JPH06251683A - Damper - Google Patents

Damper

Info

Publication number
JPH06251683A
JPH06251683A JP3317593A JP3317593A JPH06251683A JP H06251683 A JPH06251683 A JP H06251683A JP 3317593 A JP3317593 A JP 3317593A JP 3317593 A JP3317593 A JP 3317593A JP H06251683 A JPH06251683 A JP H06251683A
Authority
JP
Japan
Prior art keywords
substrate
chamber
fluid
damper
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3317593A
Other languages
Japanese (ja)
Inventor
Kiwamu Shibata
究 柴田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP3317593A priority Critical patent/JPH06251683A/en
Publication of JPH06251683A publication Critical patent/JPH06251683A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To facilitate assembling work. CONSTITUTION:A device comprises a substrate 1 divided in a plate thickness direction into two of the respective first/second substrates 11, 12 to connect through holes 11a, 12a air-tightly connected, sheets 2, 3 formed respectively with the first/second chambers 2a, 3a in both surfaces of the substrate 1 by covering both end parts of the through holes 11a, 12a and fluid 4 air-tightly sealed so that it can be moved to the other chamber through the through hole of the substrate 1 when the one chamber is pressed. Accordingly in the substrate 1, since the first/second substrates, 11, 12 are separately prepared as that already air-tightly connecting the sheets 2, 3 in a condition that the fluid 11 is infected to the first/second chambers 2a, 3a in the respective one surface, the other fellow surfaces of the substrate are required to be only connected by connecting the through holes 11a, 12a, and further the sheets 2, 3 are finished to be connected to the substrate with no hazardousness of damage to facilitate assembly work.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、リレーやスイッチ等に
適用されるダンパーに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a damper applied to relays and switches.

【0002】[0002]

【従来の技術】一般に、リレー等を構成する可動部材
は、衝突時に音、振動を発生し、それが家庭用電気機器
や自動車等に組み込まれた場合、その衝突音や振動が問
題となることがあるため、従来、可動部材に連動するピ
ストンを設け、シリンダ内の流体を移動させて衝突を緩
衝していた。
2. Description of the Related Art Generally, a movable member constituting a relay or the like generates sound or vibration at the time of collision, and when the movable member is incorporated into household electric appliances or automobiles, the collision sound or vibration becomes a problem. Therefore, conventionally, a piston interlocking with a movable member is provided to move the fluid in the cylinder to buffer the collision.

【0003】しかし、このものは、装置が大型化し、ま
たピストンとシリンダの嵌合精度が必要である等の問題
があり、これを解決するために、本願出願人は、特願平
4−103038号において図6及び図7に示す構成の
ダンパーを提案している。
However, this device has problems that the device becomes large and that the piston and the cylinder must be fitted with high precision, and in order to solve this problem, the applicant of the present application filed Japanese Patent Application No. 4-103038. In this issue, a damper having the structure shown in FIGS. 6 and 7 is proposed.

【0004】このダンパーは、貫通孔A1を中央に形成さ
れた基板A と、貫通孔A1の両端部を覆って第1室B1及び
第2室C1をそれぞれ形成するよう基板A の両面に超音波
溶接等で周りを気密接合されたシートB,C と、第1室B1
及び第2室C1の一方の室を押圧されると基板A の貫通孔
A1を通って他方の室に移動し得るよう気密封入された流
体D と、を備えてなっている。
[0004] The damper, through the hole substrate A 1 was formed in the center A, through the holes A 1 opposite ends overlying the first chamber B 1 and the second chamber substrate to C 1 to form each A Sheets B and C that are airtightly joined to each other by ultrasonic welding on both sides, and the first chamber B 1
And one of the second chamber C 1 is pressed, the through hole of the substrate A
Fluid D, which is hermetically sealed so that it can be transferred to the other chamber through A 1 .

【0005】[0005]

【発明が解決しようとする課題】上記した従来のダンパ
ーにあっては、衝突音を低減できるとともに、ピストン
及びシリンダを用いたものに比べて、嵌合精度を必要と
せず、小型にできる等の効果を奏するものとなる。
In the above-mentioned conventional damper, the collision noise can be reduced, and the fitting precision is not required and the size can be reduced as compared with the one using the piston and the cylinder. It will be effective.

【0006】しかしながら、このダンパーは、第1室B1
及び第2室C1の一方の室を押圧されると基板A の貫通孔
A1を通って他方の室に移動し得るよう、適量の流体D を
封入して基板A の両面にシートB,C を気密接合する必要
があり、その組立は例えば図8に示すように行われる。
However, this damper is used in the first chamber B 1
And one of the second chamber C 1 is pressed, the through hole of the substrate A
It is necessary to enclose a suitable amount of fluid D and hermetically bond the sheets B and C to both sides of the substrate A so that they can be moved to the other chamber through A 1. The assembly is performed as shown in FIG. 8, for example. Be seen.

【0007】すなわち、まず同図(a) にて半球ドーム状
の第2室C1を成形されたシートC に例えば接点潤滑油等
の粘性を有する流体D が適量注がれる。次いで同図(b)
に示すように、シートC が貫通孔A1の一端部を覆って第
2室C1を形成するよう基板Aの一方面に超音波溶接等で
周りを気密接合され、また半球ドーム状の第1室B1を成
形されたシートB に流体D を適量注いで準備される。次
いで、同図(c) に示すように、シートB が貫通孔A1の他
端部を覆って第1室B1を形成するよう基板A の他方面に
やはり超音波溶接等で周りを気密接合される。このと
き、シートB は半球ドーム状の開口側が下方になるが、
流体D が粘性を有するので垂れ落ちることはない。ま
た、流体D は、上記したように、一方の室を押圧される
と貫通孔A1を通って他方の室に移動し得るようにするた
めに第1室B1及び第2室C1の全容積よりも少なく注いで
あり、よって残余の容積に存在する余分な空気を押し出
しながら薄肉のためハンドリングし難いシートB を基板
A の他方面に気密接合する必要があって面倒であり、さ
らには接合済のシートC を破損する危険性もある。この
ように面倒な作業を経て同図(d) のダンパーが組み立て
られる。
That is, first, an appropriate amount of fluid D having a viscosity such as contact lubricating oil is poured into a sheet C formed by forming a second chamber C 1 having a hemispherical dome shape in FIG. Then the same figure (b)
As shown in FIG. 5, the sheet C is airtightly joined to one surface of the substrate A by ultrasonic welding or the like so as to cover one end of the through hole A 1 to form the second chamber C 1, and the hemispherical dome-shaped first One chamber B 1 is prepared by pouring an appropriate amount of fluid D into a molded sheet B. Then, the airtight around the as shown in FIG. (C), the sheet B is the other side to also ultrasonic welding or the like of the substrate A to form a first chamber B 1 over the other end of the through hole A 1 To be joined. At this time, the seat B has a hemispherical dome-shaped opening facing downward,
The fluid D is viscous and will not drip. In addition, as described above, the fluid D flows into the first chamber B 1 and the second chamber C 1 so as to be able to move to the other chamber through the through hole A 1 when pressed in one chamber. Sheet B, which is poured less than the total volume, makes it difficult to handle due to its thin wall while pushing out the excess air that exists in the remaining volume.
Since it is necessary to hermetically bond the other side of A, it is troublesome, and there is also a risk of damaging the bonded sheet C. The damper shown in Fig. 3 (d) is assembled through such troublesome work.

【0008】本発明は、上記事由に鑑みてなしたもの
で、その目的とするところは、組立作業がやり易いダン
パーを提供することにある。
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a damper that is easy to assemble.

【0009】[0009]

【課題を解決するための手段】上記した課題を解決する
ために、本発明のダンパーは、貫通孔を形成された基板
と、貫通孔の両端部を覆って基板の両面に室をそれぞれ
形成したシートと、一方の室を押圧されると基板の貫通
孔を通って他方の室に移動し得るよう気密封入された流
体と、を備えたダンパーにおいて、前記基板は、板厚方
向に分割された複数枚のそれぞれが、貫通孔を連通して
気密接合されてなる構成にしてある。
In order to solve the above problems, the damper of the present invention has a substrate having a through hole and chambers formed on both sides of the substrate to cover both ends of the through hole. In a damper comprising a sheet and a fluid that is hermetically sealed so as to be able to move to the other chamber through a through hole of the substrate when pressed in one chamber, the substrate is divided in the plate thickness direction. Each of the plurality of sheets is configured to be airtightly joined through the through holes.

【0010】[0010]

【作用】本発明のダンパーによれば、基板は、板厚方向
に分割された複数枚の内、その2枚を使用して、それぞ
れの一方面に適量の流体を注いだ室を形成されたシート
をすでに気密接合したものとして別々に準備でき、よっ
て従来例と違って剛性を有してハンドリングし易い2枚
の基板を、例えば真空中に保持して脱気しながら貫通孔
を連通して基板の他方面同士を気密接合するだけでよ
く、組立作業がやり易くなる。
According to the damper of the present invention, the substrate is formed with a chamber into which an appropriate amount of fluid is poured, on one surface of each of two of the plurality of substrates divided in the plate thickness direction. The sheets can be prepared separately as already airtightly joined, and thus two substrates that have rigidity and are easy to handle unlike the conventional example are held in, for example, vacuum and the through holes are communicated while degassing. Since it is only necessary to hermetically bond the other surfaces of the substrates to each other, the assembling work becomes easy.

【0011】[0011]

【実施例】本発明の一実施例を図1乃至図5に基づいて
以下に説明する。このダンパー10は、基板1 、シート2,
3 、流体4 からなっている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIGS. This damper 10 consists of board 1, seat 2,
It consists of 3 and fluid 4.

【0012】基板1 は、第1基板11及び第2基板12から
なっており、樹脂材料により、それぞれ中央に貫通孔11
a,12a を有して四角の平板状に形成されており、つま
り、板厚方向に2分割された第1基板11及び第2基板12
をそれぞれの貫通孔11a,12a を連通して気密接合された
状態になっている。
The substrate 1 is composed of a first substrate 11 and a second substrate 12, and is made of a resin material and has a through hole 11 in the center thereof.
The first substrate 11 and the second substrate 12 are formed in a square flat plate shape having a and 12a, that is, divided into two in the plate thickness direction.
And the through holes 11a and 12a are communicated with each other to be airtightly joined.

【0013】シート2,3 は、例えば厚さ25μmのポリ
アミド樹脂からなり、それぞれ半球ドーム状の第1室2a
及び第2室3aを有して形成されている。そして、貫通孔
11a及び12a の両端部を覆って基板1 の両面に第1室2a
及び第2室3aをそれぞれ形成して気密接合されている。
The sheets 2 and 3 are made of, for example, a polyamide resin having a thickness of 25 μm, and each has a hemispherical dome-shaped first chamber 2a.
And the second chamber 3a. And through hole
The first chamber 2a is provided on both sides of the substrate 1 so as to cover both ends of 11a and 12a.
And the second chamber 3a are respectively formed and airtightly joined.

【0014】流体4 は、例えば接点潤滑油等の粘性を有
し、第1室2a及び第2室3aの一方の室を押圧されると貫
通孔11a,12a を通って他方の室に移動し得るよう封入さ
れている。
The fluid 4 has a viscosity such as contact lubricating oil, and when one of the first chamber 2a and the second chamber 3a is pressed, it moves through the through holes 11a and 12a to the other chamber. Enclosed to get.

【0015】そして、このダンパー10は以下のようにし
て組み立てられる。まず、図3(a)に示すように、シー
ト2,3 の第1室2a及び第2室3aに流体4 が適量注がれ
る。このとき、流体4 は、一方の室を押圧されると貫通
孔を通って他方の室に移動し得るようにするために第1
室2a及び第2室3aの全容積よりも少なく注いである。そ
して図3(b) に示すように、貫通孔11a 及び12a の一端
部を覆って第1室2a及び第2室3aがそれぞれ形成される
よう第1基板11及び第2基板12の一方面に超音波溶接に
より気密接合される。
The damper 10 is assembled as follows. First, as shown in FIG. 3 (a), an appropriate amount of fluid 4 is poured into the first chamber 2a and the second chamber 3a of the sheets 2 and 3. At this time, the fluid 4 is moved to the other chamber through the through hole when being pressed in the one chamber.
Pouring less than the total volume of the chamber 2a and the second chamber 3a. Then, as shown in FIG. 3 (b), one surface of the first substrate 11 and the second substrate 12 is formed so that the first chamber 2a and the second chamber 3a are formed so as to cover one ends of the through holes 11a and 12a, respectively. It is airtightly joined by ultrasonic welding.

【0016】次いで、上記の第1基板11及び第2基板12
は、剛性を有するためハンドリングして図3(c) に示す
ように他方面同士が対向するよう真空槽13中に保持され
る。そうすると、第1室2a及び第2室3aの全容積よりも
流体4 を少なく注いであるために残余の容積に存在する
余分な空気が脱気され、その状態で貫通孔11a 及び12a
が連通するよう他方面同士を合わせて超音波溶接等によ
り気密接合され、図3(d) のダンパー10が組み立てられ
る。
Next, the above-mentioned first substrate 11 and second substrate 12
Since it has rigidity, it is handled and held in the vacuum chamber 13 so that the other surfaces face each other as shown in FIG. 3 (c). Then, since the fluid 4 is poured in less than the total volume of the first chamber 2a and the second chamber 3a, excess air existing in the remaining volume is deaerated, and in that state, the through holes 11a and 12a.
So that they communicate with each other, the other surfaces are joined together and airtightly joined by ultrasonic welding or the like to assemble the damper 10 of FIG. 3 (d).

【0017】このダンパー10を使用したリレーを図4に
基づいて説明する。このものは、ベース59にヨーク71を
固定し、固定鉄芯73上にコイル枠74にカード81を支持し
ている。
A relay using the damper 10 will be described with reference to FIG. In this device, a yoke 71 is fixed to a base 59, and a card 81 is supported by a coil frame 74 on a fixed iron core 73.

【0018】まずベース59は、中央の鉄芯載置部94の一
方側に仕切り壁61を立設し、その外側に主接点ブロック
62が配置される。すなわち、端子付固定接点板52を端子
孔64b に固定するとともに、可動接点板51の基端部を固
定した端子55を端子孔64a に固定している。53は可動接
点、54,58 は磁性体、56は編組導体、57は固定接点であ
る。また、鉄芯載置部94の他方側に補助接点ブロック63
を配置している。すなわち、段部95に補助用の端子付固
定接点板65及び可動接点板68の基端部を固定した端子69
をそれぞれ端子孔64c,64d に貫着している。66は固定接
点、67は可動接点である。
First, in the base 59, a partition wall 61 is erected on one side of the center iron core mounting portion 94, and the main contact block is provided outside the partition wall 61.
62 is placed. That is, the fixed contact plate with terminal 52 is fixed to the terminal hole 64b, and the terminal 55 to which the base end of the movable contact plate 51 is fixed is fixed to the terminal hole 64a. 53 is a movable contact, 54 and 58 are magnetic materials, 56 is a braided conductor, and 57 is a fixed contact. Further, the auxiliary contact block 63 is provided on the other side of the iron core mounting portion 94.
Are arranged. That is, the terminal 69 in which the base end portions of the auxiliary fixed contact plate 65 with terminals and the movable contact plate 68 are fixed to the step 95
To the terminal holes 64c and 64d, respectively. 66 is a fixed contact and 67 is a movable contact.

【0019】ヨーク71は、鉄芯載置部94に載置される平
板部71b と、平板部71b の一端より垂直に折曲された連
結片71a と、平板部71b の他端の両側より同方向に折曲
された一対のヨーク片72と、連結片71a の中央孔に基端
73a が連結され先端75が一対のヨーク片72の間に位置す
る固定鉄芯73とからなる。
The yoke 71 includes a flat plate portion 71b mounted on the iron core mounting portion 94, a connecting piece 71a vertically bent from one end of the flat plate portion 71b, and a flat plate portion 71b from both ends of the other end of the flat plate portion 71b. A pair of yoke pieces 72 bent in the direction and the base end in the central hole of the connecting piece 71a.
73a are connected to each other, and the tip end 75 is composed of a fixed iron core 73 positioned between a pair of yoke pieces 72.

【0020】そして、上述したダンパー10が、図5に示
すように、固定鉄芯73の先端75に固着され、このとき第
1室2a及び第2室3aは固定鉄芯73の板厚方向両面から所
定寸法突出し得るようになっている。
Then, the above-mentioned damper 10 is fixed to the tip 75 of the fixed iron core 73 as shown in FIG. 5, and at this time, the first chamber 2a and the second chamber 3a are both sides of the fixed iron core 73 in the plate thickness direction. It is designed to be able to project from the above by a predetermined size.

【0021】また、ヨーク71の平板部71b 上にコイルブ
ロック60のコイル枠74を設置し、固定鉄芯73をコイル枠
74に貫通し、その基端部73a を連結片71a の中央孔に連
結している。コイル枠74は外周にコイル76を巻装すると
ともに、コイル枠74の一方のフランジ77にはコモン及び
一対のコイル端子78を有するとともにフランジ77の凸部
77a に軸孔79を形成している。
The coil frame 74 of the coil block 60 is installed on the flat plate portion 71b of the yoke 71, and the fixed iron core 73 is attached to the coil frame.
It penetrates through 74, and the base end portion 73a is connected to the central hole of the connecting piece 71a. The coil frame 74 has a coil 76 wound around the outer periphery thereof, and one flange 77 of the coil frame 74 has a common and a pair of coil terminals 78, and a convex portion of the flange 77.
A shaft hole 79 is formed in 77a.

【0022】カードブロック80のカード81の一端の軸84
をコイル枠74の軸孔79に回動自在に嵌合してカード81を
支持し、カード81の他端部に固定鉄芯73の先端75とヨー
ク片72との間に位置する一対の接極子82を設けるととも
に、接極子82の間に永久磁石83を介在している。また、
カード81の両側部に可動接点板51の係合部85及び補助の
可動接点板68を押圧する突起89を設けている。90はカバ
ーである。なお、ダンパー10は一対の接極子82の間に位
置している。
The shaft 84 at one end of the card 81 of the card block 80
Is rotatably fitted in the shaft hole 79 of the coil frame 74 to support the card 81, and the other end of the card 81 is provided with a pair of contact points located between the tip 75 of the fixed iron core 73 and the yoke piece 72. The pole 82 is provided, and the permanent magnet 83 is interposed between the armatures 82. Also,
Protrusions 89 that press the engaging portion 85 of the movable contact plate 51 and the auxiliary movable contact plate 68 are provided on both sides of the card 81. 90 is a cover. The damper 10 is located between the pair of armatures 82.

【0023】このリレーは、コイル端子78を通してコイ
ル76を通電すると、固定鉄芯73を通してヨーク71に磁束
が流れ、固定鉄芯73の先端75とヨーク片72とが異磁極を
もち、その間の接極子82の永久磁石83による磁極と吸引
力が作用して、一対の接極子82がコイル76への通電方向
により、交互に固定鉄芯73の先端75に吸引され、ダンパ
ー10を介して衝突する。この動作により、カード81が軸
84を中心に回動し、可動接点板51,68 が開閉動作する。
In this relay, when the coil 76 is energized through the coil terminal 78, a magnetic flux flows through the fixed iron core 73 to the yoke 71, and the tip 75 of the fixed iron core 73 and the yoke piece 72 have different magnetic poles, and the contact between them. A magnetic pole and a suction force of the permanent magnet 83 of the pole 82 act, and the pair of armatures 82 are alternately attracted to the tip 75 of the fixed iron core 73 by the direction of the current flowing to the coil 76 and collide with each other via the damper 10. . This action causes the card 81 to
The movable contact plates 51 and 68 open and close by rotating around 84.

【0024】このダンパー10の動作状態を図5により説
明する。同図(a) は一対の接極子82の一方片が固定鉄芯
73の先端75に吸引保持されている状態であり、ここで上
記したようにコイル76を通電すると、同図(b) に示すよ
うに、一対の接極子82の他方片がダンパー10の第2室3a
に衝突して押圧し、第2室3a内の流体4 が連通する貫通
孔12a 及び11a を通って第1室2aに移動する。そうする
と、一対の接極子82は、粘性を有する流体4 の移動時に
生じる抵抗によって移動速度が低減され、同図(c) に示
すように、他方片が固定鉄芯73の先端75に衝突するとき
の衝撃が緩和される。また、コイル76を反対方向に通電
すると、上記と逆に動作して同図(a) の状態に戻るが、
この際もやはりダンパー10により移動速度が低減され衝
撃が緩和される。
The operating state of the damper 10 will be described with reference to FIG. In the figure (a), one of the pair of armatures 82 has a fixed iron core.
When the coil 76 is energized as described above, the other end of the pair of armatures 82 is the second end of the damper 10 as shown in FIG. Chamber 3a
The fluid 4 in the second chamber 3a moves to the first chamber 2a through the through holes 12a and 11a communicating with the first chamber 2a. Then, the moving speed of the pair of armatures 82 is reduced by the resistance generated when the viscous fluid 4 moves, and when the other piece collides with the tip 75 of the fixed iron core 73, as shown in FIG. The impact of is mitigated. Also, when the coil 76 is energized in the opposite direction, it operates in the opposite manner and returns to the state of FIG.
Also at this time, the damper 10 also reduces the moving speed to reduce the impact.

【0025】かかるダンパー10にあっては、上述したよ
うに、接極子82が固定鉄芯73の先端75に衝突するときの
衝撃が緩和されて、そのとき発生する衝突音が低減でき
るとともに、基板1 は、板厚方向に2分割された第1基
板11及び第2基板12からなっているから、それぞれの一
方面に適量の流体4 を注いだ第1室2a及び第2室3aを形
成されたシート2,3 をすでに気密接合したものとして別
々に準備でき、よって従来例と違って剛性を有してハン
ドリングし易い2枚の第1基板11及び第2基板12を、真
空槽13中に保持して脱気しながら貫通孔11a 及び12a を
連通して基板の他方面同士を気密接合するだけでよく、
しかもシート2,3 は基板に接合済であって破損する危険
性もなく、組立作業がやり易くなる。
In the damper 10, as described above, the impact when the armature 82 collides with the tip 75 of the fixed iron core 73 is alleviated, and the collision noise generated at that time can be reduced, and at the same time, the board Since 1 is composed of a first substrate 11 and a second substrate 12 which are divided into two in the plate thickness direction, a first chamber 2a and a second chamber 3a into which an appropriate amount of fluid 4 has been poured are formed on one surface of each. The sheets 2 and 3 can be separately prepared as already air-tightly joined, and thus the two first and second substrates 11 and 12 which have rigidity and are easy to handle unlike the conventional example are placed in the vacuum chamber 13. While holding and deaerating, it is sufficient to communicate the through holes 11a and 12a to hermetically bond the other surfaces of the substrates together,
Moreover, the sheets 2 and 3 are already bonded to the substrate and there is no risk of damage, and the assembly work is facilitated.

【0026】なお、本実施例では、基板1 は、板厚方向
に2分割して第1基板11及び第2基板12からなっている
が、これに限ることなく、例えば3分割して中央に第3
基板を追加し、その貫通孔の径を第1基板11及び第2基
板12の貫通孔11a 及び12a よりも小さくすれば、第3基
板により流体4 の流速を制御でき、よって、第1基板11
及び第2基板12の貫通孔11a 及び12a の径はもっと大き
くできることになるので、シート2,3 を第1基板11及び
第2基板12に気密接合した後に、その大きくなった貫通
孔11a 及び12a から流体4 を第1室2a及び第2室3aへ注
ぐことができ、また真空槽13中における脱気も広い開口
孔からより効率よく行うことができ、さらに組立作業が
やり易くなる。
In the present embodiment, the substrate 1 is divided into two parts in the plate thickness direction and is composed of the first substrate 11 and the second substrate 12. Third
If a substrate is added and the diameter of the through hole is made smaller than the through holes 11a and 12a of the first substrate 11 and the second substrate 12, the flow rate of the fluid 4 can be controlled by the third substrate.
Since the diameters of the through holes 11a and 12a of the second substrate 12 can be further increased, after the sheets 2 and 3 are airtightly bonded to the first substrate 11 and the second substrate 12, the increased through holes 11a and 12a are formed. From this, the fluid 4 can be poured into the first chamber 2a and the second chamber 3a, and deaeration in the vacuum chamber 13 can be performed more efficiently from the wide opening hole, and the assembling work becomes easier.

【0027】[0027]

【発明の効果】本発明のダンパーによれば、基板は、板
厚方向に分割された複数枚の内、その2枚を使用して、
それぞれの一方面に適量の流体を注いだ室を形成された
シートをすでに気密接合したものとして別々に準備で
き、よって従来例と違って剛性を有してハンドリングし
易い2枚の基板を、例えば真空中に保持して脱気しなが
ら貫通孔を連通して基板の他方面同士を気密接合するだ
けでよく、組立作業がやり易くなる。
According to the damper of the present invention, two of the plurality of substrates divided in the plate thickness direction are used,
Sheets having a chamber in which an appropriate amount of fluid has been poured on one side thereof can be separately prepared as already airtightly joined, and thus two substrates having rigidity and easy to handle unlike the conventional example All that is required is to keep the vacuum state and deaeration, and communicate the through holes so that the other surfaces of the substrates are airtightly joined together, which facilitates the assembly work.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例を示す正面断面図である。FIG. 1 is a front sectional view showing an embodiment of the present invention.

【図2】同上の平面図である。FIG. 2 is a plan view of the above.

【図3】同上の組立手順を示す部分正面断面図である。FIG. 3 is a partial front sectional view showing the assembling procedure of the above.

【図4】同上のダンパーをリレーに使用した状態を示す
分解斜視図である。
FIG. 4 is an exploded perspective view showing a state in which the above damper is used for a relay.

【図5】図4においてダンパーの動作状態を示す部分正
面断面図である。
5 is a partial front sectional view showing an operating state of the damper in FIG.

【図6】従来例を示す正面断面図である。FIG. 6 is a front sectional view showing a conventional example.

【図7】同上の平面図である。FIG. 7 is a plan view of the above.

【図8】同上の組立手順を示す部分正面断面図である。FIG. 8 is a partial front sectional view showing the assembling procedure of the above.

【符号の説明】[Explanation of symbols]

1 基板 2 シート 2a 第1室 3 シート 3a 第2室 10 ダンパー 11 第1基板 11a 貫通孔 12 第2基板 12a 貫通孔 4 流体 1 substrate 2 sheet 2a first chamber 3 sheet 3a second chamber 10 damper 11 first substrate 11a through hole 12 second substrate 12a through hole 4 fluid

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 貫通孔を形成された基板と、貫通孔の両
端部を覆って基板の両面に室をそれぞれ形成したシート
と、一方の室を押圧されると基板の貫通孔を通って他方
の室に移動し得るよう気密封入された流体と、を備えた
ダンパーにおいて、 前記基板は、板厚方向に分割された複数枚のそれぞれ
が、貫通孔を連通して気密接合されてなることを特徴と
するダンパー。
1. A substrate having a through hole, a sheet having both ends of the through hole formed with chambers on both sides of the substrate, and when one of the chambers is pressed through the through hole of the substrate to the other. And a fluid that is hermetically sealed so that it can be moved to the chamber of the substrate, wherein the substrate is formed by air-tightly joining each of a plurality of sheets divided in the plate thickness direction through the through holes. The characteristic damper.
JP3317593A 1993-02-23 1993-02-23 Damper Pending JPH06251683A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3317593A JPH06251683A (en) 1993-02-23 1993-02-23 Damper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3317593A JPH06251683A (en) 1993-02-23 1993-02-23 Damper

Publications (1)

Publication Number Publication Date
JPH06251683A true JPH06251683A (en) 1994-09-09

Family

ID=12379189

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3317593A Pending JPH06251683A (en) 1993-02-23 1993-02-23 Damper

Country Status (1)

Country Link
JP (1) JPH06251683A (en)

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