 is turned on in this state, the first soldering iron 4 driving mechanism 10 and the second soldering iron 9 driving mechanism 11 are driven. That is, on the first soldering iron 4 side,
While the first soldering iron 4 descends and the tip surface of the nozzle 4b contacts the through hole opening of the printed wiring board, the first soldering iron 4 is heated to a required temperature (for example, about 350 ° C.) and heated, A high temperature gas of, for example, about 350 ° C. supplied through the high temperature gas supply passage 4a is ejected from the tip surface of the nozzle 4b. On the other hand, on the second soldering iron 9 side, the second soldering iron 9 is heated to a required temperature (for example, about 350 ° C.) and heated, and the nozzle of the first soldering iron 4 is used.
The operation of sucking the gas ejected from 4b and the solder melted and contained in this gas is exhibited. Thus, the removal of the residual solder that has been deposited in the through holes of the printed wiring board is advanced, and when the removal and absorption of the solder is confirmed, the switch 12 is turned off to complete the required operation. To do.

In the above configuration example, the first soldering iron 4
In the above description, the structure for moving the second soldering iron 9 back and forth is shown. However, the relationship between the two is relatively relative, and the second soldering iron 9 may be moved back and forth. It is not limited to the support guide bar 5-arm 6 system.

[0016]

As can be seen from the above description, according to the solder sucking apparatus of the present invention, the inside of the through hole in which the solder remains or adheres is heated from both main surface sides, while the high temperature gas is supplied from the one main surface side. (A temperature at which the solder can be melted) is jetted into the through holes, which promotes the melting of the remaining / adhered solder, and is forcibly sucked from the other main surface side. Therefore, the solder that remained or adhered in the through hole
It can be easily and completely or completely removed.

[Brief description of drawings]

FIG. 1 is a side view showing a configuration example of a main part of a solder suction device according to the present invention.

FIG. 2 is a plan view showing a configuration example of a main part of a solder suction device according to the present invention.

FIG. 3 is a side view schematically showing an embodiment of removing the solder remaining on the through holes of the conventional printed wiring board.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Solder nozzle 1a ... Suction path 2 ... Printed wiring board 3 ... Through hole where solder remains and adheres 4 ... First soldering iron 4a ... High temperature gas supply path 4b ... Nozzle 5
... Support guide bar 6 ... Arm 7 ... Base 8 ... Spring 9 ... Second soldering iron 10 ... First soldering iron driving mechanism 11 ... Second soldering iron driving mechanism 12 ... Switch

Claims (1)

[Claims] 1. A first soldering iron that ejects high-temperature gas capable of melting solder from a tip surface, and a high-temperature gas that is disposed so as to face the tip of the first soldering iron and is ejected from the tip of the first soldering iron. A second soldering iron for sucking high-temperature gas and molten solder due to the high-temperature gas, the first soldering iron and the second soldering iron
And a soldering iron driving mechanism for relatively moving the soldering iron of (3) forward and backward.