JPH06283307A - Thermistor and heater - Google Patents
Thermistor and heaterInfo
- Publication number
- JPH06283307A JPH06283307A JP7062693A JP7062693A JPH06283307A JP H06283307 A JPH06283307 A JP H06283307A JP 7062693 A JP7062693 A JP 7062693A JP 7062693 A JP7062693 A JP 7062693A JP H06283307 A JPH06283307 A JP H06283307A
- Authority
- JP
- Japan
- Prior art keywords
- thermistor
- heater
- substrate
- adhesive
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、基板上に薄膜の感温
部を形成したサーミスタおよびこのサーミスタを導電性
接着剤を介し取着してなるヒータに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermistor in which a thin film temperature sensitive portion is formed on a substrate and a heater formed by attaching the thermistor via a conductive adhesive.
【０００２】[0002]
【従来の技術】サーミスタは電気抵抗の温度係数が負の
大きな値を有する半導体を用いたもので、赤外線のエネ
ルギーを吸収して温度上昇したときに抵抗値が大きく変
化し、赤外線の熱を導電体の抵抗値の大小に変換して赤
外線の強弱を測定する熱形検出素子からなるセンサであ
る。2. Description of the Related Art A thermistor uses a semiconductor having a large negative temperature coefficient of electric resistance. When the temperature of the thermistor is absorbed by infrared energy and the temperature rises, the resistance of the thermistor changes greatly and conducts heat of infrared rays. It is a sensor that consists of a thermal detection element that measures the strength of infrared rays by converting it into a large or small body resistance value.
【０００３】この熱形検出素子の特長は、検出感度が入
射光の波長によらずほぼ一定であること、動作時に室温
中で使用できる、作り易く安価であることなどである。The features of this thermal type detection element are that the detection sensitivity is substantially constant irrespective of the wavelength of incident light, that it can be used at room temperature during operation, that it is easy to manufacture, and that it is inexpensive.
【０００４】また、サーミスタは熱放射を受けて素子の
温度を上昇させ抵抗値を減少させねばならないので、で
きる限り膜厚が薄く、熱容量が小さい方が感度も応答も
よい。 そして、サーミスタは図５および図６に示す構
成である。図５において１はアルミナセラミクスからな
る平板状の基板、２はこの基板１上の中央部に形成した
マンガン、コバルト、ニッケルなどの酸化物を混合して
形成した薄膜からなる感熱部、３、３は感熱部２両端の
基板１上に接着強度を増すため被着した酸化チタン膜４
を介してこの感熱部２と連接して形成した白金層などか
らなる電極部である。また、５は感熱部２を被覆した酸
化硅素からなるオーバーコート層である。（なお、上記
の各膜は薄膜であるが図面上は誇張して厚く書いてあ
る。）このようなサーミスタＴは、たとえば図６に示す
ような板状ヒータＨの温度制御センサとしてヒータＨの
下面などに取着して使用される。Further, since the thermistor must receive the heat radiation to raise the temperature of the element and reduce the resistance value, the sensitivity and response are better if the film thickness is as thin as possible and the heat capacity is small. The thermistor has the structure shown in FIGS. In FIG. 5, reference numeral 1 is a flat plate-shaped substrate made of alumina ceramics, 2 is a heat-sensitive portion made of a thin film formed by mixing oxides of manganese, cobalt, nickel or the like formed in the central portion of the substrate 1, 3, 3. Is a titanium oxide film 4 deposited on the substrate 1 at both ends of the heat sensitive portion 2 to increase the adhesive strength.
It is an electrode portion formed of a platinum layer or the like formed by being connected to the heat-sensitive portion 2 via. Further, 5 is an overcoat layer made of silicon oxide that covers the heat-sensitive portion 2. (Note that each of the above films is a thin film, but is exaggeratedly drawn thick in the drawing.) Such a thermistor T serves as a temperature control sensor for a plate-shaped heater H as shown in FIG. Used by attaching to the bottom surface.
【０００５】図６は板状のヒータＨでアルミナセラミク
スなどからなる耐熱電気絶縁性の配線基体１１の上面に
銀・パラジウム（Ａｇ／Ｐｄ）合金などからなる抵抗発
熱体１２が、また、下面には上記発熱体１２と同様な銀
・パラジウム（Ａｇ／Ｐｄ）合金などの材料からなる配
線導体１７、１８が形成されている。そして、この取着
は配線導体１７、１８に上記サーミスタＴの電極部３、
３がそれぞれ銀・パラジウム（Ａｇ／Ｐｄ）合金粉末な
どを水ガラス（無機結着剤）や水溶性有機結着剤と混合
した導電性接着剤６を介して接合されている。FIG. 6 shows a plate-shaped heater H in which a resistance heating element 12 made of silver / palladium (Ag / Pd) alloy or the like is provided on the upper surface of a heat resistant and electrically insulating wiring substrate 11 made of alumina ceramics or the like, and a lower surface thereof. The wiring conductors 17 and 18 made of a material such as silver-palladium (Ag / Pd) alloy similar to the heating element 12 are formed. The attachment is performed by connecting the wiring conductors 17 and 18 to the electrode portion 3 of the thermistor T,
3 are joined together via a conductive adhesive 6 in which silver-palladium (Ag / Pd) alloy powder or the like is mixed with water glass (inorganic binder) or water-soluble organic binder.
【０００６】[0006]
【発明が解決しようとする課題】この取着は表面がほぼ
平らな基体１１側の配線導体１７、１８面と同じく表面
がほぼ平らなサーミスタＴの電極部３、３面とが接着剤
６により接合されているため、高温状態が長く続いたり
接合作業にばらつきがあったりあるいは経時劣化などで
接合力が低下した場合に振動や衝撃を受けたときサーミ
スタＴが外れるということが発生し、温度制御ができな
くなるという問題があった。In this attachment, the wiring conductors 17 and 18 on the side of the base 11 having a substantially flat surface and the electrode portions 3 and 3 of the thermistor T having a substantially flat surface by the adhesive 6 are used. Since they are joined, the thermistor T may come off when subjected to vibration or shock when the high temperature continues for a long time, the joining work varies, or the joining force decreases due to deterioration over time, and temperature control is performed. There was a problem that could not be.
【０００７】この接合部の外れ部分はサーミスタＴの電
極部３、３と導電性接着剤６との間で発生することが多
く、これは電極部３、３を形成する材料が白金層からな
るため（配線導体１７、１８は接着剤６と同系の銀・パ
ラジウム（Ａｇ／Ｐｄ）合金材料からなる。）と推測さ
れる。The disengaged portion of this joint often occurs between the electrodes 3 and 3 of the thermistor T and the conductive adhesive 6, and the material forming the electrodes 3 and 3 is a platinum layer. Therefore, it is assumed that the wiring conductors 17 and 18 are made of a silver-palladium (Ag / Pd) alloy material similar to the adhesive 6.
【０００８】そこで、この導電性接着剤６について種々
検討したが、耐熱性、導電性や材料費などを考慮する
と、現時点ではなかなかよい接着剤５が見出だされてい
ない。本発明は上記問題点を除去し、ヒータなどへサー
ミスタを導電性接着剤を用いて取着する場合に、その取
着強度を向上することのできる構造のサーミスタおよび
ヒータを提供することを目的とする。Therefore, various studies have been made on the conductive adhesive 6, but in view of heat resistance, conductivity, material cost, etc., no good adhesive 5 has been found at present. An object of the present invention is to eliminate the above problems and to provide a thermistor and a heater having a structure capable of improving the attachment strength when attaching a thermistor to a heater or the like using a conductive adhesive. To do.
【０００９】[0009]
【課題を解決するための手段】本発明の請求項１に記載
のサーミスタは、電気絶縁性材料からなる基板上に感温
部を有し、この感温部の両端部に電極部を連接して形成
したサーミスタにおいて、上記基板の端部部分には接着
剤係止部が形成されていることを特徴としている。A thermistor according to claim 1 of the present invention has a temperature sensitive portion on a substrate made of an electrically insulating material, and electrode portions are connected to both ends of the temperature sensitive portion. The thermistor thus formed is characterized in that an adhesive locking portion is formed at an end portion of the substrate.
【００１０】本発明の請求項２に記載のサーミスタは、
上記基板上の感温部が薄膜であることを特徴としてい
る。A thermistor according to claim 2 of the present invention is
The temperature sensitive portion on the substrate is a thin film.
【００１１】本発明の請求項３に記載のサーミスタは、
上記接着剤係止部が上記基板の電極部が形成される端部
の外側縁に形成された突出部であることを特徴としてい
る。本発明の請求項４に記載のサーミスタは、上記基板
の電極部が形成される端部面に接着剤係止用の穴孔を設
けたことを特徴としている。A thermistor according to claim 3 of the present invention is
It is characterized in that the adhesive locking portion is a protruding portion formed on an outer edge of an end portion of the substrate where the electrode portion is formed. A thermistor according to a fourth aspect of the present invention is characterized in that a hole for retaining an adhesive is provided on an end surface of the substrate on which the electrode portion is formed.
【００１２】本発明の請求項５に記載のヒータは、発熱
源を具備したヒータに上記請求項１ないし請求項４に記
載のサーミスタを導電性接着剤を介し接合取着させてな
ることを特徴としている。The heater according to a fifth aspect of the present invention is characterized in that the thermistor according to any one of the first to fourth aspects is joined and attached to the heater having a heat source through a conductive adhesive. I am trying.
【００１３】本発明の請求項６に記載のヒータは、サー
ミスタを接合させる導電性接着剤が銀・パラジウム（Ａ
ｇ／Ｐｄ）系合金粉末を無機結着剤または有機結着剤と
混合したものであることを特徴としている。In the heater according to claim 6 of the present invention, the conductive adhesive for bonding the thermistor is silver-palladium (A
It is characterized in that g / Pd) -based alloy powder is mixed with an inorganic binder or an organic binder.
【００１４】[0014]
【作用】突出部や凹状部などからなる接着剤係止部に導
電性接着剤が回り込むことにより係止されるため、導電
性接着剤とサーミスタの取着強度が向上しサーミスタが
外れることがない。[Operation] Since the conductive adhesive is locked by wrapping around the adhesive locking portion including the protruding portion and the concave portion, the attachment strength between the conductive adhesive and the thermistor is improved and the thermistor does not come off. .
【００１５】[0015]
【実施例】以下、本発明サーミスタの実施例を図１およ
び図２を参照して説明する。図１は電子複写機やファク
シミリなどの定着用に使われる平板状のヒータＨの全体
図、図２は図１の矢印Ｘ−Ｘ線の横断面を示す。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the thermistor of the present invention will be described below with reference to FIGS. FIG. 1 is an overall view of a plate-shaped heater H used for fixing in an electronic copying machine or a facsimile, and FIG. 2 is a cross section taken along the line XX in FIG.
【００１６】図においてＨは平板状ヒータで、アルミナ
（Ａｌ2 Ｏ3 ）セラミクスなどの耐熱電気絶縁体からな
る配線基体１１の上面に発熱源として銀・パラジウム合
金（Ａｇ／Ｐｄ）を主体とする材料を塗布焼成した一条
の抵抗発熱体１２が設けられている。１３、１４はこの
抵抗発熱体１２への給電するための端子部で、一方の端
子部１４は配線導体１５、１６を経て基体１１の下面側
に設けられている。Ｔはこの平板状ヒータＨの温度を検
出するサーミスタで、基体１１の下面側の配線導体１
７、１８に取着接続されていて、その検知出力用の端子
部１９、２０が基体１１の上面側に設けられている。な
お、上記配線導体１５、１６、１７、１８は抵抗発熱体
２と同様な銀・パラジウム合金（Ａｇ／Ｐｄ）などの材
料、端子部１３、１４、１９、２０は接触電気抵抗が小
さい材料たとえば銀（Ａｇ），銀・プラチナ合金（Ａｇ
／Ｐｔ），金（Ａｕ），プラチナ（Ｐｔ）などの金属ペ
ーストを厚膜状に塗布焼成して形成してある。In the drawing, H is a flat plate heater, which is mainly composed of silver-palladium alloy (Ag / Pd) as a heat source on the upper surface of the wiring substrate 11 made of a heat-resistant electric insulator such as alumina (Al 2 O 3 ) ceramics. A single line of resistance heating element 12 obtained by coating and firing a material is provided. Reference numerals 13 and 14 denote terminal portions for supplying power to the resistance heating element 12, and one terminal portion 14 is provided on the lower surface side of the base 11 via the wiring conductors 15 and 16. T is a thermistor that detects the temperature of the flat plate heater H, and is a wiring conductor 1 on the lower surface side of the base 11.
7 and 18 are attached and connected, and their detection output terminal portions 19 and 20 are provided on the upper surface side of the base 11. The wiring conductors 15, 16, 17, and 18 are made of a material such as silver-palladium alloy (Ag / Pd) similar to that of the resistance heating element 2, and the terminals 13, 14, 19, and 20 are made of a material having a small contact electric resistance, for example. Silver (Ag), silver-platinum alloy (Ag
/ Pt), gold (Au), platinum (Pt), and the like are formed by coating and firing in a thick film.
【００１７】図２を参照して上記サーミスタＴの構成お
よびその取着について詳述する。サーミスタＴはアルミ
ナ（Ａｌ2 Ｏ3 ）セラミクスからなる上方外側縁に横方
向に突出部１Ａ、１Ａを有する長四角形状の基板１上の
中央部１Ｂにマンガン、コバルト、ニッケルなどの酸化
物（ＭｎＯ2 、Ｃｏ3 Ｏ4 、ＮｉＯ）を混合して形成し
た薄膜からなる感熱部２が設けてある。そして、感熱部
２の両側の端部１Ｃ、１Ｃ面上にこの感熱部２と連接し
て白金（Ｐｔ）層からなる電極部３、３が形成してあ
る。また、上記感熱部２を形成する膜が大気中の酸素に
より特性変化を起こすのを防止するため感熱部２を被覆
する酸化硅素（ＳｉＯ2 ）からなるオーバーコート層４
が設けてある。（なお、上記の各膜は薄膜であるが図面
上は誇張して厚く書いてある。）そして、このサーミス
タＴの取着は基体１１の裏面の配線導体１７、１８に、
サーミスタＴの電極部３、３がそれぞれ銀・パラジウム
合金（Ａｇ／Ｐｄ）粉末などを水ガラス（無機結着剤）
や水溶性有機結着剤と混合した導電性接着剤６を介して
接合されている。The structure of the thermistor T and its attachment will be described in detail with reference to FIG. The thermistor T is made of an oxide (MnO) of manganese, cobalt, nickel or the like in a central portion 1B on a rectangular substrate 1 having laterally protruding portions 1A and 1A at an upper outer edge made of alumina (Al 2 O 3 ) ceramics. 2 , a heat sensitive portion 2 formed of a thin film formed by mixing (Co 3, O 4 , NiO) is provided. Then, electrode portions 3 and 3 made of a platinum (Pt) layer are formed on both end faces 1C and 1C of the heat sensitive portion 2 so as to be connected to the heat sensitive portion 2. Further, an overcoat layer 4 made of silicon oxide (SiO 2 ) covering the heat-sensitive portion 2 in order to prevent the film forming the heat-sensitive portion 2 from changing its characteristics due to oxygen in the atmosphere.
Is provided. (Note that each of the above films is a thin film, but is exaggeratedly drawn thick in the drawing.) Then, the thermistor T is attached to the wiring conductors 17 and 18 on the back surface of the base body 11,
The thermistor T electrode portions 3, 3 are made of silver-palladium alloy (Ag / Pd) powder or the like in water glass (inorganic binder).
They are joined together via a conductive adhesive 6 mixed with a water-soluble organic binder.
【００１８】この接合に際しては、導電性接着剤６は配
線導体１７、１８と電極部３、３との間はもちろん、そ
の一部６ＡはサーミスタＴの基板１の突出部１Ａ、１Ａ
を越えて基板１の側面にまで達するよう、しかも中央部
１Ｂ上の感熱部２面を覆わないようにして固化されてい
る。In this connection, the conductive adhesive 6 is not only between the wiring conductors 17 and 18 and the electrode portions 3 and 3, but also a part 6A thereof is the protruding portions 1A and 1A of the substrate 1 of the thermistor T.
It is solidified so as to reach the side surface of the substrate 1 beyond and not to cover the surface of the heat sensitive portion 2 on the central portion 1B.
【００１９】このようなヒータＨは、端子部１３、１４
間に通電すると配線導体１６、１５を経て抵抗発熱体１
２に電流が流れ抵抗発熱体１２は発熱する。この抵抗発
熱体１２の発熱により基体１１も熱伝導を受け温度上昇
し、この熱は基体１１の下面に取着してあるサーミスタ
Ｔ中央部１ａの感熱部２に伝わり、感熱部２の抵抗値を
変化させる。この感熱部２の抵抗値を変化を配線導体１
７、１８を介し端子部１９、２０から出力させ、これを
温度制御回路（図示しない。）に入力して適性な温度範
囲にあるか否かを判定して、抵抗発熱体１２に加える電
流や電圧を制御して所定の温度範囲に調整させる。Such a heater H has terminals 13 and 14
When electricity is applied between the resistance heating elements 1 through the wiring conductors 16 and 15.
A current flows through the resistance heating element 12 to generate heat. Due to the heat generated by the resistance heating element 12, the base 11 also receives heat and its temperature rises, and this heat is transmitted to the heat sensitive portion 2 of the central portion 1a of the thermistor T attached to the lower surface of the base 11, and the resistance value of the heat sensitive portion 2 is increased. Change. Change the resistance value of this heat sensitive part 2 to the wiring conductor 1
It is output from the terminal portions 19 and 20 via 7 and 18, and this is input to a temperature control circuit (not shown) to determine whether or not it is within an appropriate temperature range, and the current applied to the resistance heating element 12 and The voltage is controlled to adjust the temperature within a predetermined temperature range.
【００２０】そして、ヒータＨの高温状態が続いたり、
導電性接着剤６の付着が適切でなかったりあるいは導電
性接着剤６が経時劣化などのことにより万が一接合力が
低下してきても、サーミスタＴは基板１の突出部１Ａ、
１Ａを越えて回り込んだ接着剤６の一部が係止部６Ａを
構成し、この係止部６Ａによりこの突出部１Ａ、１Ａが
抱えられた状態で保持されている。Then, the high temperature state of the heater H continues,
Even if the adhesive strength of the conductive adhesive 6 is reduced due to improper adhesion of the conductive adhesive 6 or deterioration of the conductive adhesive 6 over time, the thermistor T is provided with the protruding portion 1A of the substrate 1.
A part of the adhesive 6 that has passed around 1A constitutes a locking portion 6A, and the locking portion 6A holds the protruding portions 1A and 1A in a held state.
【００２１】したがって、ヒータＨからサーミスタＴは
離れることなく長期に亘り電気的にも接続状態が保た
れ、他の部分に不都合が生じるまで補修などの必要はな
い。Therefore, the thermistor T is not separated from the heater H, and the electrically connected state is maintained for a long period of time, and repair is not required until other parts are inconvenient.
【００２２】また、図３は本発明の他の実施例を示し、
図中図２と同一部分には同一の符号を付してその説明は
省略する。この図３のものは基板１の中央部１Ｂをほぼ
平坦に形成し、中央部１Ｂの端から基板１の端縁に向か
う端部１Ｃを傾斜面とし、この傾斜面の端縁に突出部１
Ａ、１Ａを設けたものである。そして、中央部１Ｂには
感熱部２を、傾斜面とした端部１Ｃに電極部３、３を形
成したものである。FIG. 3 shows another embodiment of the present invention,
2, those parts which are the same as those corresponding parts in FIG. 2 are designated by the same reference numerals, and a description thereof will be omitted. In FIG. 3, the central portion 1B of the substrate 1 is formed to be substantially flat, and the end portion 1C extending from the end of the central portion 1B to the edge of the substrate 1 is an inclined surface, and the protrusion 1 is formed at the edge of the inclined surface.
A and 1A are provided. The heat sensitive portion 2 is formed in the central portion 1B, and the electrode portions 3, 3 are formed in the end portion 1C which is an inclined surface.
【００２３】このものは上記実施例と同様な作用効果を
有するとともに感熱部２を電極部３、３より高く突出し
て形成してあるので、ヒータなどにセンサとして取着使
用した場合、ヒータＨ面に対し感熱部２を当接して配設
できるので、温度検知の精度を高めることができる。Since this has the same function and effect as in the above-mentioned embodiment and the heat-sensitive portion 2 is formed so as to project higher than the electrode portions 3 and 3, when the heater is attached and used as a sensor to the heater H surface. On the other hand, since the heat sensitive portion 2 can be disposed in contact with the heat sensitive portion 2, the accuracy of temperature detection can be improved.
【００２４】また、図４は本発明の他の実施例の要部を
示す。上記実施例ではいずれも基板１に突出部１Ａ、１
Ａを設け導電性接着剤６の係止手段としたが、このもの
は電極部３が形成されて導電性接着剤６と接合する基板
１の端部１Ｃ面に穴孔１Ｄを設けたものである。FIG. 4 shows the essential parts of another embodiment of the present invention. In each of the above embodiments, the protrusions 1A, 1
A is provided as a locking means for the conductive adhesive 6, but this is one in which the electrode portion 3 is formed and the hole 1D is provided on the end 1C surface of the substrate 1 to be joined to the conductive adhesive 6. is there.
【００２５】すなわち、端部１Ｃ部分の穴孔１Ｄには、
まず、酸化チタンなどの接合補強膜４を形成したとき、
穴孔１Ｄの開口部内近傍にも膜４Ａが付着され、この補
強膜４面上にさらに電極部３を構成する膜３を形成する
と穴孔１Ｄの開口部内近傍の膜４Ａ上にも膜３Ａが付着
され，これらの膜３Ａ、４Ａで穴孔１Ｄの開口部内近傍
の径が小さくなる。そして、接合時電極部３上または配
線導体１８上に付着された導電性接着剤６は、接合時に
電極部３と配線導体１８とで押圧されてその一部は穴孔
１Ｄ内に入り込み、上記膜３Ａ、４Ａで形成された細径
部分を通って大径部分に達し、ここで団子状６Ｂとなつ
て固化する。That is, in the hole 1D at the end 1C,
First, when the joining reinforcing film 4 such as titanium oxide is formed,
The film 4A is attached also in the vicinity of the opening of the hole 1D, and when the film 3 forming the electrode portion 3 is further formed on the surface of the reinforcing film 4, the film 3A is also formed on the film 4A in the vicinity of the opening of the hole 1D. As a result, the diameter of the vicinity of the inside of the opening of the hole 1D is reduced by these films 3A and 4A. Then, the conductive adhesive 6 attached on the electrode portion 3 or the wiring conductor 18 at the time of joining is pressed by the electrode portion 3 and the wiring conductor 18 at the time of joining, and a part thereof enters the hole 1D, The large-diameter portion is reached through the small-diameter portion formed by the membranes 3A and 4A, and here, the large-diameter portion is formed and solidified into a dumpling-like shape 6B.
【００２６】そして、固化後はこの団子状６Ｂ部が係止
部となって穴孔１Ｄから抜け出ることを阻止し、サーミ
スタＴを長期に亘り強固に接合を保持させることができ
る。また、この穴孔１Ｄに入り込んだ導電性接着剤６は
団子状６Ｂに形成したものに限らず、単に穴孔１Ｄ内で
固化させた場合でも接着面積が増えるので取着強度を向
上させることができる。After the solidification, the dumpling-like 6B portion serves as a locking portion and is prevented from coming out of the hole 1D, so that the thermistor T can firmly hold the joint for a long period of time. Further, the conductive adhesive 6 that has entered the hole 1D is not limited to the one formed in the shape of a ball 6B, and even when it is simply solidified in the hole 1D, the adhesive area increases, so that the attachment strength can be improved. it can.
【００２７】なお、本発明は上記実施例に限定されな
い。たとえばサーミスタの配線基板の材質はアルミナセ
ラミクスに限らず、他のセラミクスやガラス、ポリイミ
ド樹脂のような耐熱性の高い合成樹脂部材などであって
もよい。また、配線基板の外側縁に設ける突出部は基板
をダイサーで切り出す際に同時に形成してもよい。ま
た、突出部は基板の全周でなく、少なくとも接着剤が介
在する端部部分の一部にあればよい。The present invention is not limited to the above embodiment. For example, the material of the wiring board of the thermistor is not limited to alumina ceramics, but may be other ceramics, glass, or a synthetic resin member having high heat resistance such as polyimide resin. Further, the protruding portion provided on the outer edge of the wiring board may be formed at the same time when the board is cut out with a dicer. Further, the protrusion does not have to be on the entire circumference of the substrate, but may be on at least a part of the end portion where the adhesive is interposed.
【００２８】また、感熱部の材質もマンガン、コバル
ト、ニッケルなどの酸化物（ＭｎＯ2、Ｃｏ3 Ｏ4 、Ｎ
ｉＯ）の混合体に限定されるものではなく、各単独でも
あるいはＭｇＯ、ＣａＯ、ＢａＯ、ＴｉＯ2 、Ｚｒ
Ｏ2 、Ａｌ2 Ｏ3 などであってもよい。 また、ヒータ
は膜状の抵抗発熱体を形成した平板状のヒータに限ら
ず、ニクロム線発熱体や発熱体が基体内に埋め込まれた
ヒータなどでもよく、また、ヒータへのサーミスタの取
着場所もヒータの外側面に限らず、ヒータ内であっても
あるるいはヒータを構成する他の部品部分でもよい。The material of the heat sensitive portion is also an oxide of manganese, cobalt, nickel or the like (MnO 2 , Co 3 O 4 , N).
It is not limited to a mixture of iO), and each of them may be used alone or MgO, CaO, BaO, TiO 2 , Zr.
It may be O 2 , Al 2 O 3 or the like. Further, the heater is not limited to a flat-plate heater having a film-shaped resistance heating element, but may be a nichrome wire heating element or a heater in which the heating element is embedded in the base body, and the place where the thermistor is attached to the heater. Is not limited to the outer surface of the heater, but may be inside the heater or may be another part of the heater.
【００２９】さらに、上記実施例では銀・パラジウム合
金（Ａｇ／Ｐｄ）系の導電性接着剤について述べたが、
ヒータなど検知対象物の許容温度が低い場合などは他材
質の導電性接着剤であっても、本構成とすれば強固な接
合ができる。Furthermore, in the above embodiment, the silver-palladium alloy (Ag / Pd) -based conductive adhesive was described.
When the permissible temperature of the detection object such as the heater is low, even with a conductive adhesive made of another material, this structure enables strong bonding.
【００３０】さらにまた、本発明のヒータは複写機やフ
ァクシミリなどのＯＡ機器類の定着用に限らず、種々の
産業用製造設備や家庭用機器など他の分野においても実
用化できるものである。Furthermore, the heater of the present invention can be put to practical use not only for fixing OA equipment such as copying machines and facsimiles but also in other fields such as various industrial manufacturing facilities and household equipment.
【００３１】[0031]
【発明の効果】以上の構成を有する本発明は、ヒータな
どの被検知体からサーミスタが外れることがなく、サー
ミスタが強固に取着されるため正確な温度検知機能が持
続でき、製造設備においては製品の品質向上が機器にお
いては安全性が向上できるなどの効果を有する。According to the present invention having the above-described structure, the thermistor does not come off from the object to be detected such as a heater, and the thermistor is firmly attached, so that the accurate temperature detecting function can be maintained, and the manufacturing facility is not required. Improving product quality has the effect of improving safety in equipment.
【図１】本発明の実施例を示すヒータで、（ａ）図は上
面図、（ｂ）図は側面図、（ｃ）図は下面図である。FIG. 1 is a heater showing an embodiment of the present invention, in which (a) is a top view, (b) is a side view, and (c) is a bottom view.
【図２】図１（ｂ）中の矢視Ｘ−Ｘ線に沿って断面した
横断側面図である。FIG. 2 is a cross-sectional side view taken along the line XX in FIG. 1B.
【図３】本発明サーミスタの他の実施例を示す横断側面
図である。FIG. 3 is a cross-sectional side view showing another embodiment of the thermistor of the present invention.
【図４】本発明サーミスタの他の実施例を示す要部の拡
大横断側面図である。FIG. 4 is an enlarged cross-sectional side view of essential parts showing another embodiment of the thermistor of the present invention.
【図５】従来のチップサーミスタを示す一部断面斜視図
である。FIG. 5 is a partial cross-sectional perspective view showing a conventional chip thermistor.
【図６】従来のチップサーミスタを取着したヒータの横
断側面図である。FIG. 6 is a cross-sectional side view of a heater to which a conventional chip thermistor is attached.
Ｔ：チップサーミスタ １：基板 １Ａ：突状部 １Ｂ：中央部 １Ｃ：端部 ２：感熱部 ３：電極部 ６：導電性接着剤 ６Ａ、６Ｂ：接着剤係止部 Ｈ：ヒータ １１：配線基体 １２：抵抗発熱体 １７、１８：配線導体 T: Chip thermistor 1: Substrate 1A: Projected part 1B: Central part 1C: End part 2: Heat sensitive part 3: Electrode part 6: Conductive adhesive 6A, 6B: Adhesive locking part H: Heater 11: Wiring substrate 12: Resistance heating element 17, 18: Wiring conductor
───────────────────────────────────────────────────── フロントページの続き (72)発明者 苅部 孝明 東京都港区新橋３丁目３番９号 東芝エ ー・ブイ・イー株式会社内 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Takaaki Kanabe 3-3-9 Shimbashi, Minato-ku, Tokyo Toshiba Abu E. Co., Ltd.
Claims (6)
を有し、この感温部の両端部に電極部を連接して形成し
たサーミスタにおいて、上記基板の端部部分には接着剤
係止部が形成されていることを特徴とするサーミスタ。1. A thermistor having a temperature-sensitive portion on a substrate made of an electrically insulating material, and electrode portions connected to both ends of the temperature-sensitive portion, wherein an adhesive agent is applied to the end portion of the substrate. A thermistor characterized in that a locking portion is formed.
を特徴とする請求項１に記載のサーミスタ。2. The thermistor according to claim 1, wherein the temperature sensitive portion on the substrate is a thin film.
が形成される端部の外側縁に形成された突出部であるこ
とを特徴とする請求項１に記載のサーミスタ。3. The thermistor according to claim 1, wherein the adhesive locking portion is a protruding portion formed on an outer edge of an end portion of the substrate where the electrode portion is formed.
接着剤係止用の穴孔を設けたことを特徴とする請求項１
に記載のサーミスタ。4. A hole for retaining an adhesive is provided on an end surface of the substrate on which an electrode portion is formed.
The thermistor described in.
ないし請求項４に記載のサーミスタを導電性接着剤を介
し接合取着させてなることを特徴とするヒータ。5. The heater according to claim 1, wherein the heater is provided with a heat source.
A heater comprising the thermistor according to claim 4 bonded and attached via a conductive adhesive.
銀・パラジウム（Ａｇ／Ｐｄ）系合金粉末を無機結着剤
または有機結着剤と混合したものであることを特徴とす
る請求項５に記載のヒータ。6. The conductive adhesive for bonding the thermistor is a mixture of silver-palladium (Ag / Pd) alloy powder with an inorganic binder or an organic binder. The described heater.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7062693A JPH06283307A (en) | 1993-03-30 | 1993-03-30 | Thermistor and heater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7062693A JPH06283307A (en) | 1993-03-30 | 1993-03-30 | Thermistor and heater |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14962794A Division JPH07152269A (en) | 1994-06-30 | 1994-06-30 | Fixing heater and device and image forming device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06283307A true JPH06283307A (en) | 1994-10-07 |
Family
ID=13437029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7062693A Pending JPH06283307A (en) | 1993-03-30 | 1993-03-30 | Thermistor and heater |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06283307A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10303034A (en) * | 1997-04-30 | 1998-11-13 | Tokyo Parts Ind Co Ltd | Surface-mounting coil |
| CN108279255A (en) * | 2018-02-09 | 2018-07-13 | 朱传磊 | A kind of large hydraulic engineering seepage flow real-time detection apparatus |
-
1993
- 1993-03-30 JP JP7062693A patent/JPH06283307A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10303034A (en) * | 1997-04-30 | 1998-11-13 | Tokyo Parts Ind Co Ltd | Surface-mounting coil |
| CN108279255A (en) * | 2018-02-09 | 2018-07-13 | 朱传磊 | A kind of large hydraulic engineering seepage flow real-time detection apparatus |
| CN108279255B (en) * | 2018-02-09 | 2021-01-26 | 山东省水利科学研究院 | Large-scale hydraulic engineering seepage flow real-time detection device |
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