JPH08274378A - Package for light emitting element - Google Patents

Package for light emitting element

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Publication number
JPH08274378A
JPH08274378A JP7327795A JP7327795A JPH08274378A JP H08274378 A JPH08274378 A JP H08274378A JP 7327795 A JP7327795 A JP 7327795A JP 7327795 A JP7327795 A JP 7327795A JP H08274378 A JPH08274378 A JP H08274378A
Authority
JP
Japan
Prior art keywords
light
emitting element
light emitting
package
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7327795A
Other languages
Japanese (ja)
Inventor
Makoto Konishi
真琴 小西
Original Assignee
Kyocera Corp
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp, 京セラ株式会社 filed Critical Kyocera Corp
Priority to JP7327795A priority Critical patent/JPH08274378A/en
Publication of JPH08274378A publication Critical patent/JPH08274378A/en
Application status is Pending legal-status Critical

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Abstract

PURPOSE: To provide a package for a light emitting element which can make clear the letters or images made by the light of a light emitting element by raising the brightness of light emitted by the light emitting element and also, making the contour clear. CONSTITUTION: In a package for storage of a light emitting element, where a recess 1a for accommodating a light emitting element 3 is provided on the surface side of a white insulating substrate 1 and also a metallized wiring layer 4 by which the electrode of a light emitting element 3 is electrically connected is made by coating from the bottom of the recess 1a to the external surface, the surface side of the insulating substrate 1 is coated with a light absorbing layer 2.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】本発明は、発光ダイオード素子等の発光素子を用いた表示装置において発光素子を収容するために使用される発光素子収納用パッケージに関するものである。 The present invention relates to relates to a package for housing a light-emitting element which is used to accommodate the light emitting element in the display device using the light emitting element such as a light emitting diode element.

【0002】 [0002]

【従来の技術】発光ダイオード素子は、その輝度の向上により表示装置として多用されるようになってきた。 BACKGROUND ART emitting diode element, has come to be widely used as a display device by improving the luminance.

【0003】かかる発光ダイオード素子を使用した表示装置は通常、図2に示すようにまず酸化アルミニウム質焼結体から成る白色の絶縁基体12の表面に多数の凹部13 [0003] Such light emitting diode display typically using a device, a number of recesses in the surface of the white of the insulating substrate 12 consisting of first sintered aluminum oxide as shown in FIG. 2 13
をマトリクス状に配列形成するととも該凹部13の底面から外表面にかけて複数個のメタライズ配線層14を被着させた発光素子収納用パッケージ11を準備し、次に前記発光素子収納用パッケージの各凹部13内に発光ダイオード素子15を個々に取着収容するとともに各発光ダイオード素子15の電極をメタライズ配線層14に電気的に接続させることによって形成されており、パッケージ11の各凹部 Also prepare the package for housing a light-emitting element 11 was deposited a plurality of metallized wiring layer 14 toward the outer surface from the bottom surface of the recess 13 and when arranged in a matrix, then the recess of the package for housing a light-emitting element the light emitting diode element 15 to 13 with attaching housed individually are formed by connecting the electrodes of the light emitting diode element 15 electrically to the metallized wiring layer 14, the recesses of the package 11
13内に収容された各発光ダイオード素子15にメタライズ配線層14を介して所定の電力を印加し、各発光ダイオード素子15を選択的に発光させることによって文字や画像が表示できるようになっている。 Through the metallized wiring layer 14 by applying a predetermined electric power to the light emitting diode element 15 housed in 13, so that it displays characters and images by selectively emitting the light emitting diode element 15 .

【0004】尚、前記発光素子収納用パッケージ11の絶縁基体12を白色の酸化アルミニウム質焼結体で形成するのは発光ダイオード素子15の発する光を凹部13の内壁で効率良く反射させ、発光ダイオード素子15の発する光の輝度を実質的に高めて形成される文字や画像の明るさを明るくするためである。 [0004] Incidentally, to efficiently reflect light emitted from the light emitting diode element 15 in the inner wall of the recess 13 to form an insulating base 12 of the package for housing a light-emitting element 11 with an aluminum oxide sintered body of the white light emitting diode in order to brighten the brightness of the characters and images to be formed to increase substantially the intensity of light emitted by the element 15.

【0005】 [0005]

【発明が解決しようとする課題】しかしながら、この従来の発光素子収納用パッケージは絶縁基体が白色を呈する酸化アルミニウム質焼結体で形成されており、該白色の酸化アルミニウム質焼結体は光を良好に反射するものの若干の光透過性を有しているため凹部内に収容した発光ダイオード素子を発光させるとその光の一部が絶縁基体の凹部周辺を透過して表面に漏れてしまい、その結果、発光ダイオード素子の発光によって形成される文字や画像ににじみが発生し、文字や画像が不鮮明なものになる欠点を有していた。 [SUMMARY OF THE INVENTION However, this conventional package for housing a light-emitting element is formed by sintered aluminum oxide insulating substrate exhibiting white color sintered aluminum oxide of the white color light highly reflecting ones of some when the the light emitting diode element accommodated in the recess since it has optical transparency portion of the light leaks to the surface through the recess around the insulating base, the result, bleeding occurs in the character or image formed by light-emitting diode element, it had the disadvantage of characters and images is what blurred.

【0006】またこの従来の発光素子収納用パッケージは絶縁基体が光を反射させ易い白色を呈していることから外部環境が明るい場合、絶縁基体の表面に外部より光が照射されるとこれが効率良く反射され、その結果、絶縁基体表面で反射される外部光と発光ダイオード素子が発する光との間のコントラストの差が小さくなり、発光ダイオード素子の発光によって形成される文字や画像が不鮮明なものとなる欠点も有していた。 [0006] The conventional light emitting device package for housing when the external environment is bright because it exhibits a prone white by reflecting light insulating substrate, which efficiently the light from the outside is irradiated on the surface of the insulating base It is reflected, and as a result, difference in contrast between the external light and the light emitting diode element emits the light reflected by the insulating substrate surface is reduced, as blurred characters and images formed by the light-emitting diode element a disadvantage which is also had.

【0007】 [0007]

【発明の目的】本発明は上記欠点に鑑み案出されたもので、その目的は発光素子が発する光の輝度を高めるとともに輪郭を明確とし、発光素子の光によって形成される文字や画像を鮮明なものとなすことができる発光素子収納用パッケージを提供することにある。 THE INVENTION An object of the present invention has been made in view of the above drawbacks, and its object is to clear the contour to increase the brightness of the light emitted from the light emitting element, clear characters and images formed by light emitting element and a light-emitting element storing package which can be made as such.

【0008】 [0008]

【課題を解決するための手段】本発明は白色を呈する絶縁基体の表面側に発光素子を収容するための凹部を設けるとともに該凹部底面から外表面にかけて前記発光素子の電極が電気的に接続されるメタライズ配線層を被着形成して成る発光素子収納用パッケージにおいて、前記絶縁基体の表面側に光吸収層を被着させたことを特徴とするものである。 Means for Solving the Problems The present invention electrode of the light emitting element from the recess bottom surface toward an outer surface provided with a recess for accommodating a light emitting element on the surface of the insulating substrate exhibiting white is electrically connected in the light-emitting element package for housing a metallized wiring layer formed by depositing form that is characterized in that said by depositing a light absorbing layer on the surface side of the insulating substrate.

【0009】また本発明は前記光吸収層の主成分が前記絶縁基体の主成分と同一であることを特徴とするものである。 [0009] The present invention is characterized in that the main component of the light absorbing layer is the same as the main component of the insulating substrate.

【0010】更に本発明は前記光吸収層の厚みが少なくとも5μmであることを特徴とするものである。 [0010] those still present invention, wherein the thickness of the light absorbing layer is at least 5 [mu] m.

【0011】 [0011]

【作用】本発明の発光素子収納用パッケージによれば、 According to the light emitting element package for housing the present invention,
絶縁基体が白色を呈することから絶縁基体の凹部に収容させた発光素子の発する光は凹部内壁で効率良く反射することによって輝度が実質的に高くなり、その結果、発光素子の発光によって形成される文字や画像が明るくなる。 Light emitted from the insulating base exhibits a white light-emitting element is received in the recess of the insulating substrate luminance substantially increased by efficiently reflected by the concave inner wall, as a result, it is formed by the light emission of the light emitting element character and image becomes brighter.

【0012】また本発明の発光素子収納用パッケージによれば、絶縁基体の表面側に光吸収層を設けたことから発光素子の発する光が絶縁基体の凹部周辺を透過して表面側に漏れようとしてもその漏れは有効に阻止され、その結果、発光素子の発光によって形成される文字や画像の輪郭が明確となり、文字や画像が極めて鮮明なものとなすことができる。 [0012] According to the light emitting element storing package of the present invention, light emitted from the light emitting element from the provision of the light absorbing layer on the surface side of the insulating substrate will to leak to the surface side passes through the recess around the insulating base its leakage even is effectively prevented, as a result, the contour of the character or image formed by light emission of the light emitting element becomes clear, it can be characters or images makes with extremely sharp.

【0013】更に本発明の発光素子収納用パッケージによれば、絶縁基体の表面側に光吸収層を設けたことから外部環境が明るく、絶縁基体の表面に外部より光が照射されてもその光は光吸収層に効率良く吸収されることとなり、その結果、絶縁基体表面で反射される外部光と発光素子が発する光との間のコントラストの差が大きくなり、発光素子の発光によって形成される文字や画像が極めて鮮明なものとなる。 [0013] Further, according to the light-emitting element storing package of the present invention, bright external environment from the provision of the light absorbing layer on the surface side of the insulating substrate, the light from the outside is irradiated on the surface of the insulating substrate even the light becomes to be efficiently absorbed by the light absorbing layer, as a result, difference in contrast between the light external light and the light emitting element is reflected by the insulating substrate surface emitted is increased, it is formed by the light emission of the light emitting element character and image is extremely clear.

【0014】 [0014]

【実施例】次に本発明を添付図面に基づき詳細に説明する。 EXAMPLES Next, based the present invention in the accompanying drawings will be described in detail. 図1は本発明の発光素子収納用パッケージの一実施例を示し、1 は絶縁基体、2 は光吸収層である。 Figure 1 shows an embodiment of a package for housing a light-emitting element of the present invention, 1 denotes an insulating substrate, 2 is a light-absorbing layer.

【0015】前記絶縁基体1 は、例えば白色の酸化アルミニウム質焼結体から成り、その上面側に発光素子としての発光ダイオード素子3 が収容される凹部1aが多数マトリクス状に配列されており、各凹部1a内には発光ダイオード素子3 が導電性接着剤を介して接着固定される。 [0015] The insulating substrate 1, for example, a white sintered aluminum oxide, which recess 1a which is the light emitting diode element 3 as a light emitting element on the upper surface side is accommodated is arranged in a number matrix, each the in the recess 1a emitting diode element 3 is bonded via a conductive adhesive.

【0016】前記絶縁基体1 は例えば、酸化アルミニウム、酸化珪素、酸化マグネシウム、酸化カルシウム等の原料粉末に適当な有機バインダー、溶剤等を添加混合して泥漿状となすとともにこれを従来周知のドクターブレード法やカレンダーロール法を採用することによってセラミックグリーンシート( セラミック生シート) を得、 [0016] The insulating substrate 1 is, for example, aluminum oxide, silicon oxide, magnesium oxide, suitable organic binder to the raw material powder such as calcium oxide, this with the solvent and the like added and mixed forms with the mud 漿状 well-known doctor blade to obtain a ceramic green sheet (ceramic green sheet) by adopting a law or calendar roll method,
しかる後、前記セラミックグリーンシートに適当な打ち抜き加工を施すとともに複数枚積層し、高温( 約1600 Thereafter, plural stacked together provided with suitable stamping on the ceramic green sheet, a high temperature (about 1600
℃) で焼成することによって製作される。 It is manufactured by baking at ° C.).

【0017】また前記絶縁基体1 は、その上面に形成した凹部1aの底面から下面にかけて導出する各々一対のメタライズ配線層4 が被着形成されている。 [0017] The insulating substrate 1, each pair of metallized wiring layer 4 is deposited and formed to derive toward lower surface from the bottom surface of the concave portion 1a formed on its upper surface.

【0018】前記一対のメタライズ配線層4 は発光ダイオード素子3 に外部電気回路から供給される電力を印加するための導電路として作用し、一方のメタライズ配線層4上には発光ダイオード素子3 が該発光ダイオード素子3 の一方の電極をメタライズ配線層4 に電気的に接続するようにして導電性接着剤を介して接着固定され、また他方のメタライズ配線層4 には発光ダイオード素子3 [0018] The pair of metallized wiring layer 4 light emitting diode element 3 acts as a conductive path for applying the electric power supplied from the external electric circuit, on the one metallized wiring layer 4 light emitting diode element 3 is the emitting one electrode of the diode element 3 is bonded and fixed via a so as to be electrically connected to the metallized wiring layer 4 conductive adhesive, also the other metallized wiring layer 4 light emitting diode element 3
の他の電極がボンディングワイヤ5 を介して電気的に接続される。 Other electrodes are electrically connected through bonding wires 5 of.

【0019】前記メタライズ配線層4 はタングステン、 [0019] The metallized wiring layer 4 is tungsten,
モリブデン、マンガン等の高融点金属粉末から成り、例えばタングステン等の高融点金属粉末に適当な有機バインダー、溶剤を添加混合して得た金属ペーストを絶縁基体1 となるセラミックグリーンシートに予め従来周知のスクリーン印刷法等により所定パターンに印刷塗布しておくことによって絶縁基体1 の所定位置に被着形成される。 Molybdenum, made of a refractory metal powder manganese, for example, such as tungsten refractory metal powder in a suitable organic binder, a metal paste obtained by adding and mixing the solvent in advance conventionally known in the ceramic green sheets to be the insulating base 1 It is deposited and formed on a predetermined position of the insulating substrate 1 by that you print applied to a predetermined pattern by a screen printing method or the like.

【0020】更に前記絶縁基体1 はその表面側に黒色や褐色等の暗色を呈する光吸収層2 が被着されている。 Furthermore the insulating substrate 1 is a light absorption layer 2 which exhibits a dark black or brown, etc. on its surface are deposited.

【0021】前記光吸収層2 は光を吸収、遮断する作用を為し、絶縁基体1 の凹部1a内に収容した発光ダイオード素子3 が光を発し、その光の一部が絶縁基体1 の凹部 [0021] The light absorbing layer 2 constitutes a function of absorbing light, blocking emits a light emitting diode element 3 is light housed in the recess 1a of the insulating base 1, the recess portion of the light is insulating base 1
1a周辺を透過して表面側に漏れようとしてもその漏れは前記光吸収層2 によって有効に阻止され、その結果、発光ダイオード素子3 の発光によって形成される文字や画像の輪郭が明確となり、文字や画像が極めて鮮明なものとなる。 Its leakage even if to leak to the surface side through the peripheral 1a is effectively prevented by the light absorbing layer 2, as a result, the contour of the character or image formed by light-emitting diode element 3 becomes clear, character and the image is extremely clear.

【0022】また同時に外部環境が明るく、絶縁基体1 [0022] The bright external environment at the same time, the insulating base 1
の表面に外部より光が照射されてもその光は前記光吸収層2 に効率良く吸収され、その結果、絶縁基体1 表面で反射される外部光と発光ダイオード素子3 が発する光との間のコントラストの差が大きなものとなり、発光ダイオード素子3 の発光によって形成される文字や画像を極めて鮮明なものとなすことができる。 Also the light is light from the outside is irradiated on the surface is effectively absorbed in the light absorbing layer 2, as a result, between the light emitted by the external light and the light emitting diode element 3 is reflected by the insulating base 1 surface becomes the difference in contrast is large, characters and images formed by the light-emitting diode element 3 can be made an extremely clear a.

【0023】前記光吸収層2 は例えば酸化アルミニウム質焼結体に暗色を呈する顔料を添加したものから成り、 [0023] The light absorbing layer 2 consists that the addition of the pigment exhibiting a dark, for example sintered aluminum oxide,
酸化アルミニウム、酸化珪素、酸化マグネシウム、酸化カルシウム等の原料粉末に顔料としての酸化チタン、酸化モリブデン、酸化クロム等と、適当な有機バインダー、溶剤等とを添加混合して得たペーストを前記絶縁基体1 の表面側に従来周知のスクリーン印刷法により所定厚みに印刷塗布し、しかる後、これを所定温度で焼成することによって絶縁基体1 表面側に被着される。 Aluminum oxide, silicon oxide, magnesium oxide, titanium oxide as a pigment to a raw material powder such as calcium oxide, molybdenum oxide, and chromium oxide, suitable organic binders, paste the insulating base obtained by adding and mixing a solvent, etc. applied by printing to a predetermined thickness by conventionally first surface side known screen printing method, thereafter, it is applied to the insulating substrate 1 surface by baking it in a predetermined temperature.

【0024】尚、前記光吸収層2 はその主成分を絶縁基体1 を構成する材料の主成分と同じものにしておくと光吸収層2 は絶縁基体1 の表面に極めて強固に被着され、 [0024] Incidentally, when the light absorbing layer 2 is kept the same as the main component of the material of the insulating base 1 and the main component the light absorbing layer 2 is very strongly adhered to the surface of the insulating base 1,
光吸収層2 と絶縁基体1 との間に両者の熱膨張係数の相違に起因する熱応力が発生し、光吸収層2 が絶縁基体1 Thermal stress due to the difference of thermal expansion coefficients of both between the light absorbing layer 2 and the insulating base 1 is generated, the light absorbing layer 2 is an insulating substrate 1
より剥離したりすることは一切なくなる。 It is no longer any way to or more peeling. 従って、前記光吸収層2 はその主成分を絶縁基体1 を構成する材料の主成分と同じものにしておくことが好ましい。 Accordingly, the light absorbing layer 2, it is preferable to be the same as the main component of the material constituting the main component an insulating substrate 1.

【0025】また前記光吸収層2 はその厚みが5 μm 未満であると発光ダイオード素子3 の発する光が絶縁基体 [0025] The light absorbing layer 2 is light insulating base emitted from the light emitting diode element 3 have a thickness of less than 5 [mu] m
1 の凹部周辺から表面側に漏れるのを完全に阻止するのが困難となる傾向にあることから5 μm 以上に、全体の形状を考慮すると5 μm 乃至50μm の範囲とすることが好ましい。 To 5 [mu] m or more since it tends to be difficult to completely block the first recess peripheral leaking to the surface side is preferably in the range of 5 [mu] m to 50μm considering the overall shape.

【0026】かくして上述の発光素子収納用パッケージによれば、絶縁基体1 の凹部1a内に発光ダイオード素子 [0026] Thus, according to the package for housing a light-emitting element described above, the light emitting diode element in the recess 1a of the insulating base 1
3 を収容し、該発光ダイオード素子3 の電極を導電性接着剤及びボンディングワイヤ5 を介してメタライズ配線層4 に接続させ、しかる後、絶縁基体1 の凹部1a内にエポキシ樹脂等の透明な樹脂を充填し、発光ダイオード素子3 を気密に封入することによって最終製品としての表示装置となる。 3 houses, to connect the electrode of the light emitting diode element 3 conductive adhesive and through the bonding wires 5 to the metallized wiring layer 4, and thereafter, a transparent resin such as epoxy resin into the concave portion 1a of the insulating base 1 packed with the display device as a final product by encapsulating a light emitting diode element 3 airtight.

【0027】かかる表示装置は絶縁基体1 の各凹部1a内に収容された各発光ダイオード素子3 にメタライズ配線層4 を介して所定の電力を印加し、各発光ダイオード素子3を選択的に発光させれば所定の文字や画像が表示される。 [0027] Such a display device through the metallized wiring layers 4 to each light emitting diode elements 3 accommodated in the recess 1a of the insulating substrate 1 by applying a predetermined electric power, selectively emit light of each light-emitting diode elements 3 a predetermined character or image is displayed if Re. この場合、各発光ダイオード素子3 の発する光は絶縁基体1 が白色を呈することから絶縁基体1 の凹部1a In this case, light emitted from each LED element 3 is concave 1a of the insulating base 1 since the insulating substrate 1 exhibits a white
内壁で効率良く反射されてその輝度が実質的に高くなり、その結果、発光ダイオード素子3 の発光によって形成される文字や画像が極めて明るいものとなる。 Its luminance is substantially higher is efficiently reflected by the inner wall, as a result, characters and images formed by the light-emitting diode element 3 is extremely bright.

【0028】尚、本発明は上述の実施例に限定されるものではなく、本発明の要旨を逸脱しない範囲であれば種々の変更は可能である。 [0028] The present invention is not limited to the embodiments described above, various modifications as long as it does not depart from the gist of the present invention are possible.

【0029】 [0029]

【発明の効果】本発明の発光素子収納用パッケージによれば、絶縁基体が白色を呈することから絶縁基体の凹部に収容させた発光素子の発する光は凹部内壁で効率良く反射することによって輝度が実質的に高くなり、その結果、発光素子の発光によって形成される文字や画像が明るくなる。 According to the light emitting element package for housing the present invention, the luminance by an insulating substrate light emanating from that emits white light-emitting element is received in the recess of the insulating substrate to efficiently reflected by the concave inner wall substantially higher, as a result, characters and images formed by the light emission of the light emitting element becomes bright.

【0030】また本発明の発光素子収納用パッケージによれば、絶縁基体の表面側に光吸収層を設けたことから発光素子の発する光が絶縁基体の凹部周辺を透過して表面側に漏れようとしてもその漏れは有効に阻止され、その結果、発光素子の発光によって形成される文字や画像の輪郭が明確となり、文字や画像が極めて鮮明なものとなすことができる。 [0030] According to the light emitting element storing package of the present invention, light emitted from the light emitting element from the provision of the light absorbing layer on the surface side of the insulating substrate will to leak to the surface side passes through the recess around the insulating base its leakage even is effectively prevented, as a result, the contour of the character or image formed by light emission of the light emitting element becomes clear, it can be characters or images makes with extremely sharp.

【0031】更に本発明の発光素子収納用パッケージによれば、絶縁基体の表面側に光吸収層を設けたことから外部環境が明るく、絶縁基体の表面に外部より光が照射されてもその光は光吸収層に効率良く吸収されることとなり、その結果、絶縁基体表面で反射される外部光と発光素子が発する光との間のコントラストの差が大きくなり、発光素子の発光によって形成される文字や画像が極めて鮮明なものとなる。 [0031] Further, according to the light-emitting element storing package of the present invention, bright external environment from the provision of the light absorbing layer on the surface side of the insulating substrate, the light from the outside is irradiated on the surface of the insulating substrate even the light becomes to be efficiently absorbed by the light absorbing layer, as a result, difference in contrast between the light external light and the light emitting element is reflected by the insulating substrate surface emitted is increased, it is formed by the light emission of the light emitting element character and image is extremely clear.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明の発光素子収納用パッケージの一実施例を示す断面図である。 1 is a cross-sectional view showing an embodiment of a package for housing a light-emitting element of the present invention.

【図2】従来の発光素子収納用パッケージの断面図である。 2 is a cross-sectional view of a conventional package for housing a light-emitting element.

【符号の説明】 DESCRIPTION OF SYMBOLS

1・・・・・・絶縁基体 1a・・・・・凹部 2・・・・・・光吸収層 3・・・・・・発光ダイオード素子 4・・・・・・メタライズ配線層 1 ...... insulating substrate 1a · · · · · recess 2 ...... light absorbing layer 3 ...... emitting diode element 4 ...... metallized wiring layer

Claims (3)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】白色を呈する絶縁基体の表面側に発光素子を収容するための凹部を設けるとともに該凹部底面から外表面にかけて前記発光素子の電極が電気的に接続されるメタライズ配線層を被着形成して成る発光素子収納用パッケージにおいて、前記絶縁基体の表面側に光吸収層を被着させたことを特徴とする発光素子収納用パッケージ。 1. A deposit a metallized wiring layer electrodes of the light emitting element from the recess bottom surface toward an outer surface provided with a recess for accommodating a light emitting element on the surface side of the insulating base exhibits a white color is electrically connected in the formed package for housing a light-emitting element comprising, for housing a light-emitting element package, characterized in that said by depositing a light absorbing layer on the surface side of the insulating substrate.
  2. 【請求項2】前記光吸収層の主成分が前記絶縁基体の主成分と同一であることを特徴とする請求項1に記載の発光素子収納用パッケージ。 2. A light-emitting element storing package according to claim 1, wherein the main component of the light absorbing layer is the same as the main component of the insulating substrate.
  3. 【請求項3】前記光吸収層の厚みが少なくとも5μmであることを特徴とする請求項1に記載の発光素子収納用パッケージ。 3. A package for housing a light-emitting element according to claim 1, the thickness of the light absorbing layer is equal to or is at least 5 [mu] m.
JP7327795A 1995-03-30 1995-03-30 Package for light emitting element Pending JPH08274378A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7327795A JPH08274378A (en) 1995-03-30 1995-03-30 Package for light emitting element

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Application Number Priority Date Filing Date Title
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Publications (1)

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JPH08274378A true JPH08274378A (en) 1996-10-18

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JP2006339362A (en) * 2005-06-01 2006-12-14 Ngk Spark Plug Co Ltd Wiring board for mounting light emitting element
JP2007103937A (en) * 2005-09-30 2007-04-19 Osram Opto Semiconductors Gmbh Casing for electromagnetic beam emission optoelectronics constituent element, electromagnetic beam emission optoelectronics constituent element, and method of manufacturing casing for electromagnetic beam emission optoelectronics constituent element or electromagnetic beam emission constituent element having such casing
EP1816685A1 (en) * 2004-10-27 2007-08-08 Kyocera Corporation Light emitting element mounting board, light emitting element storing package, light emitting device and lighting equipment
JP2009076949A (en) * 2009-01-15 2009-04-09 Nichia Corp Led display device, and usage therefor
US7718456B2 (en) 2004-09-30 2010-05-18 Tokuyama Corporation Package for housing light-emitting element and method for manufacturing package for housing light-emitting element
US7737461B2 (en) 2004-08-03 2010-06-15 Tokuyama Corporation Package for storing light emitting element and method for producing package for storing light emitting element
JP2010232644A (en) * 2009-03-06 2010-10-14 Nichia Corp Method of manufacturing optical semiconductor device
US8592855B2 (en) 2008-05-23 2013-11-26 Lg Innotek Co., Ltd. Light emitting device package including a substrate having at least two recessed surfaces
EP2413359A3 (en) * 2010-07-29 2013-12-04 Osram Sylvania Inc. Light emitting diode substrate, method of making the same and light source employing the same
JP2015090889A (en) * 2013-11-05 2015-05-11 京セラ株式会社 Multi-piece wiring board, wiring board and electronic component
CN106206902A (en) * 2016-09-30 2016-12-07 映瑞光电科技(上海)有限公司 Light-emitting diode chip for backlight unit

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US7737461B2 (en) 2004-08-03 2010-06-15 Tokuyama Corporation Package for storing light emitting element and method for producing package for storing light emitting element
US7718456B2 (en) 2004-09-30 2010-05-18 Tokuyama Corporation Package for housing light-emitting element and method for manufacturing package for housing light-emitting element
EP1816685A1 (en) * 2004-10-27 2007-08-08 Kyocera Corporation Light emitting element mounting board, light emitting element storing package, light emitting device and lighting equipment
JP2006339362A (en) * 2005-06-01 2006-12-14 Ngk Spark Plug Co Ltd Wiring board for mounting light emitting element
JP2007103937A (en) * 2005-09-30 2007-04-19 Osram Opto Semiconductors Gmbh Casing for electromagnetic beam emission optoelectronics constituent element, electromagnetic beam emission optoelectronics constituent element, and method of manufacturing casing for electromagnetic beam emission optoelectronics constituent element or electromagnetic beam emission constituent element having such casing
US8878229B2 (en) 2008-05-23 2014-11-04 Lg Innotek Co., Ltd. Light emitting device package including a substrate having at least two recessed surfaces
US9455375B2 (en) 2008-05-23 2016-09-27 Lg Innotek Co., Ltd. Light emitting device package including a substrate having at least two recessed surfaces
US9190450B2 (en) 2008-05-23 2015-11-17 Lg Innotek Co., Ltd. Light emitting device package including a substrate having at least two recessed surfaces
US8592855B2 (en) 2008-05-23 2013-11-26 Lg Innotek Co., Ltd. Light emitting device package including a substrate having at least two recessed surfaces
JP2009076949A (en) * 2009-01-15 2009-04-09 Nichia Corp Led display device, and usage therefor
JP2014039071A (en) * 2009-03-06 2014-02-27 Nichia Chem Ind Ltd Method for manufacturing optical semiconductor device
JP2010232644A (en) * 2009-03-06 2010-10-14 Nichia Corp Method of manufacturing optical semiconductor device
EP2413359A3 (en) * 2010-07-29 2013-12-04 Osram Sylvania Inc. Light emitting diode substrate, method of making the same and light source employing the same
JP2015090889A (en) * 2013-11-05 2015-05-11 京セラ株式会社 Multi-piece wiring board, wiring board and electronic component
CN106206902A (en) * 2016-09-30 2016-12-07 映瑞光电科技(上海)有限公司 Light-emitting diode chip for backlight unit

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