JPH06267623A - Surface mounting adapter and manufacture thereof - Google Patents

Abstract

PURPOSE:To improve the degree of freedom of the shape of a surface mounting adapter by forming a compound molding having the frame structure from easy- plating resin, which includes electroless plating catalyst, and non-plating resin, which does not include electroless soldering catalyst. CONSTITUTION:A primary molding 13 is formed by filling an upper and a lower molds 16, 17 for primary molding with easy-plating synthetic resin, which includes electroless plating catalyst. After housing the primary molding 13 inside of an upper and a lower molds 19, 10 for molding a secondary molding 21, the non-plating synthetic resin, which does not include electroless catalyst, as the material of the secondary molding is filled, and the secondary molding 21 is formed integrally with the primary molding 13 by the injection molding to form a compound molding 11. At this stage, the primary molding 13 is formed so that the surface of leg parts 14 thereof are exposed after the release from the molds. After forming exposed parts 22 of the primary molding 13 of the molding 11 is formed into the rough surface, electroless plating is performed to form a metal layer 12 and form a surface mounting adapter. Degree of freedom of the shape of an adapter is thereby improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface-mounting adapter having a frame-like structure for mounting electronic parts on a substrate,
In particular, the present invention relates to a surface-mounting adapter in which a molded product has a protrusion and an electric circuit is formed on the protrusion, and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, when mounting electronic components on a board, for example, a circuit is formed on an existing printed circuit board, and a frame-shaped structure is ground to form an adapter for surface mounting. I am trying to install.

[0003]

However, the surface-mounting adapter is formed by grinding a printed circuit board, and its shape is limited in terms of grinding workability. More importantly, the thickness of the printed circuit board is limited in several ways, and since the thickness of each is constant, there is a great limitation in forming a three-dimensional shape.

Therefore, an object of the present invention is to solve the above-mentioned drawbacks of the prior art and to provide a novel surface mounting adapter which can be freely designed in shape and a manufacturing method thereof.

[0005]

In order to achieve the above object, the present invention comprises a primary molded article made of an easily plateable resin containing an electroless plating catalyst and a hardly plated resin not containing an electroless plating catalyst. While molding a composite molded product having a frame-shaped structure with the next molded product, a part of the primary molded product is exposed on the surface of the composite molded product, and a surface mounting adapter in which a metal layer is formed on the exposed portion, In addition, primary molding is performed with an easily-plating resin containing an electroless plating catalyst, and the primary molding is used as a core to form a composite molding with a frame-like structure by secondary molding with a non-plating resin that does not contain an electroless plating catalyst. It is a manufacturing method in which a part of the primary molded product is exposed at the same time as molding, the surface exposed portion of the primary molded product is roughened, and a metal layer is formed thereon by electroless plating. .

[0006]

With the above structure, the frame-shaped composite molded article is molded with the easily-platable resin containing the electroless plating catalyst and the hard-to-plate resin not containing the electroless plating catalyst, so that the degree of freedom in shape can be increased. Can be greatly improved.

Since the primary molding material forms the skeleton of the final product and functions as a core during secondary molding, rigidity, dimensional stability and heat resistance are required, and electrical characteristics are also required. Since it has to be taken into account, it is usually chosen among so-called engineering plastics. For example, polycarbonate, polyamide, polyetherimide, polysulfone, polyether sulfone, polyphenylene sulfide, polyethylene terephthalate, polyether ketone, and polyether ether ketone are preferable. Liquid crystal polymer, such as Novacurate (trade name),
Vectra (trade name) or a thermosetting resin such as a phenol resin, an epoxy resin, or a diallyl phthalate resin may be used. A filler such as glass fiber, potassium titanate fiber or calcium carbonate may be added to these resins.

The secondary molding material, like the primary molding material,
It is possible to select from these materials, but it is desirable that the molding temperature is lower than that of the primary molding material.

In order to form a patterned metal layer on the surface of the primary molded product, when an easily plateable material is used as the primary molding material, it is amorphous or has a relatively low molecular weight and is easily roughened. The one that is easily attacked by a specific solvent, or the one to which a catalyst containing a noble metal compound such as palladium, gold or silver is added is used.

Electroless plating is used to form a metal layer on the exposed surface of the primary molded product on the surface of the composite molded product. Electroless plating involves the steps of roughening the exposed surface of the easily-platable material and then applying a catalyst made of a compound of a noble metal such as palladium, gold, or silver, if necessary, and the step of applying plating. Become.

On the surface of the primary molding (easy plating) material,
Generally, pretreatment is performed so as to have sufficient adhesion to the plating layer. First, alkali cleaner, surfactant,
Remove stains such as mold release agents, oils and fats, and dust attached to molded products with organic solvents. Then, if necessary, after treating with N, N dimethylformamide etc., chromic acid / sulfuric acid,
The surface is roughened using an etching solution such as calcium hydroxide, hydrofluoric acid / nitric acid, or acidic ammonium fluoride / nitric acid.

In order to selectively form a metal layer on the outer surface of the primary molding material, a method of adding a plating catalyst to the primary molding material in advance, a method of selectively roughening the primary molding material,
And there is a combination of both. Examples of the electroless plating catalyst added in advance to the primary molding material include Group VIII and I of the periodic table.
Group B metals such as nickel, platinum, palladium, rhodium, iridium, gold, silver and copper, simple substances or compounds such as salts and oxides can be used. Specifically, it is palladium chloride. Selective roughening of the primary molding material is possible, for example, by using a solvent that causes the primary molding material to swell but not the secondary molding material.

Instead of previously adding a catalyst for electroless plating to the primary molding material, a step of applying a catalyst may be added after surface roughening. As a method of applying a catalyst, a catalyst-accelerator method, that is, after immersing in a mixed catalyst solution of a metal such as palladium or tin, it is activated with an acid such as hydrochloric acid or oxalic acid to roughen the surface of the secondary molding material. And a sensitizing-activating method, that is, a metal pattern forming part of a secondary forming material in which a strong reducing agent such as stannous chloride, hydrazine chloride and hypophosphorous acid is roughened There is a method of precipitating the noble metal by immersing it in a catalyst solution containing a noble metal ion such as palladium or gold after adsorbing the noble metal.

After the pretreatment, copper, nickel or the like is plated by the electroless (chemical) plating method. In some cases, nickel and gold are electrolessly plated on copper. When the metal layer is used as a wiring portion of an electric circuit pattern, generally, a copper layer or a layer of nickel, gold, solder, or the like is formed alone or in combination on the copper layer. A metal layer of the same or different type may be further formed on the electroless plated layer by ordinary electroplating using this layer as a conductor (for example, an electroplated nickel layer on the electroless plated copper layer). This method is useful when a sufficient thickness of the metal layer cannot be obtained by electroless plating.

By selectively forming a metal layer on the exposed surface of the easily-platable primary molding material, a patterned metal layer is formed on the surface of the composite molded article according to the shape of the exposed portion of the primary molding material. To be done.

[0016]

An embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

FIGS. 1A to 1L show various shapes of the surface mounting adapter 10 of the present invention. FIG.
Is a composite molded article 11 formed in an annular structure, and a metal layer 12 to be a circuit is formed on the front side surface, the inner side surface, and the back side surface thereof. FIG. 1 (b) shows a modification of FIG. 1 (a), in which the composite molded product 11 is formed in an elliptical shape, and FIG. 1 (c) is also a track shape of an endless track having straight and curved portions. It was formed in.

FIGS. 1 (d), 1 (e) and 1 (f) correspond to FIGS. 1 (a), 1 (b) and 1 (c), respectively.
The metal layer 12 to be a circuit is formed on the front side surface, the outer side surface, and the back side surface.

1 (g) and 1 (h) show an example in which the metal layers 12 on the front and back sides are formed so as to face in a specific direction. FIG. 1 (g) shows the metal on the front and back sides. An example in which the metal layer 12 is formed on the layer 12 and the inner side surface is shown, and FIG.

FIG. 1 (i) shows a composite molded product 11 formed in a rectangular frame shape, and FIG. 1 (j) is formed in a rectangular frame shape, and circuits are formed on the front side surface, the inner side surface, and the back side surface, respectively. The metal layer 12 is formed.

1 (k) and 1 (l) are shown in FIG.
Corresponding to (j), the metal layer 12 to be a circuit is formed on the front surface, the outer surface, and the back surface of the composite molded product 11.

The surface mounting adapter 1 shown in FIG.
An outline of the production of No. 0 will be described with reference to FIG.

FIG. 2A shows a molding process of the primary molded product 13, and shows a state in which the upper mold 16 is removed from the primary molded product 13 after injection molding.

First, the primary molded product 13 has a leg portion 14 corresponding to the thickness of the adapter to be molded, and a connecting portion 15 for integrally connecting the leg portions 14 to each other. Further, the primary molding upper mold 16 and the lower mold 17 are formed with the recesses 18 for molding the leg portions 14, and when the upper and lower molds 16 and 17 are combined, the connecting portion 15 can be formed between them. There is.

The primary molded product 13 is molded by injecting an easily-platable synthetic resin containing an electroless plating catalyst into the upper and lower molds 16 and 17.

FIG. 2 (b) shows upper and lower dies for secondary molding 19 and 20 for injection molding the secondary molded product 21. The upper and lower dies 19 and 20 are the composite moldings shown in FIG. Article 11
Is formed so as to correspond to the outer surface shape of the. This upper and lower mold 1
After the primary molded product 13 is accommodated in the insides of 9, 20, a non-plating resin that does not contain an electroless plating catalyst, which is a secondary molding material, is injected and the secondary molded product 21 is integrated with the primary molded product 13.
Is injection-molded to form a composite molded product 11.

This composite molded article 11 is shown in FIGS.
As shown in (l), the front and back side surfaces and the inner or outer side surface of the leg portion 14 of the primary molded product 13 corresponding to the position of the metal layer 12,
The other parts are molded so as to be in close contact with the inner surfaces of the secondary molding upper and lower molds 19 and 20 and to be exposed on the surface of the composite molded product 11 after the mold is removed from the other molded parts.

After the exposed portion 22 of the primary molded product 13 of the composite molded product 11 is roughened, electroless plating is applied to the molded product 13 shown in FIG.
The metal layer 12 is formed as shown in (c), and the surface mounting adapter 10 shown in FIG. 1 is manufactured.

FIGS. 3 (a) and 3 (b) show a modification of FIG. 1, so that the metal layer 12 on the front side or the back side of the composite molded article 11 should not be provided near the inner side. It was formed. By forming the adapter 10 in this way,
At the time of molding the composite molded body 11, in particular at the stage of molding the secondary molding material, since the primary molding 13 is on the outside, it is possible to dramatically improve the filling property when the secondary molding material is injection molded from the inside. It is possible and its industrial effect is very large. The radial width of the metal layer 12 formed on the front and back surfaces is preferably more than 0% and 50% or less, and particularly preferably 10 to 40% of the radial width of the composite molded product 11. This Figure 3
In the embodiment of FIG. 1, an annular and a rectangular frame structure are illustrated.
It may be formed in various shapes as shown in FIG.

FIG. 4 shows a modified example of FIG. 3, in which the leg 14a of the primary molded product 13 is formed on the back side of the composite molded product 11 so as to project, and the metal layer 12a is formed on the projected leg 14a.
4A is formed, and FIG.
Is formed in an annular shape, and FIG. 4 (b) is formed in a rectangular shape.

FIG. 4 (c) shows a primary molded product 13 which is formed by connecting the legs 14 to each other in a rectangular shape by a connecting portion 15. FIG. 4D shows a composite molded article 11 obtained by injection-molding the secondary molded article 21 to the primary molded article 13 of FIG. 4C. Particularly, in injection-molding the secondary molded article 21, The composite molded product 11 is molded so that the leg portions 14a protrude from the back side thereof, and the primary molded product 13 exposed from the composite molded product 11 is roughened to form the metal layers 12 and 12a.

FIG. 5 shows the primary molded product 13 of FIG.
Rectangular surface mount adapter 10 shown in FIG.
3 shows a process for manufacturing the.

First, as shown in FIG. 5A, the primary molding upper and lower dies 16 and 17 are used to injection-mold the primary molding 13 in which the leg portions 14 are connected by the connecting portions 15. As this primary molding synthetic resin, polyether sulfone mixed with 0.1 wt% of palladium was used. After the primary molded product 13 is released from the primary molding upper and lower molds 16 and 17, it is housed in the secondary molding upper and lower molds 24 and 25 as shown in FIG. 5B. In the secondary molding upper and lower molds 24, 25, the upper mold 24 is the primary molded product 13
Of the lower mold 25 is formed in a flat shape so as to be in contact with the upper surface of the leg 14, and the lower mold 25 is formed with a groove 26 for accommodating the leg 14a protruding from the back side surface of the composite molded product 11 and the surface 25a of the lower mold 25. Are designed to form a predetermined gap d with the connecting portion 15.

After the primary molding 13 is set in the lower mold 25 as shown in FIG. 5B, the upper mold 24 is closed as shown in FIG. 5C and the secondary molding material is injected. The secondary molded product 21 is injection molded.

Polyphenylene sulfide, which is a kind of super engineering plastic having excellent heat resistance, is used as a secondary plating material, which is a difficult-to-plate synthetic resin.

The composite molded product 11 after injection molding is removed from the secondary molding upper and lower molds 24 and 25, and then the oil and fat components attached to the surface of the composite molded product 11 by an alkaline cleaner, a surfactant, an organic solvent or the like. Remove dirt, dust, mold release agent, etc. Then, after immersing in N, N dimethylformamide for 2 minutes, it is exposed from the composite molded article 11 by immersing in etching solution such as chromic acid / sulfuric acid, calcium hydroxide or ammonium acid fluoride / nitric acid at 60 ° C for 4 minutes. The surface of the formed primary molded product 13 was roughened. Finally, electroless copper plating was deposited on the roughened surface to a thickness of about 30 μm. Thus, as shown in FIG. 4D, the surface mounting adapter 10 can be manufactured only by injection molding and electroless plating.

By forming a protruding metal layer 12a on the back surface of the composite molded article 11 as shown in FIG. 4, the surface of the secondary molded article 21, which is a non-patterned surface, is formed on the mating side when the surface is mounted. It is possible to prevent direct contact with the surface of the substrate, and at the time of secondary molding, only the upper mold is changed while being held in the primary molding lower mold 17 without inserting the primary molded product 13 into the secondary molding mold. In addition, the secondary molding is performed while holding the lower mold 17 at a distance d from the lower mold 17 so that the molding can be performed twice continuously and automation can be realized.

[0038]

In summary, according to the present invention, the shape of a frame-shaped composite molded article is formed by molding an easily-platable resin containing an electroless plating catalyst and a hardly-platable resin containing no electroless plating catalyst. The degree of freedom of can be greatly improved.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of the present invention.

FIG. 2 is a diagram showing a manufacturing process in the present invention.

FIG. 3 is a diagram showing another embodiment of the present invention.

FIG. 4 is a diagram showing still another embodiment of the present invention.

FIG. 5 is a diagram showing the manufacturing process of FIG. 4;

[Explanation of symbols]

 11 Composite Molded Product 12 Metal Layer 13 Primary Molded Product 21 Secondary Molded Product

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takanobu Ishibashi 5-1-1 Hidaka-cho, Hitachi City, Ibaraki Prefecture, Hitachi Power Systems Co., Ltd. (72) Inventor Hideki Asano 5 Hidaka-cho, Hitachi City, Ibaraki Prefecture 1-1-1 Hitachi Cable Co., Ltd. Power Systems Research Center

Claims (2)

[Claims] 1. A composite molded product having a frame-like structure is molded from a primary molded product made of an easily plating resin containing an electroless plating catalyst and a secondary molded product made of a difficult plating resin containing no electroless plating catalyst. At the same time, a part of the primary molded product is exposed on the surface of the composite molded product, and a metal layer is formed on the exposed portion, which is a surface mounting adapter. 2. A composite having a frame-shaped structure, which is formed by primary molding with an easy-plating resin containing an electroless plating catalyst, and by using the primary molded product as a core with secondary molding with a non-plating resin containing no electroless plating catalyst. Forming a molded product and exposing a part of the primary molded product to the surface of the composite molded product, roughening the exposed surface of the primary molded product, and forming a metal layer by electroless plating on it And a method for manufacturing a surface mounting adapter.