JPH06258029A - Method and system for recognizing pattern position - Google Patents
Method and system for recognizing pattern positionInfo
- Publication number
- JPH06258029A JPH06258029A JP5069411A JP6941193A JPH06258029A JP H06258029 A JPH06258029 A JP H06258029A JP 5069411 A JP5069411 A JP 5069411A JP 6941193 A JP6941193 A JP 6941193A JP H06258029 A JPH06258029 A JP H06258029A
- Authority
- JP
- Japan
- Prior art keywords
- image
- gravity
- pattern
- inspected
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、CRT、液晶表示器等
のディスプレイを用いて、パターン位置の検査確認を行
う方法及びその装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for inspecting and confirming a pattern position by using a display such as a CRT and a liquid crystal display.
【0002】[0002]
【従来の技術】半導体製造装置製造ラインに於ける半導
体素子、電子回路のパターン位置確認を行う場合、一般
にパターンを正確な位置に配置した基準画像と、撮像機
で画像処理メモリに取込んだ被検査体のパターン画像と
を、比較して被検査体のパターン位置が正確であるかど
うかを確認していた。2. Description of the Related Art Generally, when confirming the pattern position of a semiconductor element or an electronic circuit in a semiconductor manufacturing apparatus manufacturing line, a reference image in which the pattern is arranged at an accurate position and a target image captured in an image processing memory by an image pickup device are used. It was confirmed by comparing the pattern image of the inspection object with the pattern position of the inspection object.
【0003】従来のパターン位置確認方法は、基準画像
を予め表示した固定の処理ウィンドウに被検査体の取込
み画像を重ねて表示し、基準画像のパターンと取込画像
のパターンとを比較し、位置の確認を行っていた。In the conventional pattern position confirmation method, a captured image of an object to be inspected is displayed in a superimposed manner on a fixed processing window in which a reference image is displayed in advance, and the pattern of the reference image and the pattern of the captured image are compared to determine the position. Was being confirmed.
【0004】[0004]
【発明が解決しようとする課題】ところが、上記した従
来の方法では、被検査体の搬送機構の停止位置の機械的
誤差、或は搬送機に被検査体を取付ける際の取付け誤差
があった場合等、被検査体と撮像機との間で機械的な位
置ずれがあった場合、更に画像処理メモリに取込まれる
同期+画像信号の同期分離誤差に伴うメモリ上の対象画
像データの位置ずれ等があった場合は、取込み画像と基
準画像との位置ずれがそのまま検査確認の結果に影響
し、確認ミスを発生する虞れがあった。However, in the above-mentioned conventional method, when there is a mechanical error in the stop position of the transport mechanism of the object to be inspected or an attachment error when mounting the object to be inspected on the conveyor. Etc., if there is a mechanical displacement between the object to be inspected and the image pickup device, further displacement of the target image data on the memory due to the synchronization taken in by the image processing memory + the error in the synchronization separation of the image signal, etc. In that case, the positional deviation between the captured image and the reference image directly affects the result of the inspection confirmation, and there is a possibility that a confirmation error may occur.
【0005】位置ずれを補正する方法として、被検査体
に基準マークを設定する、或は対象となる表示の一部に
基準マークを兼用させる方法が考えられるが、前者は被
検査体に基準マークを設定するスペースが必要となり、
後者は基準マークを兼用したパターンが他のパターンに
対して孤立した状態にないと干渉して基準マークの機能
を果たさない等やはり問題があった。As a method of correcting the positional deviation, a method of setting a reference mark on the object to be inspected or a method of using the reference mark as a part of the target display is conceivable. Space is required to set
The latter has a problem that the pattern that also serves as the reference mark does not function as the reference mark due to interference unless the pattern is also isolated from the other patterns.
【0006】本発明は斯かる実情に鑑み、取込画像の位
置ずれがあっても位置ずれに影響されることなく正確に
被検査体のパターン位置を確認することができる様にし
たものである。In view of the above-mentioned circumstances, the present invention is capable of accurately confirming the pattern position of the object to be inspected without being affected by the positional deviation of the captured image. .
【0007】[0007]
【課題を解決するための手段】本発明は、基準画像の重
心位置と被検査体の画像重心位置とをそれぞれ求め、両
重心位置に許容範囲以上のずれがある場合は、画像の重
心位置の少なくとも一方の座標変換をして両重心の位置
を合わせ、前記基準画像と被検査体の画像との比較を行
うことを特徴とするものである。According to the present invention, the barycentric position of a reference image and the barycentric position of an image of an object to be inspected are respectively determined. It is characterized in that at least one of the coordinates is converted to align the positions of both centers of gravity, and the reference image and the image of the inspection object are compared.
【0008】[0008]
【作用】基準画像と被検査体の取込画像の画像重心位置
のずれを解消することで、両画像自体のずれの影響を除
去し、検査すべきパターン位置のみの正確な比較を行え
る。By eliminating the shift of the image center of gravity position between the reference image and the captured image of the object to be inspected, the influence of the shift between both images can be eliminated, and only the pattern positions to be inspected can be accurately compared.
【0009】[0009]
【実施例】以下、図面を参照しつつ本発明の一実施例を
説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
【0010】図1中、1は被検査体のパターンを撮像す
る撮像機、2は撮像機の映像信号をシリアルのデジタル
信号にA/D変換する等の信号処理を行う第1信号処理
器、3は演算器、4は取込画像を記憶する第1メモリ、
5は基準画像を記憶する第2メモリ、6は前記演算器3
の演算結果を記憶する第3メモリ、7は前記演算器3か
らの信号を映像信号に変換する第2信号処理器、8は表
示器である。In FIG. 1, 1 is an image pickup device for picking up a pattern of an object to be inspected, 2 is a first signal processor for performing signal processing such as A / D conversion of a video signal of the image pickup device into a serial digital signal, 3 is a computing unit, 4 is a first memory for storing captured images,
5 is a second memory for storing a reference image, 6 is the arithmetic unit 3
3 is a third memory for storing the calculation result of, 2 is a second signal processor for converting the signal from the arithmetic unit 3 into a video signal, and 8 is a display.
【0011】以下、図3を参照して作用を説明する。The operation will be described below with reference to FIG.
【0012】先ず、前記第2メモリ5には基準画像デー
タ9が入力され、処理ウィンドウが設定される。前記演
算器3は第2メモリ5に入力された基準画像データ9か
ら基準画像の重心位置を演算し、その結果を第3メモリ
6に記憶させる。First, the reference image data 9 is input to the second memory 5, and the processing window is set. The calculator 3 calculates the barycentric position of the reference image from the reference image data 9 input to the second memory 5, and stores the result in the third memory 6.
【0013】次に、前記撮像機1が被検査体のパターン
を撮像し、前記第1信号処理器2が撮像器1からの信号
をA/D変換して前記演算器3に入力する。該演算器3
は第1信号処理器2からの被検査体画像データ10を前
記第1メモリ4に記憶させ、更に被検査体画像データ1
0より被検査体画像の重心位置を演算し、その演算結果
を前記第3メモリ6に記憶させる。Next, the image pickup device 1 picks up an image of the pattern of the object to be inspected, and the first signal processor 2 A / D-converts the signal from the image pickup device 1 and inputs it to the arithmetic unit 3. The arithmetic unit 3
Stores inspected image data 10 from the first signal processor 2 in the first memory 4, and further inspected image data 1
The gravity center position of the image of the object to be inspected is calculated from 0, and the calculation result is stored in the third memory 6.
【0014】前記演算器3は基準画像の重心位置と被検
査体画像データの重心位置とを比較し、両者の位置の相
違が許容値以内であれば、前記基準画像データ9と被検
査体画像データ10とを前記第2信号処理器7を介して
前記表示器8に重合わせて表示する(図2参照)。The arithmetic unit 3 compares the barycentric position of the reference image with the barycentric position of the image data of the object to be inspected. If the difference between the positions is within an allowable value, the reference image data 9 and the image of the object to be inspected. The data 10 and the data 10 are superimposed on the display 8 via the second signal processor 7 and displayed (see FIG. 2).
【0015】検査者は、表示器8に表示された被検査パ
ターン11と基準パターン12とを比較し、両者の位置
が合っているかどうかを検査する。The inspector compares the pattern to-be-inspected 11 displayed on the display 8 with the reference pattern 12 and inspects whether or not the positions of the two patterns match.
【0016】或は、前記第2信号処理器7により基準画
像データ9、被検査体画像データ10の内、それぞれの
対応するパターンの位置を演算させ、演算した結果を基
にパターン位置の比較を行い、どの位置のパターンが許
容範囲にあり、どの位置のパターンが許容範囲を越えて
いるかを前記表示器8に表示させることもできる。Alternatively, the positions of the corresponding patterns of the reference image data 9 and the image data 10 to be inspected are calculated by the second signal processor 7, and the pattern positions are compared based on the calculated results. It is also possible to display on the display unit 8 which pattern is in the allowable range and which pattern is in the allowable range.
【0017】前記演算器3に於いて、基準画像の重心位
置と被検査体画像データの重心位置とを比較し、両者の
位置の相違が許容値を越えていると処理ウィンドウの座
標変換を行い、基準画像の重心位置と被検査体画像デー
タの重心位置とを合致させる。而して、前記基準画像デ
ータ9と被検査体画像データ10とを前記第2信号処理
器7を介して前記表示器8に重合わせて表示し、或は基
準画像データ9、被検査体画像データ10のパターン位
置を前記演算器3により演算比較し、パターン位置の比
較結果を前記表示器8に表示させる。In the arithmetic unit 3, the barycentric position of the reference image is compared with the barycentric position of the image data of the object to be inspected, and if the difference between the two positions exceeds the allowable value, the coordinate conversion of the processing window is performed. , The center of gravity of the reference image is matched with the center of gravity of the image data of the object to be inspected. Then, the reference image data 9 and the inspected image data 10 are superimposed on the display 8 via the second signal processor 7 and displayed, or the reference image data 9 and the inspected image are displayed. The pattern position of the data 10 is calculated and compared by the calculator 3, and the comparison result of the pattern position is displayed on the display 8.
【0018】1つの被検査体のパターンの確認が完了す
ると、前記処理ウィンドウの座標変換を行った場合は、
座標変換前の状態に戻し、再び被検査体の画像の取込み
を行い、上記した作業を繰返し行う。After the confirmation of the pattern of one inspected object is completed, when the coordinate conversion of the processing window is performed,
The state before the coordinate conversion is restored, the image of the inspection object is captured again, and the above-described work is repeated.
【0019】尚、上記した様に、基準画像と取込画像と
の重心位置のデータ、更に両者の位置の差を求めること
ができるので、被検査体の搬送機構の停止位置の機械的
誤差、或は搬送機に被検査体を取付ける際の取付け誤差
を正確に測定することができる。又、上記実施例では基
準画像と取込画像との重心位置を合わせる為、基準画像
についての座標変換を行ったが、取込み画像側の座標変
換を行ってもよいこと、更に基準画像と取込画像両者に
ついての座標変換を行ってもよいことは勿論である。As described above, since the data of the barycentric position of the reference image and the captured image and the difference between the positions can be obtained, a mechanical error of the stop position of the transport mechanism of the object to be inspected, Alternatively, it is possible to accurately measure the mounting error when mounting the inspection object on the carrier. Further, in the above embodiment, the coordinate conversion of the reference image was performed in order to align the barycentric positions of the reference image and the captured image. However, the coordinate conversion of the captured image may be performed. Of course, coordinate conversion may be performed for both images.
【0020】[0020]
【発明の効果】以上述べた如く本発明によれば、取込画
像と基準画像との間に位置ずれがあっても、位置ずれに
影響されることなく正確に被検査体のパターン位置を確
認することができる。As described above, according to the present invention, even if there is a positional deviation between the captured image and the reference image, the pattern position of the object to be inspected can be accurately confirmed without being affected by the positional deviation. can do.
【図1】本発明の一実施例を示すブロック図である。FIG. 1 is a block diagram showing an embodiment of the present invention.
【図2】取込画像と基準画像の比較状態を示す説明図で
ある。FIG. 2 is an explanatory diagram showing a comparison state between a captured image and a reference image.
【図3】本実施例の作動を示すフローチャートである。FIG. 3 is a flowchart showing the operation of this embodiment.
1 撮像機 2 第1信号処理器 3 演算器 4 第1メモリ 5 第2メモリ 6 第3メモリ 7 第2信号処理器 8 表示器 9 基準画像データ 10 被検査体画像データ 11 被検査パターン 12 基準パターン 1 Imager 2 1st signal processor 3 Arithmetic unit 4 1st memory 5 2nd memory 6 3rd memory 7 2nd signal processor 8 Display 9 Reference image data 10 Inspected image data 11 Inspected pattern 12 Reference pattern
Claims (2)
心位置とをそれぞれ求め、両重心位置に許容範囲以上の
ずれがある場合は、画像の重心位置の少なくとも一方の
座標変換をして両重心の位置を合わせ、前記基準画像と
被検査体の画像との比較を行うことを特徴とするパター
ン位置確認方法。1. A barycentric position of a reference image and a barycentric position of an image of an object to be inspected are respectively obtained, and when both barycentric positions are displaced beyond an allowable range, coordinate conversion of at least one of the barycentric positions of images is performed. A pattern position confirming method characterized in that the positions of both centers of gravity are aligned and the reference image and the image of the inspection object are compared.
入力手段と、被検査体取込画像の重心及び基準画像の重
心を演算する手段と、画像の少なくとも一方の重心位置
の変換を行う手段とを少なくとも具備することを特徴と
するパターン位置確認装置。2. An image capturing means for an object to be inspected, a reference image inputting means, a means for calculating the center of gravity of the image to be inspected and the center of gravity of the reference image, and conversion of the position of the center of gravity of at least one of the images. A pattern position confirmation device comprising at least means.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5069411A JPH06258029A (en) | 1993-03-04 | 1993-03-04 | Method and system for recognizing pattern position |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5069411A JPH06258029A (en) | 1993-03-04 | 1993-03-04 | Method and system for recognizing pattern position |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06258029A true JPH06258029A (en) | 1994-09-16 |
Family
ID=13401842
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5069411A Pending JPH06258029A (en) | 1993-03-04 | 1993-03-04 | Method and system for recognizing pattern position |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH06258029A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010025836A (en) * | 2008-07-23 | 2010-02-04 | Hitachi High-Technologies Corp | Visual inspection method, visual inspection device, semiconductor inspection device, and semiconductor wafer cross-section inspection device |
-
1993
- 1993-03-04 JP JP5069411A patent/JPH06258029A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010025836A (en) * | 2008-07-23 | 2010-02-04 | Hitachi High-Technologies Corp | Visual inspection method, visual inspection device, semiconductor inspection device, and semiconductor wafer cross-section inspection device |
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