JPH06252126A - Method and system cleaning substrate - Google Patents

Abstract

PURPOSE:To effectively utilize the limited space of the cleaning room of a substrate cleaning system and, at the same time, to completely automate the cleaning process so as to surely manage the process history, etc., of a substrate automatically. CONSTITUTION:While a wafer W is subjected to a cleaning process, a substrate carrying device 10 carries the empty cassette 3' from which the wafer W is taken out to a substrate carrying-out section C during a waiting period and, upon completing the cleaning, carries the cassette to a next process after housing the washed wafer W in the cassette 3'. Therefore, the required number of carrier cassettes 3 can be reduced, because the cassettes 3 are effectively utilized, and the need of a keeping space for the cassettes 3 is eliminated, because the carrying process of the empty cassette 3' is automated and made more efficiently. Moreover, when these cleaning processes are completely automated, the management of process history, etc., of the wafer W can be surely performed automatically.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cleaning system, and more particularly to a technique for cleaning a thin substrate such as a semiconductor substrate or a liquid crystal glass substrate.

[0002]

2. Description of the Related Art A general structure of a substrate cleaning system of this type, for example, a conventional semiconductor substrate (hereinafter referred to as "wafer") cleaning system has a plurality of cleaning tanks arranged in a line in a lateral direction. A substrate carry-in section is provided at one end side thereof, and a substrate carry-out section is provided at the other end side thereof, so that the substrate transfer processing apparatus can be moved in the arrangement direction of these cleaning tanks in parallel with the cleaning tank.

The number of wafers supplied from the preceding step to the substrate loading section is a plurality of wafers (for example, about 25 wafers).
Are housed in one transfer cassette as a set, and are transferred to the substrate transfer processing apparatus at the substrate loading unit. As the structure of the substrate transfer processing apparatus, there are a cassette type in which the wafer is housed in a processing cassette for cleaning and a cassetteless type in which the wafer is directly held and cleaned. The latter cassette-less type is becoming popular in order to improve the wafer cleaning efficiency and prevent the cleaning liquid from being contaminated.

In the cassette-less type substrate cleaning system, the wafers transferred from the transfer cassette to the substrate transfer processing apparatus at the substrate loading section are successively dipped in the cleaning tank by the substrate transfer processing apparatus. After the cleaning process is performed, the substrate is unloaded into the transport cassette in the substrate unloading section and is unloaded to the next step.

In this case, the wafer transfer operation between the transfer cassette and the substrate transfer processing apparatus is automated, while the transfer operation of the empty cassette after taking out the wafer from the substrate loading section to the substrate unloading section is performed. The operator manually performed the operation through the operator zone.

[0006]

However, such a configuration has the following problems.

(1) The empty cassette after taking out the wafer is manually transferred from the substrate loading section to the substrate unloading section in parallel with the wafer cleaning process, and the substrate loading section and the substrate unloading section are: Since a plurality of cleaning tanks arranged in a horizontal row are arranged on the opposite side, the distance between them, that is, the transfer distance, is relatively long, and this transfer operation is performed in parallel with the wafer cleaning process. There must be. For this reason, the worker spends a lot of labor to convey the empty cassette, and it is difficult to perform the work efficiently.

(2) Since it is difficult to efficiently transfer an empty cassette in synchronism with the wafer cleaning process, it is necessary to wait the empty cassette in advance at the substrate unloading section prior to the wafer cleaning process. It is necessary to secure storage space for the whole system, which leads to an increase in the size of the entire system.

(3) Since the empty cassette is carried by hand, it is impossible to completely automate the cleaning process, and the empty cassette must be stored manually, which requires a lot of time and labor. Moreover, the operator must always monitor the process history of the wafer, which is insufficient in terms of reliability.

The present invention has been made in view of the above conventional problems, and an object of the present invention is to effectively utilize a limited cleaning chamber space and to completely automate the cleaning process so that the wafer An object of the present invention is to provide a substrate cleaning method and a substrate cleaning system capable of automatically and reliably performing process history management and the like.

[0011]

In order to achieve this object, the substrate cleaning method of the present invention is a method of cleaning a wafer without a cassette, and is a wafer which is accommodated and carried in a carrier cassette from the previous step. Was transferred to the substrate transfer processing device at the substrate loading section and automatically immersed in a plurality of cleaning tanks sequentially from one end of the cleaning tank row, and in parallel with this, the wafer was taken out at the substrate loading section. The empty carrier cassette is transported to the substrate unloading section on the other end side of the cleaning tank row,
In the substrate unloading unit, the wafer that has been subjected to the automatic cleaning process is transferred again from the substrate transfer processing apparatus to the same carrier cassette as when it was loaded, and then unloaded to the next step.

Further, the substrate cleaning system of the present invention performs the above substrate cleaning method fully automatically, and is provided with a loader device which is disposed on the apparatus loading side and transfers a wafer from a carrier cassette to the substrate transfer processing apparatus. A substrate carrying-in section, a cleaning section provided adjacent to the substrate carrying-in section, including a cleaning tank row composed of a plurality of cleaning tanks, and the substrate transfer processing device movable in the arrangement direction of the cleaning tanks, and the cleaning section. Between the substrate carry-in section and the substrate carry-out section, which is arranged adjacent to the carry-out side of the unit, and which includes an unloader device for transferring the cleaned wafer from the substrate carrying processing apparatus to the carrier cassette. A cassette transfer unit provided with a cassette transfer device for transferring an empty carrier cassette from which a wafer has been taken out, and a cassette transfer unit for performing the cleaning method described above. Loader, the substrate transport apparatus,
And a drive control unit for controlling the drive of the unloader device and the cassette carrying device in synchronization with each other.

[0013]

In the present invention, while the substrate is being cleaned by the substrate transfer processing apparatus, the empty carrier cassette from which the wafer has been taken out is automatically transferred to the substrate unloading section for standby, and the cleaning process is completed. The wafer thus formed is again stored in the carrier cassette used at the time of carrying in and carried out to the next step. This makes efficient use of the transport cassette,
In addition to reducing the required number, the transfer process of the transfer cassette is automated and streamlined to eliminate the need for storage space. Further, by completely automating these cleaning steps, the process history management of the substrate and the like can be performed automatically and surely.

[0014]

Embodiments of the present invention will now be described in detail with reference to the drawings.

Embodiment 1 A substrate cleaning system according to the present invention is shown in FIG. 1 and FIG. 2, and this substrate cleaning system batches a plurality of (50 in this example) wafers W, W, ... Without a cassette. It is a batch type that is performed by the following, and includes a substrate loading section A, a cleaning section B, a substrate unloading section C, a cassette transporting section D, and a control device (drive control section) E as main parts.

The substrate carry-in section A is a section into which the wafers W, W, ... Are carried in from the previous step, and is arranged on the carry-in side of the cleaning section B.
A tact feeding mechanism 1 (see FIG. 3) and a loader device 2 are provided.

The tact feed mechanism 1 includes a path (1), (2) and a path.
For example, as shown in FIG. 3, the rack 5a for traveling, which is disposed in the portion (10) and extends in the horizontal direction,
A drive motor 6 is provided on the rack 5a so as to be self-propelled via a pinion 5b, and a cylinder device 7 provided on the drive motor 6 so as to face upward.

Then, the cylinder cassette 7 pushes up the carrier cassette 3 on one carrier stand 8a to raise it, and in this state the drive motor 6 self-propels to the other carrier stand 8b. After the carrier cassette 3 is lowered again and placed on the carrier stand 8b, the drive motor 6 again returns to the position of the carrier stand 8a by self-propagation, and the subsequent operation (the cycle indicated by arrow X in FIG. 3).
Is configured to be repeated.

The wafer-containing carrier cassettes 3, 3, ... Which have been carried in from the previous step are tact-fed at predetermined intervals in the arrow (1) direction by the tact feed mechanism 1 and then in the arrow (2) direction. It is sent and two are put in parallel. In addition, in this example, one carrier cassette 3 has 25
A plurality of wafers W, W, ... Are stored.

The loader device 2 transfers the wafers W, W, ... From the carrier cassette 3 to the substrate transfer processing device 10 of the cleaning section B. Although not shown, the carrier cassette 3
A push-up mechanism that pushes up the wafers W, W, ..., A pair of chucking arms that collectively chuck the pushed wafers W, W ,.

Then, the chucking arm takes out the wafers W, W, ... (In this example, 25 wafers) from the two carrier cassettes 3, 3 arranged side by side as described above, and puts them on the two wafer holders 9a, 9a. Place each on 9b (arrow (3)). The empty carrier cassettes (empty cassettes) 3 ', 3', ... From which the wafers W, W, ... Are taken out are tact-fed to the cassette transfer section D by the tact feeding mechanism 1 through the path indicated by the arrow (10). .

One of the wafer holders 9a and 9b is
b is allowed to approach the other side 9a, and in this approaching state, the substrate transfer processing apparatus 10 is configured to stand by.

The cleaning section B comprises the substrate transfer processing apparatus 10 and a pair of left and right cleaning tank rows 11 and 12 arranged in parallel in two rows in a cleaning chamber maintained in a high cleanliness atmosphere. , One end side of each of these washing tank rows 11 and 12 is arranged so as to face the operator zone O, and
A substrate transfer unit 13 is provided between the other ends of the cleaning tank rows 11 and 12.

That is, the cleaning path for the wafers W, W, ...
It is configured to proceed from the end of the cleaning tank row 11 on the carry-in side to the end opposite the operator zone O and to the end of the cleaning tank row 12 on the carry-out side opposite the operator zone O to the end of the operator zone O. ing.

The carry-in side cleaning tank array 11 is provided with a plurality of cleaning tanks, and the substrate transfer processing apparatus 10 is arranged on the side of these cleaning tanks.

In the illustrated example, five cleaning tanks 11a-1
1e is provided. Specifically, the cleaning tank 11a is a chuck cleaning tank for cleaning the chucking arm of the substrate transfer processing apparatus 10, and the cleaning tanks 11b and 11c are sulfuric acid (H ₂ SO ₄ ) and peroxide. cleaning tank hydrogen water (H ₂ 0 ₂₎ is satisfied, the pure water tank cleaning tank 11d is warm pure water of about 60 ° C. are met and the washing tank 11e, the transfer of the wafer W to the substrate transfer unit 13 It is a delivery tank that does.

Further, the substrate transfer processing apparatus 10 has a structure in which the wafers W, W, ... Taken out from the carrier cassette 3 in the substrate loading section A are transferred without a cassette.
Arrangement direction of the cleaning tanks 11a to 11e (direction of arrow (4))
It is supposed to be able to reciprocate in parallel with. Similar to the loader device 2, the specific structure of the substrate transfer processing apparatus 10 includes a pair of chucking arms for chucking the wafers W, W, ... , (9 in this example, 50 wafers) are collectively chucked and supported.

The substrate transfer section 13 following the above-mentioned loading side cleaning tank row 11 moves from this loading side cleaning tank row 11 to the unloading side cleaning tank row 12.
The substrate transfer device 1 is a part for transferring the wafers W, W ,.
5 is provided. The substrate transfer device 15 is for transferring the wafers W, W, ... From the delivery tank 11e of the loading side cleaning tank row 11 to the delivery tank 12a of the unloading side cleaning tank row 12 (arrow (5) direction). The specific structure is substantially the same as that of the substrate transfer processing apparatus 10, and both transfer tanks 11e and 12 are provided.
It is possible to reciprocate between a.

The carry-out side cleaning tank row 12 is provided with a plurality of cleaning tanks as in the case of the carry-in side cleaning tank row 11 described above, and the substrate transfer processing apparatus 10 is disposed on the side of these cleaning tanks. In the illustrated example, four cleaning tanks 12a to 12d
And a spin dryer 12e are provided.

Specifically, the cleaning tank 12a is a transfer tank for transferring the wafer W from the substrate transfer section 13, and the cleaning tank 1
2b is a standard cleaning tank filled with SC-1 liquid (ammonia water (NH ₄ OH), hydrogen peroxide water (H ₂ 0 ₂ ) and pure water), and the cleaning tank 12c is a warm pure water of about 60 ° C. The deionized water tank filled with water and the cleaning tank 11d are final rinse tanks for rinsing the wafers W, W, ... Finally, and the spin dryer 12e is the wafers W, W ,.
To function as a drying section for spinning and drying water while centrifuging.

Further, the substrate transfer processing apparatus 10 has the above-mentioned basic structure, and although not shown, specifically, three substrate transfer processing apparatuses 10a to 10c are arranged, and the substrate transfer processing apparatus 10a is delivered. Tank 12a to pure water tank 12c
The substrate transfer processing apparatus 10b performs the transfer processing from the pure water tank 12c to the spin dryer 12e, and the substrate transfer processing apparatus 10c performs the transfer processing.
It is configured to perform a transfer process from 2e to the substrate unloading section C.

These substrate transfer processing devices 10a to 10c
Is the cleaning tanks 12a to 12d and the spin dryer 1
The wafers W, W, and W received in the delivery tank 12a are driven in parallel with each other in the direction of arrangement of 2e (arrow (6) direction), and are driven and controlled in synchronization with each other. Are successively dipped in the above 12b to 12d and then dried by the spin dryer 12e, and then placed on the two wafer platforms 19a and 19b of the substrate unloading section C (arrow (7)).

One of the wafer mounts 19a, 19b is separable from the other 19a, and in this separated state, the unloader device 20 of the substrate unloading section C is made to stand by.

The substrate unloading section C is a site where the wafers W, W, ... Are unloaded to the next process, and is arranged on the unloading side of the unloading side cleaning tank row 12 and has the unloader device 20 and the tact feed mechanism 1.
(See FIG. 3).

The unloader device 20 transfers the wafers W, W, ... From the unloading side substrate transfer processing device 10c of the cleaning section B to the empty cassette 3 ', and has the same basic structure as the loader device 2 described above. Become.

The chucking arm of the unloader device 20 lifts the wafers W, W, ... (25 wafers in this example) from the two wafer mounts 19a, 19b which are separated and arranged in parallel as described above. Then, after being placed on the push-up mechanisms in the two empty cassettes 3 ', 3', respectively, the push-up mechanisms are lowered and the wafers W, W, ...
Are stored in empty cassettes 3 ', 3' (arrow (8)).

These empty cassettes 3'and 3'are, as will be described later, indicated by arrows (10), (11) and (12) via the cassette carrying section D.
The wafers W, W, ..., Which have been subjected to the cleaning process and which have been continuously transported through the path, are the same as those stored at the time of loading.

The tact feeding mechanism 1 has the basic structure as described above, and is arranged at the portion of the path (12) and the portions of the paths (8) and (9). In the paths (12) and (8), the cleaned empty cassette 3 ', which is supplied from the cassette carrying section D described later,
3'is tact-fed to a position adjacent to the wafer mounting tables 19a and 19b. The wafers W, W, ... Are stored in the empty cassettes 3 ', 3'by the unloader device 20 as described above. The carrier cassettes 3, 3, ... In which the wafers W, W ,.
Tact is fed through the route of (9) and is carried out to the next process.

The cassette carrying section D is a section for carrying the empty cassette 3'from the substrate carrying-in section A to the substrate carrying-out section C, and connects the substrate carrying-in section A and the substrate carrying-out section C. Further, the cassette carrying section D is provided with a cassette carrying device 25, and a cassette cleaning tank 26 is provided at an intermediate position of the transfer path (11).

Similar to the substrate transfer processing device 10, the cassette transfer device 25 is capable of reciprocating along the path of the arrow (11) and includes a pair of chucking arms for chucking the empty cassette 3 '. Be prepared. Then, these chucking arms are connected to the wafer W,
The empty cassette 3 ′ from which W, ... Has been taken out is chucked, immersed in the cassette cleaning tank 26 to be subjected to a cleaning process, and then transferred to the substrate unloading section C.

The cycle time in this case is synchronized with the cycle time in the cleaning section B, and as described above, the empty cassettes (carrier cassettes) 3 ', 3'
The same wafers W, W, ... Which were stored at the time of loading from the previous process are controlled to be loaded again at the substrate unloading section C.

The control device E includes the tact feeding mechanism 1, the loader device 2, the substrate transfer processing device 10, and the unloader device 2.
0 and the cassette transfer device 25 are controlled in synchronization with each other, and the control device E performs the following cleaning processing steps fully automatically from the time of loading the wafers W, W, ... Become.

A. Loading of wafers W, W, ...: The wafers W, W, ... Having completed the previous process are stored in the carrier cassette 3, and an automatic loading means such as an automatic guided vehicle (AGV) or a loading conveyor (not shown) or an operator. By this, it is manually loaded into the substrate loading section A. The carrier cassettes 3, 3, ... Which have been carried in are sequentially tact-fed by the tact feed mechanism 1 through the paths indicated by the arrows (1) and (2) as described above, and two of them are arranged in parallel. Wafers W of both carrier cassettes 3, 3
Are transferred to the substrate transfer processing device 10 of the cleaning section B by the loader device 2 (see arrow (3)). On the other hand, the empty cassette 3'from which the wafers W, W, ... Are taken out is sent to the cassette carrying section D by the tact mechanism 1 (see arrow (10)).

B. Cleaning of the wafers W, W, ...: The wafers W, W, ... Held without a cassette in the substrate transfer processing apparatus 10 on the loading side are cleaning tanks 11a to 11d.
After being successively immersed in water and washed, the delivery water tank 1
Immersed in 1e (see arrow (4)). Wafers W, W, which stand by in the delivery water tank 11e
Is the delivery tank 12a on the unloading side by the substrate transfer device 15.
Substrate transfer processing device 10 (specifically, as described above, the three substrate transfer processing devices 10a, 10
b) and 10c) (see arrow (5))
. The wafers W, W, ..., Which are held by the substrate transfer processing apparatus 2 without a cassette, are sequentially immersed in the cleaning tanks 12b to 12d of the unloading-side cleaning tank row 12 for cleaning processing, and then the spin dryer. After being dried at 12e,
It is transferred to the board unloading section C (see arrow (6)).

C. Transfer of empty cassettes 3 ', 3', ...: The empty cassette 3'sent to the cassette transfer section D is transferred by the cassette transfer device 25 in parallel with the cleaning process of the wafers W, W, ... , Cassette cleaning tank 26
After being immersed in the substrate and subjected to a cleaning process, it is transported to the substrate unloading section C (see arrow (11)).

D. Unloading of Wafers W, W, ...: Wafers W, W, ... Whose cleaning processes in both cleaning tank rows 11 and 12 are finished are unloaded at substrate unloading section C by unloader device 20 as described above. To the empty cassettes 3'and 3'which have been cleaned (see arrows (7) and (8)). Empty cassette 3'stored in this case
Are the wafers W, W, ... Stored at the time of loading, and are previously transported to the substrate unloading unit C through the cassette transporting unit D as described above, where the wafers W, W ,.
Waiting for the cleaning process to finish (arrow (10) (1
See 1) (12) (8). Carrier cassette 3, which stores wafers W, W, ...
3, are tact-fed by the tact feed mechanism 1 along the path indicated by the arrow (9), and are also carried to the next step by a carrying-out means such as an AGV or a carry-out conveyor (not shown).

Thus, as described above, the wafers W, W,
By utilizing the carrier cassette 3 used when carrying in ..., the number of required carrier cassettes is small, and the empty cassettes 3 ′, 3 ′, ... No storage space is required and the system configuration is compact.

Further, the work of transferring the wafers W, W, ... Is automatically performed by the loader device 2 and the unloader device 25, so that the entire system is completely automated. Moreover, since the carrier cassette 3 in which the wafers W, W, ... Are stored at the time of unloading, the entire system is driven and controlled so as to be the same as that stored at the time of loading, so that the storage of the wafers W, W ,. The management, and further, the management of the process history are automatically and surely performed.

Further, the cleaning path for the wafers W, W, ...
From the end of the cleaning tank row 11 on the carry-in side to the end opposite the operator zone O, and from the end of the cleaning tank row 12 on the carry-out side opposite the operator zone O to the end on the operator zone O side The overall configuration of the substrate cleaning system has a vertically long shape with a narrow frontage and a long depth in combination with the downsizing of the system configuration.

Therefore, it becomes possible to adopt an array structure in which a plurality of substrate cleaning systems are installed in a vertically long state along the passage for the worker in the cleaning chamber, and the limited cleaning chamber space can be effectively utilized. . As a result, the operator's operator zone O, that is, the work range of the worker can be reduced to reduce the work load. On the other hand, on the contrary, the utility zone, which has been too narrow in the past, can be widely secured, and Maintenance can be performed easily.

Example 2 This example is shown in FIGS. 4 and 5, and the relative configuration of the cleaning section B and the cassette carrying section D is changed from the planar configuration as in Example 1 to a three-dimensional configuration. The substrate carry-in section A is arranged on the side opposite to the operator zone O, and the substrate carry-out section C is arranged so as to face the operator zone O.

That is, the substrate carry-in section A passes from the inlet section A ₁ facing the operator zone O, through the substrate transfer section A ₂ of the system ceiling section F maintained in a clean atmosphere,
It is configured to continue to the exit portion A ₃ . In particular,
A tact feed mechanism 1 (see FIG. 3) is arranged at each of the inlet portion A ₁ , the substrate transfer portion A ₂ and the outlet portion A ₃ , and the inlet portion A ₁ and the substrate transfer portion A ₂ are connected to each other. A lift mechanism 30 is provided between (the part of the route (2)) and between the substrate transfer part A ₂ and the exit part A ₃ (the part of the route (4)).
(See FIG. 6) are arranged.

The elevating mechanism 30 is, for example, as shown in FIG. 6, a rack 3 for elevating provided extending vertically.
5, a drive motor 37 that is vertically movable on the rack 35 via a pinion 36, and the drive motor 3
7 is provided with a support base 38 attached thereto.

Between the inlet section A ₁ and the transfer section A ₂ , the drive motor 37 drives the lower carrier table 8c.
The upper carrier cassette 3 is lifted up above the upper carrier stand 8d while being supported by the support stand 38, then lowered and placed on the carrier stand 8d, and the drive motor 37 is again moved to the lower carrier. After returning to the position of the table 8c, the lifting operation is repeated.
On the other hand, the reverse operation is repeated between the transfer section A ₂ and the outlet section A ₃ .

Then, the carrier cassettes 3, 3, ... Incorporated into the entrance portion A ₁ of the substrate loading portion A from the previous step are tact-fed by the tact feeding mechanism 1 in the arrow (1) direction. After that, the elevator mechanism 30 raises the substrate to the substrate transfer portion A ₂ of the system ceiling portion F (see arrow (2)).
The carrier cassette 3, which is sent to the substrate transfer section A ₂ ,
Further, after being tact-fed by the tact feed mechanism 1 through the path of the arrow (3), the elevating mechanism 30 descends the outlets A ₃ on the side opposite to the operator zone O (arrows ₃ , ₃₎ .
(See (4)).

A loader device 2 is installed at the outlet portion A ₃ , and the carrier cassettes 3, 3, ... Are tact-fed in the arrow (5) direction by the tact-feeding mechanism 1 and after the two are arranged in parallel. The wafers W, W, ... In these carrier cassettes 3, 3 are respectively placed on the two wafer placing stands 9a, 9b by the loader device 2 as in the first embodiment (arrow (6)). . The empty cassettes 3 ', 3', ... from which the wafers W, W, ... have been taken out are indicated by the arrow mark (10) by the tact feeding mechanism 1.
Tact is fed to the cassette carrying section D along the path.

The cleaning section B of this example is provided with a cleaning tank row 40 and a substrate transfer processing apparatus 10 arranged on the side of the cleaning tank row 40 in a cleaning chamber maintained in a high cleanliness atmosphere.

In the cleaning tank row 40, a plurality of cleaning tanks are arranged in a straight line from the substrate carry-in section A to the substrate carry-out section C. In the illustrated example, eight cleaning tanks 40a to 40h are provided.
And a spin dryer 40i.

Specifically, the cleaning tank 40a is a chuck cleaning tank for cleaning the chucking arm of the substrate transfer processing apparatus 10, the cleaning tank 40b is a cleaning tank filled with hydrofluoric acid (HF), and the cleaning tank 40c is pure. deionized water tank water is filled, the cleaning tank 40d~40f the cleaning tank is filled phosphoric acid (H ₃ PO _4), the cleaning tank 40g is filled with warm pure water of about 60 ° C. deionized water tank, The cleaning tank 40h is a final rinse tank for rinsing the wafers W, W, ... Finally, and the spin dryer 40i functions as a drying unit for spinning the wafers W, W, ... and centrifuging water for drying. To do.

The cassette carrying section D extends in parallel with the substrate carry-in section A and is arranged in parallel.
The operation paths (11) to (15) are only in the opposite direction to the substrate loading section A. That is, the cassette carrying section D
In, the operation paths (11) to (15) are configured to proceed from the exit portion A ₃ side of the substrate loading section A to the substrate unloading section C side.

The transfer cycle time of the empty cassettes 3 ', 3', ... In the cassette transfer section D is synchronized with the cycle time in the cleaning section B as in the first embodiment, and is stored at the time of loading from the previous process. Wafers W, W,
, Are again controlled to be stored in the same empty cassette (carrier cassette) 3 ', 3'in the substrate unloading section C.

Thus, in the substrate cleaning system configured as described above, the wafer-containing carrier cassettes 3, 3, ... Carried into the entrance A ₁ of the substrate carry-in section A are transferred via the substrate transfer section A _2. Sent to exit A ₃ (arrow (1) ~
(See (5)), and is transferred to the substrate transfer processing device 10 in the cleaning section B (see arrow (6)), and the remaining empty cassette 3'is sent to the cassette transfer section D (arrow (10)). )).

The wafers W, W, ... Held in the substrate transfer processing apparatus 10 are successively immersed in the cleaning tanks 40a to 40h of the cleaning section B to be subjected to cleaning processing, and then dried by the spin dryer 40i. After that, it is transferred to the substrate unloading section C (see arrow (7)).

On the other hand, the empty cassette 3 ′ sent to the cassette carrying section D is carried to the substrate unloading section C in parallel with the wafer cleaning process of the cleaning section B (arrows (11) to (15)). )).

The wafers W, W, ... Having undergone the cleaning process in the cleaning section B are transferred from the substrate transfer processing apparatus 10 to the empty cassettes 3 ', 3'in the substrate unloading section C (arrow (8)). See). Empty cassette 3'stored in this case
Are the same as in the first embodiment in that the wafers W, W, ... Are stored at the time of loading, and the carrier cassettes 3, 3 ,.
It is transported to the next process by the route of arrow (9).

The sequence of the automatic cleaning process steps in the cleaning system has been briefly described above, but the specific configuration and operation are the same as in the first embodiment.

Even in the cleaning system configuration of this example, the cleaning path for the wafers W, W, ... Is in the operator zone O.
It has a vertically long shape with a narrow frontage and a long depth by being linearly configured from the opposite side to the operator zone side, which allows multiple substrate cleaning systems to be used as a worker passage in the cleaning chamber. Along with this, it is possible to take an array structure that is installed in a vertically long state, and it is possible to obtain the same effects as those of the first embodiment such that the limited cleaning chamber space can be effectively utilized.

Example 3 This example is shown in FIGS. 7 and 8, and in the present invention, the conventionally known cleaning system, that is, the entire cleaning section B is in the operator zone O.
The cleaning unit B and the cassette transporting unit D have a three-dimensional configuration similar to that of the second embodiment.

That is, except that the substrate loading section A, the cleaning section B, and the substrate unloading section C are configured to face the operator zone O and have a horizontally long shape with a wide frontage and a short depth. It has the same basic structure as in Example 2.

In the substrate cleaning system configured as described above, the wafer-loaded carrier cassettes 3, 3, ... Carried into the substrate carry-in section A are tact-fed in the direction of the arrow (1), where Substrate transfer processing device 10 of cleaning unit B
And the remaining empty cassette 3'is sent to the cassette carrying section D (arrow (6)).
See).

The wafers W, W, ... Held in the substrate transfer processing apparatus 10 are successively immersed in the cleaning tanks 40a to 40h of the cleaning section B to be subjected to cleaning processing, and then dried by the spin dryer 40i. After that, it is transported to the substrate unloading section C (see arrow (3)).

Empty cassette 3 sent to cassette carrying section D
′ Is transferred to the substrate unloading section C in parallel with the wafer cleaning process of the cleaning section B (see arrows (7) to (10)).

The wafers W, W, ... After the cleaning process in the cleaning section B are transferred from the substrate transfer processing apparatus 10 to the empty cassettes 3 ', 3'in the substrate unloading section C (arrow (4)). See). In this case, the empty cassette 3 in which the wafers W, W, ...
′ Is the same as the wafer W, W, ... Stored at the time of loading. The carrier cassettes 3, 3, ... In which the wafers W, W, ... Are housed, are carried toward the next process along the path of the arrow (5). Other configurations and operations are similar to those of the second embodiment.

The above Examples 1 to 3 are merely for showing the preferred embodiments of the present invention, and the present invention should not be construed as being limited thereto. Various design changes are possible within the range.

For example, the tact feeding mechanism 1, the loader device 2, the substrate transfer processing device 10, the substrate transfer device 15, the cassette transfer device 25, and the elevating mechanism 30 in the illustrated example are concrete examples of each component device constituting the substrate cleaning system. The structure is not limited to the illustrated example, and various design changes can be made.

Regarding the specific structure of the cleaning section B,
Various designs are changed according to the cleaning purpose and method.

[0077]

As described in detail above, according to the present invention,
While the wafer is being cleaned by the substrate transfer processing device, the empty carrier cassette from which this wafer was taken out is automatically transferred to the substrate unloading section and placed on standby, and the wafer that has been cleaned is used again during this transfer. Since it is stored in the existing carrier cassette and carried out to the next process, the carrier cassette is efficiently used, the required number is minimized, and the carrier cassette carrying process is automated.
The efficiency is improved and the storage space is not needed, and the limited space of the washing room can be effectively used.

Furthermore, since these cleaning steps are completely automated, wafer process history management and the like can be performed automatically and reliably.

[Brief description of drawings]

FIG. 1 is a perspective view showing an overall configuration of a substrate cleaning system according to a first embodiment of the present invention, with a part of which is cut away.

FIG. 2 is a schematic plan view showing the overall configuration of the substrate cleaning system.

FIG. 3 is a front view showing a schematic configuration of a tact feed mechanism in the substrate cleaning system.

FIG. 4 is a perspective view showing an overall configuration of a substrate cleaning system that is Embodiment 2 of the present invention, with a part of which is cut away.

FIG. 5 is a schematic plan view showing the overall configuration of the substrate cleaning system.

FIG. 6 is a front view showing a schematic configuration of an elevating mechanism in the substrate cleaning system.

FIG. 7 is a perspective view showing an overall configuration of a substrate cleaning system according to a third embodiment of the present invention with a part of which is cut away.

FIG. 8 is a schematic plan view showing the overall configuration of the substrate cleaning system.

[Explanation of symbols]

W Wafer A Substrate loading section A ₁ Substrate loading section entrance A ₂ Substrate loading section substrate transfer section A ₃ Substrate loading section exit B Cleaning section C Substrate unloading section D Cassette transfer section E Controller (drive control section) F System ceiling O Operator zone 1 Tact feed mechanism 2 Loader device 3 Wafer carrier cassette 3'Empty cassette 10 Substrate transfer processing device 11, 12 Cleaning tank row 13 Substrate transfer unit 15 Substrate transfer device 20 Unloader device 25 Cassette transfer device 26 Cassette cleaning tank 30 Lifting mechanism

Claims (5)

[Claims] 1. A method in which a substrate stored in a carrier cassette from the previous step and carried in is transferred to a substrate transfer processing apparatus for cleaning processing without a cassette, and then returned to the carrier cassette and carried out to the next step. That is, the substrate stored in the carrier cassette from the previous step and transferred in is transferred to the substrate transfer processing device in the substrate transfer section, and automatically immersed in a plurality of cleaning tanks sequentially from one end side of the cleaning tank row, At the same time, the empty carrier cassette from which the substrate has been taken out by the substrate loading section is transported to the substrate unloading section on the other end side of the cleaning tank row, and the automatic cleaning process is completed at this substrate unloading section. The substrate cleaning method is characterized in that the substrate is transferred from the substrate transfer processing apparatus to the same carrier cassette as when it was loaded, and is unloaded to the next step. 2. A method in which a substrate stored in a carrier cassette from the previous step and carried in is transferred to a substrate transfer processing device for cleaning processing without a cassette, and then returned to the carrier cassette and carried out to the next step. A substrate cleaning device, which is provided on the device loading side and includes a loader device for transferring the substrate from the carrier cassette to the substrate transfer processing device, and a plurality of substrate loading parts arranged adjacent to the substrate loading part. A cleaning section including a cleaning tank row composed of cleaning tanks and the substrate transfer processing apparatus movable in the arrangement direction of the cleaning tanks, and a cleaning unit which is disposed adjacent to the unloading side of the cleaning section and has been cleaned. A substrate unloading unit that includes an unloader device that transfers the substrate from the substrate transfer processing device to a carrier cassette; and a substrate unloading unit that is arranged between the substrate unloading unit and the substrate unloading unit to remove the substrate. A cassette transport unit comprising a cassette transport device for transporting the empty carrier cassette, and the loader device, the substrate transport processing device, the unloader device, and the cassette transport device for performing the substrate cleaning method according to claim 1. A substrate cleaning system comprising: a drive control unit that controls driving in synchronization with each other. 3. The cleaning section comprises two cleaning tank rows, each of which comprises a plurality of cleaning tanks, arranged in parallel in parallel, one end of each of the cleaning tank rows facing the operator zone. A substrate transfer section is provided between the other ends of the cleaning tank rows, whereby the substrate cleaning path advances from the operator zone side end of one cleaning tank row to the operator zone opposite end and the other cleaning tank row. The substrate cleaning system according to claim 2, wherein the substrate cleaning system is configured to proceed from the opposite end of the operator zone to the end of the operator zone. 4. The cleaning unit comprises a plurality of cleaning tanks arranged in a straight line from the substrate loading unit to the substrate unloading unit, and the substrate loading unit is disposed on the opposite side of the operator zone while the substrate is loaded. A carry-out section is arranged facing the operator zone, and a board transfer section for transferring a board-containing carrier cassette carried in from the operator zone to the board carry-in section on the system ceiling above the cleaning section, and the cassette transfer section. The substrate cleaning system according to claim 2, wherein the substrate cleaning system is provided. 5. The substrate cleaning system according to claim 2, wherein the cassette transfer section is provided with a cassette cleaning tank for cleaning an empty carrier cassette transferred by the cassette transfer device.