JPH06308739A - Thin film peeling device - Google Patents

Abstract

PURPOSE:To peel a protective film without damaging a substrate, to make the peeled protective film easily superposed and placed on a fixed position, to miniaturize a protective film recovering part and to miniaturize an entire device. CONSTITUTION:As to the thin film peeling device peeling the protective film 3 from the substrate 1; a protective film peeling part 6 peeling the protective film 3 by an adhesive tape 13, a substrate carrying part 5 carrying the substrate 1 to the protective film peeling part 6, the protective film recovering part 8 superposing and recovering the protective film 3 peeled by the protective film peeling part 6 one by one, and a protective film carrying part 7 carrying the protective film 3 to the protective film recovering part 8 are provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film peeling device for peeling a thin film such as a protective film for protecting a photosensitive resin film attached to a substrate when forming a printed circuit board or the like.

[0002]

2. Description of the Related Art Conventionally, for example, a printed circuit board has been used as a wiring board for electronic equipment. This printed circuit board is generally a thin film made of a photosensitive resin film or the like on one side (or both sides) of an insulating board. Is laminated, a wiring pattern film is overlaid on the laminated body, and then the laminate is manufactured through processes such as exposure and development.

Further, the above laminated body has a laminated structure in which a transparent resin film (hereinafter referred to as a protective film) is attached to the surface of a photosensitive resin film (hereinafter referred to as a resist film) and a cover film is attached to the back surface. Has become. This laminate is usually attached on an insulating substrate while peeling off the back cover film, and after the wiring pattern is exposed, it is necessary to peel off the protective film attached on the resist film surface before development. There is.

Then, as a method of peeling the protective film from the laminate, for example, there is a method of peeling manually.
Since the protective film itself is a very thin film, it is difficult to peel it off, and if you try to peel it off forcibly, it may damage the resist film, and if you try to peel it off without damaging the resist film, peeling work There is a problem such as a decrease in efficiency.

From this, for example, JP-A-63-373.
In JP-A-52-52, a protruding member for detecting the end of the protective film is provided, and the protruding member is inserted between the resist film and the protective film to vibrate so that the end of the protective film is lifted from the resist film. And a device for automatically peeling off the protective film by blowing compressed air to the portion. According to this device, the protective film on the laminate can be easily peeled off as compared with the case of peeling by hand, so that workability in the peeling work can be improved.

[0006]

By the way, in recent years, with the miniaturization of electronic devices and the like, the printed circuit board has been miniaturized, and the pattern on the printed circuit board has been miniaturized. In a printed circuit board having such a miniaturized pattern, fine scratches on the surface of the resist film and dust adhering to the surface of the resist film have a great influence on the pattern formation.

However, as described above, the protruding member is
When inserted between the protective film and the resist film, the protruding member may damage the surface of the protective film, which may damage the resist film. When blowing compressed air between the protective film and the resist film,
Dust adhering to the protective film may fly into the air and adhere to the resist film. For these reasons, there is a problem that the pattern formation is adversely affected and the desired pattern cannot be accurately formed.

Further, in order to insert the projection-like member between the resist film and the protective film, it is necessary to accurately detect the end portion of the protective film, and the precision of the apparatus is required. This necessitates a device equipped with a precise detection device, which causes a problem such as an increase in the manufacturing cost of the device.

Further, in the method of peeling the protective film by blowing compressed air between the resist film and the protective film, since the peeled protective film is collected in a collecting box or the like by the force of air, a predetermined collection is performed. It is difficult to control so that it can be stored in the box, and it is necessary to prepare a collection box that is sufficiently larger than the protective film. Therefore, there is a problem that the size of the entire device is increased.

Therefore, the present invention has been made in view of the above problems, and an object thereof is to efficiently peel off the protective film from the resist film and to prevent the surface of the resist film from being damaged. It is an object of the present invention to provide a protective film peeling device that does not cause dust to adhere to the surface of the resist film and that enables the device to be downsized by appropriately collecting the peeled protective film.

[0011]

A thin film stripping apparatus according to claim 1, which is a thin film stripping apparatus for stripping a thin film from a substrate, wherein the thin film stripping means strips the thin film with an adhesive member, and the thin film stripping means. Further, there are provided a substrate carrying means for carrying the substrate and a thin film collecting means for collecting the thin films peeled by the thin film peeling means one by one.

A thin film stripping apparatus according to a second aspect is the first aspect.
The thin film peeling apparatus described above is characterized in that a dust removing means for removing dust is provided in the vicinity of the substrate carrying means.

[0013]

According to the structure of claim 1, since the thin film peeling means for peeling the thin film by the adhesive member is provided, if the adhesive member is attached to the surface of the thin film, It can be peeled off with a uniform force. As a result, it is not necessary to insert a protruding member such as a needle between the thin film and the substrate, and therefore damage to the substrate due to the needle or the like can be eliminated. Further, since the thin film collecting means for collecting the peeled thin films one by one is provided, it becomes easy to place the peeled thin films on a certain place. As a result, the space efficiency of the thin film recovery unit can be improved and the recovery efficiency can be improved, and the thin film recovery unit can be downsized, so that the apparatus can be downsized.

According to the second aspect of the present invention, since the dust removing means for removing dust is provided near the substrate carrying means, the substrate carrying means affixes the substrate to the thin film peeling means. Since the dust on the thin film can be removed, the adhesion of dust to the substrate after the thin film is peeled off can be reduced. As a result, for example, when forming a printed circuit board or the like as a substrate, the formation of a fine pattern is not affected, and an accurate pattern can be formed.

[0015]

【Example】

[Embodiment 1] FIG. 1 to FIG.
The explanation is based on the following.

The thin film peeling apparatus according to the present embodiment is, for example, a photosensitive resin film (hereinafter, referred to as a thin film) laminated as an insulating substrate (hereinafter, simply referred to as a substrate) 1 shown in FIG.
Of the resist film 2) and the translucent resin film (hereinafter referred to as the protective film) 3, only the protective film 3 attached to the outermost surface side is peeled off. As shown in FIG. 4, the resist film 2 is usually handled with a protective film 3 on the front surface and a cover film 4 on the back surface. The substrate 1 is formed by thermocompression molding while peeling off the film 4.
Affixed to.

Further, as shown in FIG. 1, the thin film stripping apparatus includes a substrate transport section 5 as a substrate transport means for transporting the substrate 1 and a thin film stripping means for stripping the protective film 3 attached to the surface of the substrate 1. Of the protective film 3, a protective film transporting unit 7 as a thin film transporting unit that transports the peeled protective films 3 one by one, and a protective film collecting unit 8 that collects the protective films 3 one by one. And consists of.

Of these, the substrate transfer section 5 is provided with a plurality of transfer rollers 9 at predetermined intervals, and is protected from the left side (hereinafter referred to as the supply side) of the protective film peeling section 6 in the figure. The substrate 1 is sequentially transported toward the right side of the film peeling unit 6 (hereinafter, referred to as a transport side).

In order to start the transfer of the substrate 1 from the supply side to the transfer side, an end position detection sensor (not shown) provided in the substrate transfer section 5 protects the resist film 2 attached to the substrate 1 and the protection film 2. This is done when the edge with the membrane 3 is detected.

A dust removing unit 10 for removing dust adhering to the surface of the protective film 3 is provided near the supply side of the substrate transfer unit 5. The dust removing unit 10 serves as a dust removing unit that removes static electricity charged on the dust adhering to the surface of the protective film 3 and a dust whose static electricity is removed by the static electricity removing bar 11. And a suction nozzle 12 for removing dust adhering to the substrate 1 being conveyed.

The protective film peeling section 6 is provided with an adhesive tape 13 as an adhesive member. The supply reel 14 for supplying the adhesive tape 13 and the take-up reel 1 for winding.
5, guide reels 16a, 16b, 16c for guiding the adhesive tape 13 so that it can be properly conveyed, a pressure roll 17 for pressure-bonding the adhesive tape 13 onto the surface of the protective film 3, a stopper 19 for stopping the supply of the adhesive tape 13, And a pressure-bonding roll driving device 18 including, for example, an air cylinder for driving and controlling the pressure-bonding roll 17, the stopper 1
A stopper drive control device 20 that drives and controls 9 is provided.

In the protective film peeling section 6, the adhesive tape 13 is supplied from the supply reel 14 and passes through the outer peripheral surface of the pressure bonding roll 17 to the take-up reel 15 via the guide reels 16a, 16b and 16c. To be

At this time, the pressure-bonding roll 17 presses the adhesive tape 13 supplied to the outer peripheral surface thereof toward the conveying roller 9 by the pressure-bonding roll driving device 18. As a result, when the substrate 1 is transported by the transport roller 9, the adhesive tape 13 is pressed against the surface of the substrate 1 to be attached thereto, and only the protective film 3 is peeled off. Then, during the peeling operation of the protective film 3, the stopper 19 is driven by the stopper driving device 20 so as to stop the supply of the adhesive tape 13.

After the protective film 3 is completely peeled off, the pressure-sensitive adhesive tape 13 has its use surface taken up by the take-up reel 15 from the outer peripheral surface of the pressure roll 17 in the take-up direction.
The unused surface is supplied to the outer peripheral surface of the pressure roll 17 by the supply reel 14.

The protective film peeling portions 6 are arranged at positions corresponding to both end sides of the substrate 1, respectively, and peel the protective film 3 from both end sides. As a result, the protective film 3 can be peeled off from the substrate 1 by an even force, and in the state where the protective film 3 is peeled off from the substrate 1, the protective film conveying section 7 from between the conveying rollers 9 ... The transport of the protective film 3 can be facilitated.

Further, the protective film transfer section 7 has a chuck hand 21 for holding the protective film 3 separated from the substrate 1.
21 and a driving device (not shown) for driving and controlling the chuck hands 21. Here, the chuck hands 21, 21 hold the peeled protective film 3 and convey it to the protective film collecting section 8.
As a result, the protective film 3 is conveyed to the protective film recovery unit 8 one by one.

Further, in the protective film collecting section 8, the size of the opening is made substantially the same as the size of the peeled protective film 3, and the protective films 3 are placed one on top of the other. ing.

The protective film peeling operation in the thin film peeling apparatus having the above structure will be described below with reference to FIG.

First, if the end portions of the resist film 2 and the protective film 3 attached to the substrate 1 are detected by the end portion detection sensor, the conveyance rollers 9 of the substrate conveyance portion 5 ... It is conveyed to the protective film peeling section 6. At this time, after the static electricity of the dust adhering to the surface of the protective film 3 is removed by the static electricity removing bar 11 on the way of transporting the substrate 1, that is, on the supply side of the substrate transport unit 5,
Dust is removed by the suction nozzle 12. After that, as shown in FIG. 2A, the pressure-sensitive adhesive roll 13 is pressure-bonded to the surface of the protective film 3 of the substrate 1 by the pressure-rolling drive device 18. Next, while the adhesive tape 13 is being wound up by the take-up reel 15, the pressure-sensitive adhesive roll 17 is raised in a state of being in close contact with the pressure-sensitive adhesive roll 17, so that the protective film 3 becomes the adhesive tape 1.
In the state of being in close contact with No. 3, the end portion is peeled off by the amount of rise of the pressure bonding roll 17.

Next, as shown in FIG. 2B, the stopper drive device 20 operates the stopper 19 to stop the adhesive tape 13 from moving. At this time, the protective film peeling section 6 rises away from the substrate transport section 5, while the substrate 1 is transported to the transport side by the transport rollers 9 of the substrate transport section 5. As the protective film peeling section 6 rises and the substrate 1 is transferred to the transfer side, the protective film 3 is transferred from the substrate 1 to the protective film 3.
Is peeled off.

Then, as shown in FIG. 2C, when the protective film peeling section 6 is further raised and the substrate 1 is further transported to the transport side, the protective film 3 is completely stripped from the substrate 1. After that, the peeled protective film 3 is conveyed one by one to the protective film collecting unit 8 by the protective film conveying unit 7.

Further, the operation of conveying the protective film 3 will be described with reference to FIG.
The following is a description with reference to FIG.

First, as shown in FIG. 2C, the protective film 3
As shown in FIG. 3A, the protective film 3 is held by the chuck hands 21 21 from the state where the protective film 3 is completely peeled off from the substrate 1, and the protective film 3 is separated from the adhesive tape 13.
At this time, the protective film peeling section 6 is held at the raised position so that the protective film 3 can be easily separated from the adhesive tape 13.

Next, as shown in FIG. 3 (b), the protective film 3 completely separated from the adhesive tape 13 of the protective film peeling section 6 by the chuck hands 21, 21 as shown in FIG. 3 (c). Then, they are placed one by one on the protective film recovery unit 8 by the chuck hand driving device. During the transportation of the protective film 3 to the protective film collecting unit 8, the substrate 1 is further transported to the developing process by the transport rollers 9.

Next, the chuck hands 21 and 21 place the protective film 3 in the protective film collecting section 8 and then again.
Move to the holding position and wait.

As described above, according to the above structure, the static electricity removing bar 11 removes the static electricity of the dust adhering to the surface of the protective film 3 of the substrate 1, and then the suction nozzle 12 sucks the static electricity-removed dust. Since the dust is removed, the dust can be removed without the dust removing means coming into contact with the surface of the protective film 3. Thus, the dust can be easily removed without damaging the surface of the protective film 3 and the adhesion of the dust to the surface of the resist film 2 can be suppressed. Therefore, the influence of dust adhesion on the pattern formation on the resist film 2 is eliminated,
A fine pattern can be accurately formed.

Further, since the protective film 3 is attached by the adhesive tape 13 and peeled off from the substrate 1, the protective film 3 can be peeled off without damaging the surface of the resist film 2. Further, there is no need for a detecting means for detecting the space between the protective film 3 and the resist film 2 on the substrate 1, and it is sufficient to provide a detecting means for detecting only the end portions of the protective film 3 and the resist film 2. Can be simplified, and the manufacturing cost of the protective film peeling device can be reduced.

Further, the protective film 3 peeled from the substrate 1
Is a chuck hand 2 as a means for collecting the protective film 3.
Since the sheets are conveyed one by one by 1.21, and are placed one by one on the protective film collection unit 8, it is easy to place the peeled protective film 3 on a fixed place. Therefore, the size of the protective film recovery unit 8 can be made approximately the same as the size of the protective film 3 to be peeled off. Therefore, it is possible to reduce the size of the protective film recovery unit 8 and compare the size of the protective film recovery unit 8 with that of a conventional recovery box for peeling the protective film using compressed air. Even if it is small
Since the protective film 3 is housed in the protective film collection unit 8 in an orderly manner, the protective film 3 is filled until the protective film collection unit 8 is full.
Since the recovery amount of the protective film 3 does not decrease, the recovery efficiency of the protective film 3 can be improved, and the number of times the recovered protective film 3 is discharged can be reduced.

Therefore, the size of the entire apparatus can be reduced, and the manufacturing cost of the apparatus can be reduced. Also,
Since the protective films 3 are collected one by one on the protective film collecting section 8, unlike the case where the protective film 3 is blown away by compressed air and collected, the original shape is maintained, and therefore the regeneration is facilitated. It can be carried out.

The protective film peeling section 6 as a means for peeling the protective film 3 employs an adhesive tape 13 as an adhesive member, but the invention is not limited to this.
Other adhesive members such as an adhesive pad may be used.

[Embodiment 2] Another embodiment of the present invention will be described below with reference to FIGS. 6 and 7. For convenience of explanation, the same reference numerals will be given to the units having the same functions as those shown in the drawings of the first embodiment, and the description thereof will be omitted.

In the protective film peeling apparatus according to this embodiment, as shown in FIG. 6, a vacuum hand is used instead of the chuck hands 21 as the protective film transfer means provided in the protective film transfer section 5 in FIG. A vacuum suction plate 22 having a suction member 22a connected to suction means (not shown) such as a pump is provided.

As shown in FIG. 6, the vacuum suction plate 22 is driven by a vacuum suction plate driving device (not shown), and the suction member 22a is driven by suction means such as a vacuum pump to suck the vacuum suction plate 22. Two
The protective film 3 is adsorbed on the surface opposite to the side where the 2a is provided.

Now, referring to FIG. 7, the operation of transporting the protective film 3 in the protective film peeling apparatus of this embodiment will be described.
This will be described below.

First, from the state where the protective film 3 is completely peeled from the substrate 1, as shown in FIG. 7A, the vacuum suction plate 22 is moved to the peeling position of the protective film 3. Then
When the protective film 3 comes into contact with the vacuum suction plate 22, the protective film 3 is attached to the vacuum suction plate 22 by sucking it with a vacuum pump. At this time, so that the protective film 3 can be easily separated from the adhesive tape 13 as an adhesive member,
The protective film peeling section 6 is held in the raised position.

Next, as shown in FIG. 7B, the protective film 3
Is completely separated from the adhesive tape 13 of the protective film peeling section 6 by moving the vacuum suction plate 22 downward. Then, as shown in FIG. 7C, the protective film 3 attached to the vacuum suction plate 22 is placed on the protective film collection unit 8 with the protective film 3 on the lower side, and sucked by the vacuum pump. Is released. At this time, the substrate 1 is transported to the developing process by the transport rollers 9 ...
After placing the protective film 3 on the protective film collecting unit 8, the protective film collecting unit 8 moves to the contact position of the protective film 3 again and stands by.

[Embodiment 3] The following description will explain still another embodiment of the present invention with reference to FIGS. 8 and 9. For convenience of explanation, the same reference numerals will be given to the units having the same functions as those shown in the drawings of the first embodiment, and the description thereof will be omitted.

The protective film peeling apparatus according to the present embodiment is replaced with the electrostatic chuck as shown in FIG. 8 in place of the chuck hands 21 as the protective film transfer means provided in the protective film transfer section 5 in FIG. A plate 23 is provided.

The electrostatic charging plate 23 is driven by an electrostatic charging plate driving device (not shown) so that the surface thereof is electrostatically charged by the charging device.

Here, the conveying operation of the protective film 3 in the protective film peeling apparatus of this embodiment will be described below with reference to FIG.

First, from the state where the protective film 3 is completely peeled off from the substrate 1, the electrostatic charging plate 23 is moved to the peeling position of the protective film 3 as shown in FIG. 9A. Next, when the protective film 3 comes into contact with the electrostatic charging plate 23,
The protective film 3 is attached to the electrostatic charging plate 23 by charging the plate surface with a charging device. At this time, the protective film peeling portion 6 is held at the raised position so that the protective film 3 can be easily separated from the adhesive tape 13 as the adhesive member.

Next, as shown in FIG. 9B, the protective film 3
Is completely separated from the adhesive tape 13 by the downward movement of the electrostatic charging plate 23. Then, as shown in FIG. 9C, the protective film 3 attached to the electrostatic charging plate 23 is placed on the protective film collection unit 8 with the protective film 3 on the lower side, and is charged by the charging device. Is released.
At this time, the substrate 1 is transported to the developing step by the transport rollers 9, ... After the protective film 3 is placed on the electrostatic charging plate 23 and the protective film recovery unit 8, the substrate 1 is moved to the contact position of the protective film 3 again. And wait.

[Fourth Embodiment] The following description will explain still another embodiment of the present invention with reference to FIGS. 10 and 11. For convenience of explanation, the same reference numerals will be given to the units having the same functions as those shown in the drawings of the first embodiment, and the description thereof will be omitted.

The protective film peeling apparatus according to this embodiment is shown in FIG.
As shown in FIG. 1, a chuck hand 21.2 serving as a protective film conveying means provided in the protective film conveying section 5 in FIG.
Instead of 1, the protective film conveying belt 24 and the protective film pressing plate 2
And 5 are provided.

The protective film transport belt 24 includes a first drive belt 24a, a first driven belt 24b, and a second driven belt 2.
4c, a second drive belt 24d, and a third driven belt 24e.

Of these, the first drive belt 24a is
The transport roller 9 of the substrate transport unit 5 is used as a drive roller and is stretched between the transport roller 9 and the first driven roller 26a, and the first driven belt 24b is stretched between the first driven roller 26a and the second driven roller 26b. The second driven belt 24c is stretched around the second driven roller 26b and the third driven roller 26c.

The second drive belt 24d is stretched over the drive roller 26d and the fourth driven roller 26e, and the third driven belt 24e is stretched over the fourth driven roller 26e and the fifth driven roller 26f. There is.

The first drive belt 24a and the second drive belt 24d are arranged in parallel with each other, and the first driven belt 24b.
And the second drive belt 24d are arranged such that the second driven roller 26b, which stretches the first driven belt 24b, and the fourth driven roller 26e, which stretches the second driven belt 24d, are close to each other. It is set up. Then, the peeled protective film 3 is inserted into the space formed between the first drive belt 24a and the second drive belt 24d.

The second driven belt 24c and the third driven belt 24e are provided in parallel and close to each other, and the second driven belt 24c and the third driven belt 2 are provided.
The protective film 3 is sandwiched between it and 4e and conveyed.

The protective film transport belts 24 are provided below the protective film peeling section 6 and on both end sides in the direction orthogonal to the transport direction of the substrate 1, and between the protective film transport belts 24. Is provided with a protective film pressing plate 25 for collecting the protective film 3 conveyed by the protective film conveying belt 24 in the protective film collecting section 8.

As shown in FIG. 10, the protective film pressing plate 25 is adapted to be moved from above the protective film transport belt 24 toward the protective film collecting section 8 by a driving device (not shown). While holding the protective film 3 conveyed by the protective film conveying belt 24, they are placed one on top of the other in the protective film collecting section 8 one by one.

Here, the operation of transporting the protective film in the protective film peeling apparatus of this embodiment will be described below with reference to FIG.

First, from the state where the protective film 3 is completely separated from the substrate 1, as shown in FIG.
An end portion of the protective film peeling portion 6 opposite to the portion where the adhesive tape is abutted moves to a space formed between the first driving belt 24a and the second driving belt 24d, and the second driven belt 24c.
And the third driven belt 24e. At this time, so that the protective film 3 is easily separated from the adhesive tape 13,
The protective film peeling section 6 is held in the raised position.

Next, as shown in FIG. 11B, the protective film 3 is sandwiched between the second driven belt 24c and the third driven belt 24e, and is completely removed from the adhesive tape 13 of the protective film peeling section 6. Is separated into Next, as shown in FIG. 11C, the protective film pressing plate 2 is pressed from above the protective film conveying belt 24.
5 is lowered, the second driven belt 24c and the third driven belt 2
The protective film 3 sandwiched between 4e and 4e is placed on the protective film collecting section 8 while being pressed down. At this time, the substrate 1
Are transported to the developing process by the transport rollers 9.

As described above, according to the protective film transporting means in each of the above-mentioned embodiments, the peeled protective films 3 can be collected one by one by superposing them on the protective film recovery part 8, and therefore, the protective film recovery part. 8 can be downsized, and the entire device can be downsized. Further, by collecting and collecting the protective films 3 one by one, it is possible to improve the recovery efficiency of the protective film 3, that is, the space efficiency of the recovery portion, and therefore, the number of times the recovered protective films 3 are discharged. Can be reduced, and the operability of the device can be improved.

The protective film conveying means described in each of the above embodiments may be used, and other means may be used without any particular limitation.

[0067]

According to the thin film stripping apparatus of the invention described in claim 1,
As described above, a thin film stripping device for stripping a thin film from a substrate, a thin film stripping means for stripping the thin film by an adhesive member, a substrate transporting means for transporting the substrate to the thin film stripping means, and the thin film stripping means. And a thin film collecting means for collecting the thin films separated by the means one by one.

Therefore, the thin film can be peeled off without damaging the substrate, the peeled thin films can be easily placed on the predetermined position, and the thin film recovery section can be miniaturized. There is an effect that it is possible to downsize.

Further, the thin film stripping apparatus according to the second aspect of the present invention is configured such that the dust removing means for removing dust is provided near the substrate carrying means as described above.

Therefore, by reducing the adhesion of dust to the substrate from which the thin film has been peeled off, the influence of dust is reduced,
An effect that a fine pattern can be accurately formed is exhibited.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of a protective film peeling device according to an embodiment of the present invention.

2A and 2B show a protective film peeling operation of the protective film peeling device shown in FIG. 1, wherein FIG. 2A is an explanatory diagram showing a state where a substrate is being supplied, and FIG. FIG. 6C is an explanatory diagram showing a state in which the protective film on the substrate is peeled off, and FIG.
FIG. 4 is an explanatory diagram showing a state in which the substrate and the protective film are separated.

3 shows an operation of collecting the peeled protective film in the protective film peeling device of FIG. 1, and FIG.
The peeled protective film is held by the chuck hand,
It is explanatory drawing which shows the state isolate | separated from the board | substrate, The same figure (b) is explanatory drawing which shows the state which has conveyed the separated protective film to a collection container by a chuck hand, and the same figure (c) is. FIG. 6 is an explanatory diagram showing a state in which the separated protective film is recovered in a recovery container.

FIG. 4 is a schematic configuration diagram of a laminated body according to the present embodiment.

5 is an explanatory diagram showing a state in which the laminated body of FIG. 4 is attached on a substrate.

FIG. 6 is a schematic configuration diagram of a protective film peeling device according to another embodiment of the present invention.

FIG. 7 shows an operation of collecting the peeled protective film in the protective film peeling device of FIG. 6, and FIG.
The peeled protective film is attracted by the vacuum suction plate, is an explanatory view showing a state of being separated from the substrate,
FIG. 2B is an explanatory diagram showing a state in which the separated protective film is conveyed to the collection container by the vacuum suction plate,
FIG. 6C is an explanatory diagram showing a state in which the separated protective film is collected in the collection container.

FIG. 8 is a schematic configuration diagram of a protective film peeling device according to still another embodiment of the present invention.

9 shows an operation of collecting the peeled protective film in the protective film peeling apparatus of FIG. 8, and FIG.
It is an explanatory view showing a state where the peeled protective film is adsorbed by the electrostatic charging plate and separated from the substrate,
(B) of the figure is an explanatory view showing a state in which the separated protective film is conveyed to the collection container by the electrostatic charging plate, and (c) of the figure, the separated protective film is collected in the collection container. It is explanatory drawing which shows a state.

FIG. 10 is a schematic configuration diagram of a protective film peeling device according to still another embodiment of the present invention.

11 shows an operation of collecting the peeled protective film in the protective film peeling device of FIG. 10, and FIG.
FIG. 6B is an explanatory view showing a state where the peeled protective film is separated from the substrate by the protective film conveying belt, and FIG. 6B shows that the separated protective film is conveyed to the recovery container by the protective film conveying belt. FIG. 6C is an explanatory diagram showing a state in which the separated protective film is recovered in the recovery container.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 3 Protective film (thin film) 5 Substrate transport unit (Substrate transport means) 6 Protective film stripping unit (Thin film stripping unit) 7 Protective film transport unit 8 Protective film collecting unit (Thin film collecting unit) 13 Adhesive tape (Adhesive member)

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location H05K 3/06 J 6921-4E

Claims (2)

[Claims] 1. A thin film stripping device for stripping a thin film from a substrate, comprising: thin film stripping means for stripping the thin film with an adhesive member.
The thin film stripping apparatus is provided with a substrate transporting unit for transporting the substrate and a thin film collecting unit for collecting the thin films stripped by the thin film stripping unit one by one. . 2. The thin film stripping apparatus according to claim 1, further comprising a dust removing means for removing dust provided near the substrate carrying means.