JPH0629431A - Fabrication of solid image pick-up device - Google Patents
Fabrication of solid image pick-up deviceInfo
- Publication number
- JPH0629431A JPH0629431A JP4184016A JP18401692A JPH0629431A JP H0629431 A JPH0629431 A JP H0629431A JP 4184016 A JP4184016 A JP 4184016A JP 18401692 A JP18401692 A JP 18401692A JP H0629431 A JPH0629431 A JP H0629431A
- Authority
- JP
- Japan
- Prior art keywords
- glass plate
- package
- lead frame
- adhesive
- island
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、樹脂モールド型のＣＣ
Ｄイメージセンサの如き固体撮像素子の製造方法に関す
る。BACKGROUND OF THE INVENTION The present invention relates to a resin mold type CC.
The present invention relates to a method for manufacturing a solid-state image sensor such as a D image sensor.
【０００２】[0002]
【従来の技術】テレビカメラ等に搭載されるＣＣＤイメ
ージセンサにおいては、従来より、リードフレームが埋
め込まれたセラミックパッケージに、行列配置された複
数の受光画素を有するセンサチップを収納し、このセン
サチップを透明なガラス板により封止するようにしてい
る。ところが、セラミックパッケージを採用するＣＣＤ
イメージセンサの場合、パッケージの組立てに必要な工
程数が多くなると共にパッケージ自体が高価なために、
製造コストが高くなるという問題を有している。2. Description of the Related Art Conventionally, in a CCD image sensor mounted on a television camera or the like, a sensor package having a plurality of light receiving pixels arranged in rows and columns is housed in a ceramic package in which a lead frame is embedded. Is sealed with a transparent glass plate. However, a CCD that uses a ceramic package
In the case of an image sensor, the number of steps required for assembling the package is large and the package itself is expensive.
There is a problem that the manufacturing cost becomes high.
【０００３】そこで出願人は、センサチップを透光性樹
脂でモールドすることで製造コストの引き下げを可能に
したＣＣＤイメージセンサを特願平３−６３２７１号に
提案している。図５は、その透光性樹脂モールドを採用
するＣＣＤイメージセンサの断面図である。被写体映像
を受けるセンサチップ１は、受光面に複数の受光画素が
行列配置されて成り、アイランド２上に装着される。こ
のセンサチップ１については、セラミックパッケージを
採用するＣＣＤイメージセンサのものと同一であり、従
来より周知の製造工程により製造される。センサチップ
１が装着されるアイランド２の周辺部分には、複数のリ
ード３が配列され、このリード３の先端部とセンサチッ
プ１のパッドとが金線等のワイヤ４により接続される。
これらセンサチップ１及びアイランド２は、透光性樹脂
よりなるパッケージ５に収められ、センサチップ１やワ
イヤ４の保護が図られる。パッケージ５を成す透光性樹
脂は、ガラス等に比してキズが付きやすいため、パッケ
ージ５の表面を保護するためのガラス板６がセンサチッ
プ１の受光面に対向する側に装着される。これにより、
センサチップ１への光の入射経路となるパッケージ５の
表面にキズが付きにくくなり、製造工程での素子の取扱
いが容易になる。Therefore, the applicant proposes in Japanese Patent Application No. 3-63271 a CCD image sensor capable of reducing the manufacturing cost by molding a sensor chip with a transparent resin. FIG. 5 is a sectional view of a CCD image sensor adopting the translucent resin mold. The sensor chip 1 for receiving the subject image is formed by arranging a plurality of light receiving pixels in a matrix on the light receiving surface, and is mounted on the island 2. The sensor chip 1 is the same as that of a CCD image sensor that employs a ceramic package, and is manufactured by a manufacturing process known in the related art. A plurality of leads 3 are arranged around the island 2 on which the sensor chip 1 is mounted, and the tip ends of the leads 3 and the pads of the sensor chip 1 are connected by wires 4 such as gold wires.
The sensor chip 1 and the island 2 are housed in a package 5 made of translucent resin to protect the sensor chip 1 and the wires 4. Since the translucent resin forming the package 5 is more easily scratched than glass or the like, a glass plate 6 for protecting the surface of the package 5 is mounted on the side facing the light receiving surface of the sensor chip 1. This allows
The surface of the package 5, which serves as a light incident path to the sensor chip 1, is less likely to be scratched, and the element can be easily handled in the manufacturing process.
【０００４】図６は、透光性樹脂モールドを採用するＣ
ＣＤイメージセンサの製造方法を説明する断面図であ
る。リードフレーム７は、アイランド２及びこれを取り
囲む複数のリード３からなり、それぞれの位置が外枠に
よって固定されている。そこで、所定の製造工程を経て
得られるセンサチップ１がリードフレーム７のアイラン
ド２に装着され、センサチップ１のパッドとリード３の
先端とがワイヤ４により接続された後、リード３がアイ
ランド２に対して垂直に折り曲げられる。このリード３
の折り曲げ工程については、センサチップ１の装着前に
行うことも可能である。続いて、リード３が折り曲げら
れたリードフレーム７は、ガラス板６と共に成形型１０
の凹部１１に収められる。この凹部１１は、所望のパッ
ケージの形状を成し、内部にリードフレーム７を支える
支持部１２、ガラス板６が収められる収納部１３が設け
られている。収納部１３は、リードフレーム７を収めた
ときにセンサチップ１と向かい合うように低面に形成さ
れ、ガラス板６がリードフレーム７に装着されたセンサ
チップ１に対して平行となるように支持する段差１４を
有している。そして、ガラス板６を収納部１３に収める
と共にリードフレーム７を支持部１２に支持させた状態
で、凹部１１内が熱硬化型の透光性樹脂で充填され、こ
の透光性樹脂が加熱処理により硬化されてパッケージ５
が形成される。ことのとき、ガラス板６と成形型１０と
の間に透光性樹脂が侵入するのを防止するため、ガラス
板６と成形型１０との間の空間が予めゴム系の樹脂によ
り密閉される。透光性樹脂が硬化してパッケージ５が形
成された後には、成形型１０からパッケージ５と共にリ
ードフレーム７が取り出され、リードフレーム７の外枠
等の不要部分が切り落とされてリード３が所定の長さに
揃えられる。FIG. 6 shows a C adopting a transparent resin mold.
FIG. 9 is a cross-sectional view illustrating the method of manufacturing the CD image sensor. The lead frame 7 includes an island 2 and a plurality of leads 3 surrounding the island 2, and the respective positions are fixed by an outer frame. Therefore, after the sensor chip 1 obtained through a predetermined manufacturing process is mounted on the island 2 of the lead frame 7 and the pad of the sensor chip 1 and the tip of the lead 3 are connected by the wire 4, the lead 3 is attached to the island 2. It can be bent vertically. This lead 3
The bending step may be performed before mounting the sensor chip 1. Then, the lead frame 7 in which the leads 3 are bent is combined with the glass plate 6 to form the mold 10.
It is accommodated in the recess 11 of the. The recess 11 has a desired package shape, and is provided therein with a support portion 12 for supporting the lead frame 7 and an accommodating portion 13 for accommodating the glass plate 6. The housing portion 13 is formed on a lower surface so as to face the sensor chip 1 when the lead frame 7 is housed therein, and supports the glass plate 6 so as to be parallel to the sensor chip 1 mounted on the lead frame 7. It has a step 14. Then, with the glass plate 6 accommodated in the accommodating portion 13 and the lead frame 7 supported by the supporting portion 12, the inside of the concave portion 11 is filled with a thermosetting translucent resin, and the translucent resin is heat-treated. Cured by Package 5
Is formed. At this time, in order to prevent the translucent resin from entering between the glass plate 6 and the molding die 10, the space between the glass plate 6 and the molding die 10 is previously sealed with a rubber resin. . After the translucent resin is cured and the package 5 is formed, the lead frame 7 is taken out together with the package 5 from the molding die 10 and unnecessary portions such as the outer frame of the lead frame 7 are cut off so that the leads 3 have a predetermined shape. Aligned to length.
【０００５】以上のＣＣＤイメージセンサによると、パ
ッケージ５を形成するための製造工程の簡略化と共にパ
ッケージ材料自体がセラミックに比して安価なものとな
るため、製造コストの大幅な低減が望める。According to the CCD image sensor described above, the manufacturing process for forming the package 5 is simplified, and the package material itself is cheaper than ceramics, so that the manufacturing cost can be greatly reduced.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、上述の
ＣＣＤイメージセンサの製造工程においては、成形型１
０内にガラス板６をセットする際に細かい作業が必要と
なり、作業に長い時間を要することになるために自動化
が難しく、量産性に欠けるという問題を有している。ま
た、ガラス板６と成形型１０との間を密閉する樹脂がガ
ラス板６から剥離し、その樹脂とガラス板６との間に透
光性樹脂が侵入して製造歩留まりの低下を招く虞れがあ
る。However, in the manufacturing process of the above-mentioned CCD image sensor, the molding die 1 is used.
There is a problem in that it is difficult to automate because the fine work is required when setting the glass plate 6 in 0 and the work takes a long time, and the mass productivity is poor. In addition, the resin that seals the gap between the glass plate 6 and the molding die 10 may peel off from the glass plate 6, and the translucent resin may enter between the resin and the glass plate 6 to reduce the manufacturing yield. There is.
【０００７】そこで本発明は、製造歩留まりの低下を防
止すると共に、量産に適した製造方法を提供することを
目的とする。Therefore, an object of the present invention is to provide a manufacturing method suitable for mass production while preventing a decrease in manufacturing yield.
【０００８】[0008]
【課題を解決するための手段】本発明は、上述の課題を
解決するために成されたもので、その特徴とするところ
は、複数の受光画素が行列配置される半導体チップをリ
ードフレームのアイランド部に装着すると共に、リード
フレームのリード部をアイランド部に対して略垂直に折
り曲げる工程と、底面に上記半導体チップと対応する段
差が形成されてパッケージ形状を成す凹部にリード部を
折り曲げた上記リードフレームを収納し、上記凹部内に
熱硬化型の透光性樹脂を充填して上記半導体チップを封
止する工程と、上記透光性樹脂を硬化して得るパッケー
ジの表面に、上記凹部底面の段差に対応して形成される
段差部分に合わせて、透光性の保護板を接着剤を挾んで
装着し、後に上記接着剤を硬化させる工程と、を含むこ
とにある。The present invention has been made to solve the above-mentioned problems, and is characterized in that a semiconductor chip having a plurality of light receiving pixels arranged in a matrix is used as an island of a lead frame. The step of bending the lead part of the lead frame substantially perpendicular to the island part, and the lead part is bent into a recess forming a package shape with a step corresponding to the semiconductor chip on the bottom surface. The step of housing the frame, filling the recess with a thermosetting translucent resin and sealing the semiconductor chip, and the surface of the package obtained by curing the translucent resin, A step of mounting a translucent protective plate with an adhesive sandwiched between the stepped portions formed corresponding to the step, and subsequently curing the adhesive is included.
【０００９】[0009]
【作用】本発明によれば、パッケージを形成する凹部内
に保護板をセットする必要がなくなり、リードフレーム
を凹部に収納して透光性樹脂で封止する工程の自動化が
容易になる。そして、透光性樹脂を硬化して形成される
パッケージ上に、接着剤を挾み、表面の段差部分に合わ
せて保護板を装着することで、保護板は、接着剤の表面
張力が最も落ち着く位置、即ちパッケージの段差部分と
一致する位置に自動的に移動する。従って、保護板の細
かい位置合わせは必要なくなる。According to the present invention, it is not necessary to set a protective plate in the recess forming the package, and the automation of the process of housing the lead frame in the recess and sealing with the light-transmissive resin is facilitated. Then, the adhesive is sandwiched on the package formed by curing the translucent resin, and the protective plate is attached according to the stepped portion of the surface, so that the surface tension of the adhesive on the protective plate is the most calm. It automatically moves to the position, that is, the position corresponding to the stepped portion of the package. Therefore, fine alignment of the protective plate is not necessary.
【００１０】[0010]
【実施例】図１及び図２は、本発明の第１の実施例を説
明する工程別の断面図である。リードフレーム７のアイ
ランド２上にセンサチップ１が装着された後、リードフ
レーム７のリード３とセンサチップ１のパッドとがワイ
ヤ４により接続され、さらにリード３がアイランド２に
対して垂直に折り曲げられる。このリード３が折り曲げ
られるまでは、図６と同一の製造工程による。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1 and 2 are sectional views of respective steps for explaining a first embodiment of the present invention. After the sensor chip 1 is mounted on the island 2 of the lead frame 7, the leads 3 of the lead frame 7 and the pads of the sensor chip 1 are connected by the wires 4, and the leads 3 are bent perpendicularly to the island 2. . The same manufacturing process as in FIG. 6 is performed until the lead 3 is bent.
【００１１】アイランド２にセンサチップ１が装着され
てリード３が折り曲げられたリードフレーム７は、図１
に示すように、成形型２０の凹部２１に収められる。こ
の成形型２０の凹部２１は、所望のパッケージ形状を成
しており、後述するガラス板２６と形状が一致する凹み
を形成する段差２２及びリードフレーム７を支える支持
部２３を有している。続いて、リードフレーム７が収納
された凹部２１に熱硬化型の透光性樹脂が充填され、こ
の透光性樹脂が加熱により硬化されてパッケージ２４が
形成される。そして、図２に示すように、成形型２０か
ら取り出されたパッケージ２４上に、紫外線硬化型の接
着剤２５を挾んでガラス板２６が装着される。このと
き、センサチップ１の受光面に対向するパッケージ２４
の表面には、凹部２１の段差２２と対応するステージ２
７が形成され、このステージ２７上に接着剤２５を挾ん
でガラス板２６を装着することで、接着剤２５の表面張
力の作用によりガラス板２６がステージ２７に一致する
ように合わせられる。即ち、ステージ２７をガラス板２
６と略同一の形状とし、ガラス板２６を未硬化状態の接
着剤２５を挾んで装着すると、接着剤２５の表面積を最
小とするような位置にガラス板２６が移動するため、ガ
ラス板２６は、ステージ２７上の所定位置に自動的に配
置される。従って、ガラス板２６の装着位置がずれた場
合でも位置の修正を行う必要がなく、ガラス板２６の装
着が極めて容易になる。The lead frame 7 in which the sensor chip 1 is mounted on the island 2 and the leads 3 are bent is shown in FIG.
As shown in FIG. The recess 21 of the molding die 20 has a desired package shape, and has a step 22 that forms a recess having the same shape as a glass plate 26 described later, and a support portion 23 that supports the lead frame 7. Subsequently, a thermosetting translucent resin is filled in the recess 21 in which the lead frame 7 is housed, and the translucent resin is cured by heating to form the package 24. Then, as shown in FIG. 2, a glass plate 26 is mounted on the package 24 taken out of the molding die 20 with an ultraviolet curable adhesive 25 sandwiched therebetween. At this time, the package 24 facing the light receiving surface of the sensor chip 1
On the surface of the stage 2 corresponding to the step 22 of the recess 21
7 is formed, and the glass plate 26 is mounted on the stage 27 by sandwiching the adhesive 25, and the glass plate 26 is aligned with the stage 27 by the action of the surface tension of the adhesive 25. That is, the stage 27 is attached to the glass plate 2
When the glass plate 26 has a shape substantially the same as that of 6, and the glass plate 26 is attached by sandwiching the uncured adhesive 25, the glass plate 26 moves to a position where the surface area of the adhesive 25 is minimized. , Is automatically placed at a predetermined position on the stage 27. Therefore, even if the mounting position of the glass plate 26 is displaced, there is no need to correct the position, and the mounting of the glass plate 26 becomes extremely easy.
【００１２】この後、ガラス板２６を通して紫外線が照
射され、接着剤２５が硬化されてガラス板２６の位置が
固定される。そこで、センサチップ１の受光面に光を照
射して得られる映像により、接着剤２５内に気泡や異物
の混入がないことを確認した上で接着剤２５を硬化させ
るようにすれば、ガラス板２６を装着する工程での歩留
まりの低下を抑圧できる。After that, ultraviolet rays are irradiated through the glass plate 26 to cure the adhesive 25 and fix the position of the glass plate 26. Therefore, if the adhesive 25 is hardened after confirming that no air bubbles or foreign matter are mixed in the adhesive 25 by an image obtained by irradiating the light receiving surface of the sensor chip 1 with light, a glass plate can be obtained. It is possible to suppress a decrease in yield in the process of mounting 26.
【００１３】図３及び図４は、本発明の第２の実施例を
説明する工程別の断面図である。この製造工程におい
て、センサチップ１が装着されたリードフレーム７をモ
ールドする方法自体は、図１及び図２と同一で、成形型
３０の凹部３１に収納されるリードフレーム７をセンサ
チップ１と共に透光性樹脂で封止するようしている。こ
こで特徴となるのは、透光性樹脂を硬化して得られるパ
ッケージ３２表面のガラス板３３の装着部分が他の部分
より低く形成され、ガラス板３３を埋め込むようにして
パッケージ３２に装着することにある。即ち、成形型３
０の凹部３１は、リードフレーム７を支える支持部３４
と共に、ガラス板３３と一致する形状の凸部を形成する
段差３５を有し、この凹部３１内にリードフレーム７を
収めてパッケージ３２を形成することで、センサチップ
１の受光面と対向するパッケージ３２の表面にガラス板
３３を収納し得る凹み３６が形成される。そこで、この
凹み３６に合わせ、紫外線硬化型の接着剤３７を挾んで
ガラス板３３を装着すると、ガラス板３３が所望の位置
に設定される。FIG. 3 and FIG. 4 are sectional views for explaining the second embodiment of the present invention. In this manufacturing process, the method itself for molding the lead frame 7 on which the sensor chip 1 is mounted is the same as in FIGS. 1 and 2, and the lead frame 7 housed in the recess 31 of the molding die 30 is transparent together with the sensor chip 1. It is designed to be sealed with an optical resin. The feature here is that the mounting portion of the glass plate 33 on the surface of the package 32 obtained by curing the translucent resin is formed lower than the other portions, and the glass plate 33 is embedded and mounted in the package 32. Especially. That is, the mold 3
The recess 31 of 0 is a supporting portion 34 that supports the lead frame 7.
At the same time, there is a step 35 that forms a convex portion having a shape matching the glass plate 33, and the lead frame 7 is housed in the concave portion 31 to form the package 32, so that the package faces the light receiving surface of the sensor chip 1. A recess 36 capable of accommodating the glass plate 33 is formed on the surface of 32. Therefore, when the glass plate 33 is attached by inserting the ultraviolet curable adhesive 37 in alignment with the recess 36, the glass plate 33 is set at a desired position.
【００１４】そして、ガラス板３３が装着された後に
は、図２の場合と同様にして、センサチップ１の受光面
に光を照射して得られる映像を確認し、接着剤３７が良
好な状態であれば紫外線を照射して接着剤を硬化させ
る。なお、このとき接着剤３７内に異物の混入が確認さ
れれば、ガラス板３３を取り外し、接着剤３７を除去し
て再度装着するようにする。After the glass plate 33 is attached, the image obtained by irradiating the light-receiving surface of the sensor chip 1 with light is confirmed in the same manner as in FIG. 2, and the adhesive 37 is in a good state. In that case, the adhesive is cured by irradiating ultraviolet rays. At this time, if it is confirmed that foreign matter is mixed in the adhesive 37, the glass plate 33 is removed, the adhesive 37 is removed, and the adhesive 37 is attached again.
【００１５】以上の製造方法によると、成形型２０、３
０にリードフレーム７を収納する工程から、ガラス板２
６、３３を装着する工程まで自動化が容易にできるた
め、量産性を向上でき、更なるコストの低減が図れる。According to the above manufacturing method, the molding dies 20, 3 are formed.
From the step of housing the lead frame 7 to the glass plate 2
Since the process of mounting 6 and 33 can be easily automated, mass productivity can be improved and the cost can be further reduced.
【００１６】[0016]
【発明の効果】本発明によれば、パッケージ材料自体の
コストの低減に加えて、量産性の向上による製造コスト
の低減が図れるため、安価で取扱いの容易なＣＣＤイメ
ージセンサを提供することができる。According to the present invention, the cost of the package material itself can be reduced, and the manufacturing cost can be reduced by improving the mass productivity. Therefore, a CCD image sensor which is inexpensive and easy to handle can be provided. .
【図１】本発明の第１の実施例の第１の工程を説明する
断面図である。FIG. 1 is a sectional view illustrating a first step of a first embodiment of the present invention.
【図２】本発明の第１の実施例の第２の工程を説明する
断面図である。FIG. 2 is a sectional view illustrating a second step of the first embodiment of the present invention.
【図３】本発明の第２の実施例の第１の工程を説明する
断面図である。FIG. 3 is a sectional view illustrating a first step of the second embodiment of the present invention.
【図４】本発明の第２の実施例の第２の工程を説明する
断面図である。FIG. 4 is a sectional view illustrating a second step of the second embodiment of the present invention.
【図５】従来の固体撮像素子の断面図である。FIG. 5 is a sectional view of a conventional solid-state image sensor.
【図６】従来の製造方法を説明する断面図である。FIG. 6 is a cross-sectional view illustrating a conventional manufacturing method.
１ センサチップ ２ アイランド ３ リード ４ ワイヤ ５、２４、３２ パッケージ ６、２６、３３ ガラス板 ７ リードフレーム １０、２０、３０ 成形型 １１、２１、３１ 凹部 １２、２３、３４ 支持部 １３ 収納部 ２２、３５ 段差 ２５、３７ 接着剤 ２７ ステージ ３６ 凹み 1 sensor chip 2 island 3 lead 4 wire 5, 24, 32 package 6, 26, 33 glass plate 7 lead frame 10, 20, 30 molding die 11, 21, 31 recess 12, 23, 34 support portion 13 storage portion 22, 35 Step 25, 37 Adhesive 27 Stage 36 Recess
フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 27/14 Continuation of front page (51) Int.Cl. 5 Identification code Office reference number FI technical display area H01L 27/14
Claims (3)
チップをリードフレームのアイランド部に装着すると共
に、リードフレームのリード部をアイランド部に対して
略垂直に折り曲げる工程と、底面に上記半導体チップと
対応する段差が形成されてパッケージ形状を成す凹部に
リード部を折り曲げた上記リードフレームを収納し、上
記凹部内に熱硬化型の透光性樹脂を充填して上記半導体
チップを封止する工程と、上記透光性樹脂を硬化して得
るパッケージの表面に、上記凹部底面の段差に対応して
形成される段差部分に合わせて、透光性の保護板を接着
剤を挾んで装着し、後に上記接着剤を硬化させる工程
と、を含むことを特徴とする固体撮像素子の製造方法。1. A step of mounting a semiconductor chip having a plurality of light receiving pixels arranged in a matrix on an island portion of a lead frame and bending the lead portion of the lead frame substantially perpendicular to the island portion, and the semiconductor chip on the bottom surface. A step of accommodating the lead frame, in which the lead portion is bent, in a concave portion having a step corresponding to the above and forming a package shape, and filling the concave portion with a thermosetting translucent resin to seal the semiconductor chip And, on the surface of the package obtained by curing the translucent resin, in accordance with the step portion formed corresponding to the step of the bottom surface of the recessed portion, a translucent protective plate is attached with an adhesive interposed therebetween, And a step of subsequently curing the adhesive.
板の形状と一致させることを特徴とする請求項１記載の
固体撮像素子の製造方法。2. The method for manufacturing a solid-state image sensor according to claim 1, wherein the shape of the step on the bottom surface of the recess is made to match the shape of the protective plate.
通して上記半導体チップの受光面に光を照射し、上記受
光画素の受光状態を確認して上記接着剤を硬化させるこ
とを特徴とする請求項１記載の固体撮像素子の製造方
法。3. After mounting the protective plate, the light receiving surface of the semiconductor chip is irradiated with light through the protective plate, the light receiving state of the light receiving pixels is confirmed, and the adhesive is cured. The method for manufacturing a solid-state image sensor according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4184016A JP2983767B2 (en) | 1992-07-10 | 1992-07-10 | Method for manufacturing solid-state imaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4184016A JP2983767B2 (en) | 1992-07-10 | 1992-07-10 | Method for manufacturing solid-state imaging device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11209426A Division JP3138260B2 (en) | 1999-07-23 | 1999-07-23 | Method for manufacturing solid-state imaging device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0629431A true JPH0629431A (en) | 1994-02-04 |
| JP2983767B2 JP2983767B2 (en) | 1999-11-29 |
Family
ID=16145867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4184016A Expired - Lifetime JP2983767B2 (en) | 1992-07-10 | 1992-07-10 | Method for manufacturing solid-state imaging device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2983767B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001111019A (en) * | 1999-08-04 | 2001-04-20 | Sharp Corp | Two-dimensional image detector |
| JP2007103967A (en) * | 1999-08-04 | 2007-04-19 | Sharp Corp | Two-dimensional image detector |
| US7866183B2 (en) | 2006-10-03 | 2011-01-11 | Donna Roth | Drink bottle and method of manufacturing same |
-
1992
- 1992-07-10 JP JP4184016A patent/JP2983767B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001111019A (en) * | 1999-08-04 | 2001-04-20 | Sharp Corp | Two-dimensional image detector |
| JP2007103967A (en) * | 1999-08-04 | 2007-04-19 | Sharp Corp | Two-dimensional image detector |
| US7866183B2 (en) | 2006-10-03 | 2011-01-11 | Donna Roth | Drink bottle and method of manufacturing same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2983767B2 (en) | 1999-11-29 |
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