JPH06310585A - Mounting structure for finger of robot arm used for transferring wafers in one lot in semiconductor manufacturing equipment - Google Patents
Mounting structure for finger of robot arm used for transferring wafers in one lot in semiconductor manufacturing equipmentInfo
- Publication number
- JPH06310585A JPH06310585A JP11761293A JP11761293A JPH06310585A JP H06310585 A JPH06310585 A JP H06310585A JP 11761293 A JP11761293 A JP 11761293A JP 11761293 A JP11761293 A JP 11761293A JP H06310585 A JPH06310585 A JP H06310585A
- Authority
- JP
- Japan
- Prior art keywords
- finger
- mounting
- holes
- fingers
- bracket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は半導体の単結晶を材料で
あるウェーハ上に形成する半導体製造装置(以下CVD
装置と略称する)に関し、更に詳しくはキャリヤステー
ジからボートへウェーハを一括して自動的に移載・装填
するロボットアームのフィンガ取付構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus (hereinafter referred to as CVD) for forming a semiconductor single crystal on a wafer as a material.
The apparatus is abbreviated as "apparatus"), and more specifically, it relates to a finger mounting structure of a robot arm for automatically transferring and loading wafers collectively from a carrier stage to a boat.
【0002】[0002]
【産業上の利用分野】従来、半導体の単結晶を材料ウェ
ーハの上に形成するCVD装置は内部概要を示す側面図
の図9のような構成になっている。1はCVD装置であ
って無塵室を形成しており、2は移載装置であるロボッ
トであって、このロボットのアーム21の先端に設けた
フィンガ23によって、材料であるウェーハ3をキャリ
ヤステージ4からボート5の内部の溝棚6に移載・装填
し、ウェーハ3の装填を完了したボート5は上昇して、
この材料ウェーハ3を所要の熱処理を行う反応装置7に
収納する。又、8はこのCVD装置の制御装置、9はそ
の操作盤で無塵室外に置かれる。BACKGROUND OF THE INVENTION Conventionally, a CVD apparatus for forming a semiconductor single crystal on a material wafer has a structure as shown in FIG. 9 which is a side view showing an internal outline. Reference numeral 1 is a CVD apparatus which forms a dust-free chamber, and 2 is a robot which is a transfer apparatus. A finger 23 provided at the tip of an arm 21 of the robot transfers a wafer 3 which is a material to a carrier stage. 4 is loaded and loaded on the groove shelf 6 inside the boat 5, and the boat 5 which has completed loading the wafers 3 moves up,
This material wafer 3 is housed in a reaction device 7 that performs a required heat treatment. Further, 8 is a control device of this CVD apparatus, and 9 is its operation panel, which is placed outside the dust-free chamber.
【0003】図9に示すようにボート5の内部は複数個
(通常25個)の溝棚6が設けられ、キャリヤステージ
4にあるカセット(図示せず)に通常5段に置かれたウ
ェーハ3をロボット2のアーム21の先端に設けられた
フィンガ23により複数個一括して(この例では5個、
図6参照)キャリヤステージ4からボート5へ移載・装
填を行い、反応装置7で処理が完了したウェーハは上記
と逆に例えば5個宛フィンガ23でキャリヤステージ4
へ戻される。As shown in FIG. 9, a plurality of (normally 25) groove shelves 6 are provided inside the boat 5, and the wafers 3 usually placed in five stages in a cassette (not shown) on the carrier stage 4. By a finger 23 provided at the tip of the arm 21 of the robot 2 (5 in this example,
(See FIG. 6) The wafers that have been transferred and loaded from the carrier stage 4 to the boat 5 and have been processed by the reactor 7 are, for example, five fingers 23 in reverse to the above.
Returned to.
【0004】[0004]
【発明が解決しようとする課題】図6にフィンガ23を
複数個(この例では5個)スペーサ25を介してアーム
21の先端部のフィンガ保持部22に取り付けた状態を
示し、スペーサ25の平面図、正面図をそれぞれ図7,
図8に示すが、矩形のスペーサ25の四隅に通し穴25
aが明けられ、フィンガ23の対応する位置にも通し穴
が設けられ、図6に示すように下から順にスペーサ2
5、フィンガ23、スペーサ25と重ねられ、最終にス
ペーサ25と同形で厚さだけが薄いフィンガ抑え24が
置かれて、四隅の通し穴に取付ボルトを通して全体を締
め付けているが、フィンガ23はシリコン製なので、強
く締め付けると破損の恐れがあって、余り強く締められ
ない。その上に、各フィンガ取付端部の厚みの累積誤差
が加わって、例えば5個の中1個が締付不良でふらつき
を生ずることがある。この場合、そのフィンガにはウェ
ーハは移載されないが、ウェーハの履歴管理上そのまま
ボートへの移載・装填作業を続け、反応装置7の能率
上、ボート5の未装填の溝棚6は図6の右側に示す1個
の取付フィンガを使用して満杯にする。このような余分
の工数を掛けないで済むように、ふらつきフィンガがな
い複数個のウェーハの一括搬送用のロボットアームのフ
ィンガ取付構造を提供するのが本発明の目的である。FIG. 6 shows a state in which a plurality of fingers 23 (five in this example) are attached to the finger holding portion 22 at the tip portion of the arm 21 through the spacer 25, and the plane of the spacer 25 is shown. Figure and front view are shown in Figure 7,
As shown in FIG. 8, the through holes 25 are provided at the four corners of the rectangular spacer 25.
a is opened, through holes are also provided at corresponding positions of the fingers 23, and as shown in FIG.
5, the finger 23 and the spacer 25 are overlapped with each other, and finally the finger restraint 24 having the same shape as the spacer 25 and a small thickness is placed, and the whole bolt is tightened through the mounting bolts through the through holes at the four corners. Since it is made, there is a risk of damage if tightened too strongly, so it cannot be tightened too strongly. On top of that, an accumulated error in the thickness of each finger attachment end is added, and for example, one out of five fingers may cause wobble due to improper tightening. In this case, the wafer is not transferred to the finger, but in the history management of the wafer, the transfer / loading operation to the boat is continued as it is, and due to the efficiency of the reaction device 7, the unloaded groove rack 6 of the boat 5 is shown in FIG. Fill with one mounting finger shown on the right side of. SUMMARY OF THE INVENTION It is an object of the present invention to provide a robot arm finger mounting structure for batch transfer of a plurality of wafers without wobbling fingers so as to avoid such extra man-hours.
【0005】[0005]
【課題を解決するための手段】本発明では、上表面に設
けられ、一方向が開いた四角形のくぼみの底部に複数個
のフィンガ取付ねじ用の通し穴及びねじ穴を配設した矩
形状の第一のブラケットと、前記通し穴がねじ穴に、前
記ねじ穴が通し穴に変えられ、その他は前記第一のブラ
ケットと同一形状の第二のブラケットとを、フィンガを
前記くぼみに挿入した後、前記通し穴に通した取付ねじ
を当該フィンガの取付穴を介して直下のねじ穴にねじ込
むことにより前記フィンガを取付けつつ、交互に所定枚
数を重ねる構造としたことによって課題を解決した。According to the present invention, a rectangular shape having a plurality of through holes and screw holes for finger mounting screws is provided at the bottom of a quadrangular recess provided on the upper surface and open in one direction. After inserting the finger into the recess, the first bracket, the through hole into a screw hole, the screw hole is changed to a through hole, the other second bracket having the same shape as the first bracket The problem is solved by adopting a structure in which a predetermined number of sheets are alternately stacked while mounting the fingers by screwing a mounting screw passed through the through hole into a screw hole immediately below through the mounting hole of the finger.
【0006】[0006]
【作用】ブラケットのくぼみの深さはフィンガ取付端部
の厚さより少し大きいので、各フィンガは一枚毎にそれ
ぞれのブラケットのくぼみ内に確実に取付ねじで締め付
けられてフィンガの厚みの誤差が累積することがなく、
第一のブラケットに使用した取付ねじの頭部は上に取り
付けられる第二のブラケットの通し穴内に収容され(図
4参照)、以下同様にしてブラケットが重ねられ、四隅
の取付ボルトで複数個のブラケットをフィンガ保持部に
強く締め付けることができる。[Function] Since the depth of the recess of the bracket is slightly larger than the thickness of the finger mounting end, each finger is securely tightened in the recess of each bracket with the mounting screw, and the error in finger thickness accumulates. Without doing
The head of the mounting screw used for the first bracket is housed in the through hole of the second bracket that is mounted on top (see Fig. 4), and the brackets are piled up in the same manner, and a plurality of mounting bolts at the four corners are used. The bracket can be firmly tightened on the finger holding part.
【0007】[0007]
【実施例】本発明による第一,第二のブラケット35,
35Aを使用してフィンガ23をロボット2のアーム2
1の先端にあるフィンガ保持部22に取り付けた一実施
例の正面図を図1に、第一のブラケット35の平面図を
図2に、図2のAーA断面正面図を図3に、フィンガ取
付ねじ付近の拡大断面図を図4に、又図1の部分展開図
を図5に示す。図2及び図3に示すように矩形状の第一
のブラケット35の上表面36にはフィンガ取付端部2
3A(図1及び図5参照)が嵌まる一方向37が開いた
四角なくぼみ38が設けられ、その深さはフィンガ取付
端部23Aの厚さより少く大きく、底部39には複数個
(この例ではそれぞれ3個)のねじ穴40と通し穴41
が交互に配設されて、フィンガ取付ねじ42(図4、図
5参照)でフィンガ端部23Aが取り付けられるように
なっており、又ブラケット35の四隅には取付ボルト4
3が貫通する通し穴44が、更に通し穴44の取り付け
られたフィンガの長手方向の中間には位置決め平行ピン
45が通る通し穴46が設けられている。第二のブラケ
ット35A(図5参照)は第一のブラケット35のねじ
穴40と通し穴41とが入れ換えられた以外は全く同様
である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First and second brackets 35 according to the present invention,
35A is used to move the finger 23 to the arm 2 of the robot 2.
1 is a front view of an embodiment attached to the finger holding portion 22 at the tip of FIG. 1, FIG. 2 is a plan view of the first bracket 35, FIG. An enlarged cross-sectional view of the vicinity of the finger mounting screw is shown in FIG. 4, and a partially developed view of FIG. 1 is shown in FIG. As shown in FIGS. 2 and 3, the finger mounting end portion 2 is provided on the upper surface 36 of the rectangular first bracket 35.
3A (see FIGS. 1 and 5) is provided with a square recess 38 that is open in one direction 37, the depth of which is slightly larger than the thickness of the finger mounting end 23A, and a plurality of bottom recesses 39 (in this example). (Three for each) 40 and through holes 41
Are alternately arranged so that the finger end portions 23A can be attached by the finger attaching screws 42 (see FIGS. 4 and 5), and the mounting bolts 4 can be attached to the four corners of the bracket 35.
A through hole 44 through which the positioning parallel pin 3 passes is provided, and a through hole 46 through which the positioning parallel pin 45 passes is provided in the middle of the finger to which the through hole 44 is attached in the longitudinal direction. The second bracket 35A (see FIG. 5) is completely the same except that the screw hole 40 and the through hole 41 of the first bracket 35 are replaced.
【0008】次にフィンガ23の取り付け及び作用につ
いて説明する。図2乃至図5を参照して、第一及び第二
のブラケット35,35Aを、フィンガの取付穴23B
を開けたフィンガ23の取付端部23Aをくぼみ38に
挿入した後、通し穴41に通した取付ねじ42を当該フ
ィンガ23の取付穴23Bを介して直下のねじ穴40に
ねじ込むことにより前記フィンガを取付けつつ、フィン
ガ保持部22に打ち込んだ平行ピン45に沿って交互に
所定枚数を重ね、最後に輪郭がブラケット35,35A
と同じで厚さが薄く四隅に通し穴が明けられたフィンガ
抑え24をのせ、フィンガ抑え24、ブラケット35,
35Aの四隅の通し穴に取付ボルト43(図5参照)を
通して固く締め付ける。このようにすれば、各フィンガ
23は過大な締付力を受けることなく、又平行ピン45
により各ブラケット35,35Aのねじ穴40、通し穴
41は垂直線上に合致して、フィンガ取付ねじ42の頭
はそれぞれの上にあるブラケットの通し穴41に収容さ
れて(図4参照)、取付ボルト43の締め付けに支障を
来さないようになっている。Next, the mounting and operation of the finger 23 will be described. 2 to 5, the first and second brackets 35, 35A are attached to the finger mounting holes 23B.
After inserting the mounting end portion 23A of the opened finger 23 into the recess 38, the mounting screw 42 passed through the through hole 41 is screwed into the screw hole 40 immediately below through the mounting hole 23B of the finger 23, thereby mounting the finger. While mounting, a predetermined number of sheets are alternately stacked along the parallel pins 45 driven into the finger holding portion 22, and finally the contours are brackets 35, 35A.
The finger restraint 24, which is the same as the above, is thin and has through holes in the four corners, and the finger restraint 24, the bracket 35,
Pass the mounting bolts 43 (see FIG. 5) through the through holes at the four corners of 35A and tighten them firmly. In this way, each finger 23 does not receive an excessive tightening force and the parallel pin 45
Thus, the screw holes 40 and the through holes 41 of the brackets 35 and 35A are aligned on the vertical line, and the heads of the finger mounting screws 42 are accommodated in the through holes 41 of the brackets above them (see FIG. 4) to mount the brackets. It does not interfere with the tightening of the bolt 43.
【0009】[0009]
【発明の効果】上記のようなフィンガ取付構造なので、
フィンガがふらつくことがなく、従ってボートにウェー
ハが移載・装填されない溝棚を生じないので作業能率が
格段に向上し、ウェーハの管理も容易に行われる。Since the finger mounting structure is as described above,
Since the fingers do not fluctuate, and therefore, the groove shelf in which the wafers are not transferred and loaded in the boat is not generated, the work efficiency is remarkably improved, and the wafers are easily managed.
【図1】本発明による第一、第二のブラケットを使用し
てフィンガをロボットのアームの先端に取り付けた一実
施例の正面図である。FIG. 1 is a front view of an embodiment in which a finger is attached to a tip of an arm of a robot by using first and second brackets according to the present invention.
【図2】図1に使用される第一のブラケットの平面図で
ある。2 is a plan view of the first bracket used in FIG. 1. FIG.
【図3】図2のAーA断面正面図である。FIG. 3 is a front view taken along the line AA of FIG.
【図4】フィンガ取付ねじ付近の拡大断面図である。FIG. 4 is an enlarged cross-sectional view near a finger mounting screw.
【図5】図1の部分展開図である。FIG. 5 is a partially developed view of FIG.
【図6】従来のスペーサにより複数個のフィンガをロボ
ットのアームの先端に取り付けた状態を示す正面図であ
る。FIG. 6 is a front view showing a state in which a plurality of fingers are attached to the tip of an arm of a robot by a conventional spacer.
【図7】図6に使用されるスペーサの平面図である。FIG. 7 is a plan view of the spacer used in FIG.
【図8】図6のスペーサの正面図である。FIG. 8 is a front view of the spacer of FIG.
【図9】半導体製造装置の内部概要を示す側面図であ
る。FIG. 9 is a side view showing an internal outline of a semiconductor manufacturing apparatus.
1 半導体製造装置 2 ロボット 3 ウェーハ 4 キャリヤステージ 5 ボート 6 溝棚 7 反応装置 8 制御装置 9 操作盤 21 アーム 23 フィンガ 35 第一のブラケット 35A 第二のブラケット 38 くぼみ 39 底部 40 ねじ穴 41 通し穴 1 Semiconductor Manufacturing Equipment 2 Robot 3 Wafer 4 Carrier Stage 5 Boat 6 Groove Shelf 7 Reactor 8 Control Device 9 Operation Panel 21 Arm 23 Finger 35 First Bracket 35A Second Bracket 38 Recess 39 Bottom 40 Screw Hole 41 Through Hole
Claims (1)
形のくぼみの底部に複数個のフィンガ取付ねじ用の通し
穴及びねじ穴を配設した矩形状の第一のブラケットと、
前記通し穴がねじ穴に、前記ねじ穴が通し穴に変えら
れ、その他は前記第一のブラケットと同一形状の第二の
ブラケットとを、フィンガを前記くぼみに挿入した後、
前記通し穴に通した取付ねじを当該フィンガの取付穴を
介して直下のねじ穴にねじ込むことにより前記フィンガ
を取付けつつ、交互に所定枚数を重ねる構造としたこと
を特徴とする半導体製造装置におけるウェーハ一括搬送
用ロボットアームのフィンガ取付構造。1. A rectangular first bracket in which a plurality of through holes and screw holes for finger mounting screws are provided on the bottom of a quadrangular recess provided on the upper surface and open in one direction.
The through hole is a screw hole, the screw hole is changed to a through hole, the other second bracket having the same shape as the first bracket, after inserting the finger into the recess,
A wafer in a semiconductor manufacturing apparatus characterized in that a predetermined number of sheets are alternately stacked while mounting the fingers by screwing the mounting screws passed through the through holes into the screw holes immediately below through the mounting holes of the fingers. Finger mounting structure for batch transfer robot arm.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11761293A JP2970308B2 (en) | 1993-04-22 | 1993-04-22 | Finger mounting structure of robot arm for batch transfer of wafers in semiconductor manufacturing equipment |
MYPI9400964 MY121923A (en) | 1993-04-22 | 1994-04-20 | Finger mounting structure for a robot arm adapted to collectively conveying wafers in a semiconductor manufacturing system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11761293A JP2970308B2 (en) | 1993-04-22 | 1993-04-22 | Finger mounting structure of robot arm for batch transfer of wafers in semiconductor manufacturing equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH06310585A true JPH06310585A (en) | 1994-11-04 |
JP2970308B2 JP2970308B2 (en) | 1999-11-02 |
Family
ID=14716074
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11761293A Expired - Fee Related JP2970308B2 (en) | 1993-04-22 | 1993-04-22 | Finger mounting structure of robot arm for batch transfer of wafers in semiconductor manufacturing equipment |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2970308B2 (en) |
MY (1) | MY121923A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000005761A1 (en) * | 1998-07-24 | 2000-02-03 | Mitsubishi Denki Kabushiki Kaisha | Wafer holding hand |
JP2010251790A (en) * | 1998-07-10 | 2010-11-04 | Brooks Automation Inc | Dual arm substrate handling robot with batch loader |
-
1993
- 1993-04-22 JP JP11761293A patent/JP2970308B2/en not_active Expired - Fee Related
-
1994
- 1994-04-20 MY MYPI9400964 patent/MY121923A/en unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010251790A (en) * | 1998-07-10 | 2010-11-04 | Brooks Automation Inc | Dual arm substrate handling robot with batch loader |
WO2000005761A1 (en) * | 1998-07-24 | 2000-02-03 | Mitsubishi Denki Kabushiki Kaisha | Wafer holding hand |
US6216883B1 (en) | 1998-07-24 | 2001-04-17 | Mitsubishi Denki Kabushiki Kaisha | Wafer holding hand |
Also Published As
Publication number | Publication date |
---|---|
JP2970308B2 (en) | 1999-11-02 |
MY121923A (en) | 2006-03-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |