JPH06300718A - X-ray analyzer - Google Patents

Abstract

PURPOSE:To easily perform the X-ray analysis of a microscopic region on a sample by giving a large position change to the sample. CONSTITUTION:An X-ray optical element which is provided with a condensing and image formation action and whose working distance is long is combined with an X-ray generating device 1'. The rotation center of a sample scanning stage 10 to which a goniostage 15, a rotary stage 12 and rectlinearly advancing stages 17, 18, 19 capable of being moved precisely in three axes have been mounted and attached is arranged on the focal plane of the X-ray optical element. In addition, an X-ray position detector or an X-ray energy detector which can be turned by using the sample scanning stage 10 as the center are arranged.

Description

Detailed Description of the Invention

[0001]

The present invention relates to the non-destructive identification of minute regions in a sample by diffracted X-rays, fluorescent X-rays and transmitted X-rays, and
The present invention relates to an X-ray apparatus that performs a chemical analysis and scans a sample surface to perform a surface or line analysis.

[0002]

2. Description of the Related Art As a conventional X-ray analysis apparatus, for example, there is one shown in JP-A-59-72052. This is for a sample fixed at the center of the sample stage that combines a triaxial micro-movement mechanism and a biaxial rotation mechanism.
From the X-ray source, extend an aerial thin tube whose inner cross section is circular, elliptical or polygonal and whose inner wall is parallel and has a mirror surface. Counter or fluorescent X
This is a mechanism for receiving light by an X-ray conduit for line measurement. According to this structure, with respect to a small and thin sample, the hollow thin tube extending from the X-ray source is brought close to the sample, and the thin bundle X-ray beam having the same size as the inner diameter of the hollow thin tube is irradiated to emit fluorescence X generated from the sample. The rays are received by the X-ray fluorescent X-ray measuring tube and measured by the semiconductor detector arranged at the end of the X-ray measuring tube. The diffracted X-rays are measured by a film or a position-sensitive proportional counter to identify a substance in a minute region and perform a chemical analysis, and a sample is subjected to surface or line analysis by a linear movement mechanism.

Another conventional example is disclosed in Japanese Patent Laid-Open No. 61-22240. this is,
A collimator for injecting a thin X-ray beam into a minute portion of a sample, a detachable dispersive crystal installed so that fluorescent X-rays generated from the sample surface are incident, and a minute portion symmetric with respect to the surface of the dispersive crystal. It is composed of an arc-shaped incident position-sensitive X-ray detector movably installed so that the point and its minute portion are respectively centered. According to this structure, the thin X shape is formed by bringing the tip of the collimator close to the sample.
The fluorescent X-rays generated from the minute area in the sample irradiated by the line beam are spectrally reflected by the dispersive crystal and moved in an arc shape centered on a point symmetrical to the dispersive crystal and the X-ray irradiated area. The fluorescent X-ray energy is measured from the difference in the incident position by the incident position sensitive X-ray detector.
The diffracted X-rays are measured by an arc-shaped incident position sensitive X-ray detector that is moved around the X-ray irradiation area, and the material in the micro area is identified and chemically analyzed, and the sample moves straight. A mechanism is used to perform surface or line analysis.

[0004]

However, the one disclosed in Japanese Patent Laid-Open No. 59-72052 guides X-rays from the X-ray source to the center of the sample stage by means of a hollow thin tube. However, since this hollow thin tube is a non-imaging optical element, the aberration is severe. Further, when a certain distance of several mm or more is provided between the sample and the hollow thin tube, it is impossible to make the X-ray into a thin X-ray beam of the order of μm. With the above configuration, in order to form a fine X-ray beam of the order of μm, the inner diameter of the thin tube corresponding to the X-ray exit pupil is set to a size equal to or smaller than the region to be measured, and the end of the thin tube is positioned near the sample stage pole. Will be required. However, when the end of the thin tube is brought close to the sample stage, the size of the sample is limited and the rotation angle of the sample stage is also limited. If the thickness of the hollow thin tube is reduced in order not to be restricted by the rotation angle, X-rays will pass through the hollow thin tube, and the effective diameter of the X-ray beam will increase, resulting in a small area. There was a problem that analysis became impossible.

Further, in the above-mentioned conventional example, since the three-axis minute linear movement mechanism is incorporated in the rotating mechanism, the sample stage becomes small and the movement distance of the three-axis minute linear movement mechanism is as short as several mm or less. Also, JP-A-61-222
The one disclosed in Japanese Patent No. 40 uses a collimator to apply a thin X-ray beam from an X-ray source to a sample surface. The minute region in the sample irradiated with X-rays is determined by the inner diameter of the collimator and the distance between the collimator and the sample surface. Therefore, as in the case of the above publication, in order to minimize the X-ray beam diameter, it is necessary to make the inner diameter of the collimator small and make the distance between the collimator and the sample surface extremely close. Therefore, also in this case, the rotation angle of the sample surface is limited to the collimator itself, and the rotation angle of the sample surface cannot be made large. Further, in the example of this publication, since the sample has only one rotation axis, when the number of crystal grains in the minute region irradiated with the X-ray is small, the diffraction X
It is difficult to measure the line.

[0006] For the above two publications, the target sample is limited to a small sample. This is because, as described above, the short sample scanning distance of the sample stage and the sample tilt rotation are limited by the collimator or the hollow thin tube. Therefore, it is difficult to measure a thin film on a silicon wafer having a size of 1 cm square or more, and it is necessary to form a minute piece.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and provides an X-ray optical element having a working distance of 1 cm or more, which has a focusing action for focusing on an X-ray generator. In combination, a spatial space was provided between the X-ray optical element and the sample scanning table. As a result, an X for monochromatic spectroscopy or for collimation is provided between the X-ray optical element and the sample scanning table.
It is also possible to insert a line spatial filter. In addition, the sample scanning table has a mechanism capable of large rotation and large tilt, and can be precisely moved and has a moving distance of 1 cm or more.
A dimensional rectilinear mechanism was attached, and a through hole was provided in a portion through which the X-ray optical axis passed. The center of the X-ray detector was the same as the axis of rotation of the sample scanning table. The X-ray detection unit combines a rectilinear mechanism having a long moving distance in the rotation center direction of the sample scanning table with a rectilinear mechanism capable of moving in a direction orthogonal to the rotation direction of the sample scanning table and the rotation center direction, Either the X-ray position detector or the X-ray energy detector, or both of them are used in combination.

[0008]

According to the above-mentioned structure, since the X-ray optical element having a working distance of 1 cm or more, which has a condensing and imaging action, is used, the space between the X-ray optical element and the sample scanning table can be arbitrarily set. The position of the sample can be changed. That is, the sample up to about 1 cm on one side can be freely tilted and rotated. Therefore, by using an X-ray optical element having a longer working distance, a larger sample can be arbitrarily rotated and rotated. At this time, the sample scan is 1 cm in 3 directions.
Because of the above, an area corresponding to almost the entire surface of the mounted sample can be scanned, and a sample having a thickness of up to about 1 cm can be a non-destructive measurement target.

Further, by using the spatial filter in the space, it is possible to easily monochromate the X-ray beam and change the aperture of the X-ray optical element. Since the X-ray beam diameter is determined by the reduction rate and the X-ray light source diameter determined by the X-ray optical element by using the X-ray optical element having the condensing and imaging action, use a large reduction rate and a small X-ray light source diameter. This makes it possible to irradiate the sample with a much smaller X-ray beam than in the conventional example. Since the sample scanning table has a through hole, the X-ray transmitted through the sample on the sample scanning table can be measured by rotating the X-ray detection unit along the X-ray optical axis. The detector moving mechanism attached to the X-ray detector allows the X-ray detector to be arranged at any position around the sample.

[0010]

EXAMPLES Example 1 Hereinafter, the present invention will be described in detail with reference to FIG. 1, FIG. 2 and FIG. 3 which schematically show examples. FIG. 1 shows a top view of the X-ray analysis apparatus. FIG. 2 shows a side view near the sample scanning table. FIG. 3 shows a sectional view of the vicinity of the X-ray optical element in the X-ray optical element alignment mechanism.

The X-ray generator 1'is a reflection type X-ray generator, and causes the X-ray target 1 to generate X-rays. The X-ray generator 1 ′ has a focal spot size of several hundred μm to 10 μm.
It can change to some extent. In addition, the X-ray target 1 is Cu,
It can be replaced with various targets such as Fe and W.

The generated X-rays 3 pass through a pipe 6 which is in a vacuum state by a vacuum pump unit 4. The vacuum gate valve 5 can partition the pipe 6 into a vacuum state from the X-ray generator side. The X-rays 3 that have passed through the pipe 6 enter the X-ray optical element alignment mechanism 7.

The X-ray optical element alignment mechanism 7 is composed of a bi-directional rectilinear mechanism and a biaxial tilt mechanism. Due to this mechanism, the X-ray optical element 30 does not include the X-ray optical axis 2.
Aligned axially. The alignment sensitivity is maintained at 1 μm for parallel movement of the X-ray optical element and 5 seconds or less for tilting, and the X-ray optical element can be precisely positioned. This X
The X-ray optical element alignment mechanism 7 incorporates an X-ray window 8 that separates vacuum from atmospheric air, and the X-ray optical element 30 mounted inside the tube 7 ′ can be replaced in the atmospheric air.

The X-ray 3 incident on the X-ray optical element 30 is the focal plane on the X-ray optical axis 2 in the atmosphere, that is, the sample scanning table 10.
The upper sample surface 9 is irradiated with a minute X-ray spot. The X-ray optical element used can be any small X-ray optical element such as a transmission type zone plate, a total reflection mirror, a multilayer film mirror, and a curved crystal that focuses and images X-ray energy of about 5 KeV or more. is there. As the X-ray optical element 30, for example, an X-ray made of Pyrex glass having a spheroidal shape.
A line focusing mirror is used. The X-ray focusing mirror 30 has a focal length of about 1 m and a working distance of about 70 mm, and reduces the X-ray generation region to 1/10 to form an image. X-ray incident angle is 5m
rad, and the inside of the X-ray focusing mirror 30 is coated with platinum on the X-ray reflecting surface. Therefore, the X-ray reflecting surface is capable of absorbing X-rays having an X-ray energy of up to about 10 KeV.
Reflects at a reflectance of 80% or more. X-ray focusing mirror 30
Has an inner diameter gently changing from 1.6 mm to 1.2 mm, an outer diameter of about 8 mmφ, a length of about 40 mm, and is in the shape of a half-divided glass tube. To fix the X-ray focusing mirror 30, the outer diameter 1 so that the outer shape of the X-ray focusing mirror 30 fits
A 0 mmφ stainless steel tube 7'is used.

As a method of fixing the X-ray focusing mirror 30 and the tube 7 ', the tip of the tube 7'and the tip of the exit pupil of the X-ray focusing mirror 30 are aligned and bonded with an adhesive or the like. Tube 7'integrated with the X-ray focusing mirror 30
Is attached to the X-ray optical element alignment mechanism 7 using the thread cut in the tube 7 ′. By the method of fixing the X-ray focusing mirror 30 to the X-ray optical element alignment mechanism 7, the X-ray focusing point on the sample surface 9 and the tube 7 '.
70m which is the working distance of the X-ray focusing mirror between the tip
There will be m spatial spaces. Therefore, one side 70
It was possible to freely rotate a sample of mm or less over 300 ° by the rotary stage 13 and a tilt rotation of ± 45 ° by the gonio stage 15.

The sample scanning table 10 has a linear stage 11 for moving the sample scanning table 10 in the X-ray optical axis direction, a rotary stage 12 for rotating the X-ray detector 21, and a sample scanning table 10 for rotating the sample scanning table 10. The rotary stage 13, the bracket 14, the goniometer stage 15, the bracket 16, the rectilinear stages 17, 18, 19 and the large sample holder 20. The rectilinear stage 11 is the scanning rotary stage 1.
3 and the central axis of the gonio stage 15 to the X-ray focusing mirror 30.
The purpose is to match the focal position of. The moving range of the linear stage 11 is about 80 mm, and the positional accuracy is 1 μm.

The rotary stage 12 for rotating the X-ray detector 21 rotates the X-ray detector 21 independently of the sample scanning stage rotary stage 13. The X-ray detection unit 21 can rotate within a range of about 300 ° excluding an angle blocked by the X-ray optical element alignment mechanism 7, and has a rotation accuracy of 1/100.
The angle can be set at 0 °.

The X-ray detector 21 comprises a moving mechanism and an X-ray detector. The moving mechanism is composed of a stage 24 having a rectilinear function of about 250 mm or more, and a rectilinear stage 25 having a moving distance of about 20 mm in a direction orthogonal to the sample stage rotation direction and the sample stage rotation center direction. As the X-ray detector, a semiconductor detector having an energy resolution of incident X-rays, a gas flow type proportional counter, a phosphor for X-rays having a positional resolution of incident X-rays, and an image intensifier were combined. A detector can be used.

The rotary stage 13 for rotating the sample scanning table 10 can rotate about 300 °, and its rotation angle accuracy is 1/1000 °. The goniometer stage 15 on the rotary stage 13 can rotate up to ± 45 °,
The rotation accuracy is 1/1000 °. The gonio stage 15 and the rotary stage 13 have a common rotation center. For this purpose, a bracket 14 is arranged between the two stages 13 and 15,
The precision alignment of the rotary shaft of No. 5 is performed. The three-direction rectilinear stages 17, 18, 19 and the bracket 16 are arranged in combination on the scanning sample stage rotating stage 13 and the goniometer stage 15. In this state, when the rotary stage 13 rotates in the angular range of 0 to 90 ° and the gonio stage 15 rotates in the tilt angle ± 10 ° angular range, the rotational axis deviation of the two stages 13 and 15 should be within 40 μm. There is.

On the goniometer stage 15, a straight stage 1
7 is placed. The moving distance of the straight stage 15 is 2
5 mm, resolution 0.1 μm, reproducibility ± 1 μm, and the sample surface 9 can be moved and adjusted to the focal point of the X-ray focusing mirror, that is, the center of rotation. Therefore, 20m on the sample scanning table
It is possible to mount a sample with a thickness of up to about m. The straight stage 17 has a side motor specification.

A bracket 16 is mounted on the linear stage 17. The bracket 16 is attached so that the other two-axis linear movement stages 18 and 19 can move orthogonally to the movement direction of the linear movement stage 17. Stage 18, 1
The performance of No. 9 is equivalent to the linear movement stage 17 in resolution and position reproducibility. The moving distances are both about 50 mm, and the motor for driving the stage is mounted in the straight direction.

32 mmφ is provided at the portion where the X-ray optical axis 2 of the bracket 16 supporting the two-direction linearly moving stages 18 and 19 which are vertically erected on the goniometer stage 15 pass through.
Through holes are provided. A large sample such as a 6-inch silicon wafer can be mounted on the large sample holder 20. The large sample holder 20 has a large rectilinear mechanism having a moving distance of 70 mm and a rotating mechanism capable of rotating 360 °. This makes it possible to scan the entire surface of a large sample. The X-ray detector 21 and the large sample holder 20
All stages except can be operated remotely.

An example of measurement of diffracted X-rays in a microscopic region using the X-ray analyzer having the above-mentioned structure will be described. Cu was used for the X-ray target 1, and the acceleration voltage of the X-ray generator 1 ′ was set to 50 KV. The X-ray is focused on the sample surface 9 by the X-ray focusing mirror 30. The X-ray condensing mirror 30 used is the same as the above X-ray condensing mirror. Therefore, the distance between the X-ray emitting portion and the measurement sample surface is about 70 mm. X collected on the sample surface
The effective energy of the line is from 5 KeV to 10 KeV. About 1 from the X-ray window 8 to the focal point on the sample surface
The X-ray energy of 5 KeV or less is absorbed by the space of 50 mm. The X-ray generation spot in the X-ray generator 1'is narrowed down to 20 or 30 μm. At this time, the X-ray focusing spot diameter by the X-ray focusing mirror 30 is
The size in only one direction is about 5 μm. The X-ray generation spot diameter is 1/10 of the reduction ratio of the X-ray focusing mirror, and
It has not been reduced to the line focus spot diameter. The reason for this is X
This is due to the surface roughness of the line focusing mirror 30 and the size of the shape error.

For sample 9, an Al wiring pattern on a 4-inch silicon wafer was used. Al wiring has a thickness of 2 μm
The pitch is about 65 μm in width. Sample 9
Is fixed on the sample scanning table using a large sample holder 20. Since Cu was used for the X-ray target 1, Cu having a strong intensity peak at an energy of 8 KeV
The characteristic X-rays of 1 are irradiated onto the sample surface. Since the Al wiring is considered to be a thin film in a polycrystalline state, the lattice spacing of the 111 plane showing the maximum X-ray diffraction intensity in Al is considered to be the lattice spacing d of the Al wiring on the Si wafer. X focused on the sample
Since the line wavelength λ is mainly the characteristic X-ray of Cu, the value of the sample angle θ satisfying the Bragg equation is obtained. The sample angle is 0 ° when the sample is parallel to the X-ray optical axis 2.

2 * d * sin θ = λ From the above equation, θ is 19.24 °, and the sample rotation angle is adjusted to the value of θ. For the X-ray detector, a fiber plate provided with a screen of X-ray phosphor Gd2O2S; Tb was used by being connected to an image intensifier with an adhesive having the same optical refractive index. The angle of the X-ray detector was adjusted to be twice the rotation angle of the sample. Al wiring to X
The diffracted X-ray intensity incident on the line detector is very weak. Therefore, the X-ray detector surface is brought closer to 40 mm or less than the sample surface by using the straight-ahead mechanism of the X-ray detection unit. In order to measure a diffracted X-ray spot having a high S / N ratio, 30-second image integration is performed for one point measurement. Scan the sample surface in 5 μm steps
The characteristic line of Cu diffracted on the sample surface was 65
It was measured at a μm pitch.

In measuring the diffracted X-rays, the Ni filter is inserted between the X-ray focusing mirror 30 and the sample surface 9 in the first embodiment to measure monochromaticity, and the X-ray detector is used. Observing a clear diffraction spot. W instead of Cu
Was used as the X-ray target 1, the sample rotation angle was set at a lower angle of about 3 °, and the reflection Laue image of the Al wiring was observed. The large sample holder 20 was removed and the sample surface 9 was made perpendicular to the X-ray optical axis 2. As the sample, an Al thin film having an organic thin film as a support was used. The sample was directly attached to the straight stage 19. The X-ray detector was placed behind the sample surface with respect to the X-ray optical axis 2 and the transmission Laue image of the sample was observed.

(Embodiment 2) In Embodiment 2, a method for measuring fluorescent X-rays in a minute area will be described. For example, Example 1
The X-ray focusing mirror used in 1. is used as an X-ray optical element. Therefore, the distance between the X-ray emitting portion of the tube 7'and the measurement sample surface is about 70 mm. The conditions of the X-ray generator were the same as in Example 1, the acceleration voltage was 50 KV, and Cu was used for the X-ray target 1. The X-ray focusing spot diameter by the X-ray focusing mirror 30 is 5 μm in only one direction.
It is a degree. The effective energy of the X-rays focused on the sample surface is about 5 KeV to 10 KeV. A gas flow type proportional counter using PR gas was used for the X-ray detector. A stainless steel mesh having a pitch of 127 μm was used as a sample and fixed on the large sample holder 20. The sample 9 was rotated about 30 ° by the rotary stage 13 and the proportional counter was placed within 40 mm from the sample. Two-dimensional scanning of 1 mm square in the sample was performed using the straight-moving stages 18 and 19, and a mesh image by the fluorescent X-ray of Fe was measured.

A semiconductor X-ray detector may be used as a method for measuring fluorescent X-rays in addition to the second embodiment. Since the semiconductor X driver detector has a remarkably high energy resolution, the fluorescence X of the element whose element number in the sample is adjacent
It is possible to measure linear energy separately. For example, a sample is a 4-inch Si wafer, which is fixed on a large sample holder 20 and a trace element on the extreme surface is detected. In order to perform the total reflection fluorescent X-ray analysis method, the rotation angle of the sample table was set to 1 ° or less so that the X-rays were smoothly incident on the sample surface. In order to increase the S / N ratio of fluorescent X-rays excited from the sample, a monochromatic filter, in this case, Ni thin film 2
5 μm was inserted. Further, a collimator was arranged between the X-ray focusing mirror 30 and the sample surface 9.

The X-ray focusing mirror used in the embodiment has a large divergence angle of X-ray of about 0.6 °. Therefore, the use area of the X-ray reflection surface of the X-ray focusing mirror, that is, the ring zone of the X-ray focusing mirror 30 is limited by using a collimator, and the divergence angle of the X-ray focusing beam is 0.1. It was set to °. The semiconductor detector was installed within a distance of 20 mm from the sample surface. The rotation angle of the sample by the rotary stage 13 was changed from 0 °, and the fluorescent X-ray from the sample was measured. Then, the contamination state of Fe or the like with respect to the depth up to about 100 Å of the sample Si wafer was found.

(Embodiment 3) In Embodiment 3, a method of measuring transmitted X-rays in a minute area will be described. For example, Example 1
The X-ray focusing mirror used in 2 and 2 is used as an X-ray optical element. Therefore, the distance between the X-ray emitting portion of the tube 7'and the measurement sample surface is about 70 mm. The condition of the X-ray generator is that the acceleration voltage is 50 KV as in the first and second embodiments.
Cu was used for the X-ray target 1. X-ray focusing mirror 3
The X-ray focused spot diameter of 0 is about 5 μm in the size in only one direction. The effective energy of the X-rays focused on the sample surface is about 5 KeV to 10 KeV.

A gas flow type proportional counter using PR gas was used for the X-ray detector. The large sample holder 20 is removed and the sample is directly attached to the linear stage 19 in order to utilize the through holes provided in the linear stages 13 and 15 of the sample scanning table 10 and the bracket 16. As a sample,
A stainless steel mesh having a pitch of 127 μm was used. The proportional counter is moved on the X-ray optical axis 2 by the rotary stage 12 and brought close to the very vicinity of the rear surface of the bracket 16 of the sample scanning table. 10 using straight stages 18 and 19
Two-dimensional scanning of 1 mm square was performed on the sample in μm steps.
A characteristic X-ray of Cu was measured by a proportional counter, and a mesh image was obtained by changing the intensity of the transmitted X-ray.

In the third embodiment, the transmission image of the sample having a shape which can be seen directly is measured, but it is possible to observe the inside of the thin substance of several hundred μm which cannot be seen by an optical microscope or the like. . When a sample is irradiated with a characteristic X-ray of Cu, the transmitted X-ray intensity is extremely reduced in a portion containing a large amount of Fe and Ni and a portion containing a heavy element even in a thin film sample having a uniform appearance. . This occurs due to the effect of the absorption edge peculiar to the element and the property of the heavy element that makes it difficult for X-rays to pass through. A method of measuring transmitted X-rays, which has a high resolution, for example, a semiconductor X-ray detector is used. Then, it becomes possible to clarify the elemental composition of the sample by examining the changes in the incident X-ray energy intensity and the transmitted X-ray energy intensity incident on the sample. In the case of a sample with no change in transmitted X-ray intensity,
The sample is tilted by the rotary stage 13 and the goniometer stage 15. It is also possible to infer a rough internal structure in one direction of the sample by changing the transmitted X-ray intensity in a specific direction of the sample.

In the above description, the case of transmission X-rays, diffraction X-rays and fluorescent X-rays has been described separately by the above embodiment. By combining a two-dimensional position detector and an energy detector in a hybrid and performing simultaneous measurement of X-ray intensity for each X-ray energy,
The X-ray case described above can be performed simultaneously. Example 2
X-ray collimators are used to limit the X-ray divergence angle. As another usage method, it can be used to reduce the diameter of the X-ray focusing spot that is spread due to the surface roughness and shape error of the X-ray focusing mirror.

[0034]

According to the present invention, it is possible to easily identify a minute region of a sample substance and measure its chemical composition by means of transmitted X-rays, diffracted X-rays and fluorescent X-rays in the same apparatus configuration as described above.

[Brief description of drawings]

FIG. 1 is a schematic top view of an embodiment according to the present invention.

FIG. 2 is a layout view of a schematic scanning sample stage and an X-ray optical element alignment unit according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view of a schematic X-ray optical element placement portion of an embodiment according to the present invention.

[Explanation of symbols]

 1 X-ray reflection target 2 X-ray optical axis 3 X-ray 4 Vacuuming unit 5 Gate valve 6 Pipe 7 X-ray optical element alignment part 8 X-ray window 9 Sample 10 Scanning sample stage 11 Linear stage 12 X-ray detection part Rotation stage 13 Sample stage rotating stage 14 Bracket 15 Goniometer stage 16 Bracket 17 Straight stage 18 Straight stage 19 Straight stage 20 Large sample holder 21 X-ray detector 22 Base 23 Pipe column 24 Straight stage 25 Straight stage 30 X-ray optical element

Claims (4)

[Claims] 1. An X-ray generator comprising an X-ray generator, an X-ray optical element for condensing and forming an X-ray from the X-ray generator, a sample scanning table having a rotary tilt mechanism, and an X-ray detector. In the line analysis device, the distance between the condensing point of the X-ray optical element and the X-ray optical element is 1 cm or more, and the energy intensity of the X-ray at the condensing point is 5 keV or more. Characteristic X-ray analysis device. 2. The sample scanning table is equipped with a triaxial rectilinear stage and a sample holder, and the rectilinear stage group is provided with a hole for penetrating X-rays. X-ray analyzer. 3. The X-ray detection unit includes a mechanism for enabling rotational movement about a sample scanning stage and linear movement in two directions;
The X-ray analysis apparatus according to claim 1, comprising a line position detector or an X-ray energy detector. 4. The sample scanning table is equipped with a goniometer stage capable of a tilt angle of ± 10 ° or more and a rotary stage capable of rotating an angle of 90 ° or more. The X-ray analysis apparatus according to claim 1, 2, or 3.