JPH0629363A - Measuring method for electrical characteristic of semiconductor device - Google Patents
Measuring method for electrical characteristic of semiconductor deviceInfo
- Publication number
- JPH0629363A JPH0629363A JP4181994A JP18199492A JPH0629363A JP H0629363 A JPH0629363 A JP H0629363A JP 4181994 A JP4181994 A JP 4181994A JP 18199492 A JP18199492 A JP 18199492A JP H0629363 A JPH0629363 A JP H0629363A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- package
- loose
- measurement
- measuring method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体装置の電気的特
性測定方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for measuring electrical characteristics of a semiconductor device.
【０００２】[0002]
【従来の技術】従来の電気的特性測定方法は、図２の側
面図に示す様に、半導体装置のリード１と電極２とを接
触させることにより電気的特性測定を行っていた。その
際、測定を安定させる為に、リード１をプッシャー６に
より電極２に押しつけていた。2. Description of the Related Art In a conventional electric characteristic measuring method, as shown in the side view of FIG. 2, the electric characteristic is measured by bringing a lead 1 and an electrode 2 of a semiconductor device into contact with each other. At that time, in order to stabilize the measurement, the lead 1 was pressed against the electrode 2 by the pusher 6.
【０００３】[0003]
【発明が解決しようとする課題】この従来の電気的特性
測定方法では、測定時に半導体装置のリードと電極とを
接触させただけで測定を行っている為、半導体装置内部
にルーズコンタクト等の不良個所があっても不良品とし
て検出出来ず、良品と判定されてユーザーに納入される
為、品質が保障できないという問題点があった。In this conventional electrical characteristic measuring method, since the measurement is performed only by bringing the lead and the electrode of the semiconductor device into contact with each other at the time of measurement, a defect such as loose contact is caused inside the semiconductor device. Even if there is a part, it cannot be detected as a defective product, and it is judged to be a good product and delivered to the user, so there is a problem that the quality cannot be guaranteed.
【０００４】[0004]
【課題を解決するための手段】本発明の電気的特性測定
方法は、測定時に半導体装置パッケージに応力を加え、
パッケージを変形させて半導体装置内部のルーズコンタ
クト部をオープンにして測定を行う測定方法である。The electrical characteristic measuring method of the present invention is characterized in that stress is applied to a semiconductor device package during measurement,
This is a measurement method in which the package is deformed to open the loose contact portion inside the semiconductor device for measurement.
【０００５】[0005]
【実施例】次に本発明にていて図面を参照して説明す
る。図１は本発明の一実施例の電気的特性測定方法を説
明する側面図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 is a side view illustrating an electric characteristic measuring method according to an embodiment of the present invention.
【０００６】電極２上に配置された半導体装置のパッケ
ージ３上面をエアシリンダ４によって推力を得た加圧部
５が加圧し、押え台７とでパッケージ３をはさみ込む事
によりパッケージ３に応力をかけ、パッケージ３に点線
の様なたわみを発生させる。A pressure portion 5 which receives thrust from the air cylinder 4 presses the upper surface of the package 3 of the semiconductor device arranged on the electrode 2, and the package 3 is sandwiched by the presser base 7 so that stress is applied to the package 3. Then, the package 3 is bent as shown by the dotted line.
【０００７】この状態で測定を行った場合、ルーズコン
タクト品は、完全なオープン不良となり不良として検出
することが出来る。尚、推力を得る為のエアシリンダ４
を、ソレノイドもしくはその他のアクチュエーターを用
いても同様の検出が出来る。又、押え台にアクチュエー
ターを取り付ける事によっても同様な効果がある。When the measurement is performed in this state, the loose contact product becomes a complete open defect and can be detected as a defect. In addition, the air cylinder 4 for obtaining thrust
Can be detected by using a solenoid or other actuator. The same effect can be obtained by attaching an actuator to the presser base.
【０００８】[0008]
【発明の効果】以上説明したように本発明は、電気的特
性測定時に半導体装置に応力を加えるようにしたので、
ルーズコンタクト品の検出がで出来るという効果があ
り、従来約０．０１％程度のルーズコンタクト品が良品
と判定されていたが、本発明により皆無にするこのが可
能となった。As described above, according to the present invention, stress is applied to the semiconductor device at the time of measuring the electrical characteristics.
There is an effect that it is possible to detect loose-contact products, and conventionally about 0.01% of loose-contact products were determined to be non-defective products, but the present invention makes it possible to eliminate them.
【図１】本発明の一実施例を説明する側面図である。FIG. 1 is a side view illustrating an embodiment of the present invention.
【図２】従来の測定方法を説明する側面図である。FIG. 2 is a side view illustrating a conventional measuring method.
１ リード ２ 電極 ３ パッケージ ４ エアシリンダ ５ 加圧部 ６ プッシャー ７ 押え台 1 lead 2 electrode 3 package 4 air cylinder 5 pressurizing part 6 pusher 7 presser base
Claims (1)
て、半導体装置パッケージに応力を加え、パッケージを
変形させて半導体装置内部のルーズコンタクト部をオー
プンにして測定を行うことを特徴とする半導体装置の電
気的特性測定方法1. A method for electrically measuring a semiconductor device, wherein stress is applied to the semiconductor device package to deform the package to open a loose contact portion inside the semiconductor device for measurement. Electrical characteristics measurement method
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4181994A JPH0629363A (en) | 1992-07-09 | 1992-07-09 | Measuring method for electrical characteristic of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4181994A JPH0629363A (en) | 1992-07-09 | 1992-07-09 | Measuring method for electrical characteristic of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0629363A true JPH0629363A (en) | 1994-02-04 |
Family
ID=16110469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4181994A Withdrawn JPH0629363A (en) | 1992-07-09 | 1992-07-09 | Measuring method for electrical characteristic of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0629363A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5914159A (en) * | 1996-02-08 | 1999-06-22 | Asmo Co., Ltd. | Water-proofing structure for a case |
-
1992
- 1992-07-09 JP JP4181994A patent/JPH0629363A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5914159A (en) * | 1996-02-08 | 1999-06-22 | Asmo Co., Ltd. | Water-proofing structure for a case |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19991005 |