JPH04338529A - Manufacture of synthetic resin composite molded item - Google Patents
Manufacture of synthetic resin composite molded itemInfo
- Publication number
- JPH04338529A JPH04338529A JP13819491A JP13819491A JPH04338529A JP H04338529 A JPH04338529 A JP H04338529A JP 13819491 A JP13819491 A JP 13819491A JP 13819491 A JP13819491 A JP 13819491A JP H04338529 A JPH04338529 A JP H04338529A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- metal layer
- molded item
- primary
- electroless plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 34
- 229920003002 synthetic resin Polymers 0.000 title claims description 20
- 239000000057 synthetic resin Substances 0.000 title claims description 20
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 45
- 239000002184 metal Substances 0.000 claims abstract description 45
- 238000007772 electroless plating Methods 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 20
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 12
- 238000007788 roughening Methods 0.000 claims description 12
- 239000000126 substance Substances 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 6
- 238000005406 washing Methods 0.000 claims description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract description 18
- 239000003054 catalyst Substances 0.000 abstract description 17
- 238000000465 moulding Methods 0.000 abstract description 13
- 239000000853 adhesive Substances 0.000 abstract description 10
- 230000001070 adhesive effect Effects 0.000 abstract description 10
- 229910052763 palladium Inorganic materials 0.000 abstract description 9
- 239000004695 Polyether sulfone Substances 0.000 abstract description 6
- 239000004734 Polyphenylene sulfide Substances 0.000 abstract description 6
- 239000003365 glass fiber Substances 0.000 abstract description 6
- 229920006393 polyether sulfone Polymers 0.000 abstract description 6
- 229920000069 polyphenylene sulfide Polymers 0.000 abstract description 6
- 239000012778 molding material Substances 0.000 description 28
- 239000000463 material Substances 0.000 description 27
- 238000007747 plating Methods 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 239000004033 plastic Substances 0.000 description 10
- 229920003023 plastic Polymers 0.000 description 10
- 239000000243 solution Substances 0.000 description 10
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
- 229910052737 gold Inorganic materials 0.000 description 7
- 239000010931 gold Substances 0.000 description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 5
- 229910000510 noble metal Inorganic materials 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- BIVUUOPIAYRCAP-UHFFFAOYSA-N aminoazanium;chloride Chemical compound Cl.NN BIVUUOPIAYRCAP-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Chemically Coating (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は合成樹脂複合成形品の製
造方法、特に表面に強固に接着したパターン状金属層を
有する合成樹脂複合成形品の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a synthetic resin composite molded article, and more particularly to a method of manufacturing a synthetic resin composite molded article having a patterned metal layer firmly adhered to its surface.
【0002】0002
【従来の技術】表面に電気回路パターン等として利用さ
れるパターン状金属層を有するプラスチック成形品、例
えばMCB(molded circuit boar
d) 、MWB(molded wiring boa
rd)、MID(molded interconne
ction device)が、軽量化、スペース節減
、コスト低下等の諸要求に沿うものとして注目されてい
る。2. Description of the Related Art Plastic molded products, such as MCB (molded circuit bore), have a patterned metal layer on the surface that is used as an electric circuit pattern.
d) , MWB (molded wiring boa)
rd), MID (molded interconnection)
ction devices) are attracting attention as they meet various demands such as weight reduction, space saving, and cost reduction.
【0003】表面にパターン状金属層を有するプラスチ
ック成形品を製造する方法として、従来、例えば、特開
昭63─50482号、特開平1─207989号に記
載されているように、無電解めっきすることが容易なプ
ラスチック材料(以下、易めっき性材料と言う)で、骨
格に相当する部分の一次成形品を形成した後、一次成形
品の外面のめっき不要の部分に無電解めっきすることが
困難なプラスチック材料(以下、難めっき性材料と言う
)を注入し、これらを一体として二次成形した後、易め
っき性材料の露出部に無電解めっきにより金属層を形成
する方法が、広く用いられている。Conventionally, as a method for producing a plastic molded product having a patterned metal layer on the surface, electroless plating is used, as described in, for example, Japanese Patent Application Laid-Open Nos. 63-50482 and 1-207989. After forming the primary molded part of the part corresponding to the skeleton using a plastic material that is easy to plate (hereinafter referred to as "easy-plating material"), it is difficult to electrolessly plate the parts of the outer surface of the primary molded part that do not require plating. A widely used method is to inject a plastic material that is difficult to plate (hereinafter referred to as a difficult-to-plating material), and then secondary-forming the materials as one piece, and then forming a metal layer on the exposed portion of the easily plateable material by electroless plating. ing.
【0004】例えば、まず図2(A)に示すように、頂
部が平面をなす凸部21aと、その間に凹部21bを有
する一次成形体21を、易めっき性の一次成形材料22
で形成する。ついで、図2(B)に示すように、二次成
形用の金型12の中で、一次成形体21の凹部21bを
含む、金型内のキャビティ12bに、難めっき性の二次
成形材料23を注入することにより、図2(C)に示す
ような断面を持つ二次成形品24を形成させる。二次成
形品24では、上述の凹部21bが難めっき性の二次成
形材料23で充填されている。金型から外した二次成形
品24の上面24aを、図2(D)に示すように粗面化
した後、無電解めっきを施すと、図2(E)に示すよう
に、一次成形体21の凸部21aに対応する、二次成形
品24の表面に易めっき性の一次成形材料22が露出し
ている部分21cの表面だけに、金属層25が形成され
る。こうして、金属パターンを有する合成樹脂複合成形
品(プラスチックツーショット基板)26が得られる。For example, first, as shown in FIG. 2A, a primary molded body 21 having a convex portion 21a having a flat top and a concave portion 21b therebetween is prepared using a primary molded material 22 that is easy to plate.
to form. Next, as shown in FIG. 2(B), in the mold 12 for secondary molding, a secondary molding material that is difficult to plate is placed in a cavity 12b in the mold, including the recess 21b of the primary molded body 21. By injecting 23, a secondary molded product 24 having a cross section as shown in FIG. 2(C) is formed. In the secondary molded product 24, the above-mentioned recess 21b is filled with a secondary molding material 23 that is difficult to plate. When the upper surface 24a of the secondary molded product 24 removed from the mold is roughened as shown in FIG. 2(D) and then subjected to electroless plating, the primary molded product is formed as shown in FIG. 2(E). The metal layer 25 is formed only on the surface of the portion 21c where the easily plateable primary molding material 22 is exposed on the surface of the secondary molded product 24, which corresponds to the convex portion 21a of the second molded product 21. In this way, a synthetic resin composite molded product (plastic two-shot substrate) 26 having a metal pattern is obtained.
【0005】易めっき性材料としては、非晶性あるいは
比較的低分子量で、物理的または化学的に粗面化され易
いプラスチック材料、あるいはパラジウム、金、銀等の
貴金属を含む触媒を添加したプラスチック材料が用いら
れる。前者、すなわち粗面化され易く、触媒を含まない
プラスチック材料を用いる場合には、無電解めっきを施
す前に、貴金属を含む触媒を表面に予め付与する処理が
行われる。Easily plateable materials include plastic materials that are amorphous or have a relatively low molecular weight and are easily roughened physically or chemically, or plastics that have added catalysts containing noble metals such as palladium, gold, and silver. material is used. In the former case, that is, when using a plastic material that is easily roughened and does not contain a catalyst, a process is performed in which a catalyst containing a noble metal is applied to the surface in advance before electroless plating is applied.
【0006】[0006]
【発明が解決しようとする課題】しかし、上記のような
従来の方法には、以下に述べるような短所があった。す
なわち、無電解めっきにより形成された金属層の、プラ
スチック材料に対する接着強度は、JIS.C5012
による試験で1.0kgf/cm程度で、比較的剥離し
易い。それだけでなく、表面の粗面化の際、薬液が易め
っき性材料と難めっき性材料との界面に浸透し、めっき
後、それが徐々に滲み出し、めっき膜を劣化させたり、
電気回路の絶縁不良を生じる場合がある。[Problems to be Solved by the Invention] However, the above conventional methods have the following disadvantages. That is, the adhesive strength of a metal layer formed by electroless plating to a plastic material is determined according to JIS. C5012
According to the test, it was about 1.0 kgf/cm, and it peeled off relatively easily. Not only that, when the surface is roughened, the chemical solution penetrates the interface between the easily plated material and the difficult to plate material, and after plating, it gradually oozes out, causing the plating film to deteriorate.
This may result in poor insulation of electrical circuits.
【0007】本発明の目的は、金属層の接着強度が大き
く、金属層が粗面化のための薬液の滲み出しにより劣化
しないように改良された、表面にパターン状金属層を有
する合成樹脂複合成形品の製造方法の実現にある。The object of the present invention is to provide a synthetic resin composite having a patterned metal layer on the surface, which has a high adhesive strength and is improved so that the metal layer does not deteriorate due to seepage of a chemical solution for surface roughening. The goal lies in the realization of a method for manufacturing molded products.
【0008】本発明では、金属層の接着強度が大きく、
金属層が粗面化のための薬液の滲み出しにより劣化しな
いように改良された、表面にパターン状金属層を有する
合成樹脂複合成形品の製造方法を実現するため、易めっ
き性材料(表面を粗面化して無電解めっきすることがで
きる、第一の熱可塑性樹脂)から成る第一の成形体の、
表面の少なくとも所定の部分を粗面化し、それを型内に
固定し、第一の成形体の所定の部分を押圧し、型内のキ
ャビティに、難めっき性材料(無電解めっきが困難な、
第二の熱可塑性樹脂)を充填して、複合成形品を形成し
、この複合成形品の表面の、上記の押圧された第一の成
形体の部分に、無電解めっきを施すようにした。第一の
成形体の所定の部分の押圧は、二次成形前の型締めの際
、型の内面を第一の成形体の面に圧接させる方法で、容
易に行うことができる。[0008] In the present invention, the adhesive strength of the metal layer is high;
In order to realize a method for manufacturing a synthetic resin composite molded product with a patterned metal layer on the surface, which is improved so that the metal layer does not deteriorate due to oozing of chemicals for surface roughening, we developed an easily plated material (the surface is of a first molded body made of a first thermoplastic resin (a first thermoplastic resin whose surface can be roughened and subjected to electroless plating);
At least a predetermined portion of the surface is roughened, it is fixed in a mold, a predetermined portion of the first molded body is pressed, and a difficult-to-plating material (a material that is difficult to electroless plate,
A composite molded article was formed by filling the composite molded article with a second thermoplastic resin, and electroless plating was applied to the surface of the composite molded article on the pressed first molded article. Pressing a predetermined portion of the first molded body can be easily performed by pressing the inner surface of the mold against the surface of the first molded body during mold clamping before secondary molding.
【0009】第一の熱可塑性樹脂は、一次成形体が複合
成形品の骨格を形成し、また二次成形の際の中子として
機能するため、剛性、寸法安定性、耐熱性が要求され、
電気的特性も考慮しなければならないので、通常、いわ
ゆるエンジニアリングプラスチックの中から選ばれる。
例えばポリカーボネート、ポリアミド、ポリエーテルイ
ミド、ポリスルホン、ポリエーテルスルホン、ポリアリ
ール(aryl)スルホン、ポリフェニレンスルフィド
、ポリアリレート(polyarylate) 、ポリ
エチレンテレフタレート、ポリブチレンテレフタレート
、ポリエーテルケトン、ポリエーテルエーテルケトンが
好ましい。液晶ポリマー、例えばノバキュレート(商品
名)、ベクトラ(商品名)、あるいはフェノール樹脂、
エポキシ樹脂、ジアリルフタレート樹脂等の熱硬化性樹
脂を用いてもよい。
これらの樹脂には、ガラス繊維、チタン酸カリウム繊維
、炭酸カルシウム等のフィラーを添加してもよい。[0009] The first thermoplastic resin is required to have rigidity, dimensional stability, and heat resistance because the primary molded product forms the skeleton of the composite molded product and also functions as a core during secondary molding.
Since electrical properties must also be considered, the material is usually selected from among so-called engineering plastics. For example, polycarbonate, polyamide, polyetherimide, polysulfone, polyethersulfone, polyaryl sulfone, polyphenylene sulfide, polyarylate, polyethylene terephthalate, polybutylene terephthalate, polyetherketone, polyetheretherketone are preferred. Liquid crystal polymers, such as Novaculate (trade name), Vectra (trade name), or phenolic resins,
Thermosetting resins such as epoxy resins and diallyl phthalate resins may also be used. Fillers such as glass fiber, potassium titanate fiber, and calcium carbonate may be added to these resins.
【0010】第二の熱可塑性樹脂は、第一の熱可塑性樹
脂と同様に、これらの材料から選ぶことができるが、第
一の熱可塑性樹脂より成形温度が低いことが好ましい。The second thermoplastic resin can be selected from these materials in the same way as the first thermoplastic resin, but it is preferable that the molding temperature is lower than that of the first thermoplastic resin.
【0011】一次成形体の表面にパターン状金属層を形
成させる必要上、一次成形材料として用いる易めっき性
材料(第一の熱可塑性樹脂)としては、非晶性あるいは
比較的低分子量で、粗面化され易いか、特定の溶剤、薬
品等に侵され易いものが好ましい。また、パラジウム、
金、銀等の貴金属触媒を添加したものを用いると、無電
解めっき前に一次成形体に触媒を付与する工程が不要と
なり、有利である。[0011] Since it is necessary to form a patterned metal layer on the surface of the primary molding, the easily plated material (first thermoplastic resin) used as the primary molding material is amorphous or relatively low molecular weight and coarse. It is preferable to use materials that are easily surfaced or easily attacked by specific solvents, chemicals, etc. Also, palladium,
It is advantageous to use a catalyst to which a noble metal catalyst such as gold or silver is added because it eliminates the need for a step of applying a catalyst to the primary molded body before electroless plating.
【0012】複合成形体の表面の、一次成形体の露出部
分に金属層を形成させるには、無電解めっきを利用する
。無電解めっきは、易めっき性材料で構成された一次成
形体の、粗化され、押圧された表面の部分に行う。無電
解めっきを行う前に、必要ならば、パラジウム、金、銀
等の貴金属触媒を付与する前処理を施してもよい。[0012] Electroless plating is used to form a metal layer on the exposed portion of the primary molded body on the surface of the composite molded body. Electroless plating is performed on a roughened and pressed surface portion of a primary molded body made of an easily plated material. Before performing electroless plating, if necessary, a pretreatment of imparting a noble metal catalyst such as palladium, gold, or silver may be performed.
【0013】易めっき性材料で構成された一次成形体の
表面を粗面化するには、通常、まずアルカリクリーナ、
界面活性剤、有機溶剤等により成形品に付着している離
型剤、脂分、ごみ等の汚れを除去する。次に必要に応じ
N,N−ジメチルホルムアミド等で処理した後、クロム
酸/硫酸、水酸化カルシウム、弗化水素酸/硝酸、酸性
弗化アンモニウム/硝酸等のエッチング液を用いて、粗
面化する。このような粗面化処理により、めっき層との
間の充分な接着力が得られるようになる。[0013] In order to roughen the surface of a primary molded body made of an easily plated material, it is usually first treated with an alkaline cleaner,
Removes dirt such as mold release agents, fat, and dirt adhering to molded products using surfactants, organic solvents, etc. Next, after processing with N,N-dimethylformamide, etc. as necessary, the surface is roughened using an etching solution such as chromic acid/sulfuric acid, calcium hydroxide, hydrofluoric acid/nitric acid, acidic ammonium fluoride/nitric acid, etc. do. Such surface roughening treatment makes it possible to obtain sufficient adhesive strength between the plated layer and the plated layer.
【0014】予めめっき触媒を添加することにより易め
っき性にした一次成形材料を用いることは、一次成形材
料の外面に選択的に金属層を形成させるために好ましい
。一次成形材料に予め添加する無電解めっき触媒として
は、周期律表第VIII族および第IB族の金属の単体
および化合物、例えば銅、銀、金、ニッケル、白金、パ
ラジウム、ロジウム、イリジウム、またはそれらの塩、
酸化物等を用いることができる。一次成形材料のみを粗
面化し、押圧する方法でも、一次成形材料の外面に選択
的に金属層を形成させることは可能である。[0014] It is preferable to use a primary molding material which has been made easier to plate by adding a plating catalyst in advance, in order to selectively form a metal layer on the outer surface of the primary molding material. The electroless plating catalyst to be added in advance to the primary molding material may include simple substances and compounds of metals of Group VIII and Group IB of the periodic table, such as copper, silver, gold, nickel, platinum, palladium, rhodium, iridium, and the like. salt,
Oxides etc. can be used. It is also possible to selectively form a metal layer on the outer surface of the primary molding material by roughening and pressing only the primary molding material.
【0015】一次成形材料に予め無電解めっきに対する
触媒を添加する代わりに、表面粗面化の後に触媒付与の
工程を付加してもよい。触媒付与の方法としては、キャ
タリスト─アクセラレータ法、すなわちパラジウム、錫
等の金属の混合触媒液に浸漬後、塩酸、しゅう酸等の酸
で活性化して、二次成形材料の粗面化された表面にパラ
ジウム等を析出させる方法と、センシタイジング─アク
ティベーティング法、すなわち塩化第一錫、塩化ヒドラ
ジン、次亜燐酸等の強い還元剤を粗面化された易めっき
性材料の所要部分に吸着させた後、パラジウム、金等の
貴金属イオンを含む触媒液に浸漬し、貴金属を析出させ
る方法がある。触媒付与の工程は、二次成形前、二次成
形後のいずれでもよいが、二次成形後が好ましい。Instead of adding a catalyst for electroless plating to the primary molding material in advance, a step of applying a catalyst may be added after surface roughening. The method for applying the catalyst is the catalyst-accelerator method, in which the material is immersed in a mixed catalyst solution containing metals such as palladium and tin, and then activated with an acid such as hydrochloric acid or oxalic acid to roughen the surface of the secondary forming material. A method of precipitating palladium etc. on the surface and a sensitizing-activating method, that is, a strong reducing agent such as stannous chloride, hydrazine chloride, hypophosphorous acid, etc., is applied to the required parts of the roughened and easily plated material. After adsorption, there is a method in which the precious metal is precipitated by immersion in a catalyst solution containing noble metal ions such as palladium and gold. The step of applying the catalyst may be performed either before or after the secondary molding, but preferably after the secondary molding.
【0016】前処理後、無電解めっき(化学めっき)の
方法を用いて、銅、ニッケル等のめっきを施す。銅の上
にニッケル、さらに金を無電解めっきする場合もある。
金属層を電気回路パターンの配線部として用いる場合に
は、一般に、銅層あるいは銅層の上にニッケル、金、ハ
ンダ等の層を、単独にまたは組み合わせて、形成させる
。無電解めっき層の上に、この層を導体として、通常の
電気めっきによりさらに同種または異種の金属層を形成
してもよい(例えば無電解めっき銅層の上に電気めっき
ニッケル層)。この方法は、無電解めっきにより金属層
の充分な厚さが得られない場合に有用である。After the pretreatment, plating with copper, nickel, etc. is applied using an electroless plating (chemical plating) method. In some cases, copper is electrolessly plated with nickel and then gold. When a metal layer is used as a wiring part of an electric circuit pattern, generally a copper layer or a layer of nickel, gold, solder, etc., alone or in combination, is formed on the copper layer. On the electroless plated layer, a layer of the same or different metal may be further formed by ordinary electroplating using this layer as a conductor (for example, an electroplated nickel layer on an electroless plated copper layer). This method is useful when sufficient thickness of the metal layer cannot be obtained by electroless plating.
【0017】[0017]
【作用】複合成形品の表面の、易めっき性材料で構成さ
れた一次成形体が露出している部分は、予め粗面化され
、押圧されているため、無電解めっきによって金属層が
選択的に形成され、金属層は一次成形体に対して、粗面
化のみで押圧しない場合に比し強固に接着する。その結
果、複合成形品の表面には、容易に剥離しない、パター
ン状の金属層が形成される。粗面化が二次成形前に行わ
れるため、二次成形後に粗面化する場合と異なり、粗面
化に用いる薬液が一次成形体と二次成形体の界面に滲み
込むことはない。それ故、一次成形体と二次成形体の界
面から滲み出した薬液により、二次成形体の外面に形成
された金属層の表面およびその付近が、汚染されること
はない。[Effect] The surface of the composite molded product where the primary molded body made of easily plated material is exposed has been roughened and pressed in advance, so the metal layer can be selectively removed by electroless plating. The metal layer adheres to the primary molded body more firmly than when the surface is roughened but not pressed. As a result, a patterned metal layer that does not peel off easily is formed on the surface of the composite molded product. Since the surface roughening is performed before secondary molding, unlike when the surface is roughened after secondary molding, the chemical solution used for surface roughening does not seep into the interface between the primary molded body and the secondary molded body. Therefore, the surface of the metal layer formed on the outer surface of the secondary molded body and the vicinity thereof will not be contaminated by the chemical solution seeping from the interface between the primary molded body and the secondary molded body.
【0018】[0018]
【実施例】以下、実施例により本発明をさらに詳細に説
明する。
〔実施例1〕本発明により製造される、金属パターンを
有する合成樹脂複合成形品の一例を図1(F)に示す。
合成樹脂複合成形品1は、一次成形材料2の凸部2aの
間の凹部2bに二次成形材料3が充填され、一次成形材
料2の凸部2aの露出していた部分の表面に金属層4が
形成されたものである。一次成形材料2は、無電解めっ
きの触媒としてパラジウム0.1重量%、充填剤として
ガラス繊維20重量%を含むポリエーテルスルホン(p
olyethersulfone) 、二次成形材料3
は充填剤としてガラス繊維を30重量%含むポリフェニ
レンスルフィド(polyphenylenesulf
ide)である。[Examples] The present invention will be explained in more detail with reference to Examples below. [Example 1] An example of a synthetic resin composite molded product having a metal pattern manufactured according to the present invention is shown in FIG. 1(F). In the synthetic resin composite molded product 1, the concave portions 2b between the convex portions 2a of the primary molding material 2 are filled with the secondary molding material 3, and a metal layer is formed on the surface of the exposed portions of the convex portions 2a of the primary molding material 2. 4 was formed. The primary molding material 2 was polyether sulfone (p
secondary molding material 3
is polyphenylene sulfide containing 30% by weight of glass fiber as a filler.
ide).
【0019】このプラスチック複合成形品1は、下記の
ような方法で製造する。パラジウム触媒とガラス繊維を
含むポリエーテルスルホンを一次成形材料2として用い
、図1(A)に示す断面をもつ一次成形体11を、常法
により射出成形する。射出成形温度は380℃、金型温
度は150℃とした。一次成形体11には凸部2aおよ
び凹部2bが形成される。This plastic composite molded article 1 is manufactured by the following method. Using polyether sulfone containing a palladium catalyst and glass fiber as the primary molding material 2, a primary molded body 11 having a cross section shown in FIG. 1(A) is injection molded by a conventional method. The injection molding temperature was 380°C, and the mold temperature was 150°C. A convex portion 2a and a concave portion 2b are formed in the primary molded body 11.
【0020】次に、一次成形体11の外面を常法により
脱脂処理し、N,N−ジメチルホルムアミドに2分間浸
漬した後、温度60℃のクロム酸/硫酸エッチング液に
4分間浸漬してエッチングを行い、図1(B)に示すよ
うに、一次成形材料の露出部分2cを粗面化した。水洗
後、図1(C)に示すように、一次成形体11を金型1
2内に挿入して、金型12を型締めすると、一次成形体
11の凸部2aの頂部の粗面化された面は、金型12の
内面12aに圧接され、粗化度が減小する。Next, the outer surface of the primary molded body 11 is degreased by a conventional method, dipped in N,N-dimethylformamide for 2 minutes, and then etched by immersed in a chromic acid/sulfuric acid etching solution at a temperature of 60° C. for 4 minutes. As shown in FIG. 1(B), the exposed portion 2c of the primary molding material was roughened. After washing with water, as shown in FIG. 1(C), the primary formed body 11 is placed in the mold 1
2 and clamps the mold 12, the roughened surface of the top of the convex portion 2a of the primary molded body 11 is pressed against the inner surface 12a of the mold 12, and the degree of roughness is reduced. do.
【0021】図示しないゲートから二次成形材料3とし
て、ガラス繊維を加えたポリフェニレンスルフィドを注
入し、図1(D)に示すように、一次成形体11の凹部
2bを含むキャビティ12bに、二次成形材料3を充填
する。その結果、図1(E)に示す二次成形品13を得
る(本発明では、一次成形体の凹部等のキャビティに充
填された二次成形材料で構成される部分を二次成形体と
呼び、一次成形体と二次成形体で構成された、金属層を
有しない複合成形品を、二次成形品と呼ぶ)。射出成形
温度は300℃、金型温度は100℃とした。二次成形
品13は、一次成形体11の粗面化され、押圧された、
露出部分2cを有する。Polyphenylene sulfide to which glass fiber has been added is injected as the secondary molding material 3 through a gate (not shown), and the secondary molding material is poured into the cavity 12b including the recess 2b of the primary molded body 11, as shown in FIG. 1(D). Fill with molding material 3. As a result, a secondary molded product 13 shown in FIG. , A composite molded product that is composed of a primary molded product and a secondary molded product and does not have a metal layer is called a secondary molded product). The injection molding temperature was 300°C and the mold temperature was 100°C. The secondary molded product 13 is obtained by roughening and pressing the primary molded product 11.
It has an exposed portion 2c.
【0022】二次成形品13の表面を再び脱脂処理し、
水洗した後、常法により無電解銅めっきを行い、一次成
形体の露出部分2cに、金属層4として30ミクロンの
厚さに銅を析出させた。このようにして、図1(F)に
示す断面をもつ合成樹脂複合成形品1が得られる。[0022] The surface of the secondary molded product 13 is again degreased,
After washing with water, electroless copper plating was performed by a conventional method to deposit copper as a metal layer 4 to a thickness of 30 microns on the exposed portion 2c of the primary molded body. In this way, a synthetic resin composite molded article 1 having a cross section shown in FIG. 1(F) is obtained.
【0023】無電解めっきにより形成された金属層4の
、一次成形体11に対する接着強度は、JIS.C50
12による試験で約1.8kgf/cmであった。また
、室温で30日間放置後にも、金属層4の表面の汚れは
認められなかった。The adhesive strength of the metal layer 4 formed by electroless plating to the primary molded body 11 is determined according to JIS. C50
12, it was approximately 1.8 kgf/cm. Furthermore, no stains on the surface of the metal layer 4 were observed even after being left at room temperature for 30 days.
【0024】〔実施例2〕ポリフェニレンスルフィドの
代わりにポリエーテルスルホンを用いた以外は、実施例
1と同様にして、合成樹脂複合成形品を製造した。金属
層の接着強度は約1.8kgf/cmであった(JIS
.C5012による)。また、室温で30日間放置後に
も、金属層の表面の汚れは認められなかった。[Example 2] A synthetic resin composite molded article was produced in the same manner as in Example 1, except that polyether sulfone was used instead of polyphenylene sulfide. The adhesive strength of the metal layer was approximately 1.8 kgf/cm (JIS
.. C5012). Further, no stains on the surface of the metal layer were observed even after being left at room temperature for 30 days.
【0025】〔比較例1〕比較のため、従来の方法によ
り複合成形品を製造した。すなわち、一次成形体を、粗
面化を行わずに金型に挿入して、二次成形を行い、その
後に二次成形品の粗面化と、無電解めっきを行った。[Comparative Example 1] For comparison, a composite molded article was manufactured by a conventional method. That is, the primary molded product was inserted into a mold without surface roughening, secondary molding was performed, and then the surface of the secondary molded product was roughened and electroless plating was performed.
【0026】具体的には、実施例1と同じ一次成形材料
22を用いて、図2(A)に示す一次成形体21を射出
成形し、これを金型12内に挿入して、図2(B)に示
すように、キャビティに実施例1と同じ二次成形材料2
3を充填して(二次成形)、図2(C)に示すような二
次成形品24を得る。その後に、二次成形品24の外面
を実施例1と同様に脱脂処理し、N,N−ジメチルホル
ムアミドに2分間浸漬した後、温度60℃のクロム酸/
硫酸エッチング液に4分間浸漬してエッチングを行い、
図2(D)に示すように、二次成形品24の上面24a
を粗面化した。水洗後、実施例1と同様の無電解銅めっ
きにより、図2(E)に示すように、一次成形体の露出
部分21cに、金属層25として30ミクロンの厚さに
銅を析出させた。こうして、図2(E)に示す断面をも
つ合成樹脂複合成形品26を製造した。Specifically, using the same primary molding material 22 as in Example 1, the primary molded body 21 shown in FIG. 2A is injection molded, and this is inserted into the mold 12. As shown in (B), the same secondary molding material 2 as in Example 1 is placed in the cavity.
3 (secondary molding) to obtain a second molded product 24 as shown in FIG. 2(C). Thereafter, the outer surface of the secondary molded product 24 was degreased in the same manner as in Example 1, immersed in N,N-dimethylformamide for 2 minutes, and then chromic acid/
Etch by immersing in sulfuric acid etching solution for 4 minutes,
As shown in FIG. 2(D), the upper surface 24a of the secondary molded product 24
The surface was roughened. After washing with water, copper was deposited as a metal layer 25 to a thickness of 30 microns on the exposed portion 21c of the primary molded body by electroless copper plating similar to that in Example 1, as shown in FIG. 2(E). In this way, a synthetic resin composite molded article 26 having a cross section shown in FIG. 2(E) was manufactured.
【0027】金属層の接着強度は約1.0kgf/cm
であった(JIS.C5012による)。また、室温で
2日間放置後、金属層の表面に汚れが認められた。[0027] The adhesive strength of the metal layer is approximately 1.0 kgf/cm.
(according to JIS.C5012). Further, after being left at room temperature for 2 days, stains were observed on the surface of the metal layer.
【0028】〔比較例2〕ポリフェニレンスルフィドの
代わりにポリエーテルスルホンを用いた以外は、比較例
1と同様にして、合成樹脂複合成形品を製造した。比較
例1と同様、金属層の接着強度は約1.0kgf/cm
であった(JIS.C5012による)。また、室温で
2日間放置後、金属層の表面に汚れが認められた。[Comparative Example 2] A synthetic resin composite molded article was produced in the same manner as in Comparative Example 1, except that polyether sulfone was used instead of polyphenylene sulfide. Similar to Comparative Example 1, the adhesive strength of the metal layer is approximately 1.0 kgf/cm
(according to JIS.C5012). Further, after being left at room temperature for 2 days, stains were observed on the surface of the metal layer.
【0029】[0029]
【発明の効果】本発明の方法により製造される合成樹脂
複合成形品は、表面にパターン状に形成された金属層の
接着強度が大きく、無電解めっき前に行う粗面化の工程
で用いた薬液の表面への滲み出しによる、金属層の劣化
が生じない。[Effect of the invention] The synthetic resin composite molded product produced by the method of the present invention has a high adhesive strength of the metal layer formed in a pattern on the surface, and can be used in the surface roughening process before electroless plating. The metal layer does not deteriorate due to seepage of the chemical solution onto the surface.
【図1】図1(A)〜(F)は、本発明による合成樹脂
複合成形品の製造方法の一実施例を示す説明断面図であ
る。FIGS. 1A to 1F are explanatory cross-sectional views showing one embodiment of the method for manufacturing a synthetic resin composite molded article according to the present invention.
【図2】図2(A)〜(E)は、従来の合成樹脂複合成
形品の製造方法を示す説明断面図である。FIGS. 2A to 2E are explanatory cross-sectional views showing a conventional method for manufacturing a synthetic resin composite molded product.
1 合成樹脂複合成形品
2a 一次成形材料または一次成形体の凸部2b
一次成形材料または一次成形体の凹部2c 一次成形
材料の露出部分
3 二次成形材料
4 金属層
11 一次成形体
12 金型
12a 金型の内面
12b キャビティ
13 二次成形品
21 一次成形体
21a 一次成形体の凸部
21b 一次成形体の凹部
21c 一次成形体が露出している表面22
一次成形材料
23 二次成形材料
24 二次成形品
24a 二次成形品の上面
25 金属層
26 合成樹脂複合成形品1 Synthetic resin composite molded product 2a Primary molding material or convex portion 2b of the primary molded product
Recessed portion 2c of primary molding material or primary molded body Exposed portion of primary molding material 3 Secondary molding material 4 Metal layer 11 Primary molded body 12 Mold 12a Inner surface 12b of mold Cavity 13 Secondary molded product 21 Primary molded body 21a Primary molding Convex portion 21b of the body Concave portion 21c of the primary molded product Surface 22 where the primary molded product is exposed
Primary molding material 23 Secondary molding material 24 Secondary molded product 24a Upper surface 25 of secondary molded product Metal layer 26 Synthetic resin composite molded product
Claims (3)
とができる第一の熱可塑性樹脂から成る第一の成形体の
、表面の少なくとも所定の部分を粗面化し、粗面化され
た前記第一の成形体を型内に固定し、前記第一の成形体
の前記所定の部分を押圧し、前記型内のキャビティに、
無電解めっきが困難な第二の熱可塑性樹脂を充填して、
複合成形品を形成し、この複合成形品の表面の、前記圧
接された前記第一の成形体の部分に、無電解めっきを施
して、パターン状金属層を形成させることから成る、合
成樹脂複合成形品の製造方法。1. A first molded article made of a first thermoplastic resin whose surface can be roughened and subjected to electroless plating. A first molded body is fixed in a mold, the predetermined portion of the first molded body is pressed, and the cavity in the mold is
Filled with a second thermoplastic resin that is difficult to electroless plate,
A synthetic resin composite comprising forming a composite molded article, and applying electroless plating to the surface of the composite molded article on the pressure-welded portion of the first molded body to form a patterned metal layer. Method of manufacturing molded products.
の成形体の前記所定の部分に圧接することにより行われ
る、請求項1の合成樹脂複合成形品の製造方法。2. The method for manufacturing a synthetic resin composite molded article according to claim 1, wherein the pressing is performed by pressing the inner surface of the mold against the predetermined portion of the first molded body.
面化の方法により行い、前記型内に固定する前に、前記
薬液が洗浄により除去される、請求項1または2の合成
樹脂複合成形品の製造方法。3. The synthetic resin according to claim 1, wherein the surface roughening is performed by a chemical roughening method using a chemical solution, and the chemical solution is removed by washing before fixing in the mold. Method for manufacturing composite molded products.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13819491A JPH04338529A (en) | 1991-05-14 | 1991-05-14 | Manufacture of synthetic resin composite molded item |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13819491A JPH04338529A (en) | 1991-05-14 | 1991-05-14 | Manufacture of synthetic resin composite molded item |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04338529A true JPH04338529A (en) | 1992-11-25 |
Family
ID=15216282
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13819491A Pending JPH04338529A (en) | 1991-05-14 | 1991-05-14 | Manufacture of synthetic resin composite molded item |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04338529A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0849092A (en) * | 1994-05-20 | 1996-02-20 | Lacks Ind Inc | Method for selectively plating molding and molding produced thereby |
WO1999028161A1 (en) * | 1997-12-01 | 1999-06-10 | Lear Automotive Dearborn, Inc. | Interior trim panel and electrical harness apparatus for an automotive vehicle |
GB2349598A (en) * | 1999-01-22 | 2000-11-08 | Finglas Technologies Ltd | Moulded electrical components |
JP2006346441A (en) * | 2005-05-17 | 2006-12-28 | Sri Sports Ltd | Method for production of golf ball |
-
1991
- 1991-05-14 JP JP13819491A patent/JPH04338529A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0849092A (en) * | 1994-05-20 | 1996-02-20 | Lacks Ind Inc | Method for selectively plating molding and molding produced thereby |
WO1999028161A1 (en) * | 1997-12-01 | 1999-06-10 | Lear Automotive Dearborn, Inc. | Interior trim panel and electrical harness apparatus for an automotive vehicle |
GB2349598A (en) * | 1999-01-22 | 2000-11-08 | Finglas Technologies Ltd | Moulded electrical components |
JP2006346441A (en) * | 2005-05-17 | 2006-12-28 | Sri Sports Ltd | Method for production of golf ball |
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