JPH06275704A - Manufacture of semiconductor chip ejector needle and manufacturing jig thereof - Google Patents

Abstract

PURPOSE:To simply and efficiently manufacture an operation for exactly aligning ends of a plurality of styluses and adhering them to a stylus base by forming the steps of forming a recess for an adhesive, dropping the adhesive and polishing to align it, etc. CONSTITUTION:A plurality of stylus engaging holes 1a passing vertically and a conical recess 1b for adhesive are formed at a stylus base 1. A manufacturing jig 3 is formed with a cutout to be mounted with a specified plate 3a and a positioning hole 3b. A plurality of disclike magnets 4 are mounted on a rear surface side of the jig 3. The base l is engaged with the hole 3b of the jig 3. Then, an end 2a of a stylus 2 made of a magnetic material such as a spring steel is directed down, and engaged within the hole 1a. The ends 2a of the styluses 2 are brought into contact with the plate 3a to be received, attracted by the magnet 4 to be effectively brought into contact with the plate 3a and held. Then, adhesive 5 is dropped in the recess 1b of the board 1 to fix the stylus 2, and a protruding part of the adhesive 5 is removed to be flattened.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a semiconductor chip push-up needle and a jig for manufacturing the same for pushing up a semiconductor wafer or the like after dicing to separate the semiconductor chips.

[0002]

2. Description of the Related Art A semiconductor wafer diced by a die bonder or the like is separated into individual semiconductor chips. In order to facilitate the separation, conventionally, the back surface side of the semiconductor chip, that is, the tape side of the frame to which the semiconductor wafer is pasted The semiconductor chip push-up needle pushes up the semiconductor chip. Such a semiconductor chip push-up needle has a structure in which a plurality of small needles are fitted and fixed in a predetermined needle base with their needle tips aligned as shown by 6'in FIG.
The semiconductor chip is prevented from being locally stressed at the time of pushing up.

[0003]

In order to manufacture the semiconductor chip push-up needles, a plurality of needle holes 1c are formed in a disk-shaped needle base 1 made of, for example, aluminum, and small needles 2 are provided in each needle hole 1c. The needle tip 2a of the small needle 2 is properly aligned, the adhesive is dropped into each of the needle holes 1a, and the small needle 2 is fixed. However, according to such a conventional manufacturing method, it takes a considerable amount of skill and time to properly align the needle tips 2a of the plurality of small needles 2 and to bond them to the needle base 1. The adhesion process has become a bottleneck, resulting in a decrease in productivity, which is a problem that must be solved. The present invention has been made to solve such a conventional problem, and is capable of easily and efficiently adhering the needle bases of a plurality of small needles to a needle base to manufacture a semiconductor chip push-up needle. A method and a jig for manufacturing the method are provided.

[0004]

In order to achieve the above object, the present invention provides a step of forming a plurality of needle fitting holes in a needle base formed in a predetermined shape, and an adhesive agent in the needle fitting holes. A step of forming a concave portion for use, a step of mounting the needle base on a manufacturing jig, inserting a needle into the needle insertion hole, and dropping an adhesive agent,
The gist is a method of manufacturing a semiconductor chip push-up needle, which comprises a step of polishing and adjusting the adhesive side.
In addition, the gist is a jig for manufacturing a semiconductor chip push-up needle, which is composed of a positioning hole for mounting the needle base and positioning it at a predetermined position, and a regulation plate for aligning the needle tips. A jig for manufacturing a semiconductor chip push-up needle is provided, in which a magnet for attracting the needle is loaded on the regulation plate so that the tip of the needle fitted in the hole comes into contact with the regulation plate.

[0005]

[Operation] When the needle base is mounted in the positioning hole of the manufacturing jig with the adhesive recess on the top, and the small needle is inserted into the needle insertion hole formed in the needle base with the needle point down, respectively. , The needle tip protrudes from the needle insertion hole and abuts on the regulation plate of the manufacturing jig so that the needle tip of the small needle aligns itself properly, and then the adhesive is dropped into the adhesive recess of the needle base to add the small needle. After fixing each of them, and finally polishing the adhesive side to make it flat, the desired semiconductor chip push-up needle can be manufactured. Also, if a magnet is loaded below the regulation plate of the needle base, the needle tip of the small needle inserted in the needle insertion hole is attracted and comes into contact with the regulation plate to ensure that the needle tip is aligned and fixed with an adhesive. Since the small needle does not move when doing, work becomes easier.

[0006]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. In FIG. 1, reference numeral 1 is a disc-shaped needle base made of aluminum or the like. As shown in FIG. 1, a step of forming a plurality of needle fitting holes 1a vertically penetrating the needle base 1 is performed. As described above, the step of forming the mortar-shaped adhesive recess 1b at the upper end of the needle insertion hole 1a is performed.

Reference numeral 3 is a manufacturing jig formed of a metal in a substantially rectangular parallelepiped shape. As shown in, a regulating plate 3a parallel to the upper and lower surfaces of the jig is formed by a notch, and a positioning hole 3b is formed from the upper surface to the notch. A plurality of (two in the illustrated case) are formed, and a reduced diameter step portion 3c is formed at the lower end of the positioning hole 3b.
When the needle base 1 is fitted, the needle base 1 is received by the reduced diameter step portion 3c and can be positioned at a predetermined position.

Further, a plurality of disk-shaped magnets 4 are loaded on the back side of the manufacturing jig 3, and these magnets 4 are provided on the regulation plate 3 described above.
They are arranged so that they are close to a and have the same axis as the positioning hole 3b.

In order to manufacture a semiconductor chip push-up needle by using the manufacturing jig 3 thus formed, the needle base which has undergone the above-mentioned steps is formed in the positioning hole 3b of the manufacturing jig 3 as shown in FIG. The pedestals 1 are fitted and positioned with the adhesive recesses 1b facing upward.

After this, the small needle 2 made of a magnetic material such as spring steel is inserted into the positioning hole 3b of the manufacturing jig 3 with the needle tip 2a facing downward. Insert into 1a respectively. At this time, the needle tip 2a of each small needle 2 projects from the needle fitting hole 1a and is received by contacting the regulation plate 3a, whereby the needle tip 2a of each small needle 2 is naturally aligned and the magnet 4 Is attracted by the slab to reliably contact the regulating plate 3a and its position is held.
Therefore, even if each of the small needles 2 is fitted roughly to some extent or there is some manufacturing error in the length of each of the small needles 2, the needle tip 2a of each of the small needles 2 is always aligned properly. Pre-alignment work is done naturally and is extremely easy and efficient.

After positioning the needle base 1 and the small needles 2 on the manufacturing jig 3 in this manner, each small needle 2 is fixed by the adhesive dropping step. This is the concave portion 1b for the adhesive on the needle base 1. This is done by dropping a strong adhesive 5 on the surface. in this case,
Since the adhesive recess 1b has a mortar shape as described above, the step of dropping the adhesive 5 can be performed easily and reliably.

After the adhesive 5 is hardened, a step of removing the needle base 1 from the manufacturing jig 3 and polishing and adjusting the adhesive side as shown in FIG. 1 is performed. This may be performed in order to remove the adhesive 5 because the adhesive 5 may be raised or the needle 2 may be slightly projected, so that the adhesive 5 can be flattened. The target semiconductor chip push-up needle 6 can be manufactured through the above steps.

The semiconductor chip push-up needle 6 thus formed has a cylindrical housing 7 as shown in FIG. 2, for example.
The small needle 2 of the semiconductor chip thrusting needle 6 attached to the tip of the piston 8a of the air cylinder 8 provided inside
The needle tip 2a is used by incorporating it into a push-up machine 9 configured to be retractable from a through hole 7b provided in the upper end surface 7a of the cylindrical housing 7.

In FIG. 2, reference numeral 10 denotes a semiconductor chip after dicing, which is held on a tape 11 of a frame (not shown), and the upper end surface 7a of the push-up machine 9 is pushed from the back surface side of the tape 11. If the tip end 2a of the small needle 2 is made to protrude from the through hole 7b by operating the air cylinder 8 by aligning the upper end surface 7a with any one of the semiconductor chips 10 in a state where it is slightly lifted, The needle tip 2a can penetrate the tape 11 and push up the semiconductor chip 10 to separate it. The separated semiconductor chip is immediately adsorbed by the adsorbing collet 12 that stands by immediately above the semiconductor chip, and is transferred to a predetermined location.

After that, the push-up machine 9 operates the needle tip 2a of the small needle 2.
After retracting one end into the through hole 7b, the next semiconductor chip 1
The semiconductor chip can be separated by moving it to the position 0 and repeating the above operation, and all the semiconductor chips are separated by repeating this operation.

Incidentally, even if the magnet 4 is not loaded in the manufacturing jig 3, the needle tips 2a of the respective small needles 2 can be properly aligned by themselves only by the regulating plate 3a. Further, in the embodiment, two positioning holes of the manufacturing jig are formed, but it is of course possible to form more positioning holes.

[0017]

As described above, according to the present invention,
Positioning hole for mounting the needle base and positioning it at a predetermined position,
This is a method of manufacturing semiconductor chip push-up needles using a manufacturing jig that has a regulation plate that aligns the needle tips, and inserts small needles with the needle tips down into the needle insertion holes formed in the needle base. Then, the needle tips project from the needle insertion holes and come into contact with the regulation plates of the manufacturing jig to be properly aligned by themselves, so that the needle tip aligning work of the small needle 2 becomes extremely easy and efficient, and the adhesive is used. Since it suffices to drop the adhesive in a mortar-shaped concave portion for adhesive, the work can be performed easily and surely, and therefore, an excellent effect such that the production efficiency is remarkably improved and the quality is improved can be obtained. Also, if a magnet is loaded below the regulation plate of the needle base, the needle tip of the small needle inserted in the needle insertion hole is attracted and comes into contact with the regulation plate to ensure that the needle tip is aligned and fixed with an adhesive. Since the small needle does not move when performing, work becomes easier.

[Brief description of drawings]

FIG. 1 is an explanatory view showing a method of manufacturing a semiconductor chip push-up needle according to the present invention in the order of steps.

FIG. 2 is a partial vertical cross-sectional view showing a mode of use of the semiconductor chip push-up needle according to the present invention.

FIG. 3 is an explanatory view showing a method of manufacturing a conventional semiconductor chip push-up needle in process order.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Needle base 1a ... Needle insertion hole 1b ... Adhesive recess 1c ... Needle hole 2 ... Small needle 2a ... Needle tip 3 ... Manufacturing jig 3a ... Regulation plate 3b ... Positioning hole 3
c ... Reduced-diameter step portion 4 ... Magnet 5 ... Adhesive agent 6 ... Semiconductor chip push-up needle 7 ... Cylindrical housing 7a
... Upper surface 7b ... Through hole 8 ... Air cylinder 8
a ... Piston 9 ... Pushing machine 10 ... Semiconductor chip 11 ... Tape 12 ... Suction collet

Claims (3)

[Claims] 1. A step of forming a plurality of needle fitting holes in a needle base formed in a predetermined shape, a step of forming an adhesive recess in the needle fitting holes, and a needle jig on a manufacturing jig. Attaching a table, inserting a needle into the needle insertion hole, and dropping an adhesive;
A method of manufacturing a semiconductor chip push-up needle, comprising the steps of polishing and adjusting the adhesive side. 2. A jig for manufacturing a semiconductor chip push-up needle, comprising a positioning hole for mounting a needle base and positioning it at a predetermined position, and a regulating plate for aligning the needle tips. 3. The semiconductor according to claim 2, wherein a magnet for attracting the needle is loaded on the regulation plate so that the tip of the needle fitted in the needle fitting hole of the needle base comes into contact with the regulation plate. A jig for manufacturing tip push-up needles.