JPH06283831A - 充填剤を含む配合フルオロポリマーの回路基板材料及びその製造法 - Google Patents

充填剤を含む配合フルオロポリマーの回路基板材料及びその製造法

Info

Publication number
JPH06283831A
JPH06283831A JP14073193A JP14073193A JPH06283831A JP H06283831 A JPH06283831 A JP H06283831A JP 14073193 A JP14073193 A JP 14073193A JP 14073193 A JP14073193 A JP 14073193A JP H06283831 A JPH06283831 A JP H06283831A
Authority
JP
Japan
Prior art keywords
fluoropolymer
filler
ptfe
coating
composite material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14073193A
Other languages
English (en)
Japanese (ja)
Inventor
Gwo S Swei
グウオ・エス・スウエイ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rogers Corp
Original Assignee
Rogers Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rogers Corp filed Critical Rogers Corp
Publication of JPH06283831A publication Critical patent/JPH06283831A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/034—Organic insulating material consisting of one material containing halogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP14073193A 1992-06-11 1993-06-11 充填剤を含む配合フルオロポリマーの回路基板材料及びその製造法 Pending JPH06283831A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US89724492A 1992-06-11 1992-06-11
US897244 1992-06-11

Publications (1)

Publication Number Publication Date
JPH06283831A true JPH06283831A (ja) 1994-10-07

Family

ID=25407608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14073193A Pending JPH06283831A (ja) 1992-06-11 1993-06-11 充填剤を含む配合フルオロポリマーの回路基板材料及びその製造法

Country Status (2)

Country Link
JP (1) JPH06283831A (de)
DE (1) DE4319045A1 (de)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001023470A1 (fr) * 1999-09-30 2001-04-05 Daikin Industries, Ltd. Composition elastomere transparente
WO2006123694A1 (ja) * 2005-05-18 2006-11-23 Daikin Industries, Ltd. フッ素樹脂組成物及び電線
WO2007043525A1 (ja) * 2005-10-11 2007-04-19 Daikin Industries, Ltd. フッ素樹脂成形体
JP2007246930A (ja) * 1999-09-30 2007-09-27 Daikin Ind Ltd 透明なエラストマー組成物およびその製造法
WO2008099954A1 (ja) * 2007-02-16 2008-08-21 Daikin Industries, Ltd. フッ素樹脂組成物、フッ素樹脂成形品及びその製造方法
JP2010280106A (ja) * 2009-06-03 2010-12-16 Nichias Corp ペースト押出成形方法及びペースト押出成形体
JP2011011535A (ja) * 2009-06-03 2011-01-20 Nichias Corp ペースト押出成形方法及びペースト押出成形体
CN114015092A (zh) * 2021-11-18 2022-02-08 佛山(华南)新材料研究院 一种复合介质薄膜的制备方法及其应用
CN115627041A (zh) * 2022-11-02 2023-01-20 浙江工业大学 一种ptfe-pfa复合材料及其制备方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112018002707B4 (de) 2017-05-26 2022-05-05 Mitsubishi Electric Corporation Halbleiterbauelement

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6756445B1 (en) 1999-09-30 2004-06-29 Daikin Industries, Ltd. Transparent elastomer composition
US6884847B2 (en) 1999-09-30 2005-04-26 Daikin Industries, Ltd. Transparent elastomer composition
JP2007246930A (ja) * 1999-09-30 2007-09-27 Daikin Ind Ltd 透明なエラストマー組成物およびその製造法
WO2001023470A1 (fr) * 1999-09-30 2001-04-05 Daikin Industries, Ltd. Composition elastomere transparente
US7723615B2 (en) 2005-05-18 2010-05-25 Daikin Industries, Ltd. Fluororesin composition and electric wire
WO2006123694A1 (ja) * 2005-05-18 2006-11-23 Daikin Industries, Ltd. フッ素樹脂組成物及び電線
WO2007043525A1 (ja) * 2005-10-11 2007-04-19 Daikin Industries, Ltd. フッ素樹脂成形体
WO2008099954A1 (ja) * 2007-02-16 2008-08-21 Daikin Industries, Ltd. フッ素樹脂組成物、フッ素樹脂成形品及びその製造方法
JP5131202B2 (ja) * 2007-02-16 2013-01-30 ダイキン工業株式会社 フッ素樹脂組成物、フッ素樹脂成形品及びその製造方法
US8466236B2 (en) 2007-02-16 2013-06-18 Daikin Industries, Ltd. Fluororesin composition, fluororesin molded article and method for producing the same
JP2010280106A (ja) * 2009-06-03 2010-12-16 Nichias Corp ペースト押出成形方法及びペースト押出成形体
JP2011011535A (ja) * 2009-06-03 2011-01-20 Nichias Corp ペースト押出成形方法及びペースト押出成形体
CN114015092A (zh) * 2021-11-18 2022-02-08 佛山(华南)新材料研究院 一种复合介质薄膜的制备方法及其应用
CN115627041A (zh) * 2022-11-02 2023-01-20 浙江工业大学 一种ptfe-pfa复合材料及其制备方法
CN115627041B (zh) * 2022-11-02 2023-11-24 浙江工业大学 一种ptfe-pfa复合材料及其制备方法

Also Published As

Publication number Publication date
DE4319045A1 (de) 1993-12-16

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