JPH0630878B2 - Thin film perforation method and apparatus for implementing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (1) Object of the Invention [Industrial field of use] The present invention relates to a perforating apparatus, and particularly to a technique effective when applied to a thin film perforating apparatus used in a thin film sticking apparatus. It is about.

[Prior Art] A printed wiring board used in an electronic device such as a computer is one in which a predetermined pattern of wiring such as copper is formed on one side or both sides of an insulating substrate.

This type of printed wiring board can be manufactured by the following manufacturing process.

First, a thin laminated body (an example of a thin film) including a photosensitive resin (photoresist) layer and a translucent resin film (protective film) for protecting it on a conductive layer provided on an insulating substrate.
Thermocompression laminate (attach). This thermocompression-bonding lamination is mass-produced by a thin film sticking device, a so-called laminator. After that, a wiring pattern film is overlaid on the laminate, and the photosensitive resin layer is exposed for a predetermined time through the wiring pattern film and the transparent resin film. Then, the translucent resin film is peeled off by a peeling device, and then the exposed photosensitive resin layer is developed to form an etching mask pattern. After that, unnecessary portions of the conductive layer are removed by etching, and the remaining photosensitive resin layer is removed to form a printed wiring board having a predetermined wiring pattern.

[Problems to be Solved by the Invention] In the manufacturing process of the printed wiring board described above, a step of exposing a photosensitive resin layer by stacking a wiring pattern film on a laminate thermocompression-bonded to the substrate is required. Has been done. The superposition of the two is done by forming a guide hole (also called a positioning hole) provided in advance at the angle or end of the substrate,
The positioning pin is attached to the guide hole provided on the wiring pattern film corresponding to the guide hole. Since the laminated body is laminated on the substrate, a hole for inserting the alignment pin is formed in the laminated body at a position corresponding to the guide hole of the substrate before the alignment pin is attached. The perforation of the laminated body is performed by thermocompression-laminating the laminated body on a substrate and then by manual work using a drill or punch, or by mechanical work using a dedicated perforating device.

However, in the above-described work of forming a hole in the laminated body, the chips of the laminated body are scattered on the laminated body forming the wiring pattern, and it is very difficult to eliminate the chips. For this reason, since it is not possible to draw an accurate wiring pattern on the photosensitive resin layer, there is a problem that the manufacturing yield of the printed wiring board is reduced.

Also, in the work of forming perforations in the laminate, since another mechanical work is performed after manual work or lamination,
There was a problem that work efficiency was extremely poor.

The above and other problems and novel features to be solved by the present invention will be apparent from the description of the present specification and the accompanying drawings.

(2) Structure of the Invention [Means for Solving the Problems] The typical ones of the inventions disclosed in the present application will be briefly described as follows.

That is, in order to laminate the thin film on the substrate provided with the positioning holes that are conveyed discontinuously to the thin film laminating laminator, perforations are formed in the thin film before lamination at positions corresponding to the positioning holes. A method of transporting a substrate at a constant speed along a transport path, wherein a front end and a rear end of the substrate passing through the transport path are determined by the predetermined time. The position of the positioning hole in the substrate is calculated by detecting the coincidence with the determined position, and the position of the positioning hole in the substrate is calculated by the calculated speed and the passing time. Chips that are set corresponding to the positions of the positioning holes and that are formed with perforations at the set positions of the thin film and that are generated when the perforations are formed. Removed, the length of the thin film to a predetermined with perforations, in order to laminate the conveyed discontinuously substrate, characterized by cutting.

In addition, in order to laminate a thin film on a substrate having a positioning hole, a punching device for forming a hole in the thin film before laminating at a position corresponding to the positioning hole, wherein the device is a thin film supply path arranged. In a punching device provided with a thin film supply means for forming a substrate and a substrate supply means for forming a substrate transport path for a laminator for laminating a thin film on a substrate, the substrate is moved when the substrate moves along the substrate transport path. Means for determining the position of the hole in the substrate by sensing the length of the substrate, a control means for outputting a control signal in response to the sensing means, and a thin film supply path in response to the output signal from the control means. Along the thin film feed path to move the perforating device along the thin film to form perforations in the thin film that correspond to the positioning holes in the substrate when laminated. Means for removing and moving means for setting the proper position to form a perforation set position by said moving means of the thin film, the chips generated during borehole,
Cutting means for cutting a thin film having a certain length corresponding to the length of the substrate in response to the output of the control means.

[Operation] The present invention detects the position of the positioning hole of the substrate conveyed to the laminator, and sets the perforation position of the thin film attached to the substrate by the laminator corresponding to the position of the positioning hole of the substrate. However, by forming holes at the hole positions of the thin film, holes can be formed before the thin film is attached to the substrate, and the chips of this thin film can be automatically removed at this point, improving the manufacturing yield. can do. Moreover, before the thin film is attached, the holes can be automatically formed at the hole positions corresponding to the positions of the positioning holes on the substrate.
Work efficiency can be improved.

[Examples] Hereinafter, the present invention will be described with reference to a thin film sticking device (laminator) for thermocompression-bonding a laminate having a photosensitive resin layer on a substrate for a printed wiring board (a plate having a conductive layer provided on an insulating substrate). An embodiment applied to a punching device used in the above will be described with reference to the drawings.

In all the drawings of the embodiments, those having the same functions are designated by the same reference numerals, and the repeated description thereof will be omitted.

FIG. 1 shows the configuration of a thin film sticking system which is an embodiment of the present invention.

The thin film sticking system according to the present embodiment, as shown in FIG.
Mainly, thin film sticking device I, transfer device IIA, transfer device II
B and preheater III.

The preheating device III is installed on the front side of the substrate transfer path for transferring the substrate to the thin film sticking device I. This preheater
III is configured to preheat an insulating substrate (printed wiring board substrate, hereinafter simply referred to as a substrate) having conductive layers formed on both sides (or one side) thereof before thermocompression lamination. This preheating is for facilitating thermocompression lamination of the laminate having the photosensitive resin layer on the substrate.

The transfer device IIA is configured to transfer the substrate preheated by the preheating device III to the thin film sticking device I. Carrier
In the IIA, a substrate width aligning device IIa for aligning the center line of the substrate in the substrate transport direction with the center line of the thin film sticking device I (laminate) so that accurate thermocompression lamination can be performed.
Is provided. The substrate width aligning device IIa is provided with a control mechanism so that even a thin substrate does not warp in the width direction (the direction perpendicular to the substrate transport direction).

Further, the transfer device IIA (or the thin film sticking device I) is provided with a holding device IIb that fixes the substrate so that it does not move during thermocompression lamination.

The transfer device IIB is configured to transfer the substrate, on which the laminate is thermocompression-bonded and laminated by the thin film sticking device I, to the exposure device.

In this thin film sticking system, a substrate size detecting sensor IV is provided on a substrate carrying path for carrying a substrate to the thin film sticking apparatus I, specifically, a substrate carrying path on the discharge side of the preheating device III. The substrate size detection sensor IV, which will be described in detail later, detects the positions of the front and rear ends in the transport direction of the substrate transported by the transport roller at a constant speed, and outputs this detection signal to the control device.
It is configured to output to VII. Controller VII is
It is provided below the carrier IIB. The substrate size detection sensor IV may be provided in the substrate transfer path on the upstream side of the transfer device IIA.

Further, in the thin film sticking system, a substrate position detection sensor (perforation start sensor) V is provided on a substrate carrying path for carrying the substrate to the thin film sticking apparatus I, specifically, a substrate carrying path on the rear side of the carrying apparatus IIA. It is provided. The substrate position detection sensor V is
It is configured to detect the positions of the front and rear ends in the transport direction of the substrate transported by the transport roller at a constant speed, and output this detection signal to the control device VII.

Further, the thin film sticking system is provided with a perforation defect detection sensor VI in the substrate carrying path for carrying the substrate from the thin film sticking apparatus I to the exposure apparatus, specifically, in the substrate carrying path on the upstream side of the carrying apparatus IIB. ing. The perforation failure detection sensor VI is configured to detect whether or not perforation is formed at the perforation position of the laminated body corresponding to the dimensions of the substrate after thermocompression lamination, and output this detection signal to the control device VII. There is.

The substrate size detection sensor IV, the substrate position detection sensor V, or the perforation defect detection sensor VI is composed of, for example, a transmissive photo sensor, a reflective photo sensor, or an ultrasonic sensor.

The thin film sticking device I is configured as shown in FIG. 2 (schematic configuration diagram). Laminate 1 having a three-layer structure including a transparent resin film, a photosensitive resin layer, and a transparent resin film 1
Are continuously wound around the supply roller 2. The laminate 1 of the supply roller 2 is a peeling roller 3, and is a laminate 1B including a transparent resin film (protective film) 1A, a photosensitive resin layer having one surface (adhesive surface) exposed, and a transparent resin film. And separated.

The translucent resin film 1A thus separated is the winding roller 4
It is configured to be wound up by.

The leading end portion of the laminated body 1B in the supply direction is configured to be attracted to the main vacuum plate 6 via a tension roller 5 that gives an appropriate tension. The main vacuum plate 6 is supported by the frame 8 via an air cylinder 7 whose position can be changed in the arrow A direction. The main vacuum plate 6 works together with the tension roller 5 so as not to cause wrinkles or the like.
Is supplied to the substrate 17 side.

The arcuate portion 6A at the tip of the main vacuum plate 6 is
A heater 6B is provided inside the laminated body 1
The front end of B is laminated on the conductive layer of the substrate 17 by provisional thermocompression bonding.

A rotary cutter 9 for cutting the continuous laminated body 1B according to the size of the substrate 17 is provided at a position close to the arcuate portion 6A.

At a position facing the rotary cutter 9, a sub-vacuum plate 10 for adsorbing the tip of the cut laminated body 1B to the arcuate portion 6A is provided. The sub-vacuum plate 10 is supported by the frame 8 via an air cylinder 11 whose position can be changed in the arrow B direction.

The frame 8 supporting the main vacuum plate 6 and the sub-vacuum plate 10 has a thin film sticking device I via an air cylinder 12 whose position can be changed in the direction of arrow C.
It is supported by the frame 13 of the main body.

The laminated body 1B in which the tip portion of the arc-shaped portion 6A is temporarily thermocompression-laminated on the conductive layer of the substrate 17 is configured to be thermocompression-laminated entirely by the thermocompression-bonding roller 14. The thermocompression-bonding roller 14 is configured to move from the position shown by the dotted line and the position shown by the solid line 14 'in FIG. There is.

The rear end portion of the laminated body 1B cut by the rotary cutter 9 is guided by a rotary vacuum plate 15 having a triangular cross section so as not to cause wrinkles, and is laminated by thermocompression bonding by a thermocompression bonding roller 14. Has been done.

The thin film sticking apparatus I configured as described above has the above-described configurations, on the conductive layers on both sides (or one side) of the substrate 17 transported by the transportation apparatus IIA including the transportation roller 16A and the pressing roller 16B. The laminated body 1B is laminated by thermocompression bonding. This thermocompression bonded laminate is used for the substrate 17
The positions of the perforation holes for the guides provided in the same and the positions of the perforations formed in the laminated body 1B by the perforation device 18 are made to coincide with each other. The laminated body 1B is configured to be thermocompression-bonded and laminated on the substrate 17 so that the adhesive surface of the photosensitive resin layer from which the translucent resin film 1A is peeled off and the conductive layer surface are adhered.

The punching device 18 is shown in FIG. 2, FIG. 3 (a sectional view seen from the direction of arrow D shown in FIG. 2) and FIG. 4 (arrow E in FIG. 2).
(Side view as seen from the direction). The punching device 18 includes the cutter support member 1 via the holder 18C.
Convex cutter (punch) 18A and 1 supported by 8D
8B and concave cutters (dies) 18E and 18F supported by the cutter support member 18G are fitted to each other to form perforations in the laminated body 1B. The cutter support member 18G is configured to move with respect to the cutter support member 18D by a support shaft 18H and a drive device (air or hydraulic cylinder) 18I, and the cutters 18A and 18E and 18B and 18F are fitted to each other. .

The cutters 18A and 18E form perforations on the front end side of the laminated body 1B which is thermocompression-bonded and laminated on the substrate 17,
B and 18F are configured to form perforations on the rear end side of the laminated body 1B. Laminated body 1B in which perforations are formed
Is configured to be cut by the rotary cutter 9 between the perforation on the front end side and the perforation on the rear end side. By providing the cutters 18A and 18B and 18E and 18F in such an arrangement, it is possible to configure the punching device 18 with a size extremely smaller than the size of the substrate 17 (size in the carrying direction). can do.

The cutters 18A and 18B are configured to slide in the holder 18C by compressed air pressure. Also, the cutter 18A
And 18B are provided with pores penetrating in the axial direction from which the compressed air is ejected. The compressed air ejected from the pores is configured so that the chips generated when the perforations are formed in the laminated body 1B can be stored in the cleaner box 18J through the through holes of the cutters 18E and 18F. The dimensional diameters of the cutters 18A and 18B and 18E and 18F are configured to be larger than the guide perforation diameter of the substrate 17 in order to ensure the alignment margin between them.

As described above, the chips produced when the perforations are formed in the laminate 1B are stored in the cleaner box 18J at this point, so that the chips are scattered between the photosensitive resin layer and the wiring pattern film in the exposure step. Since this can be prevented, the wiring pattern can be accurately drawn on the photosensitive resin layer, and the manufacturing yield of the printed wiring board due to the chips can be improved.

The punching device 18 is a supply path (conveyance path) for the laminated body 1B.
The frame 13 is movably supported in the direction of arrow F (up and down direction) via the arm 13A. That is,
The punching device 18 includes a roller 18K at one end and an arm 13A.
The guide groove 13B, the guide groove 18L at the other end, and the guide rail 13C of the arm 13A are slidably moved. The movement of the punching device 18 is controlled by a screw ball nut 18 provided at the other end.
M (or gear 18M ') is engaged with a spiral shaft (screw shaft) 19 rotatably attached to the frame 13. The spiral shaft 19 is connected to the control motor 19B via a transmission mechanism (gear mechanism) 19A. The control motor 19B inputs the detection signal of the substrate size detection sensor to the control device VII, and based on the output signal of the control device VII, the laminated body 1 corresponding to the position of the guide hole of the substrate 17 is formed.
It is configured to move the punching device 18 to the punching position B.

As described above, the laminated body 1B in which the perforations are formed by the perforation device 18 is thermocompression bonded to the substrate 17 so that the perforations of the laminated body 1B and the guide perforations of the substrate 17 match.
The substrate 17 is transferred to the transfer device IIB. The conveyed board 17 is configured to detect whether or not the positions of the perforations of the laminated body 1B and the guide perforations of the board 17 coincide with each other by the perforation defect detection sensor VI (FIG. 1). And FIG. 2). In addition, the perforation failure detection sensor VI,
A defective product in which the laminated body 1B not perforated is laminated on the substrate 17 is also detected.

When the substrate 17 detected by the perforation defect detection sensor VI is not defective, it is transported to the exposure device by the transport device IIB. Further, when the board 17 detected by the perforation failure detection sensor VI is defective, an alarm is given to the operator. Further, in the case of a defect, a substrate defect eliminating device for eliminating the defective substrate 17 from the substrate conveying path by an eliminating member may be provided in the conveying device IIB. This defective board 17
Although it may be erased, the position of the perforations in the laminated body 1B may be corrected manually by an operator or another perforation device, and the perforations may be again transported to the exposure device by the transport device IIB.

In this way, by providing the perforation defect detection sensor in the substrate conveyance path between the thin film sticking device I and the exposure device, it is possible to prevent the defective substrate 17 from being conveyed to the next-stage device, and thus the printed wiring board. It is possible to improve the manufacturing yield. Further, since the defective board 17 can be automatically detected, the work efficiency can be improved.

Next, the control method of the above-mentioned thin film sticking device I and perforation device 18 will be explained using the control flow shown in FIGS. 1 to 4 and 5.

First, the substrate 17 preheated by the preheating device III shown in FIG.
The substrate dimension detection sensor IV measures the dimension (length in the transport direction in this embodiment) during transportation. The board size detection sensor IV detects the front and rear ends of the board 17 in the carrying direction, and the detection signal is output to the control device VII.

In the control device VII, a constant transport speed S of the substrate 17 and a time T during which the substrate 17 passes the substrate size detection sensor IV.
Multiply by (board size = S × T) to output the size of each type of board 17 as a pulse signal, classify the size according to the number of pulses of the size, and convert it to data (hereinafter referred to as board size data) storage device Memorize in <120>.

That is, the transport speed S of the substrate 17 is equal to the transport roller 1
It is obtained by setting the rotation speed of 6 A constant.

The time T during which the board 17 passes the board size detection sensor IV can be obtained from the detection signals of the front and rear ends of the board 17 detected by the board size detection sensor IV. For example, when the front end of the board 17 is detected by the board size detection sensor IV, the counter starts counting pulses (clocks) of a constant frequency, and when the back end is detected,
This can be easily realized by stopping the count and generating a signal corresponding to the count number of the counter.

Further, the various substrates 17 are classified according to the number of pulses corresponding to the detected size of the substrate 17 in each predetermined size range, for example, D ₁ , D ₂ , D ₃ , D ₄ , D _5. It is used as board size data.

Here, when storing the substrate dimension data of the D ₁ to D ₅ in the storage device, when there is no substrate size data to the address input is adapted to sequentially shifted to the point where there is a substrate dimension data. The board size data of the leading address is always read. The board size data of the leading address is always the punching position data corresponding to the board size.

Then, based on the board size data, the controller VII
Drives the control motor 19B to move the punching device 18 via the transmission mechanism 19A and the spiral shaft <121>.
The movement of the punching device 18 is performed by moving the position of the guide hole or the positioning hole of the substrate 17 and the position of the guide hole or the positioning hole of the laminated body 1B to be laminated on the substrate 17 by thermocompression bonding, which are set by the board size data. Are supposed to match.

In this state, when the tip of the substrate 17 is detected by the substrate position detection sensor V <100>, the punching device 18 is driven <1>.
22>, perforations are formed at the perforation positions of the laminated body 1B <12
3>. When the perforation is formed, the end signal is sent to the control device VII.
The control device VII moves the punching device 18 based on the input <124>, and the punching device 18 is returned to the reference position <125>. When the punching device 18 is returned to the reference position, the completion signal is input to the control device VII, and the board size data for operating the punching device 18 is deleted from the leading address of the storage circuit. Substrate size data of the substrate 17 conveyed next from the next address is shifted to the address of the erased recording circuit.

On the other hand, the detection signal of the substrate position detection sensor V is the transfer device II.
The A transport roller 16A is stopped <101>, and the substrate 17 is stopped.

At this time, the main vacuum plate 6 of the thin film sticking apparatus I
The tip of the laminated body 1B is adsorbed to the arcuate portion 6A of <114>. The suction of the tip portion of the laminated body 1B is performed by the sub-vacuum plate 10. The front end portion of the laminated body 1B has perforations formed in the same process as the perforation formed at the rear end portion of the laminated body 1B that is thermocompression bonded to the substrate 17 in the preceding process. The perforations at the tip of the laminated body 1B are formed by the cutters 18A and 18E.

Then, the main vacuum plate 6 is moved to the substrate 17 side in a state where the laminated body 1B is adsorbed to the arcuate portion 6A <102>, and the leading end portion of the laminated body 1B is temporarily thermocompression laminated to the leading end portion of the substrate 17. <103>.

When the provisional thermocompression lamination is performed, the vacuum of the main vacuum plate 6 is stopped <104>, and the main vacuum plate 6 is moved to the original reference position <105>.

Then, the thermocompression bonding roller 14 is moved from the position indicated by the reference numeral 14 'in FIG. 2 to the position indicated by the solid line <106>.
When the substrate 17 is clamped by the movement of the thermocompression-bonding roller 14, the thermocompression-bonding roller 14 and the transport roller 16A are driven <107>, and the laminated body 1B is thermocompression-bonded to the substrate 17 from the temporarily thermocompression-bonded tip. Begin to.

When the rear end of the substrate 17 in the thermocompression laminate is detected by the substrate position detection sensor V <108>, the control device VII counts the time or distance to the cutting position of the laminated body 1B by the detection signal <109>. >. When this count reaches a predetermined set value, the main vacuum plate 6 is moved at a speed higher than the thermocompression laminating speed <110>, and the rear end of the laminated body 1B is set at the cutting position of the rotary cutter 9.

The rear end of the laminated body 1B set at the cutting position is cut by the rotary cutter 9 <111>, <112>. The cut rear end portion of the laminated body 1B is adsorbed by the rotary vacuum plate 15 and conveyed to the substrate 17 so as not to cause wrinkles and the like <113>, and the thermocompression lamination is completed.

When the rear end of the substrate 17 is detected by the substrate position detection sensor V <108>, the thermocompression laminated substrate 1 is detected.
A counter that counts seven numbers operates <115>, and when thermocompression lamination is completed, the number of substrates 17 is counted <116>.

Then, when the new substrate 17 is not transported to the thin film sticking device I after this, each device of the thin film sticking device I moves to the reference position <117>. When new substrates 17 are continuously transferred, the thin film sticking device I and the punching device 18 are controlled again from the first stage of the sequence control described above.

In this way, the substrate 17 conveyed to the thin film sticking apparatus I
Of the laminated body 1B to be attached to the substrate 17 by the thin film laminating apparatus I in correspondence with the position of the guide perforation of the substrate 17 by detecting the size of By setting the perforation position and forming the perforations at the perforation position of the laminated body 1B, the laminating position is automatically set to the guide perforation position of the substrate 17 and the corresponding perforation position of the laminated body 1B before attaching the laminated body 1B. Since it is possible to form the perforations, it is possible to shorten the time required to form the perforations and improve the work efficiency.

Further, the board size data set by the detection signal of the board size detection sensor IV is temporarily stored in the storage circuit one by one, and the board size data of the storage circuit is sequentially read by the detection signal of the board position detection sensor V. Since the perforations are formed in the laminated body 1B corresponding to the above, the respective substrates 1 that are continuously conveyed at random intervals
The laminated body 1B in which the perforations are formed in 7 can be accurately thermocompression-laminated.

It should be noted that the present invention is not limited to the above-mentioned embodiment, and it goes without saying that various modifications can be made without departing from the scope of the invention.

For example, the present invention provides a board size detection sensor that detects the size of the board 17 in the width direction, and a punching device that is configured to move the punching position in the width direction of the laminated body 1B. The punching position of the punching device may be controlled on the basis of the detection signal.

(3) Effects As described above, according to the present invention, the position of the guide perforation of the substrate conveyed to the thin film sticking apparatus is detected, and the position corresponding to the guide perforation of the substrate is detected as described above. Set the perforation position of the thin film attached to the substrate with the thin film sticking device,
By forming perforations at the perforation position of the thin film, the perforations are formed before attaching the thin film of the substrate, and the chips of this thin film can be eliminated at this point, so that the yield in manufacturing can be improved, Moreover, since the perforations can be automatically formed at the perforation positions of the thin film corresponding to the positions of the perforation holes for guiding the substrate before the thin film is attached, the working efficiency can be improved.

[Brief description of drawings]

FIG. 1 is a block diagram of a thin film sticking system which is an embodiment of the present invention, FIG. 2 is a schematic block diagram of a thin film sticking device of the thin film sticking system, and FIG. Sectional drawing of the perforation apparatus seen from the arrow D direction, FIG. 4 is a side view of the perforation apparatus seen from the arrow F direction of FIG. 2, and FIG. 5 shows the said thin film sticking apparatus and the control method of the perforation apparatus. It is a control flow for explaining. In the figure, I ... Thin film sticking device, IIA, IIB ... Conveying device,
IV: substrate size detection sensor, V: substrate position detection sensor, VI: defective hole detection sensor, VII: control device, 1
B: laminated body, 16A: transport roller, 17: substrate,
18 ... Punching device, 18A, 18B, 18E, 18F ...
... cutter, 18M ... screw ball nut, 18J ... cleaner box, 19 ... spiral shaft, 19A ... transmission mechanism, 19B ... control motor.

Claims (2)

[Claims] 1. To laminate a thin film on a substrate having positioning holes that are discontinuously conveyed to a thin film laminating laminator, perforating the thin film before lamination at a position corresponding to the positioning hole. A method of forming a substrate, the substrate is transported at a constant speed along a transport path, and the passage time for the substrate to pass a predetermined position in the transport path is determined by the front end and the rear end of the substrate passing through the route. It is calculated by detecting that it coincides with the predetermined position, and the position of the positioning hole in the substrate is calculated by the calculated speed and passing time, and the position where the perforation is formed in the thin film is calculated before laminating. It is set corresponding to the position of the positioning hole in the substrate, and perforations are formed at the set positions of the thin film, and the cutting that occurs when the perforations are formed. Was removed, the length of the thin film to a predetermined with perforations, in order to laminate the conveyed discontinuously substrate, a thin film perforations wherein the cutting. 2. A punching device for forming a thin film on a substrate having a positioning hole at a position corresponding to the positioning hole in the thin film before lamination, the device being arranged. In a punching device provided with a thin film supply means for forming a thin film supply path and a substrate supply means for forming a substrate transfer path for a laminator for laminating a thin film on a substrate, when the substrate moves along the substrate transfer path Sensing means for determining the position of the hole in the substrate by sensing the length of the substrate, control means for outputting a control signal in response to the sensing means, and responsive to an output signal from the control means. The perforation device is moved along the thin film supply path to form a perforation corresponding to the positioning hole of the substrate in the thin film when laminating the thin film supply path. In response to the output of the control means, a moving means to be set at an appropriate position along the moving means, a means for forming a perforation at a position set by the moving means of the thin film, a means for removing chips generated at the time of the perforation, and a control means. A perforating apparatus comprising: a cutting means for cutting a thin film having a certain length corresponding to the length of the substrate.