JPH062700U - Basket for semiconductor wafers - Google Patents

Abstract

(57) [Abstract] [Purpose] A basket for a semiconductor wafer, which has improved strength and fluidity of a processing liquid and can be applied to a semiconductor wafer having a large diameter and a large weight and thickness. [Structure] Both side walls 31, 32 having a large number of ribs 39, 40 for forming wafer W insertion grooves 41, 42 on the inner surface thereof,
Support plates 33 and 34 for connecting the side walls 31 and 32,
The base parts 37 and 38 located below both the side walls 31 and 32 are formed into a box shape with the upper and lower sides opened, and the side walls 31 and 32 extend downward inwardly so that the ribs 39 and 40 are formed. The lower edge of the wafer W carries the lower edge of the wafer W.
Pedestal portions 35A and 36A are formed, and obliquely downward second pedestal portions 35B and 36B are formed on the upper surfaces of the leg pedestal portions 37 and 38, and the second pedestal portions Part 35
B and 36B are provided with interval holding members 47 and 48 for spacing the carried wafers W at a pitch matching the ribs 39 and 40, and the first pedestal portions 35A and 36A and the second pedestal portion 3 are provided.
Wide open window holes 45 and 46 are formed between 5B and 36B.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a semiconductor wafer basket in which a large number of semiconductor wafers are aligned and stored in parallel at a predetermined pitch, and are subjected to processing such as cleaning, etching, and drying, and a semiconductor wafer basket particularly suitable for a large-diameter semiconductor wafer. Regarding

[0002]

[Prior art]

 As this type of semiconductor wafer basket, for example, there is one disclosed in Japanese Utility Model Publication No. 2-25233 previously proposed by the present applicant. As shown in FIGS. 5 to 7, the basket A is wholly integrally molded of a fluororesin material, and has support plates 13 extending in the lateral direction between both ends of both side walls 1 and 3 which are parallel to each other in the longitudinal direction. 14 are connected to each other, and under the side walls 1 and 3, table portions 5 and 6 for supporting the wafer W are provided so as to project inwardly, respectively, and are formed in a box shape with upper and lower openings. There is. A large number of ribs 2 and 4 extending in the vertical direction in which the wafer W is inserted are provided in parallel on the inner surfaces of the side walls 1 and 3 at a predetermined pitch in the longitudinal direction of the side walls 1 and 3. Vertically long slits 7 and 8 are formed between the ribs 2 and 4 so as to communicate the inside and outside of the side walls 1 and 3. Further, ribs 9 and 10 extending inwardly in a continuous manner from the ribs 2 and 4 are also projected on the inclined upper surfaces 5a and 6a of the pedestals 5 and 6, and between the ribs 9 and 10. Also, vertically elongated slits 11 and 12 for communicating the inside and the outside of both side walls 1 and 3 are provided respectively, and the slits 7 and 11 or the slits 8 and 12 are vertically aligned along the wafer W insertion direction. It is arranged.

When the wafer W is stored in the above-mentioned basket A, if the wafer W is inserted between the ribs 2 and 4, the wafer W that has fallen between the ribs 9 and 10 continuous thereto while dropping. The lower edge of W is carried on the inclined upper surfaces 5a, 6a of the pedestals 5, 6. The large number of wafers W stored in the basket A in this manner are held in an interval by the ribs 2 and 4 and the ribs 9 and 10, and are arranged in an aligned state, and the slits 7 and 8 and the slit 11 are formed. , 12 improves the flow of the processing liquid and the liquid running out, so that uniform and excellent processing can be performed.

[0004]

[Problems to be solved by the device]

 However, this kind of semiconductor wafer can be manufactured with a large diameter due to recent remarkable technological innovation, and it is more efficient and economical to make a semiconductor wafer with a diameter as large as possible and cut it from this. The diameter is gradually increasing due to reasons such as target, and recently, the diameter of 8 inches has also been standardized. As the diameter of semiconductor wafers increases, the weight of semiconductor wafers increases, and the thickness of semiconductor wafers increases to prevent cracks and deformations.Therefore, the size of the basket must be increased to accommodate this. However, this is not the only requirement, and a basket that is more uniform and capable of better processing than ever before is required. Therefore, simply increasing the size of the above-mentioned conventional basket is not sufficient.

For example, when a large-diameter wafer is stored in the basket A having the above-described conventional structure, the inclined upper surfaces 5a and 6a of the pedestals 5 and 6 carrying the lower edge of the wafer W are increased by the increase of the wafer weight. It receives an impact and a load when it is dropped more than ever. However, since the inclined upper surfaces 5a and 6a are notched at the intermediate portions by the slits 11 and 12, the pressure receiving area is small, and therefore a large load is applied per unit area, and especially the edges of the slits 11 and 12 are The part is subjected to a large drop impact by the edge of the wafer W. For this reason, while the wafer W is frequently taken in and out, the inclined upper surfaces 5a and 6a carrying the wafer W are dented, the edge portions of the slits 11 and 12 are damaged, and the wafer W is pierced and the wafer W is pierced. It may not be possible to take in and out the wafer, and fine debris that has been scraped may mix into the processing liquid and adhere to the wafer W or contaminate the processing liquid, significantly reducing the performance of the wafer W for use. Disable it.

In addition, in the basket A having the conventional structure, the slits 7 and the slits 11 and the slits 8 and the slits 12 are vertically aligned in the wafer W insertion direction. When W is inserted between the adjacent ribs 2 and 2, between the ribs 9 and 9, and between the ribs 4 and 4 and the ribs 10 and 10, respectively, all the slits 7 and 8 of the wafer W 1 are inserted. Part of 11 and 12 will be blocked from the inside more than ever, and the flow of the processing liquid will become worse. Particularly in the case of a large-diameter wafer with an increased thickness, the slits 11 and 12 on the lower side, which are the most important in order to improve liquid drainage, are blocked by the increased thickness, so that the processing liquid easily accumulates here. It was extremely unfavorable for uniform and good treatment. However, if the pitch between the ribs is increased to widen the space in order to prevent this, the number of wafers W to be stored decreases, the processing capacity decreases, and a play space in which the wafer W swings between the ribs is created. Since the adjacent wafers W become large and may contact each other and be damaged, the pitch cannot be unnecessarily increased.

Further, among the above-mentioned slits 7, 8, 11, 12 in particular, the slanted slits 11, 12 formed in the pedestals 5, 6 are communicated in the vertical direction to cause the last liquid cut-off. The slits 11 and 12 are blocked by the wafer W as described above, or the edges of the slits 11 and 12 are damaged due to the impact of the dropped wafer W as described above, and the smooth surface is fluffed. In this state, the processing solution will stagnate in this area, and uniform processing will not be possible. Therefore, the present invention has an object to solve these problems and provide a basket for a semiconductor wafer which can be adapted to a wafer having a large diameter and increased weight and thickness.

[0008]

[Means for Solving the Problems]

 In order to solve the above-mentioned problems, in the semiconductor wafer basket of the present invention, a large number of longitudinally extending ribs that form wafer insertion grooves are provided in parallel in the longitudinal direction at predetermined pitches in the basket. Both side walls, the left and right support plates that connect the both ends of each side wall, and the leg parts that are located below the both side walls and project toward the inside of the both side walls in opposite directions It is formed in a box shape that opens, and the upper and lower sides of both side walls including the above ribs are extended vertically and the lower side is inclined inward, and at the lower ends of the side walls where each rib ends. A first pedestal portion is formed to carry the lower edge of the inserted wafer, and an inclined shape is formed along the extension line of the inclined surface of the pedestal portion diagonally below the first pedestal portion. A second pedestal part is formed on the upper surface of the leg part, and is carried on the second pedestal part. A space holding member that separates the roof is provided in parallel with each other at predetermined pitches aligned with the rib, and a wide open window is provided between the first pedestal portion and the second pedestal portion. Holes are drilled.

[0009]

【Example】

 Hereinafter, the present invention will be described in detail with reference to the embodiments shown in FIGS. The basket 30 includes side walls 31 and 32 that are parallel to each other along the longitudinal direction, left and right support plates 33 and 34 that connect the both ends of the side walls 31 and 32, respectively. It is formed in a box shape with its top and bottom opened by the leg stand portions 37 and 38 which are positioned inside the both side walls 31 and 32 so as to face each other, and are entirely molded integrally with a fluororesin material. The basket 30 is provided with an inclined pedestal portion for supporting the lower edge portion of the accommodated wafer W. The pedestal portion is the lower end of the side walls 31 and 32 described above. It is composed of first pedestal portions 35A and 36A formed on the base and second pedestal portions 35B and 36B formed on the upper surfaces of the leg portions 37 and 38.

On the inner surfaces of the side walls 31 and 32, a plurality of longitudinally extending ribs 39 and 40 that form the insertion grooves 41 and 42 of the wafer W between adjacent ones of the side walls 31 and 32 are formed. The insertion grooves 41, 42 are provided in parallel with each other at a predetermined pitch in the hand direction, and vertically elongated slits 41a, 42a for communicating the inside and outside of the basket 30 are formed in the back of the insertion grooves 41, 42. The side walls 31 and 32 and the ribs 39 and 40 extend substantially vertically on the upper side and extend inwardly on the lower side, and the ribs 39 and 40 project from each other so as to face each other. ing. Further, these ribs 39 and 40 are connected to each other by reinforcing ribs 43 and 44 which are adjacent to each other at an intermediate portion, and the ribs 39 and 40 are connected to the above-mentioned first pedestal portions 35A and 36A at the end portions. It is connected.

Next, wide open window holes 45, 46 are provided between the first receiving portions 35A, 36A and the second receiving portions 35B, 36B for communicating the inside and outside of the basket 30. Some of them are connected by a suitable number of reinforcing ribs 45a and 46a. Positioning projections 47 and 48 are provided on the second pedestal portions 35B and 36B as spacing members that lock and separate the lower edge portions of the carried wafer W. The positioning protrusions 47, 48 are arranged in parallel for each predetermined pitch in a manner aligned with the extension lines of the ribs 39, 40, and the positioning protrusions 47, 48 have a truncated cone shape. The space formed between the base portions of the adjacent positioning protrusions is made slightly smaller than the space between the adjacent ribs 39, 40. The first pedestal portions 35A and 36A and the second pedestal portions 35B and 36B described above are formed in an arcuate surface that fits the outer peripheral surface of the wafer W.

When the wafer W is stored in the basket 30, the wafer W is inserted into the insertion grooves 41 and 42 formed between the adjacent ribs 39 and 40. And the positioning protrusions 47 and 48 are arranged in an aligned state in which the distance between adjacent ones is maintained, and the lower edges thereof are the inclinations of the first pedestal portions 35A and 36A and the second pedestal portions 35B and 36B. Each is carried by a contoured inner surface. When the lower edge of the wafer W is held at two points by the first pedestal portions 35A and 36A and the second pedestal portions 35B and 36B as described above, the drop impact when the wafer W is inserted is caused by the side wall. Since the wafers W are distributed on the side of the pedestals 31 and 32 and on the side of the pedestals 37 and 38, even if the wafer W has a large diameter and is heavy, the wafer W is damaged or damaged by a drop impact and the basket 30 is damaged or deformed. Can be reduced. Further, the lower edge of the inserted wafer W is supported at two points in a point contact state, and wide open window holes 45 and 46 for communicating the inside and outside of the basket 30 are bored in the middle part thereof. Even if the wafer W has a large diameter and a large thickness, it is possible to improve the drainage of the cleaning liquid and other processing liquids. Further, since each wafer W in the basket 30 is separated by the ribs 39, 40 on the upper side and the positioning protrusions 47, 48 on the lower side at predetermined intervals, the wafer W is different from the conventional structure. Can be easily inserted and the space can be reliably maintained. That is, the insertion width formed between the adjacent ribs 39 and 40 and the positioning protrusions 47 and 48 is not constant as in the case of a series of ribs of the conventional structure, but can be set to different desired widths. For example, as in the above-described embodiment, the insertion width is set so that the wafer W can be easily inserted on the ribs 39, 40 side and the upper side can be swung to reduce the obstruction of the slits 41, 42 by the inserted wafer W. On the side of the positioning protrusions 47, 48, the insertion width can be narrowed so that the adjacent wafers W that are oscillated do not come into contact with each other, and the distance can be maintained.

It should be noted that the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the gist. For example, instead of the above-described positioning protrusions 47 and 48, short ribs separated from the ribs 39 and 40 may be used as the space holding member. Further, the reinforcing ribs 45a and 46a between the open window holes 45 and 46 described above can be omitted. Further, without forming the slits 41a and 42a in the back portions of the above-mentioned insertion grooves 41 and 42, it is possible to form a basket structure with a bottomed insertion groove with the entire surface as a side wall.

[0014]

[Effect of device]

 As is apparent from the above-described embodiments, the semiconductor wafer basket according to the present invention has the following effects. In this basket, the lower edge of the wafer to be stored is carried by the inclined inner surfaces of the first pedestal portion and the second pedestal portion, respectively, and the drop impact at the time of insertion is accommodated on the side wall side and the pedestal side. Since the particles are dispersed in and, even if the wafer has a large diameter and a large weight, it is possible to reduce the damage and damage of the wafer and the damage and deformation of the basket due to the falling impact. In addition, the lower edge of the inserted wafer is supported at two points in a point contact state, and a wide open window hole for communicating the inside and outside of the basket is bored in the middle part thereof, so that a large diameter is provided. Thus, even if the wafer has a large thickness, the processing liquid such as the cleaning liquid is prevented from accumulating, and the liquid running out can be improved. Further, since the stored wafers are separated from each other by the ribs of the side walls on the upper side and the lower side by the space holding members on the side of the pedestal formed separately from the ribs, the wafers are separated in an aligned state. Unlike the case of the series of ribs, the insertion width for inserting the wafer is not regulated to be constant, and it is possible to individually set a desired insertion width suitable for the insertion of the wafer and the flow of the processing liquid to the wafer. .

[Brief description of drawings]

FIG. 1 is a perspective view showing a main part of a basket for a semiconductor wafer according to an embodiment of the present invention with a part thereof broken away.

FIG. 2 is a plan view showing the entire basket.

FIG. 3 is a front view showing the entire basket.

4 is a vertical cross-sectional view taken along the line B-C of FIG.

FIG. 5 is an overall perspective view of a conventional semiconductor wafer basket.

FIG. 6 is a front view of the basket.

7 is a vertical cross-sectional view taken along the line BB of FIG.

[Explanation of symbols]

30 basket 31, 32 side wall 33, 34 support plate 35A, 36A
First pedestal portion 35B, 36B Second pedestal portion 37,38 Leg base portion 39,40 Rib 41,42 Insertion groove 43,44 Reinforcing rib 45,46 Open window hole 47,48 Positioning protrusion W Wafer

Claims (1)

[Scope of utility model registration request] 1. A side wall in which a large number of longitudinally extending ribs that form a wafer insertion groove are provided in parallel on the inner surface at a predetermined pitch in the longitudinal direction, and between both ends of each side wall. The left and right support plates to be connected to each other and the leg stand portions that are located below the both side walls and project inwardly from the both side walls are formed into a box-like shape that opens up and down. The both side walls including the upper side are substantially vertical and the lower side is inclined inward, and the lower ends of the side walls terminating at the respective ribs carry the lower edge of the inserted wafer. Is formed below the first pedestal portion, and an inclined second pedestal portion is formed obliquely below the first pedestal portion along an extension line of the inclined surface of the pedestal portion. The second pedestal portion is formed on the second pedestal portion and has a spacing member for spacing the carried wafers from each other at a predetermined pitch that aligns with the rib. A semiconductor wafer basket characterized in that each of them is provided in parallel with each other, and a wide open window hole is formed between the first pedestal portion and the second pedestal portion.