JPH06276002A - Module for high frequency circuit - Google Patents

Abstract

PURPOSE:To reduce the size of the module for the high frequency circuit which includes filter parts. CONSTITUTION:This module consists of a thick film multi-layered substrate which has at least one conductor layer 6 and an insulating layer 4 formed alternately and baked on a ceramic substrate 1 except at a specific part and is provided with a strip line 3a for coaxial resonator coupling at the specific part and a coaxial resonator 10 which is mounted on the strip line on the thick film multi-layered substrate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high frequency circuit module used in a small wireless communication device such as a mobile phone.

[0002]

2. Description of the Related Art In a small wireless communication device such as a mobile phone, it is required to use a higher frequency and to reduce the size and weight of the device. However, the control unit and the wireless IF block of the device have a large scale integrated circuit (LSI). It is expected that each of them will be composed of 1 to 2 chips. On the other hand, with respect to the high-frequency block of the wireless unit, although small-scale integration of a mixer, an amplifier, a VCO, a power amplifier module, etc. has been realized, it is said that it is difficult to make the entire wireless unit into an LSI. What is important in realizing these miniaturization is to reduce the height of components used, but it is disadvantageous to miniaturize the entire circuit block if the module components are used as a whole.

On the other hand, in order to miniaturize high-frequency components including filter components, for example, a co-fired substrate using a green sheet laminating method as described in JP-A-4-301901 (H01P3 / 08). In addition, a configuration in which a filter having a triplate structure is built in is conceivable, but it is said that there is a problem in practical use due to its low Q.

Therefore, in order to miniaturize the high frequency component including such a filter component, a structure as shown in FIG. 5 is considered. That is, a circuit component such as a chip component 15 and an IC 16 is mounted on the dielectric substrate 14, and a dielectric filter 17 is placed to form a high frequency circuit module. The dielectric filter 17 has a structure as described in Japanese Patent Application No. 5-30538 already filed by the present applicant, and has a prismatic dielectric block having a through hole 10a as shown in FIG. 18, a plurality of coaxial resonators 10 each having an outer conductor 21 and an inner conductor 22 formed on the entire surface except the open end 19 and the bottom surface 20 are mounted on a dielectric substrate 23.

[0005]

In the above-mentioned prior art,
Since the height of the entire module is determined by the height of the dielectric filter 17 and the circuit components such as the IC 16, there is a problem in that there is a limit to reducing the height.

[0006]

In order to solve the above-mentioned problems of the prior art, the high-frequency circuit module according to the present invention has at least one conductor layer and an insulating layer on a ceramic substrate, leaving a predetermined portion. A thick-film multilayer substrate having strip lines for coupling coaxial resonators formed on the predetermined portions and formed alternately, and a coaxial resonator mounted on the strip line of the thick-film multilayer substrate. It is a feature.

In the high-frequency circuit module according to the present invention, at least one conductor layer is sputtered on the ceramic substrate and the insulating layer is spin-coated to leave a predetermined portion alternately, and the firing portion is formed. And a coaxial resonator mounted on the strip line of the thick film multilayer substrate, and a coaxial resonator mounted on the strip line of the thick film multilayer substrate.

[0008]

According to the present invention, a thick film multi-layer substrate or a thin film multi-layer substrate is formed on a ceramic substrate with a predetermined portion left, and a coaxial dielectric resonator is mounted on the remaining predetermined portion. It is possible to reduce the size of the high frequency circuit module including the components.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view of a high frequency circuit module according to the present invention. In the figure, 1 is a ground pattern 2 on the back surface and a predetermined circuit pattern 3 on the front surface.
Is a ceramic substrate formed by printing, on the ceramic substrate 1, insulating layers 4 and 5 such as glass and conductor layers 6 such as silver and copper are alternately formed into a thick film by a technique such as screen printing and baked. The resulting thick film multilayer is applied.

In this multi-layer portion, a conductor layer of gold, copper or the like is formed by sputtering, and an insulating layer having high heat resistance such as polyimide resin is alternately and repeatedly formed by a method such as spin coating. It may be a thin film multilayer obtained by.

Then, a portion where the thick film multilayer is not provided is provided in a part of the ceramic substrate 1, the semiconductor element 7 is mounted on the part, and wire bonding 8 and resin sealing 9 are applied to form a MIC. Furthermore, a filter is realized by forming a strip line 3a for coupling a coaxial resonator and mounting a coaxial resonator 10 as shown in FIG. 6 on a portion where the thick film multilayer is not applied.

Further, as shown in FIG. 2, the ceramic substrate should be composed of a line which is not required to have a high dimensional accuracy, for example, a power supply line or a circuit block connection line, or a multilayer substrate 11 having an external connection terminal as an inner layer. As a result, higher density and smaller size can be achieved.

Further, in order to realize further miniaturization, as shown in FIG. 3, the coaxial resonator 12 having a rectangular cross section,
It is effective to use 13. The coaxial resonator 12 shown in FIG. 7A has a circular through hole 12a having a rectangular cross section, and the coaxial resonator 13 shown in FIG. 7B has a rectangular through hole 13a. . FIG. 4 shows the relationship between the cross-sectional shape of the coaxial resonator and the Q value. If the cross-sectional area (axb) is constant, there is no significant deterioration in the Q value. In particular, as shown in FIG. By making the hole 13a rectangular, the Q value can be improved, and the module can be downsized and the performance can be improved.

[0014]

As described above, according to the present invention, a thick film multilayer substrate or a thin film multilayer substrate is formed on a ceramic substrate with a predetermined portion left, and a coaxial dielectric resonator is formed on the remaining predetermined portion. It is possible to reduce the size of the high-frequency circuit module including the filter component by mounting. Further, by making the coaxial resonator have a flat rectangular cross section, and by making the shape of the through hole similar to the cross section, deterioration of the Q value can be prevented, and a compact, high-performance high-frequency wave can be provided. It is possible to realize a circuit module.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a high frequency circuit module according to the present invention.

FIG. 2 is a sectional view of another embodiment of the high-frequency circuit module according to the present invention.

FIG. 3 is a cross-sectional view of a coaxial resonator used in the high-frequency circuit module according to the present invention.

FIG. 4 is a diagram showing the relationship between the cross-sectional shape and the Q value of a coaxial resonator used in the high-frequency circuit module according to the present invention.

FIG. 5 is a cross-sectional view of a high frequency module according to the related art.

FIG. 6 is a diagram showing a coaxial resonator used in the present invention and the prior art.

[Explanation of symbols]

 1, 11 Ceramic substrate 6 Conductor layer 4, 5 Insulating layer 3a Strip line 10, 12, 13 Coaxial resonator 10a, 12a, 13a Through hole

Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI Technical display location H05K 3/46 H 6921-4E Q 6921-4E

Claims (4)

[Claims] 1. A thick-film multilayer structure in which at least one conductor layer and at least one insulating layer are alternately formed on a ceramic substrate while leaving a predetermined portion and fired, and a strip line for coupling a coaxial resonator is provided in the predetermined portion. A high frequency circuit module comprising a substrate and a coaxial resonator mounted on a strip line of the thick film multilayer substrate. 2. A strip line for coupling coaxial resonators to at least one conductor layer formed on a ceramic substrate by sputtering and an insulating layer by spin coating so that a predetermined portion is left and alternately formed and baked. A high-frequency circuit module comprising: a thin-film multi-layered substrate provided with and a coaxial resonator mounted on a strip line of the thick-film multi-layered substrate. 3. The high frequency circuit module according to claim 1 or 2, wherein the coaxial resonator has a flat rectangular cross section. 4. The high-frequency circuit module according to claim 1 or 2, wherein the coaxial resonator has a flat rectangular cross section and a through hole having a similar shape to this cross section. Module for high frequency circuits.