JPH06297432A - Press for boardlike body - Google Patents

Abstract

PURPOSE:To be able to perform easily fitting.removal of a boardlike body to and from a bottom force and prevent a boardlike body from being damaged at the time of the fitting.removal without damaging a function pinching pressing the boardlike body under a state incapable of sliding the boardlike body, in performing pinching and pressing the boardlike body such as a ceramic laminated body by both the top and bottom forces. CONSTITUTION:A frame body 8 which is made so as to surround a boardlike body A is provided on a bottom force 1 and sliding movement or widening deformation of the boardlike body A at the time of pinching and pressing the boardlike body 8 are prevented. The frame body 8 is constituted of a movable frame part 8a, which is freely movable irrespective of a distance toward the shaft center of the bottom force 1 and fitting.removal of the boardlike body 8 are made easy.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention, for example, in a manufacturing process of a ceramic chip capacitor, a plate-shaped body having an appropriate thickness, such as a pressing device used for press-bonding a ceramic laminated sheet (green sheet), The present invention relates to a pressing device for pressing in the thickness direction.

[0002]

2. Description of the Related Art Ceramic chip capacitors are manufactured by the following steps. That is, a plurality of thin ceramic sheets in which a large number of chip capacitors are aligned vertically and horizontally are formed to form a plurality of thin ceramic sheets, and internal electrodes are screen-printed on each surface of each of the ceramic sheets corresponding to each chip capacitor. After coating and drying, these ceramic sheets are superposed, and a laminated sheet composed of a plurality of these ceramic sheets is pressure-bonded to one sheet while being pressed while being pressed by a press device,
Then, the pressure-bonded laminated sheet is broken, and then a side electrode is formed by coating on the end face of the laminated sheet, which is a manufacturing process.

When the laminated sheet is pressure-bonded by a press machine, the prior art is Japanese Patent Laid-Open No. 61-2.
As disclosed in Japanese Patent Publication No. 92309 and partially shown in FIG. 15 (b), on the upper surface of the lower mold 21 in the press machine,
A frame 22 having a rectangular shape in plan view is fixed, the laminated sheet A is fitted into the frame 22, and the laminated sheet A is pinched by the upper and lower molds 21 and 23 in this state.

In FIG. 15B, a contact portion of the upper die 23 that contacts the upper surface of the laminated sheet A is formed of a flexible sheet 24, and the flexible sheet 24 is provided above the flexible sheet 24. The high-pressure liquid 25 is injected into the formed liquid chamber, and the flexible sheet 2
The pressure of the liquid 25 is applied to the laminated sheet A via the pressure roller 4 to press each part of the laminated sheet A with a uniform force.

As shown in FIG. 15 (a), this means that when the supporting portion of the lower die 22 'and the contact portion of the upper die 23' are both rigid and flat, the inside of the laminated sheet A is Due to the thickness of the electrode B1, the sandwiching force of the portion corresponding to the end portion of the chip capacitor C in the laminated sheet A becomes small, so that delamination is likely to occur, and the laminated sheet A is evenly distributed over the whole. Since the laminated sheet A is broken along the fold line D and the side surface electrode B2 is formed by coating, the chip capacitor C can be compressed.
In view of the problem that only the side electrode B2 is thicker and difficult to handle when packaging or mounting on a printed circuit board, by clamping each part of the laminated sheet A with a uniform force, In addition to preventing delamination,
In order to allow the chip capacitor C to be formed to have the same thickness over the whole, liquid pressure is used to press each part of the laminated sheet A with an equal force.

Generally, the laminated sheet A is pinched while being heated. In that case, in order to prevent air and volatile substances remaining in the laminated sheet A from forming bubbles in the laminated sheet A, the frame 22 Further, a vacuum suction hole 26 is formed to suck and remove the air and volatile substances from the end surface of the laminated sheet A.

[0007]

According to this prior art, since the laminated sheet A is pressure-bonded while being held in the frame 22 so as not to be displaced, the laminated sheet A is laterally expanded and deformed by the pinching pressure. This is advantageous in that the chip capacitors C can be accurately aligned in size.

On the other hand, however, when mounting the laminated sheet A, the laminated sheet A is fitted into the frame body 22 in such a manner that the postures thereof are accurately aligned so that they are exactly overlapped with each other in plan view. Since it is necessary to attach the laminated sheet A, it is troublesome to attach the laminated sheet A, and the edge of the laminated sheet A is apt to come into strong contact with the frame body 22 to be chipped or deformed. Is strongly pressed against the inner peripheral surface of the frame body 22, so that it takes a lot of time and effort to remove the laminated sheet A, and the edge of the laminated sheet A tends to be chipped when the laminated sheet A is removed from the frame body 22. It was a problem.

It is an object of the present invention to provide a press device that solves this problem.

[0010]

In order to achieve this object, the present invention provides a lower die having a supporting portion on which the plate-like body is placed, and a plate-like body placed on the supporting portion of the lower die. A press having an upper die having an abutment portion abutting on the upper surface, and a frame body to which a plate-shaped body placed on the support portion fits is provided in a region around the support portion in the lower die. In the apparatus, at least a portion of the frame body, which is in contact with two adjacent end faces of the plate-like body, is a movable frame portion that is movable in the distance from the axial center of the lower mold.

[0011]

In this structure, the movable frame is
If it is moved away from the axis of the lower die, the area of the part surrounded by the frame can be made wider than the area of the plate-like body. The work of placing the plate-shaped body on the plate can be performed quickly, and the edge of the plate-shaped body is not chipped or deformed.

Further, when the movable frame portion is moved so as to approach the axis of the lower die while the plate is placed on the supporting portion of the lower die, the lower die is displaced with the plate being displaced. Even if the plate-shaped body is mounted on the support portion, the posture of the plate-shaped body is automatically corrected by the guide action of the movable frame portion so that the plate-shaped body is fitted tightly inside the frame body. Then, when the pressing of the plate-shaped body by the upper and lower dies is completed, the upper and lower dies are separated, and then the movable frame portion is moved so as to be separated from the axis of the lower mold,
It can be taken out very easily without damaging the plate.

Therefore, according to the present invention, when the plate-shaped body is clamped by the upper and lower molds, the plate-shaped body can be applied to the press device without causing problems such as extension deformation and displacement of the plate-shaped body during the pressing. It is possible to attach and remove the plate efficiently, and since the edge of the plate does not come into strong contact with the inner peripheral surface of the frame when the plate is attached or detached, it can be attached to the lower mold. -It has the effect of preventing the edge of the plate from being chipped or damaged during removal.

Further, according to the second aspect of the invention, since the contact portion of the upper die can be brought into contact with the entire upper surface of the plate-shaped body, the plate-shaped body can be uniformly pressed over its entire area. There is an advantage to say. By the way, in manufacturing the above-mentioned ceramic capacitor, as shown in FIG.
As shown in FIG. 7, when the laminated sheet A is sandwiched by hydraulic pressure via the flexible sheet 24, the peripheral edge of the flexible sheet 24 is supported by the frame body 22, and therefore the alternate long and short dash line 27 As shown, the portion of the flexible sheet 24 that contacts the peripheral edge portion A1 of the laminated sheet A is not sufficiently deformed, and the clamping force on the peripheral edge portion A1 of the laminated sheet A is smaller than that of the other portions. Therefore, delamination occurs at the peripheral edge A1 of the laminated sheet A, or only the chip capacitor C formed from the peripheral edge A1 of the laminated sheet A has side electrodes B
There was a problem that the second part would become thick.

On the other hand, when the pressing device for press-bonding the laminated sheet has the structure of claim 2, the flexible sheet is moved downward even at the peripheral portion of the laminated sheet, so that the peripheral portion of the laminated sheet is moved. Since it is possible to pinch it uniformly with the same force as other parts, delamination may occur at the peripheral edge of the laminated sheet, or only the chip capacitors manufactured at the peripheral edge of the laminated sheet may have thicker side electrode parts. Can be reliably prevented.

Therefore, when the structure of claim 2 is applied to a pressing device for manufacturing a chip capacitor, in addition to the effect that the laminated sheet can be easily attached / detached to / from the pressing device without damaging it, defective pressing of the laminated sheet can be prevented. This has the effect of preventing it and significantly reducing the incidence of defective products.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment in which the present invention is applied to a pressing device for manufacturing a ceramic chip capacitor will be described with reference to the drawings (FIGS. 1 to 14). 1 to 9 show the first embodiment, and in these drawings, reference numeral 1 is
The lower die fixed to the lower machine base 4 via the heat insulating plate 3 is denoted by reference numeral 2
Indicates the upper die fixed to the upper machine base 6 through the heat insulating plate 5,
An electrothermal heater 7 is embedded in both the molds 1 and 2.

The lower die 1 has a supporting portion 1a having a rectangular shape in plan view on which the ceramic laminated sheet A is placed, and the supporting portion 1
A peripheral wall portion 1b surrounding a is formed in a stepped shape, and a frame body 8 for positioning the laminated sheet A is provided at a portion between the support portion 1a and the peripheral wall portion 1b. The frame body 8 is composed of four movable frame portions 8a arranged at each portion between each side surface of the support portion 1a and the peripheral wall portion 1b, and two movable frame portions of the four movable frame portions 8a are opposed to each other. 8a is set to have the same length dimension as the lateral width dimension of the supporting portion 1a, and the other two movable frame portions 8a facing each other are set to have a length longer than the lateral width dimension of the side surface of the supporting portion 1a. There is.

Each movable frame portion 8a is configured to be movable in the distance from the side surface of the support portion 1a by an air cylinder 9 provided on the peripheral wall portion 1b. Further, the reciprocating motion of each movable frame portion 8a, as shown in FIGS. 4 to 5, is performed by the support portion 1a and the peripheral wall portion 1b.
The movement is guided by a guide bar 10 mounted between and. Then, the protrusion dimension e of the movable frame portion 8a from the upper surface of the support portion 1a is set to the laminated sheet A after pressure bonding
(For example, when the thickness of the laminated sheet A before crimping is about 1.5 mm, the thickness is reduced to about 1 mm by crimping. The protrusion e of the portion 8a is set to about 1 mm).

Further, an annular O-ring 11 extending over the entire circumference of the peripheral wall portion 1b is attached to the upper surface of the peripheral wall portion 1b of the lower mold 1, and when the molds 1 and 2 are brought close to each other,
The lower surface of the upper mold 2 and the peripheral wall portion 1b of the lower mold 1 are brought into contact with each other via the O-ring 11, so that the portion surrounded by the O-ring 11 is kept in a sealed state. On the other hand, the lower surface of the upper mold 2 is formed with a recess 12 into which the movable frame portions 8a in a state of being in close contact with the support portion 1a of the lower mold 1 can be fitted. As an example of a contact portion for the laminated sheet A, a flexible sheet 13 made of reinforced rubber or the like is stretched at a midway depth portion, and a high pressure pump 15 is provided in a liquid chamber 14 formed above the flexible sheet 13. Connect.

The recess 12 is formed in a stepped shape, and the portion close to the flexible sheet 13 is fitted tightly in a state where each movable frame portion 8a is in close contact with the support portion 1a as shown in FIG. Is set to get. Therefore, even if the laminated sheet A is pinched and a radial outward pressing force acts on each movable frame portion 8a, the movable frame portion 8a does not shift and the laminated sheet A is prevented from expanding and deforming.

Further, the upper mold 2 is provided with a vacuum suction hole 16 communicating with the inside of the recess 12, and the vacuum suction hole 1 is formed.
6 and the vacuum pump 17 are connected. Further, in the recess 12 of the upper die 2 at a portion closely contacting the movable frame portion 8a,
As clearly shown in FIG. 3, by forming a large number of communication grooves 18 extending in the vertical direction at appropriate intervals along the circumferential direction, the laminated sheet A is sandwiched between the two molds 1 and 2, and the laminated sheet A is sandwiched. It is designed so that gas, dust, etc. can be sucked from around the. The communication groove 18 may be formed on the side surface of the movable frame portion 8a as shown by the alternate long and short dash line in FIG. 3, or may be formed on both the movable frame portion 8a and the upper die 2.

In the above structure, the press-bonding of the laminated sheet A is performed by the following steps. First, as shown in FIG. 6, with the movable frame portions 8a retracted, the laminated sheet A is placed on the support portion 1a of the lower mold 1, and then the length of the four movable frame portions 8 is first changed. After moving the two movable frame portions 8a having short lengths, the two movable frame portions 8a having long lengths are moved forward.

Then, even if the laminated sheet A is placed on the supporting portion 1a in a displaced position, the laminated sheet A is guided by the movable frame portions 8a so that the laminated sheet A is supported by the supporting portion 1a.
It is accurately positioned on a and is held by the frame 8 so that it cannot be displaced. Next, as shown in FIG.
In a state where the two are in close contact with each other, the pressure in the liquid chamber 14 is increased to apply the liquid pressure to the laminated sheet A through the flexible sheet 13, and the air between the upper and lower molds 1 and 2 is vacuumed. Suction with the pump 17.

Then, since the upper surface of each movable frame portion 8a is located below the upper surface of the laminated sheet A, as shown in FIG. 8, the peripheral edge portion A1 of the laminated sheet A is also uniform like other portions. Therefore, delamination occurs at the peripheral edge A1 of the laminated sheet A, or the chip capacitor C formed from the peripheral edge A1 of the laminated sheet A has a thick side electrode B2. The occurrence rate of defective products can be significantly reduced.

Further, the air and volatile components remaining inside the laminated sheet A are sucked to the outside through the communication groove 18, so that the air and volatile components are bubbled in the laminated sheet A. It is possible to prevent delamination due to the debris and also remove dust and dirt. In this case, FIG. 15 (b) described above
When only the vacuum suction hole 25 is desired on the end surface of the laminated sheet A as in the prior art of No. 1, since the suction area is very small, the function of removing air and volatile components is low.
When the structure in which a step is formed between the upper surface of each movable frame portion 8a and the upper surface of the laminated sheet A as in this embodiment, the vacuum suction area is remarkably increased. Therefore, suction removal of gas, dust, etc. The function can be greatly improved.

After the pressure-bonding of the laminated sheet A, the upper and lower molds 1 and 2 are separated from each other, and then the movable frame bodies 8a are separated from the supporting portion 1a as shown in FIG. A can be taken out extremely easily without damaging it. Needless to say, the guide means and reciprocating means of each movable frame portion 8a may have other configurations.

In the first embodiment described above, the frame body 8 is composed of the four movable frame portions 8a. However, as shown as a second embodiment in FIG. 10, the frame body 8 is viewed in plan view. Both movable frame portions 8a are constituted by two movable frame portions 8a formed in an L shape.
May be configured to be movable in the perspective direction from the diagonal direction of the support portion 1a toward the axis of the support portion 1a. Further, in order to easily place and remove the laminated sheet A on the lower mold 1, it is sufficient if the laminated sheet A can be moved at least in the vertical direction and the horizontal direction in a plan view. It is not necessary that the entire body 8 be composed of the movable frame portion 8a.

Therefore, as shown in FIG. 11 as a third embodiment, a portion of the frame 8 extending along one side surface of the supporting portion 1a is fixed or integrally formed with the supporting portion 1a.
As a movable frame portion 8a that individually moves the other three parts
Alternatively, or as shown as a fourth embodiment in FIG. 12, two adjacent parts of the four parts of the frame body 8 are fixed to the support part 1a or integrally formed as a fixed part 8b, Movable frame part 8 that moves the two parts of the body integrally or individually
It may be configured as a.

Further, the movable frame portion 8a is not limited to be configured to be horizontally movable, and as shown in FIG. 13 as a fifth embodiment, the movable frame portion 8a is pivoted by a pin 19 so as to rotate around its lower portion. It may be configured such that when it is worn, it moves far and far with respect to the side surface of the support portion 1a. Further, as shown by arrows E and F in FIG.
It may be movable toward and away from a, and may be lowered against the elasticity. In this case, the laminated sheet A
When mounting the laminated sheet A on the supporting portion 1a, the movable frame portion 8a can be made to project further than the upper surface of the laminated sheet A, so that the laminated sheet A can be positioned more easily, and the upper die 2 is flexible. Since the movable frame 8a is displaced downward by the pressing of the flexible sheet 13, the function of uniformly pressing the laminated sheet A over the entire area is not impaired.

In the above-mentioned embodiment, the laminated sheet is directly placed on the lower die supporting portion, but an elastic plate such as rubber may be stretched on the upper surface of the supporting portion. Further, when the laminated sheet is an adhesive material, a release sheet may be attached to the upper surface of the supporting portion in order to facilitate the peeling of the laminated sheet after pressure bonding. It is needless to say that the present invention can be applied not only to pressure bonding of a laminated sheet made of a ceramic sheet, but also to a pressing device for pinching various other plate-like objects such as a pressing device for adhering a paperboard or a veneer plate. .

[Brief description of drawings]

FIG. 1 is a partially cutaway perspective view of a first embodiment.

FIG. 2 is a vertical sectional front view of the first embodiment.

FIG. 3 III-III of FIG. 2 in a state where the upper and lower molds are close to each other
FIG. 9 is a view cross-sectional view and a view taken along the line III-III in FIG. 7.

FIG. 4 is a plan view taken along line IV-IV of FIG.

5 is a sectional view taken along line VV of FIG.

FIG. 6 is a plan view showing the operation of the movable frame portion.

FIG. 7 is a cross-sectional view in a pinched state.

FIG. 8 is a cross-sectional view showing a state in which pressure bonding of a laminated sheet is completed.

FIG. 9 is a plan view of the lower mold before the pressure-bonded laminated sheet is removed.

FIG. 10 is a plan view of the lower mold of the second embodiment.

FIG. 11 is a perspective view of an essential part of the third embodiment.

FIG. 12 is a perspective view of essential parts of a fourth embodiment.

FIG. 13 is a cross-sectional view of an essential part of the fifth embodiment.

FIG. 14 is a cross-sectional view of essential parts of a sixth embodiment.

FIG. 15 is a diagram showing a conventional example.

[Explanation of symbols]

 A ceramic laminated sheet as an example of a plate-like body 1 lower die 1a supporting portion 1b peripheral wall portion 2 upper die 7 heater 9 air cylinder 12 upper die recess 13 flexible sheet 14 liquid chamber 16 vacuum suction hole 18 communicating groove

Claims (2)

[Claims] 1. A lower die having a support portion for mounting a plate-like body,
An upper die having an abutting portion that abuts an upper surface of a plate-shaped body placed on the lower die supporting portion, and is mounted on the supporting portion at a portion around the supporting portion in the lower die. In a pressing device provided with a frame body to which the placed plate body is fitted, at least a portion of the frame body that abuts two adjacent end faces of the plate body is moved perspectively with respect to the axis of the lower mold. A plate-shaped press device characterized by a freely movable frame part. 2. The "claim 1" according to claim 1, characterized in that the height of the upper surface of the frame is set to be lower than the upper surface of the plate-shaped body mounted on the lower die supporting portion. Pressing device for plate-shaped body.