JPH06262527A - Grinding wheel - Google Patents

Grinding wheel

Info

Publication number
JPH06262527A
JPH06262527A JP5107593A JP5107593A JPH06262527A JP H06262527 A JPH06262527 A JP H06262527A JP 5107593 A JP5107593 A JP 5107593A JP 5107593 A JP5107593 A JP 5107593A JP H06262527 A JPH06262527 A JP H06262527A
Authority
JP
Japan
Prior art keywords
grinding
abrasive grains
diamond
grindstone
abrasive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5107593A
Other languages
Japanese (ja)
Inventor
Tetsuji Yamashita
哲二 山下
Eiji Minagawa
英治 皆川
Shigetsugu Maekawa
茂嗣 前川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP5107593A priority Critical patent/JPH06262527A/en
Publication of JPH06262527A publication Critical patent/JPH06262527A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To increase working efficiency by providing abrasive grains with diamond and cubic system boron nitride, reducing the rotation of dressing and tooling, and also reducing power required for grinding, in a grinding wheel with an abrasive grain layer in which abrasive grains are dispersed and fixed in a bonding phase. CONSTITUTION:In a grinding wheel, an abrasive grain layer 2 is formed on an abrasive grain layer forming surface 1A of a base metal 1, the abrasion grain layer 2 is made by dispersing and fixing abrasive grains 4 in a bonding phase 3, and diamond and cubic system boron nitride(CBN) are used as the abrasive grains 4. When grinding is made using a grinding wheel of such structure, the abrasive grains 4 become difficult to wear during grinding due to presence of diamond in the abrasive grains 4. Accordingly, the service life of the grinding wheel is prolonged and cost is reduced. Also, because grinding performance is increased by occasional collapse of CBN in the abrasive grains 4, grinding speed is increased and also power is reduced. In addition, because burrs formed at the rear of the surfaces to be cut become small in size, post- treatment after grinding is also facilitated.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、砥粒層を有し、各種研
削加工等に使用される砥石に係り、特に、研削性能を高
め、かつ砥石の寿命を延長するための砥石の改良に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a grindstone having an abrasive grain layer and used for various grinding processes, and more particularly to improvement of a grindstone for improving grinding performance and extending the life of the grindstone. .

【0002】[0002]

【従来の技術】各種研削加工等に使用される砥石の一種
として、結合剤からなる結合相と、この結合相内に分散
固定された砥粒とからなる砥粒層を有するものがある。
一般的には、結合相としてレジンボンド、ビトリファイ
ドボンド、あるいはメタルボンド等を用い、砥粒として
ダイヤモンドまたは立方晶窒化ホウ素(以下、CBNと
略称する。)のいずれかを用いることが多い。ここで、
ダイヤモンドは硬度が高く強靱である点を、CBNは破
砕性が高い点をその特徴としている。
2. Description of the Related Art As one type of grindstone used for various grinding processes, there is one having an abrasive grain layer composed of a binder phase composed of a binder and abrasive grains dispersed and fixed in the binder phase.
Generally, a resin bond, a vitrified bond, a metal bond, or the like is used as the binder phase, and either diamond or cubic boron nitride (hereinafter abbreviated as CBN) is often used as the abrasive grains. here,
Diamond is characterized by high hardness and toughness, and CBN is characterized by high friability.

【0003】従って、例えばトロコイドポンプのロータ
のような耐摩耗性に優れた鉄系焼結部品の精密研削を行
う場合、砥粒としてダイヤモンドを用いた砥石(以下、
ダイヤモンド砥石と称する。)で研削を行うと、砥粒が
強靱なため砥石の寿命が長く、コスト的に有利となる。
しかも、両頭研削に用いた場合には、ワークの上下に形
成された被削面の平行度が高くなるという利点がある。
Therefore, when performing precision grinding of an iron-based sintered component having excellent wear resistance, such as a rotor of a trochoid pump, a grindstone using diamond as abrasive grains (hereinafter,
It is called a diamond grindstone. If the grinding is performed with (1), since the abrasive grains are tough, the life of the grindstone is long, which is advantageous in terms of cost.
Moreover, when it is used for double-sided grinding, there is an advantage that the parallelism of the work surfaces formed above and below the work becomes high.

【0004】一方、砥粒としてCBNを用いた砥石(以
下、CBN砥石と称する。)で研削を行うと、研削中砥
粒が適宜破砕し、その結果、常時鋭利な砥粒が研削に供
されるため研削性能が向上する。従って、研削速度が速
くなり、かつ研削に要する動力も小さくて済む。また、
一般に砥粒層と被削材とを面接触させながら研削を行う
場合、研削に伴い被削面の後端にバリが形成されるが、
CBN砥石で研削を行うと、研削性能が高いためバリが
小さくなるという利点がある。
On the other hand, when grinding is performed with a grindstone using CBN as abrasive grains (hereinafter referred to as CBN grindstone), the abrasive grains are appropriately crushed during grinding, and as a result, sharp abrasive grains are always provided for grinding. Therefore, the grinding performance is improved. Therefore, the grinding speed can be increased and the power required for grinding can be reduced. Also,
Generally, when grinding is carried out while making surface contact between the abrasive grain layer and the work material, burrs are formed at the rear end of the work surface due to grinding,
Grinding with a CBN grindstone has an advantage that burrs are reduced due to high grinding performance.

【0005】[0005]

【発明が解決しようとする課題】ところで、ダイヤモン
ド砥石においては、砥粒が強靱な半面、研削に伴う摩耗
により砥粒の鋭利さが失われ、研削性能が低下する傾向
がある。その結果、前記被削面の後端にはCBN砥石に
よる研削と比較して大きなバリが形成され、しかも、こ
のバリはバレル研磨等の後処理でも除去しにくいため、
前記後処理が面倒となるという問題がある。一方、CB
N砥石を研削に用いた場合には、砥粒が破砕しやすいの
で砥粒面の消耗も速くなる。その結果、砥石の寿命が短
くなるとともに、頻繁にドレッシングやツーリングを行
わなければならないという問題がある。
By the way, in a diamond grindstone, the abrasive grains are tough, but the sharpness of the abrasive grains tends to be lost due to the abrasion accompanying the grinding, and the grinding performance tends to deteriorate. As a result, large burrs are formed at the rear end of the work surface as compared with grinding with a CBN grindstone, and these burrs are difficult to remove even by post-treatment such as barrel polishing.
There is a problem that the post-processing becomes troublesome. On the other hand, CB
When the N grindstone is used for grinding, the abrasive grains are likely to be crushed, so that the wear of the abrasive grain surface becomes faster. As a result, there is a problem that the life of the grindstone is shortened and dressing and tooling must be frequently performed.

【0006】[0006]

【課題を解決するための手段】本発明は、上記事情に鑑
みてなされたもので、結合相内に砥粒が分散固定された
砥粒層を有する砥石であって、前記砥粒が、ダイヤモン
ドとCBNとを有するものである。
The present invention has been made in view of the above circumstances, and is a grindstone having an abrasive grain layer in which abrasive grains are dispersed and fixed in a bonding phase, wherein the abrasive grains are diamond. And CBN.

【0007】[0007]

【作用】本発明の砥石は、砥粒がダイヤモンドを有する
ので摩滅しにくく、しかも、砥粒がCBNを有するので
研削性能が高い。
The grinding stone of the present invention is hard to wear because the abrasive grains contain diamond, and has high grinding performance because the abrasive grains have CBN.

【0008】[0008]

【実施例】以下、図面に基づき、本発明の実施例につい
て、更に詳しく説明する。図1は、本発明に係わる砥石
の一実施例を示す砥石断面の拡大図である。図中符号1
は台金で、この台金1の形状は限定されず、カップ型、
ホイール型、総型等従来使用されているいかなる形状の
台金でもよい。
Embodiments of the present invention will now be described in more detail with reference to the drawings. FIG. 1 is an enlarged view of a cross section of a grindstone showing an embodiment of the grindstone according to the present invention. Reference numeral 1 in the figure
Is a base metal, and the shape of the base metal 1 is not limited to a cup type,
A base metal of any shape conventionally used such as a wheel type or a general type may be used.

【0009】台金1の砥粒層形成面1Aには砥粒層2が
形成されている。この砥粒層2は、結合相3内に砥粒4
を分散固定させたもので、本実施例の場合、結合相3に
はレジンボンドが使用され、かつ砥粒4としては、ダイ
ヤモンドとCBNとが使用されている。ここで、砥粒4
の集中度は30〜70とすることが望ましい。これは、
集中度が30未満となると研削比が低下して研削性能が
低化する一方、集中度が70を越えると砥粒保持力が不
十分となるためである。
An abrasive grain layer 2 is formed on the abrasive grain layer forming surface 1A of the base metal 1. This abrasive grain layer 2 includes abrasive grains 4 in the bond phase 3.
In this embodiment, a resin bond is used for the binder phase 3 and diamond and CBN are used as the abrasive grains 4. Here, abrasive grain 4
It is desirable that the degree of concentration is 30 to 70. this is,
This is because when the concentration is less than 30, the grinding ratio is lowered and the grinding performance is deteriorated, whereas when the concentration is more than 70, the abrasive grain holding force becomes insufficient.

【0010】また、砥粒4の粒径は、ダイヤモンド:C
BN=1:1.3〜1.5とすることが望ましい。これ
は、ダイヤモンドの粒径がCBNの1.3倍未満となる
と、ダイヤモンドがフィラーとして働き、研削に作用し
なくなる一方、ダイヤモンドの粒径がCBNの1.5倍
を越えると、ダイヤモンドの影響が大きく、砥粒の混合
による効果が薄れるためである。
The grain size of the abrasive grains 4 is diamond: C
It is desirable that BN = 1: 1.3 to 1.5. This is because when the grain size of diamond is less than 1.3 times CBN, diamond acts as a filler and does not act on grinding, while when the grain size of diamond exceeds 1.5 times CBN, the effect of diamond is This is because the effect of mixing the abrasive grains is small and the effect is small.

【0011】更に、砥粒4の混合比は、ダイヤモンド:
CBN=70:30〜40:60とすることが望まし
い。これは、ダイヤモンドの混合比が40%未満となる
と砥石の摩滅が速くなって砥石の寿命が短縮する一方、
ダイヤモンドの混合比が70%を越えると、被削面の辺
縁部に大きなバリが形成されて研削後の後処理が面倒と
なるためである。
Further, the mixing ratio of the abrasive grains 4 is diamond:
It is desirable to set CBN = 70: 30 to 40:60. This is because when the diamond mixing ratio is less than 40%, the abrasion of the grindstone becomes faster and the life of the grindstone is shortened.
This is because if the mixing ratio of diamond exceeds 70%, large burrs are formed at the peripheral edge of the work surface, and the post-treatment after grinding becomes troublesome.

【0012】上記構成を有する砥石により研削を行う
と、砥粒4中のダイヤモンドの存在により、研削中、砥
粒4が摩滅しにくくなる。従って、砥石の寿命が長く、
コスト的に有利となる。また、砥粒4中のCBNが適宜
崩壊し、研削性能が向上するため、研削速度が速く、か
つ動力も小さくて済む。しかも、被削面の後端に形成さ
れるバリがCBN砥石による研削の場合と同様小さくな
るため、研削後の後処理も容易となる。
When grinding is performed with the grindstone having the above structure, the presence of diamond in the abrasive grains 4 makes it difficult for the abrasive grains 4 to wear during the grinding. Therefore, the life of the grindstone is long,
It is cost effective. Further, the CBN in the abrasive grains 4 is appropriately collapsed to improve the grinding performance, so that the grinding speed is fast and the power is small. Moreover, since the burr formed at the rear end of the surface to be cut becomes small as in the case of grinding with a CBN grindstone, post-processing after grinding becomes easy.

【0013】また、結合相3にビトリファイドボンドを
使用してもよいが、この場合には、砥粒4の集中度は4
0〜100とすることが望ましい。これは、結合相3に
ビトリファイドボンドを使用した場合には、集中度40
未満となると研削比が低下して研削性能が低化する一
方、集中度が100を越えると砥粒保持力が不十分とな
るためである。
A vitrified bond may be used as the binder phase 3, but in this case, the concentration of the abrasive grains 4 is 4%.
It is desirable to set 0 to 100. This is because when the vitrified bond is used for the binder phase 3, the degree of concentration is 40.
If it is less than 100%, the grinding ratio is lowered and the grinding performance is lowered. On the other hand, if the degree of concentration exceeds 100, the abrasive grain holding force becomes insufficient.

【0014】[0014]

【実験例】以下に実験例を示し、本発明の効果について
説明する。 実験例1 砥種の異なる砥石を用いてそれぞれ研削を行い、研削に
際し機械主軸にて消費された電流値(主軸電流値)の、
研削砥石降下量に伴う変化を測定した。実験に供した砥
石の砥種は以下の4種である。 (比較例1)CBN砥粒 (比較例2)ダイヤモンド砥粒 (比較例3)上記比較例1にて用いたCBN砥粒と上記
比較例2にて用いたダイヤモンド砥粒とを混合比CB
N:ダイヤモンド=2:1で混合したもの (発明例1)上記比較例1にて用いたCBN砥粒と上記
比較例2にて用いたダイヤモンド砥粒とを混合比CB
N:ダイヤモンド=1:1で混合したもの 砥石径はいずれも200(D)×5(W)×3(X)と
し、砥粒径は#170に統一した。更に、結合相には同
一種のレジンボンドを用いた。
[Experimental Examples] Experimental effects will be described below with reference to experimental examples. Experimental Example 1 Grinding was performed using different grindstones, and the current value (main axis current value) consumed by the machine spindle during grinding
The change with grinding wheel fall was measured. Grinding stones used in the experiment are the following four kinds. (Comparative Example 1) CBN Abrasive Grains (Comparative Example 2) Diamond Abrasive Grains (Comparative Example 3) A mixing ratio CB of the CBN abrasive grains used in Comparative Example 1 and the diamond abrasive grains used in Comparative Example 2 above.
N: Diamond = 2: 1 mixed (Invention Example 1) The mixing ratio CB of the CBN abrasive grains used in Comparative Example 1 and the diamond abrasive grains used in Comparative Example 2 above.
N: diamond = 1: 1 mixed The grindstone diameters were all 200 (D) × 5 (W) × 3 (X), and the grain size was unified to # 170. Further, the same type of resin bond was used for the binder phase.

【0015】また、研削条件は全て下記条件に統一し
た。 砥石回転数:2400r.p.m. 切込速度 :0.05mm/min 被削材 :焼結部品
Further, all the grinding conditions are unified to the following conditions. Grinding wheel speed: 2400r.pm Cutting speed: 0.05mm / min Work material: Sintered parts

【0016】研削による前記降下量の変化に伴う主軸電
流値の変化を図2に示す。図2からわかる通り、主軸電
流値は、砥石として発明例1のものを用いた場合が常時
最低であった。これは、発明例1に示した砥石の切削能
力が最も高いことを示す。
FIG. 2 shows the change in the spindle current value due to the change in the drop amount due to grinding. As can be seen from FIG. 2, the spindle current value was always the lowest when the wheel of Invention Example 1 was used. This indicates that the grindstone shown in Invention Example 1 has the highest cutting ability.

【0017】なお、図2では、比較例1(CBN砥石を
用いた場合)における主軸電流値が比較例2(ダイヤモ
ンド砥石を用いた場合)における主軸電流値を上回って
いるが、これは、CBN砥粒の破砕を伴う研削域では自
生作用を伴うため主軸電流値の上昇は起こらないが、C
BN砥粒の摩滅を伴う研削域では自生作用が起きず、そ
の結果、主軸電流値が上昇するためである。
In FIG. 2, the spindle current value in Comparative Example 1 (when the CBN grindstone is used) exceeds the spindle current value in Comparative Example 2 (when the diamond grindstone is used), which is CBN. In the grinding area where the abrasive grains are crushed, the spindle current value does not rise because of the self-generated effect, but C
This is because autogenous action does not occur in the grinding area accompanied by abrasion of the BN abrasive grains, and as a result, the spindle current value increases.

【0018】実験例2 砥種の異なる砥石を用い、切込速度を変えてそれぞれ研
削を行い、研削に際し機械主軸にて消費された電流値の
変化を測定した。実験に供した砥石の砥種は以下の3種
である。 (比較例4)CBN砥粒 (比較例5)ダイヤモンド砥粒 (発明例2)ダイヤモンド砥粒とを混合比CBN:ダイ
ヤモンド=1:1で混合したもの 砥石径はいずれも200(D)×5(W)×3(X)と
し、砥粒径は#170に統一した。更に、結合相には同
一種のレジンボンドを用いた。
Experimental Example 2 Grinding wheels having different grinding types were used, grinding was performed at different cutting speeds, and changes in the current value consumed by the machine spindle during grinding were measured. The grinding types of the grindstones used in the experiment are the following three types. (Comparative example 4) CBN abrasive grains (Comparative example 5) Diamond abrasive grains (Invention example 2) A mixture of diamond abrasive grains with a mixing ratio of CBN: diamond = 1: 1. (W) × 3 (X), and the abrasive grain size was unified to # 170. Further, the same type of resin bond was used for the binder phase.

【0019】また、研削条件は全て下記条件に統一し
た。 砥石回転数:2380r.p.m. 切込速度 :0.025,0.05,0.1(mm/min)の
3段階 被削材 :鉄系焼結部品
Further, all the grinding conditions are unified to the following conditions. Grindstone rotation speed: 2380r.pm Cutting speed: 0.025, 0.05, 0.1 (mm / min) 3 steps Work material: Iron-based sintered parts

【0020】切込速度の変動に伴う主軸電流値の変化を
図3に示す。図3からわかる通り、主軸電流値は、切込
速度を少なくとも0.05mm/min以下とした場合には、
砥石として発明例2のものを用いた場合が最低であっ
た。これは、上記条件下では、発明例2に示した砥石の
切削能力が最も高いことを示す。なお、発明例2におい
ては、砥粒の粒径がダイヤモンド:CBN=1:1とさ
れているが、粒径をダイヤモンド:CBN=1:1.3
〜1.5とすると、切込速度が0.05mm/min以上であ
っても、主軸電流値を比較例より低くすることができ
る。
FIG. 3 shows the change in the spindle current value with the change in the cutting speed. As can be seen from Fig. 3, when the cutting speed is at least 0.05 mm / min, the spindle current value is
The worst was the case where the grinding stone of Inventive Example 2 was used. This indicates that under the above conditions, the cutting ability of the grindstone shown in Inventive Example 2 is the highest. In Invention Example 2, the grain size of the abrasive grains is diamond: CBN = 1: 1, but the grain size is diamond: CBN = 1: 1.3.
When it is set to 1.5, the spindle current value can be made lower than that of the comparative example even if the cutting speed is 0.05 mm / min or more.

【0021】[0021]

【発明の効果】以上説明した通り、本発明の砥石を用い
ることにより、寿命が長くかつ研削性能の高い砥石が得
られる。その結果、ドレッシングやツーリングの回数も
減り、かつ研削に要する動力も少なくて済むため、作業
効率が向上する。
As described above, by using the grindstone of the present invention, a grindstone having a long life and high grinding performance can be obtained. As a result, the frequency of dressing and tooling is reduced, and the power required for grinding is reduced, so that the work efficiency is improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の第一実施例を示す砥石断面の拡大図で
ある。
FIG. 1 is an enlarged view of a cross section of a grindstone showing a first embodiment of the present invention.

【図2】本発明に係る実験例を示すもので、研削に伴う
機械主軸の電流値と砥石降下量の変化との関係を示す図
である。
FIG. 2 is a diagram showing an experimental example according to the present invention and is a diagram showing a relationship between a current value of a machine spindle and a change in a grindstone fall amount due to grinding.

【図3】本発明に係る実験例を示すもので、研削に伴う
機械主軸の電流値と切込速度の変化との関係を示す図で
ある。
FIG. 3 is a diagram showing an experimental example according to the present invention and is a diagram showing a relationship between a current value of a machine spindle and a change in cutting speed during grinding.

【符号の説明】[Explanation of symbols]

1 台金 1A 砥粒層形成面 2 砥粒層 3 結合相 4 砥石 1 Metal 1A Abrasive grain layer forming surface 2 Abrasive grain layer 3 Bonding phase 4 Grinding stone

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 結合相内に砥粒が分散固定された砥粒層
を有する砥石であって、前記砥粒が、ダイヤモンドと立
方晶窒化ホウ素とを有することを特徴とする砥石。
1. A grindstone having an abrasive grain layer in which abrasive grains are dispersed and fixed in a binder phase, wherein the abrasive grains contain diamond and cubic boron nitride.
【請求項2】 前記結合相としてレジンボンドが用いら
れ、かつ前記砥粒の集中度が30〜70であるととも
に、前記砥粒の粒径が、ダイヤモンド:立方晶窒化ホウ
素=1:1.3〜1.5とされ、しかも、前記砥粒の混
合比が、ダイヤモンド:立方晶窒化ホウ素=70:30
〜40:60とされていることを特徴とする請求項1記
載の砥石。
2. A resin bond is used as the binder phase, the concentration of the abrasive grains is 30 to 70, and the grain size of the abrasive grains is diamond: cubic boron nitride = 1: 1.3. .About.1.5, and the mixing ratio of the abrasive grains is diamond: cubic boron nitride = 70: 30.
The grindstone according to claim 1, wherein the grindstone is set to 40:60.
【請求項3】 前記結合相としてビトリファイドボンド
が用いられ、かつ前記砥粒の集中度が40〜100であ
るとともに、前記砥粒の粒径が、ダイヤモンド:立方晶
窒化ホウ素=1:1.3〜1.5とされ、しかも、前記
砥粒の混合比が、ダイヤモンド:立方晶窒化ホウ素=7
0:30〜40:60とされていることを特徴とする請
求項1記載の砥石。
3. A vitrified bond is used as the binder phase, the concentration of the abrasive grains is 40 to 100, and the grain size of the abrasive grains is diamond: cubic boron nitride = 1: 1.3. .About.1.5, and the mixing ratio of the abrasive grains is diamond: cubic boron nitride = 7.
The grindstone according to claim 1, which is set to 0:30 to 40:60.
JP5107593A 1993-03-11 1993-03-11 Grinding wheel Pending JPH06262527A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5107593A JPH06262527A (en) 1993-03-11 1993-03-11 Grinding wheel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5107593A JPH06262527A (en) 1993-03-11 1993-03-11 Grinding wheel

Publications (1)

Publication Number Publication Date
JPH06262527A true JPH06262527A (en) 1994-09-20

Family

ID=12876696

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JPH06262527A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3922874A1 (en) * 1989-07-12 1991-01-24 Webasto Ag Fahrzeugtechnik Wind deflector along front edge sunroof - has deflector actuating lever guided and pivoting in vertical track
KR20020024892A (en) * 2000-09-27 2002-04-03 김세광 Superbrasive tool and manufacturing method of it using Superbrasive stone for grinding of Brown tube pannel face
CN102059659A (en) * 2009-11-13 2011-05-18 沈阳中科超硬磨具磨削研究所 Formula system for abrasive layer of resin cubic boron nitride (CBN) end face grinding wheel
WO2013108898A1 (en) * 2012-01-18 2013-07-25 株式会社ノリタケカンパニーリミテド Vitrified super-abrasive-grain grindstone
JPWO2017203848A1 (en) * 2016-05-27 2019-03-22 株式会社アライドマテリアル Superabrasive wheel
US10875152B2 (en) 2016-03-24 2020-12-29 A.L.M.T. Corp. Super-abrasive grinding wheel

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4959387A (en) * 1972-10-12 1974-06-08
JPS6374567A (en) * 1986-09-18 1988-04-05 Micron Seimitsu Kk Cbn grindstone

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4959387A (en) * 1972-10-12 1974-06-08
JPS6374567A (en) * 1986-09-18 1988-04-05 Micron Seimitsu Kk Cbn grindstone

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3922874A1 (en) * 1989-07-12 1991-01-24 Webasto Ag Fahrzeugtechnik Wind deflector along front edge sunroof - has deflector actuating lever guided and pivoting in vertical track
KR20020024892A (en) * 2000-09-27 2002-04-03 김세광 Superbrasive tool and manufacturing method of it using Superbrasive stone for grinding of Brown tube pannel face
CN102059659A (en) * 2009-11-13 2011-05-18 沈阳中科超硬磨具磨削研究所 Formula system for abrasive layer of resin cubic boron nitride (CBN) end face grinding wheel
WO2013108898A1 (en) * 2012-01-18 2013-07-25 株式会社ノリタケカンパニーリミテド Vitrified super-abrasive-grain grindstone
CN104066549A (en) * 2012-01-18 2014-09-24 株式会社则武 Vitrified super-abrasive-grain grindstone
US9168637B2 (en) 2012-01-18 2015-10-27 Noritake Co., Limited Vitrified super-abrasive-grain grindstone
US10875152B2 (en) 2016-03-24 2020-12-29 A.L.M.T. Corp. Super-abrasive grinding wheel
JPWO2017203848A1 (en) * 2016-05-27 2019-03-22 株式会社アライドマテリアル Superabrasive wheel
US11123841B2 (en) 2016-05-27 2021-09-21 A.L.M.T. Corp. Super-abrasive grinding wheel

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