JPH0628921U - Light emitting device storage package - Google Patents
Light emitting device storage packageInfo
- Publication number
- JPH0628921U JPH0628921U JP065523U JP6552392U JPH0628921U JP H0628921 U JPH0628921 U JP H0628921U JP 065523 U JP065523 U JP 065523U JP 6552392 U JP6552392 U JP 6552392U JP H0628921 U JPH0628921 U JP H0628921U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting element
- insulating base
- emitting diode
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
(57)【要約】
【目的】表示文字、画像の鮮明度が高い表示装置を得る
ことができる発光素子収納用パッケージを提供すること
にある。
【構成】発光素子３が載置される載置部１ａ及び発光素
子３の電極が電気的に接続される複数個のメタライズ配
線層５を有する白色絶縁基体１と、前記白色絶縁基体１
に該白色絶縁基体１の発光素子載置部１ａを囲繞するよ
うにして取着された黒色絶縁枠体２とから成る。
(57) [Abstract] [Purpose] To provide a package for housing a light emitting element, which can obtain a display device with high definition of displayed characters and images. A white insulating base 1 having a mounting portion 1a on which a light emitting element 3 is mounted and a plurality of metallized wiring layers 5 to which electrodes of the light emitting element 3 are electrically connected, and the white insulating base 1
And a black insulating frame 2 attached so as to surround the light emitting element mounting portion 1a of the white insulating base 1.
Description
【０００１】[0001]
本考案は発光ダイオード等の発光素子を用いた表示装置において、発光素子を 収容するために使用される発光素子収納用パッケージの改良に関するものである 。 The present invention relates to an improvement of a light emitting device housing package used for housing a light emitting device in a display device using a light emitting device such as a light emitting diode.
【０００２】[0002]
発光ダイオードはその輝度の向上により表示装置の表示素子として多用される ようになってきた。 Light emitting diodes have come to be widely used as display elements of display devices due to their improved brightness.
【０００３】 かかる発光ダイオードを使用した表示装置は通常、図２に示すようにまず酸化 アルミニウム質焼結体から成る白色の絶縁基体12の表面に多数の凹部13をマトリ クス状に配列形成するとともに該凹部13の底面から下面にかけて複数個のメタラ イズ配線層14を被着させた発光素子収納用パッケージ11を準備し、次に前記発光 素子収納用パッケージの各凹部13内に発光ダイオード15を個々に取着収容すると ともに各発光ダイオード15の電極をメタライズ配線層14に電気的に接続させるこ とによって形成されており、パッケージ11の各凹部13内に収容された各発光ダイ オード15にメタライズ配線層14を介して所定の電力を印加し、各発光ダイオード 15を選択的に発光させることによって文字や画像が表示できるようになっている 。In a display device using such a light emitting diode, generally, as shown in FIG. 2, first, a large number of concave portions 13 are formed in a matrix form on the surface of a white insulating base 12 made of an aluminum oxide sintered body. A package 11 for housing a light emitting device is prepared in which a plurality of metallized wiring layers 14 are applied from the bottom surface to the bottom surface of the recess 13, and then a light emitting diode 15 is individually placed in each recess 13 of the package for housing a light emitting device. It is formed by electrically mounting the electrodes of each light emitting diode 15 to the metallized wiring layer 14 and electrically connecting the electrodes of each light emitting diode 15 to the metallized wiring layer 14. Characters and images can be displayed by applying a predetermined electric power through the layer 14 and selectively causing each light emitting diode 15 to emit light.
【０００４】 しかしながら、近時、表示装置は表示する文字や画像の鮮明度を向上させるた めに発光素子収納用パッケージ11への単位面積当たりの発光ダイオードの収容数 が大幅に増大しており、パッケージ11の絶縁基体12表面に形成する凹部13もその 隣接する凹部13間の壁16の厚みが0.3mm 程度の薄いものとして多数形成されるよ うになってきた。However, recently, in the display device, the number of light emitting diodes accommodated in a unit area of the light emitting device housing package 11 has significantly increased in order to improve the sharpness of characters and images to be displayed. Many recesses 13 are formed on the surface of the insulating substrate 12 of the package 11, and the wall 16 between the recesses 13 adjacent to each other is thin and the thickness of the wall 16 is about 0.3 mm.
【０００５】 そのためこの発光素子収納用パッケージ11に発光ダイオード15を収容させて表 示装置となすと、各発光ダイオード15を発光させ表示装置として作動させた場合 、各発光ダイオード15が発する光は壁16の厚さが薄いことによって壁16を透過し 、隣接する凹部13内に漏れてしまい、その結果、発光ダイオード15の発光による 文字や画像ににじみが生じ、不鮮明なものとなってしまう欠点を招来した。Therefore, if a light emitting diode 15 is housed in the light emitting element housing package 11 to form a display device, when each light emitting diode 15 emits light and is operated as a display device, the light emitted from each light emitting diode 15 is a wall. Since the thickness of 16 is small, it penetrates through the wall 16 and leaks into the adjacent recessed portion 13, resulting in blurring of characters and images due to the light emission of the light emitting diode 15 and making it unclear. I was invited.
【０００６】 そこで上記欠点を解消するために白色の絶縁基体12に二酸化チタン(TiO2 ) 等 を添加含有させて黒色化し、発光ダイオード15の発する光が壁16を透過して隣接 する凹部13に漏れるのを有効に防止することが検討されている。Therefore, in order to eliminate the above-mentioned drawbacks, titanium dioxide (TiO 2 ) or the like is added to the white insulating substrate 12 to make it black, and the light emitted from the light emitting diode 15 is transmitted through the wall 16 to the adjacent concave portion 13. Effective prevention of leakage is being considered.
【０００７】[0007]
しかしながら、白色の絶縁基体12に二酸化チタン(TiO2 ) 等を添加含有させて 黒色化した場合、絶縁基体12の絶縁性が二酸化チタン(TiO2 ) 等によって低下し 、隣接するメタライズ配線層14間に絶縁不良による漏洩電流が流れ、信号入力の 減衰、クロストーク現象等の弊害が発生するという欠点を誘発してしまう。However, when titanium dioxide (TiO 2 ) or the like is added to the white insulating substrate 12 to make it black, the insulating property of the insulating substrate 12 is deteriorated by titanium dioxide (TiO 2 ) or the like, and the space between the adjacent metallized wiring layers 14 is reduced. Leakage current flows due to poor insulation, which causes the drawbacks such as signal input attenuation and crosstalk phenomenon.
【０００８】[0008]
本考案は上記欠点に鑑み案出されたもので、その目的は表示文字、画像の鮮明 度が高い表示装置を得ることができる発光素子収納用パッケージを提供すること にある。 The present invention has been devised in view of the above-mentioned drawbacks, and an object thereof is to provide a package for housing a light emitting element, which can obtain a display device with high definition of displayed characters and images.
【０００９】[0009]
本考案の発光素子収納用パッケージは発光素子が載置される載置部及び発光素 子の電極が電気的に接続される複数個のメタライズ配線層を有する白色絶縁基体 と、前記白色絶縁基体に該白色絶縁基体の発光素子載置部を囲繞するようにして 取着された黒色絶縁枠体とから成ることを特徴とするものである。 The light emitting device housing package of the present invention includes a mounting portion on which a light emitting device is mounted and a white insulating substrate having a plurality of metallized wiring layers to which electrodes of the light emitting device are electrically connected, and the white insulating substrate. And a black insulating frame attached to surround the light emitting element mounting portion of the white insulating base.
【００１０】[0010]
次に本考案を添付図面に基づき詳細に説明する。 図1 は本考案の発光素子収納用パッケージの一実施例を示す断面図であり、1 は白色を呈する絶縁基体、2 は黒色を呈する絶縁枠体である。 Next, the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a cross-sectional view showing an embodiment of a package for housing a light emitting device according to the present invention, in which 1 is an insulating base body having a white color and 2 is an insulating frame body having a black color.
【００１１】 前記絶縁基体1 はその上面に発光素子としての発光ダイオード3 が載置される 載置部1aがマトリクス状に多数配列されており、各載置部1a上には発光ダイオー ド3 が導電性の接着剤4 を介して接着固定される。On the upper surface of the insulating substrate 1, a plurality of mounting portions 1a on which light emitting diodes 3 as light emitting elements are mounted are arranged in a matrix, and the light emitting diodes 3 are arranged on each mounting portion 1a. It is fixed by adhesion via a conductive adhesive 4.
【００１２】 前記絶縁基体1 は酸化アルミニウム質焼結体から成り、例えばアルミナ(Al 2 O 3 ) 、シリカ(SiO2 ) 、カルシア(CaO) 、マグネシア(MgO) 等の原料粉末に適 当な有機溶剤、溶媒を添加混合して泥漿状となすとともにこれをドクターブレー ド法やカレンダーロール法を採用することによってセラミックグリーンシート( セラミック生シート) を形成し、しかる後、前記セラミックグリーンシートに適 当な打ち抜き加工を施すとともに複数枚積層し、高温( 約1600℃) で焼成するこ とによって製作される。The insulating substrate 1 is made of an aluminum oxide sintered body, and is made of an organic material suitable for a raw material powder such as alumina (Al 2 O 3 ), silica (SiO 2 ), calcia (CaO), and magnesia (MgO). A ceramic green sheet (ceramic green sheet) is formed by adding a solvent and a solvent to form a slurry and adopting a doctor blade method or a calendar roll method, and then applying the ceramic green sheet. It is manufactured by performing various punching processes, stacking multiple sheets, and baking at high temperature (about 1600 ° C).
【００１３】 また前記絶縁基体1 は発光ダイオード3 が載置される各載置部1aから下面にか けて各々一対のメタライズ配線層5 が被着形成されている。A pair of metallized wiring layers 5 are formed on the insulating substrate 1 from the mounting portions 1a on which the light emitting diodes 3 are mounted to the lower surface.
【００１４】 前記一対のメタライズ配線層5 は発光ダイオード3 に外部電気回路から供給さ れる電力を印加して発光ダイオード3 に所定の輝度の発光をさせる作用を為し、 一方のメタライズ配線層5 上には発光ダイオード3 が該発光ダイオード3 の一方 の電極をメタライズ配線層5 に電気的接続するようにして導電性接着剤4 により 接着され、また他方のメタライズ配線層5 には発光ダイオード3 の他の電極がボ ンディングワイヤ6 を介して電気的に接続される。この場合、前記メタライズ配 線層5 は酸化アルミニウム質焼結体等の白色絶縁基体1 に形成され、絶縁基体1 の絶縁性が優れていることから隣接するメタライズ配線層5 間に絶縁不良による 漏洩電流が流れることはなく、信号入力の減衰、クロストーク現象等の弊害が発 生することもない。The pair of metallized wiring layers 5 has a function of applying electric power supplied from an external electric circuit to the light emitting diode 3 to cause the light emitting diode 3 to emit light of a predetermined brightness. Is attached to the metallized wiring layer 5 with a conductive adhesive 4 so as to electrically connect one electrode of the light-emitting diode 3 to the metallized wiring layer 5, and the other metallized wiring layer 5 is attached to the other metallized wiring layer 5. Are electrically connected to each other via the bonding wire 6. In this case, the metallized wiring layer 5 is formed on the white insulating substrate 1 such as an aluminum oxide sintered body, and since the insulating substrate 1 has excellent insulation properties, leakage due to poor insulation between the adjacent metallized wiring layers 5 is caused. No current flows, and no adverse effects such as signal input attenuation and crosstalk phenomenon occur.
【００１５】 前記メタライズ配線層5 はタングステン、モリブデン、マンガン等の高融点金 属粉末から成り、例えばタングステン等の粉末に適当な有機溶剤、溶媒を添加混 合して得た金属ペーストを絶縁基体1 となるセラミックグリーンシートに予め従 来周知のスクリーン印刷法を採用し所定パターンに印刷塗布しておくことによっ て絶縁基体1 の所定位置に被着形成される。The metallized wiring layer 5 is made of a refractory metal powder such as tungsten, molybdenum, or manganese. For example, a metal paste obtained by adding a suitable organic solvent or a solvent to powder of tungsten or the like is used as the insulating substrate 1. The ceramic green sheet to be formed is previously formed by applying a well-known screen printing method to a predetermined pattern by printing and coating, so that it is adhered and formed at a predetermined position of the insulating substrate 1.
【００１６】 また前記メタライズ配線層5 はその露出する表面にニッケル、金等の耐蝕性に 優れ、且つ良導電性である金属をメッキ法により1.0 乃至20.0μm の厚みに層着 させておくとメタライズ配線層5 の酸化腐食が有効に防止されるとともにメタラ イズ配線層5 に発光ダイオード3 を取着する際、その取着強度を極めて強固なも のとなすことができる。従って、前記メタライズ配線層5 はその露出表面にニッ ケル、金等をメッキ法により1.0 乃至20.0μm の厚みに被着させておくことが好 ましい。The metallized wiring layer 5 is formed by depositing a metal such as nickel or gold, which has excellent corrosion resistance and good conductivity, on the exposed surface by plating to a thickness of 1.0 to 20.0 μm. Oxidation and corrosion of the wiring layer 5 can be effectively prevented, and when the light emitting diode 3 is attached to the metallized wiring layer 5, the attachment strength can be extremely strong. Therefore, it is preferable to deposit nickel, gold or the like on the exposed surface of the metallized wiring layer 5 by a plating method to a thickness of 1.0 to 20.0 μm.
【００１７】 更に前記メタライズ配線層5 上に発光ダイオード3 を接着する導電性の接着剤 4 は、例えば半田等のロウ材やエポキシ樹脂に金属粉末を含有させた導電性樹脂 等が好適に使用される。Further, as the conductive adhesive 4 for bonding the light emitting diode 3 on the metallized wiring layer 5, for example, a brazing material such as solder or a conductive resin containing epoxy resin containing metal powder is preferably used. It
【００１８】 前記絶縁基体1 はまたその上面に黒色を呈する絶縁枠体2 が発光ダイオード3 を載置する各載置部1aを囲繞するようにして取着されており、該絶縁基体1 と絶 縁枠体2 とで各載置部1a上に発光ダイオード3 を収容する凹部を形成している。The insulating base body 1 is also attached so that an insulating frame body 2 having a black color on its upper surface surrounds each mounting portion 1 a on which the light emitting diode 3 is mounted, and is insulated from the insulating base body 1. With the edge frame body 2, a recess for accommodating the light emitting diode 3 is formed on each mounting portion 1a.
【００１９】 前記絶縁枠体2 は黒色を呈することから光の透過が防止され、隣接する発光ダ イオード3 間の壁7 の厚みが0.3mm 程度の薄いものになったとしても各発光ダイ オード3 が発する光は壁7 を透過して隣接する発光ダイオード3 側に漏れること は殆どなく、これによって各発光ダイオード3 の発光輪郭を明確とし、表示文字 、画像を鮮明なものとなすことができる。Since the insulating frame 2 has a black color, the transmission of light is prevented, and even if the thickness of the wall 7 between the adjacent light emitting diodes 3 is as thin as about 0.3 mm, each light emitting diode 3 Light emitted by the LED hardly passes through the wall 7 and leaks to the adjacent light emitting diode 3 side, whereby the light emitting contour of each light emitting diode 3 can be made clear and the displayed characters and images can be made clear.
【００２０】 また前記黒色絶縁枠体2 は光の透過を有効に防止し、壁7 の厚みを0.3mm 程度 まで薄くしても発光ダイオード3 の発する光が隣接する発光ダイオード3 側に漏 れないことから発光ダイオード3 を絶縁基体1 の上面に高密度に載置することが でき、その結果、表示文字、画像の鮮明度をより向上させることができる。The black insulating frame 2 effectively prevents the transmission of light, and even if the thickness of the wall 7 is reduced to about 0.3 mm, the light emitted from the light emitting diode 3 does not leak to the adjacent light emitting diode 3 side. Therefore, the light emitting diodes 3 can be mounted on the upper surface of the insulating substrate 1 with high density, and as a result, the definition of displayed characters and images can be further improved.
【００２１】 尚、前記黒色絶縁枠体2 は酸化アルミニウム質焼結体に黒色の顔料を添加した ものから成り、例えばアルミナ(Al 2 O 3 ) 、シリカ(SiO2 ) 、カルシア(CaO) 、マグネシア(MgO) 等の原料粉末に顔料としての二酸化チタン(TiO2 ) 、酸化モ リブデン(MoO2 ) 、酸化クロム(Cr 2 O 3 ) 等と適当な有機溶剤、溶媒を添加混 合して泥漿状となすとともにこれをドクターブレード法やカレンダーロール法を 採用することによってセラミックグリーンシート( セラミック生シート) を形成 し、しかる後、前記セラミックグリーンシートに適当な打ち抜き加工を施すとと もに高温で焼成することによって製作される。The black insulating frame 2 is made of an aluminum oxide sintered body to which a black pigment is added. For example, alumina (Al 2 O 3 ), silica (SiO 2 ), calcia (CaO), magnesia. Titanium dioxide (TiO 2 ) as a pigment, molybdenum oxide (MoO 2 ), chromium oxide (Cr 2 O 3 ), etc., and a suitable organic solvent and solvent are added to the raw material powder such as (MgO), and mixed to form a slurry. The ceramic green sheet (ceramic green sheet) is formed by using the doctor blade method or calender roll method, and then the ceramic green sheet is appropriately punched and baked at high temperature. It is produced by doing.
【００２２】 また前記絶縁枠体2 と絶縁基体1 との取着は絶縁基体1 となるセラミックグリ ーンシートの上部に絶縁枠体2 となるセラミックグリーンシートを積層し、しか る後、これを焼成し、両者を焼結一体化させることによって行われる。尚、この 場合、絶縁枠体2 の主成分を絶縁基体1 の主成分と同じものにしておくと絶縁枠 体2 は絶縁基体1 上に極めて強固に取着され、両者間に両者の熱膨張係数等の相 違に起因する熱応力が発生して反りや剥離が生じることは一切なくなる。従って 、前記絶縁枠体2 はその主成分を絶縁基体1 の主成分と同じものにしておくこと が好ましい。In addition, the insulating frame 2 and the insulating base 1 are attached to each other by laminating a ceramic green sheet to be the insulating frame 2 on top of the ceramic green sheet to be the insulating base 1, and then firing this. , Both are integrated by sintering. In this case, if the main component of the insulating frame 2 is the same as the main component of the insulating substrate 1, the insulating frame 2 is attached extremely firmly on the insulating substrate 1 and the thermal expansion of both There is no occurrence of warpage or peeling due to thermal stress due to the difference in the coefficient. Therefore, it is preferable that the main component of the insulating frame 2 is the same as the main component of the insulating base 1.
【００２３】 かくして本考案の発光素子収納用パッケージによれば、絶縁基体1 の発光素子 載置部1a上に発光ダイオード3 を導電性の接着剤4 を介して接着するとともに発 光ダイオード3 の電極をボンディングワイヤ6 を介して電気的に接続し、しかる 後、絶縁基体1 と絶縁枠体2 とで形成される凹部内にエポキシ樹脂等の透明な樹 脂を充填し、発光ダイオード3 を気密に封入することによって最終製品としての 表示装置となる。Thus, according to the package for housing the light emitting device of the present invention, the light emitting diode 3 is bonded onto the light emitting device mounting portion 1a of the insulating substrate 1 through the conductive adhesive 4 and the electrode of the light emitting diode 3 is attached. Are electrically connected via a bonding wire 6, and then a transparent resin such as epoxy resin is filled in the recess formed by the insulating base 1 and the insulating frame 2 to hermetically seal the light emitting diode 3. By enclosing it, it becomes a display device as the final product.
【００２４】 尚、本考案は上述の実施例に限定されるものではなく、本考案の要旨を逸脱し ない範囲であれば種々の変更は可能である。It should be noted that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention.
【００２５】[0025]
本考案の発光素子収納用パッケージによれば、発光素子の電極が接続されるメ タライズ配線層が絶縁性に優れた白色を呈する絶縁基体に形成されているため隣 接するメタライズ配線層間に絶縁不良による漏洩電流が流れることはなく、信号 入力の減衰、クロストーク現象等の弊害が発生することもない。 According to the package for accommodating a light emitting device of the present invention, the metallized wiring layer to which the electrodes of the light emitting element are connected is formed on the insulating base body which exhibits white with excellent insulation properties, so that insulation failure may occur between the adjacent metallized wiring layers. There is no leakage current, and there are no problems such as signal input attenuation and crosstalk.
【００２６】 また絶縁基体の上部に、該絶縁基体の発光素子が載置される載置部を囲繞する ようにして光の透過を有効に防止する黒色の絶縁枠体を取着させたことから隣接 する発光素子間の壁の厚みが0.3mm 程度の薄いものになったとしても各発光素子 が発する光は壁を透過して隣接する発光素子側に漏れることは殆どなく、これに よって各発光素子の発光輪郭を明確とし、表示文字、画像を鮮明なものとなすこ とができる。Further, a black insulating frame body is attached to the upper part of the insulating base so as to surround the mounting portion on which the light emitting element of the insulating base is mounted so as to effectively prevent the transmission of light. Even if the thickness of the wall between adjacent light emitting elements is thin, about 0.3 mm, the light emitted by each light emitting element rarely passes through the wall and leaks to the adjacent light emitting element side. The emission contours of the device can be made clear and the displayed characters and images can be made clear.
【００２７】 更に前記黒色絶縁枠体は光の透過を有効に防止し、壁の厚みを0.3mm 程度まで 薄くしても発光素子の発する光が隣接する発光素子側に漏れないことから発光素 子を絶縁基体の上面に高密度に載置することができ、その結果、表示文字、画像 の鮮明度をより向上させることができる。Further, the black insulating frame effectively prevents the transmission of light, and even if the wall thickness is reduced to about 0.3 mm, the light emitted from the light emitting element does not leak to the adjacent light emitting element side. Can be mounted on the upper surface of the insulating substrate with high density, and as a result, the sharpness of displayed characters and images can be further improved.
【図１】本考案の発光素子収納用パッケージの一実施例
を示す断面図である。FIG. 1 is a sectional view showing an embodiment of a package for housing a light emitting device according to the present invention.
【図２】従来の発光素子収納用パッケージの断面図であ
る。FIG. 2 is a cross-sectional view of a conventional package for housing a light emitting device.
１・・・絶縁基体 １ａ・・発光素子載置部 ２・・・絶縁枠体 ３・・・発光ダイオード ５・・・メタライズ配線層 ７・・・壁 DESCRIPTION OF SYMBOLS 1 ... Insulating substrate 1a ... Light emitting element mounting portion 2 ... Insulating frame 3 ... Light emitting diode 5 ... Metallized wiring layer 7 ... Wall
Claims (2)
の電極が電気的に接続される複数個のメタライズ配線層
を有する白色絶縁基体と、前記白色絶縁基体に該白色絶
縁基体の発光素子載置部を囲繞するようにして取着され
た黒色絶縁枠体とから成る発光素子収納用パッケージ。1. A white insulating base having a mounting portion on which a light emitting element is mounted and a plurality of metallized wiring layers to which electrodes of the light emitting element are electrically connected, and the white insulating base on the white insulating base. A package for housing a light emitting element, comprising a black insulating frame attached so as to surround a light emitting element mounting portion.
分を同一とする絶縁材料により形成されていることを特
徴とする請求項１記載の発光素子収納用パッケージ。2. The package for housing a light emitting element according to claim 1, wherein the white insulating base body and the black insulating frame body are formed of an insulating material having the same main components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP065523U JPH0628921U (en) | 1992-09-21 | 1992-09-21 | Light emitting device storage package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP065523U JPH0628921U (en) | 1992-09-21 | 1992-09-21 | Light emitting device storage package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0628921U true JPH0628921U (en) | 1994-04-15 |
Family
ID=13289471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP065523U Pending JPH0628921U (en) | 1992-09-21 | 1992-09-21 | Light emitting device storage package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0628921U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005035864A (en) * | 2002-10-15 | 2005-02-10 | Kenichiro Miyahara | Substrate for mounting luminous element |
| JP2015043403A (en) * | 2013-07-26 | 2015-03-05 | 京セラ株式会社 | Package for storing light emitting element, light emitting device including the same, and light emitting display device including the light emitting device |
-
1992
- 1992-09-21 JP JP065523U patent/JPH0628921U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005035864A (en) * | 2002-10-15 | 2005-02-10 | Kenichiro Miyahara | Substrate for mounting luminous element |
| JP2015043403A (en) * | 2013-07-26 | 2015-03-05 | 京セラ株式会社 | Package for storing light emitting element, light emitting device including the same, and light emitting display device including the light emitting device |
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