JPH06291233A - Semiconductor device and manufacture thereof - Google Patents

Abstract

PURPOSE:To enable a semiconductor device which can be mounted on a circuit board in a vertical surface mounting manner to be enhanced in heat dissipating properties. CONSTITUTION:A first semiconductor chip is mounted on a stage 6, a second and a third semiconductor chip, 8 and 9, are mounted on the surface of the first semiconductor chip, the semiconductor chips are sealed up with resin into a package 1, a part of the stage 6 is extended out of the package 1 to serve as a heat dissipating plate 4, the rear of the stage 6 where the first semiconductor chip is mounted and the rear sides of the semiconductor chips 8 and 9 are exposed out of the front surface of the package 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to improvement of heat dissipation and packaging density of a vertical type surface mountable semiconductor device.

[0002]

2. Description of the Related Art A semiconductor device containing a semiconductor chip used for a memory or the like is required to have a large storage capacity with a small occupation ratio on a circuit board, and therefore, is mounted on the circuit board. It is required to improve the density and mount a plurality of semiconductor chips on a single semiconductor device.

Recent semiconductor chips are highly integrated and tend to be large-scaled, and accordingly, the amount of heat generated during operation is also increased. Therefore, a semiconductor device accommodating such a semiconductor chip is more suitable. Improvement of heat dissipation is required. 2. Description of the Related Art Conventionally, there is a semiconductor device having a structure in which a package in which a semiconductor chip is sealed can be vertically surface-mounted on a circuit board for the purpose of improving the mounting density of the semiconductor device on the circuit board.

FIG. 5 shows this semiconductor device. In the figure, 1 is a package, 2 is an external lead, 3 is a support lead, and 14 is a circuit board. In such a semiconductor device, a plurality of external leads 2 and support leads 3 are extended from one side surface of a package 1 in which a semiconductor chip is sealed with a mold resin.

One end of each of the plurality of external leads 2 is connected to a semiconductor chip sealed inside the package 1, and the other end extends from one side surface of the package 1 and is bent near the package 1. Are doing The plurality of support leads 3 extend from the same side surface of the package 1 from which the external leads 2 extend, and have a structure in which they are bent in different directions near the package 1.

The package 1 is supported by the support leads 3 bent in different directions and fixed to the circuit board 14, and is electrically connected to the wiring pattern on the circuit board 14 by the external leads 2 and surface-mounted. Connection lead 2
Then, for surface mounting the support leads 3 on the circuit board 14, a reflow soldering method is used in which solder is supplied to the mounting locations in advance and the components are mounted by heating with infrared rays or the like.

A plurality of such semiconductor devices are mounted on a circuit board and used as a memory module or the like.

[0008]

However, since the conventional semiconductor device has a structure in which the semiconductor chip is sealed with a resin package, the heat generated by the semiconductor chip cannot be efficiently dissipated. Since heat is trapped inside the package, there is a problem that the performance of the mounted semiconductor chip cannot be fully exhibited.

Further, since there is no means for efficiently radiating the heat generated by the semiconductor chip, it is impossible to mount a plurality of semiconductor chips inside the package, and it is not possible to improve the semiconductor chip mounting density of the package. In order to solve these problems, it is an object of the present invention to provide a semiconductor device having a vertical surface mounting structure with improved heat dissipation and improved semiconductor chip mounting density.

[0010]

In the semiconductor device of the present invention, as shown in FIG. 1, a stage 6 on which a semiconductor chip 7 is mounted and a resin package 1 for sealing the semiconductor chip 7 and the stage 6 are provided. A plurality of external leads 2 and supporting leads 3 extending from one side surface of the resin package 1 and bent in the vicinity of the resin package 1, and a short side surface of the resin package 1 from which the external leads 2 extend. The resin package 1 has a heat dissipation plate 4 extending from two side surfaces adjacent to the side and bent.
Is held on the circuit board 14 in an independent state.

Further, a part of the stage 6 extends to the outside of the resin package 1 to form the heat dissipation plate 4, the through hole 5 is provided in the heat dissipation plate 4, and the heat dissipation is performed. A support portion 15 is provided at the lower end of the plate 4, and the resin package 1 is supported by the support portion 15.
Is held on the circuit board 14 in an independent state.

Further, the first semiconductor chip 7 is mounted on the stage 6, and the second and third semiconductor chips 7 are mounted on the element formation surface of the first semiconductor chip 7 by the insulating adhesive tape 10 having the wiring 13 inside. Of the semiconductor chips 8 and 9 are mounted so as to face each other, and the back surface of the stage 6 where the first semiconductor chip 7 is mounted and the back surfaces of the second and third semiconductor chips 8 and 9 are mounted. Is exposed on the surface of the resin package 1.

In the method of mounting a semiconductor device according to the present invention, a plurality of the packages 1 are mounted on the circuit board 14 so that the heat sinks 4 are substantially parallel to the heat sinks 4 of the adjacent packages 1, and the support leads 3 are provided. And a step of fixing to the circuit board 14 so as to be held in a self-supporting state by the support portion 15.

[0014]

According to the semiconductor device of the present invention, since the stage on which the semiconductor chip is mounted is extended to the outside of the package and serves as a heat dissipation plate, the heat generated by the semiconductor chip can be efficiently dissipated, and a plurality of semiconductors can be packaged in the package. It becomes possible to mount a chip.

Further, the heat radiating plate has a lower end bent to form a supporting portion, and the supporting portion has a function of vertically fixing the package to the circuit board, so that the package is more firmly fixed to the circuit board. be able to. A plurality of semiconductor devices according to the present invention may be mounted on a circuit board, but the heat dissipation plate is provided with through holes for allowing air from a blower fan to pass therethrough. Since turbulent flow due to wind wraparound can be prevented and the air can be sent to the semiconductor devices in every corner of the circuit board, heat dissipation can be improved. The through holes also have a function of improving the heat dissipation of the heat dissipation plate.

Further, the heat sink extending from the package is
When multiple packages are mounted on a circuit board, they are bent so as to be substantially parallel to the heat sinks of the adjacent packages, so they can be mounted at the same density as the conventional semiconductor device mounted on the circuit board. it can. In the semiconductor device according to the present invention, by the insulating adhesive tape having wiring inside,
The element formation surfaces of the second and third semiconductor chips can be mounted face-to-face with the element formation surface of the first semiconductor chip mounted on the stage, and the semiconductor chip mounting density of the semiconductor device can be improved.

Further, since the rear surface of the stage where the first semiconductor chip is mounted and the rear surfaces of the second and third semiconductor chips are exposed on the package surface, the heat generated by the semiconductor chip can be efficiently generated. Can dissipate heat.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention is shown in FIGS. 1, 2, 3 and 4. In the figure, 1 is a package, 2 is an external lead, 3 is a support lead, 4 is a heat dissipation plate, 5 is a through hole, 6 is a stage, 7, 8 and 9 are semiconductor chips, 10 is an adhesive tape, 1
Reference numeral 4 is a circuit board, and 15 is a supporting portion.

FIG. 1A is a front perspective view of the semiconductor device according to the present invention, and FIG. 1B is a rear perspective view thereof.
A bottom view is shown in (a), and a side view is shown in (b). In the semiconductor device of the present invention, the plurality of external leads 2 and the support leads 3 extend from one side surface of the package 1, and the heat dissipation plate 4 extends from two side surfaces adjacent to the one side surface of the package 1 where the external leads 2 extend. It has a structure.

The external lead 2 has one end connected to the semiconductor chips 7, 8 and 9 inside the package 1, the other end extending outside the package 1, bent along the package 1, and placed on the circuit board 14. It can be connected to the wiring. One end of the support lead 3 is embedded in the package 1,
The other end is a portion extending from the package 1 and is bent in opposite directions so that the package 1 can be vertically fixed to the circuit board 14.

The heat radiating plate 4 is a part of the stage 6 which is sealed in the package 1 and extends to the outside. The heat radiating plate 4 is provided with a through hole 5 for improving heat radiation and the lower end is bent. Thus, the supporting portion 15 is formed. The heat dissipation plate 4 is bent near the package 1 toward the front or back of the package 1. By fixing the support portion 15 to the circuit board 14, the package 1 can be more stably mounted on the vertical surface. .

It is also possible to vertically fix the package 1 to the circuit board 14 only by the support portion 15 of the heat dissipation plate 4 without providing the support lead 3 on the package 1. Circuit board 1 of external lead 2, support lead 3, and support portion 15 of heat sink 4
For fixing and connecting to 4, the reflow soldering method is used in which solder is previously supplied to the mounting location and heated by infrared rays or the like to mount the component.

On the surface of the package 1 of this semiconductor device, the back surface of the stage 6 on which the semiconductor chip 7 is mounted and the back surfaces of the semiconductor chips 8 and 9 are exposed, so that the heat dissipation is improved. . FIG. 3 (a) is a sectional view of a semiconductor device according to the present invention, and FIG. 3 (b) shows a semiconductor chip connection structure.

As shown in FIG. 3A, in the semiconductor device according to the present invention, the first semiconductor chip 7 is mounted on the stage 6, and the second semiconductor chip 8 is formed on the element forming surface of the first semiconductor chip 7. Then, the element forming surfaces of the third semiconductor chip 9 are mounted so as to face each other, and they are molded with resin to form the package 1. Ag paste or the like is used to fix the first semiconductor chip 7 to the stage 6, and an adhesive resin is used to fix the element forming surfaces of the semiconductor chips 8 and 9 to the element forming surface of the semiconductor chip 7. The tape 10 is used. The adhesive tape 10 has wiring 13 inside.

The stage 6 is formed so that both sides of the portions on which the semiconductor chips 7, 8 and 9 are mounted serve as the heat radiating plate 4, and is extended to the outside of the package 1 when it is resin-sealed. There is. Further, at the time of resin sealing, the back surface of the portion of the stage 6 on which the first semiconductor chip 7 is mounted and the back surfaces of the second and third semiconductor chips 8 and 9 are exposed on the surface of the package 1. The semiconductor chips 7, 8, 9
The generated heat can be efficiently dissipated to the outside of the package 1.

As shown in FIG. 3 (b), the semiconductor chips 7, 8 and 9 are provided with a pad 12 in the central portion, and the pad 12 and the external lead 2 are insulated from each other by an insulating adhesive tape 10.
Signals are exchanged with the outside of the package 1 by connecting with the wiring 13 provided inside. A plurality of semiconductor devices according to the present invention are mounted on a circuit board 14 for use as shown in FIG. Since the flow can be prevented and air can be blown to every corner of the circuit board 14, heat dissipation of all the semiconductor devices on the circuit board 14 can be improved.

Since the heat sink 4 of the package 1 on the circuit board 14 is bent so as to be substantially parallel to the heat sink 4 of the adjacent package 1, the conventional semiconductor device is mounted on the circuit board. It can be mounted at the same density as the density.

[0028]

As described above, according to the present invention, it is possible to obtain a vertical surface mountable semiconductor device having a high mounting density of semiconductor chips, an excellent heat dissipation property and a high mounting density on a circuit board. .

[Brief description of drawings]

1A and 1B are views showing a semiconductor device according to an embodiment of the present invention, in which FIG. 1A is a front perspective view and FIG. 1B is a rear perspective view.

2A and 2B are views showing a semiconductor device according to an embodiment of the present invention, in which FIG. 2A is a bottom view and FIG. 2B is a side view.

3A and 3B are diagrams showing an internal structure of a semiconductor device according to an embodiment of the present invention. FIG. 3A is a sectional view and FIG. 3B is a semiconductor chip connection structure.

FIG. 4 is a diagram showing a state in which a plurality of semiconductor devices according to an embodiment of the present invention are mounted on a circuit board.

5A and 5B are diagrams showing a conventional semiconductor device having a vertical surface mounting structure. FIG. 5A is a bottom view and FIG. 5B is a perspective view.

[Explanation of sign]

 1 ... Package 2 ... External lead 3 ... Support lead 4 ... Heat sink 5 ... Through hole 6 ... Stage 7, 8, 9 ... Semiconductor chip 10 ... Adhesive tape 12 ... Pads 13 ... Wiring 14 ... Circuit board 15 ... Support part

─────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] December 6, 1993

[Procedure Amendment 1]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 1

[Correction method] Change

[Correction content]

[Figure 1]

[Procedure Amendment 2]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 2

[Correction method] Change

[Correction content]

[Fig. 2]

[Procedure 3]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 3

[Correction method] Change

[Correction content]

[Figure 3]

Front page continued (72) Inventor Masanori Yoshimoto 1015 Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Fujitsu Limited

Claims (6)

[Claims] 1. A stage (6) on which a semiconductor chip (7) is mounted, a resin package (1) for sealing the semiconductor chip (7) and the stage (6), and one side surface of the resin package (1). A plurality of external leads (2) and supporting leads (3) extending from the resin package (1) and bent in the vicinity of the resin package (1), and one side surface of the resin package (1) from which the external leads (2) extend. The resin package (1) is provided on the circuit board (14) by the support lead (3) and the heat dissipation plate (4), which has a heat dissipation plate (4) extending from two short sides adjacent to the short side and bent. A semiconductor device characterized by being held in an independent state. 2. The semiconductor device according to claim 1, wherein a part of the stage (6) extends to the outside of the resin package (1) to form the heat dissipation plate (4). 3. A through hole (5) in the heat sink (4).
The semiconductor device according to claim 1, further comprising: 4. A support portion (1) is provided at a lower end of the heat dissipation plate (4).
5. The semiconductor device according to claim 1, further comprising: 5), wherein the support portion (15) holds the resin package (1) on the circuit board (14) in an independent state. 5. An insulating adhesive tape (1) having a first semiconductor chip (7) mounted on the stage (6) and having wirings (13) inside.
0), the element forming surfaces of the second and third semiconductor chips (8, 9) are mounted face-to-face with the element forming surface of the first semiconductor chip (7). The rear surface of the stage (6) on which (7) is mounted and the second and third semiconductor chips (8,
9) The semiconductor device according to claim 1, wherein the back surface is exposed on the front surface of the resin package (1). 6. The semiconductor device according to claim 1, wherein the package (1) is circuited so that the radiator plate (4) is substantially parallel to the radiator plate (4) of an adjacent package (1). A plurality of substrates (14) are mounted, and the support leads (3) are provided.
And a step of fixing to the circuit board (14) so as to be held in a self-supporting state by the support part (15).