JPH06260785A - Substrate shielding structure - Google Patents

Abstract

PURPOSE:To realize perfect shield and moreover provide a substrate shield structure ensuring good workability by reducing a space required for shielding and acquiring sufficient compression of a conductive substance provided with respect to cabinet. CONSTITUTION:In a substrate shield structure where a conductive cabinet 10 consisting of an upper cover 1 and a lower cover 2 and a peripheral region 3b surrounding the predetermined region 3a of a substrate 3 to be accommodated within the cabinet 10 are placed in contact to shield the predetermined region 3a, a conductive rib 6 to be in contact with the peripheral region 3b from the upper cover 1 and lower cover 2 is projected toward the inside of the cabinet 10 and the end part of this rib 6 is covered with the U-shaped part of the conductive material 4 having the U-shaped cross-section. The rib 6 is placed in contact with the peripheral region 3b through the conductive material 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate shield structure, and more particularly to a substrate shield structure for shielding a predetermined area on a substrate housed in a housing of an electronic device such as a radio of a car telephone.

[0002]

2. Description of the Related Art A conventional substrate shield structure of this type is shown in FIG.
The structure shown in is known. (A) is an exploded perspective view and (B) is a sectional view. The conductive casing 10 has a structure in which the upper cover 1 and the lower cover 2 are disassembled, and the substrate 3 is housed in the casing 10 as shown in the figure. When the predetermined area 3a of the substrate 3 is to be shielded, the peripheral area 3 of the predetermined area 3a
The surface b is covered with a conductive film to form the entire ground area. The peripheral region 3b is formed on the front and back surfaces of the substrate 3. Then, a protruding portion 1a is formed so as to protrude into the housing 10 from a position corresponding to the peripheral region 3b of the upper cover 1 and the lower cover 2. A groove 1b is provided at the tip of the protruding portion 1a, and a conductive material 5 in which a conductive rubber or a wire mesh is formed in a linear shape is fitted into the groove 1b, and the protruding portion 1a is formed by utilizing the elasticity of the conductive material. By contacting the peripheral region 3b of the substrate 3, the predetermined region 3a of the substrate 3 is completely shielded by the housing 10.

The casing 10 may be made of aluminum die-cast to make it conductive, or may be made of plastic with conductive coating or plating.

Further, the protrusion 1a is formed on the housing 1 during die casting.
It is possible to form it as a part of 0, but the housing 10
It may be formed by using a different material after the formation of and is attached to the housing 10.

[0005]

However, in the above-mentioned conventional substrate shield structure, the groove 1b is provided at the tip of the protrusion 1a, and the conductive material 5 such as conductive rubber is inserted into the groove 1b. Therefore, considering miniaturization, the groove 1
The conductive material 5 contained in b had to be miniaturized. For this reason, when the conductive material 5 is downsized, there is a problem that it is difficult to apply it to a place where there is a depth due to the thickness of the groove 1b due to poor contact with the peripheral region 3b of the substrate 3 due to a reduction in the amount of compression. It was

The present invention has been made in order to solve the above-mentioned problems, and the space required for the shield can be reduced, and a sufficient amount of the conductive material interposed between the case and the case can be secured to secure the shield. It is an object of the present invention to provide a substrate shield structure that can be completed and that has good workability.

[0007]

According to the present invention, a conductive casing including an upper cover and a lower cover is brought into contact with a peripheral region surrounding a predetermined region of a substrate housed inside the casing, and In the board shield structure that shields a predetermined area,
A conductive rib that comes into contact with the peripheral region is projected from the upper cover and the lower cover toward the inside of the housing, and a tip of the rib is covered with a U-shaped portion of a conductive member having a U-shaped cross section. The rib is brought into contact with the peripheral region via the conductive member.

[0008]

According to the present invention, the ribs are provided so as to project toward the inside of the housing at positions corresponding to the peripheral region formed around the predetermined region to be shielded from the upper cover and the lower cover. Since it is not necessary to form a groove at the tip of this rib as in the conventional case, the rib can be formed finely. A conductive member such as a gasket having a U-shaped cross section is covered on the tips of the ribs so that the U-shaped portion fits into the tips of the ribs, and the peripheral region of the substrate is pressure-bonded by the upper and lower ribs via the conductive members. Unlike the conventional structure, the conductive member has a structure in which the conductive member is covered with the rib without being inserted, so that a sufficient amount of compression can be secured. Therefore, a substrate shield structure having a good shield effect can be obtained.

[0009]

1 is a view showing a substrate shield structure according to an embodiment of the present invention. (A) is an exploded perspective view and (B) is a sectional view. The same parts as those of the conventional structure shown in FIG. 2 are designated by the same reference numerals, and detailed description thereof will be omitted. A rib 6 is provided so as to project from the upper cover 1 and the lower cover 2 toward the inside of the housing 10. A peripheral region 3b is provided around the shielded predetermined region 3a of the substrate 3 so as to surround it, and serves as a ground region. The rib 6 is provided in a shape corresponding to the peripheral region 3b.

As shown in the sectional view of FIG. 1 (B), the rib 6 does not need to have a groove at its tip and may be a thin plate-like box shape. A gasket 4 made of conductive rubber or the like having a U-shaped cross section is attached to the tip of the rib 6. The gasket 4 is prepared in advance so as to have a U-shaped cross section, and the tip of the rib 6 is inserted into this U-shaped groove and attached. In this way, by pressing the rib 6 having the gasket 4 attached to the tip thereof to the peripheral region 3b of the substrate 3, the gasket 4 is compressed and the peripheral region 3b of the substrate 3 and the rib 6 are conducted to provide a shield.

The shape of the rib 6 is the substrate 3 to be shielded.
Since it is determined by the shape of the predetermined area 3a, various shapes are possible in addition to the rectangular shape shown in the embodiment.

[0012]

As described above in detail with reference to the embodiments, according to the present invention, the ribs formed inside the housing are covered with a conductive member having a U-shaped cross section so that the peripheral area of the substrate is Since it is electrically connected to the housing, the space required for the shield can be reduced and the thickness of the conductive member can be increased, so that the conductive member can be sufficiently compressed. Therefore, stable contact with the substrate is obtained. Also, because it is possible to form thin ribs, it can be applied to high parts without worrying about the sink of the plastic, and the conductive member can be attached just by covering the ribs, which contributes to the improvement of workability. .

The contact surface of the conductive member with the substrate may be provided with protrusions to increase the amount of compression with the substrate, allowing more stable contact and ensuring the integrity of the shield.

[Brief description of drawings]

FIG. 1 is a diagram showing a substrate shield structure according to an embodiment of the present invention.

FIG. 2 is a diagram showing a conventional substrate shield structure.

[Explanation of symbols]

 1 Upper Cover 2 Lower Cover 3 Substrate 3a Predetermined Area to be Shielded 3b Peripheral Area 4 Gasket (Conductive Member) 6 Rib 10 Housing

Claims (1)

[Claims] 1. A substrate shield that shields a predetermined area by bringing a conductive case including an upper cover and a lower cover into contact with a peripheral region surrounding a predetermined region of a substrate housed inside the case. In the structure, a conductive rib that comes into contact with the peripheral region is projected from the upper cover and the lower cover toward the inside of the housing, and a U-shaped portion of a conductive member having a U-shaped cross section at the tip of the rib. And a rib for contacting the rib with the peripheral region via the conductive member.