JP4059202B2 - Micro relay - Google Patents

Description

  The present invention relates to a microrelay in which at least some components are formed using a semiconductor microfabrication technique.

  Conventionally, as a small relay, a micro relay in which at least a part of components is formed by a semiconductor micromachining technique has been proposed. As the micro relay, in addition to an electrostatic driving type using a Coulomb force as a driving force for opening and closing a contact device, an electromagnetic driving type using an electromagnetic device and a magnetic force is known. The electromagnetically driven microrelay has a feature that a large driving force can be obtained with the same volume as compared with the electrostatically driven type (see, for example, Patent Document 1).

As described above, electromagnetically driven microrelays can provide a large driving force with the same volume compared to electrostatically driven microrelays, so that a large contact pressure can be obtained and impact resistance can be improved. Can be relatively high. In addition, since the armature stroke can be increased, the distance between the movable contact and the stationary contact can be increased when the contact device is opened, and signal leakage during opening is reduced, resulting in relatively high frequency characteristics. Can be high.
Japanese Patent Laid-Open No. 5-114347

  By the way, in the microrelay described in Patent Document 1 described above, no means for restricting the movement of the amateur is provided, so that the armature moves when the armature plate provided in the amateur comes into contact with the electromagnet device. Will be regulated. That is, the amateur stroke is determined only by the positional relationship between the electromagnet device and the amateur, and there is a problem that the amateur stroke cannot be managed with high accuracy.

  The present invention has been made in view of the above reasons, and an object of the present invention is to provide a microrelay that can easily manage the stroke of an amateur and can be easily manufactured.

According to the first aspect of the present invention, there is provided an electromagnet device that includes a yoke around which a coil is wound and is housed in a case, and a frame-like frame that is fixed to the case, and is integral with the frame and disposed inside the frame. An armature block having an armature that operates in a seesaw manner around a specified fulcrum by a magnetic force acting between the armature, a fixed contact provided at a fixed position of the case, and a movable contact that is separated from the fixed contact by movement of the end of the armature And a contact device that opens and closes by an amateur seesaw operation. The armature is composed of a movable substrate made of a semiconductor material formed integrally with the frame, and an electromagnetic device laminated on at least one surface in the thickness direction of the movable substrate. An armature plate made of a magnetic material that exerts a magnetic force in between, and both ends of the seesaw operation of an amateur that is continuously integrated with a movable substrate A fulcrum projection that protrudes to one surface side in the thickness direction of the movable substrate at the intermediate portion in the longitudinal direction of the movable substrate, which is the connecting direction, and the tip contacts the specified position of the case, and serves as a fulcrum for amateur seesaw operation, The both ends of the movable substrate in the longitudinal direction of the movable substrate protrude toward the one surface in the thickness direction of the movable substrate, and when the amateur moves by a seesaw operation, the tip of the amateur contacts the specified position of the case. A stopper projection for restricting the movement range; a movable contact base that is arranged in parallel with the movable substrate and protrudes toward the one surface in the thickness direction of the movable substrate; and a movable contact is provided on the tip surface; and the movable substrate and the movable contact base. And a contact pressure spring that continuously and integrally connects the surface of the movable contact base with the movable contact on the tip of the fulcrum protrusion and stopper protrusion. Characterized in that located on one plane.

  According to this configuration, the fulcrum protrusion serving as the fulcrum of the seesaw operation of the amateur and the stopper protrusion that restricts the movement range of the amateur when the amateur moves are integrally integrated with the movable substrate and on one side in the thickness direction of the movable substrate. Therefore, the armature stroke can be managed with high accuracy by controlling the dimensions of the fulcrum protrusion and the stopper protrusion protruding from the movable substrate. In addition, since the fulcrum protrusion and the stopper protrusion are continuously formed integrally with the movable substrate by the semiconductor material, it is possible to adopt a semiconductor precision processing technique, and as a result, it is possible to perform highly accurate processing while reducing the size. Furthermore, since the front end surfaces of the fulcrum protrusion and the stopper protrusion are located on one plane, the fulcrum protrusion and the stopper protrusion can be processed simultaneously and under the same conditions, and the manufacture becomes easy.

In addition, the movable contact base can be processed simultaneously and under the same conditions as the fulcrum protrusion and the stopper protrusion, making it possible to easily manufacture the movable contact base while forming it integrally with the amateur. Become.

According to a second aspect of the present invention, in the first aspect of the invention, the movable contact base is farther from the fulcrum protrusion than a portion of the armature plate that receives the magnetic force from the electromagnet device in the longitudinal direction of the movable substrate. It is characterized by that.

  According to this configuration, when the amateur performs a seesaw operation by receiving the magnetic force from the electromagnet device, the amount of movement of the movable contact is larger than the end of the armature in the longitudinal direction. However, it becomes easy to secure the contact pressure of the movable contact.

According to a third aspect of the present invention, in the first or second aspect of the present invention, the stopper protrusion is located between the fulcrum protrusion and the movable contact base in the longitudinal direction of the movable substrate. .

  According to this configuration, when the armature performs a seesaw operation by receiving the magnetic force from the electromagnet device, the moving amount of the movable contact is larger than the moving amount of the stopper projection, so that the movable contact is brought into contact with the fixed contact. It is easy to realize the operation of restricting the movement of the amateur by the stopper projection. For example, even if the surface facing the tip of the stopper projection on the base substrate and the surface facing the movable contact on the fixed contact are provided on the same plane, the armature is moved by the stopper projection after the movable contact contacts the fixed contact. Is regulated.

According to the configuration of the present invention, the fulcrum protrusion serving as a fulcrum for the seesaw operation of the amateur and the stopper protrusion for restricting the movement range of the amateur when the amateur moves are integrally integrated with the movable substrate in the thickness direction of the movable substrate. Since the projection is provided on the one surface side, there is an advantage that the stroke of the amateur can be accurately managed by managing the dimension in which the fulcrum projection and the stopper projection protrude from the movable substrate. Moreover, since the fulcrum protrusion and the stopper protrusion are continuously formed integrally with the movable substrate by the semiconductor material, it is possible to adopt a semiconductor precision processing technique, and as a result, it is possible to perform highly accurate processing while reducing the size. The effect can be expected. Furthermore, since the tip surfaces of the fulcrum protrusion and the stopper protrusion are located on one plane, it is possible to process the fulcrum protrusion and the stopper protrusion at the same time and under the same conditions, and there is an advantage that manufacture is easy. . In addition, the movable contact base can be processed simultaneously and under the same conditions as the fulcrum protrusion and the stopper protrusion, making it possible to easily manufacture the movable contact base while forming it integrally with the amateur. Become.

  As shown in FIG. 2, the micro relay of the present embodiment has a rectangular parallelepiped case A, and an electromagnet device 2 in which two coils 22 are wound around a U-shaped yoke 20 opened upward; An armature block 3 having a rectangular plate-like armature 30 that performs a seesaw operation by a magnetic force acting with the electromagnet device 2, a fixed contact 14 provided at a fixed position of the case A, and a movable contact provided at an end of the armature 30 And a contact device that opens and closes by an amateur seesaw operation.

  The case A includes a rectangular base plate 1, a rectangular frame 31 that is a part of the armature block 3 and surrounds the entire circumference of the amateur 30, and the base substrate 1 stacked on the base substrate 1 via the frame 31. 1 and the cover 4 that forms a space in which the amateur 30 performs a seesaw operation. That is, the frame 31 is fixed to the case A. Further, in order to secure a space for the amateur 30 to perform a seesaw operation, the cover 4 has an operation recess 4a as shown in FIG. The base substrate 1 and the cover 4 are formed using heat-resistant glass such as Pyrex (registered trademark), and the amateur block 3 is formed using a semiconductor substrate made of single crystal silicon. Accordingly, the bonding metal thin films 15, 38a, 38b, and 42 (see FIGS. 2, 6, and 8) are formed on the opposing surfaces of the base substrate 1, the frame 31, and the cover 4, respectively. , 38a, 38b, 42 are bonded together. The bonding metal thin films 15, 38a, 38b, and 42 will be described later. The base substrate 1, the frame 31, and the cover 4 are formed in a rectangular shape having substantially the same outer peripheral shape, and are formed in a rectangular parallelepiped shape by being joined to each other.

  As shown in FIG. 4, the base substrate 1 has a cross shape in plan view and has a storage hole 16 that penetrates in the thickness direction of the base substrate 1 in the center, and opens in a circular shape and penetrates in the thickness direction of the base substrate 1 Through holes 10 are provided at the four corners. In addition, circular lands 12 (see FIGS. 3 and 4) are formed on the opening peripheral portions of the through holes 10 on both surfaces in the thickness direction of the base substrate 1. Two lands 12 formed on both surfaces of the base substrate 1 in the thickness direction of one through hole 10 are electrically connected through a conductive layer deposited on the inner peripheral surface of the through hole 10. On the surface that does not face the cover 4 in the thickness direction of the base substrate 1, the bump 13 is fixed to each land 12, and the opening surface of the through hole 10 is blocked by the bump 13. At both ends in the longitudinal direction of one surface facing the cover 4 in the thickness direction of the base substrate 1, it is extended in the longitudinal direction of the base substrate 1 to a portion between each pair of through holes 10 aligned in the width direction of the base substrate 1. Each pair of fixed contacts 14 is formed. Each land 12 is connected to one end in the longitudinal direction of each fixed contact 14 via a conductive pattern 18, and each bump 13 is connected to each fixed contact 14 on a one-to-one basis. Further, on this one surface of the base substrate 1, the opening surface of the through hole 10 is closed by a silicon thin plate cover plate 19 covering the land 12. That is, each opening surface of the through hole 10 is closed by the bump 13 and the cover plate 19. Here, the conductive material forming the conductive layer deposited on the inner peripheral surface of the through hole 10 and the land 12, the fixed contact 14, and the conductive pattern 18 are, for example, Cu, Cr, Ti, Pt, Co, Ni , Au, or an alloy thereof. The conductive material forming the bumps 13 is selected from, for example, Au, Ag, Cu, and solder.

  The through hole 10 and the storage hole 16 are formed by a method selected from, for example, a sand blasting method and an etching method, and the conductive layer is formed by a method selected from, for example, a plating method, a vapor deposition method, and a sputtering method. .

  Incidentally, a cover plate 17 made of a thin silicon plate and closing the accommodation hole 16 is fixed to one surface facing the cover 4 in the thickness direction of the base substrate 1. A space surrounded by the inner peripheral surface of the storage hole 16 and the cover plate 17 is a storage chamber for storing the electromagnet device 2. After the electromagnet device 2 is stored in the storage chamber, the storage chamber is filled with resin by potting or the like. The electromagnet device 2 is protected and fixed. As the resin filled in the storage hole 16, it is desirable to use a silicon resin that has elasticity even after curing. The inner peripheral surface of the storage hole 16 is formed in a tapered shape that increases the opening area from one opening surface closed by the cover plate 17 toward the other opening surface, and one opening closed by the cover plate 17. Although the opening area of the surface is relatively small, the insertion operation of the electromagnet device 2 from the other opening surface is facilitated. That is, since it is necessary to form the fixed contact 14 and the conductive pattern 18 in addition to the land 12 on the one opening surface around the storage hole 16, the smaller the opening area of the storage hole 16, the fixed contact 14 and the conductive pattern 18. Can be afforded, resulting in miniaturization.

  As the cover plates 17 and 19, a silicon thin plate formed by thinning a silicon substrate by etching or polishing is used, and the thickness dimension is set to 20 μm, for example. Note that the thickness dimension of the lid plate 17 is not limited to 20 μm, and is appropriately set within a range of about 5 μm to 50 μm. Further, as the cover plates 17 and 19, a glass thin plate formed by thinning a glass substrate by etching or polishing instead of the silicon thin plate may be used.

  As shown in FIGS. 2 and 5, the electromagnet device 2 has leg pieces 20 b at both ends in the longitudinal direction of a rectangular plate-like coil winding piece 20 a around which two coils 22 (see FIG. 2) are wound. An extended U-shaped yoke 20 is provided. The coil winding piece 20a and the leg piece 20b are formed in a rectangular cross section. Each coil 22 is wound directly on each end in the longitudinal direction of the coil winding piece 20a without using a coil bobbin. Further, a rectangular parallelepiped permanent magnet 21 is disposed between the coils 22 in the central portion of the coil winding piece 20a in the longitudinal direction. Each coil 22 is restricted from moving in the longitudinal direction of the coil winding piece 20 a by the permanent magnet 21 and the leg piece 20 b of the yoke 20.

  The permanent magnet 21 is magnetized in the vertical direction of FIG. 5, and the lower magnetic pole of the permanent magnet 21 is magnetically coupled to the coil winding piece 20a. The upper end surface of the permanent magnet 21 has the same height as the upper end surface of the leg piece 20b, and the electromagnet device 2 is placed in the storage chamber (the upper chamber of the leg piece 20b in contact with the lid plate 17). When stored in the storage hole 16), one end surface (the upper end surface in FIG. 5) of the permanent magnet 21 also comes into contact with the lid plate 17.

  A connection board 23 made of a printed circuit board is disposed on the opposite side of the permanent magnet 21 via the coil winding piece 20a, and the connection board 23 is fixed to the coil winding piece 20a. The connection substrate 23 has a rectangular plate shape, and the longitudinal direction of the connection substrate 23 is orthogonal to the longitudinal direction of the coil winding piece 20a. As shown in FIG. 3, the connection substrate 23 is formed by forming independent conductor patterns 23b at both ends in the longitudinal direction on one surface of the insulating substrate 23a. An external circuit is formed on a circular portion of each conductor pattern 23b. And the end of the coil 22 is connected to the rectangular portion. A bump 24 made of a material selected from Au, Ag, Cu, and solder is fixed to a portion to which an external circuit is connected.

  The two coils 22 described above are connected to a rectangular portion of the conductor pattern 23b provided on the connection substrate 23 and connected in series or in parallel. In other words, if one of the two coils 22 is energized, the other is also energized, and the two coils 22 are connected so that the tip surfaces of both leg pieces 20b of the yoke 20 are excited to have different polarities. Therefore, the magnetic flux generated in one coil 22 is the same as the magnetic flux generated in the permanent magnet 21, and the magnetic flux generated in the other coil 22 is reversed. The magnetic flux density increases around, and the magnetic flux density decreases around the tip surface of the other leg piece 20b. In which leg piece 20b the magnetic flux density is increased is selected according to the direction of the current flowing through the coil 22.

  In the above example, the bumps 24 are fixed to the conductor pattern 23b of the connection substrate 23. However, electrode pads for connecting bonding wires may be provided in place of the bumps 24. The yoke 20 is formed by bending a soft magnetic material plate such as electromagnetic soft iron, casting a soft magnetic material, or pressing.

  The amateur block 3 is formed by processing a semiconductor substrate made of a silicon substrate of single crystal silicon by a semiconductor microfabrication technique. As shown in FIGS. 6 and 7, the inside of a frame 31 having a rectangular frame shape is formed. A rectangular plate-shaped amateur 30 is arranged on the top. As shown in FIGS. 1, 6, and 7, the amateur 30 has a movable substrate 30 a formed from a semiconductor substrate and a surface facing the cover plate 17 provided on the base substrate 1 in the thickness direction of the movable substrate 30 a. The armature plate 30b is made of a magnetic material that is laminated and generates a magnetic force with the electromagnet device 2. The material of the armature plate 30b is Fe, Co, Ni, an alloy thereof, or a material obtained by adding a small amount of Si, Mo, V, or the like to these materials, for example, soft iron, electromagnetic stainless steel, permalloy, 42 alloy, It is selected from permendur. The armature plate 30b can be formed by etching or plating in addition to machining. The frame 31 and the movable substrate 30a are integrally connected by four support springs 32. The support spring 32 will be described later.

  Protruding pieces 33 and 36 are projected from both ends of each side edge and the center of each side edge along the longitudinal direction of the movable substrate 30a. Each protruding piece 33 is provided with a tapered truncated pyramid-shaped stopper protrusion 33a on the surface facing the cover plate 17, and each protruding piece 36 is tapered on the surface facing the cover plate 17. A truncated pyramid-shaped fulcrum projection 36b is provided. The tip of the fulcrum protrusion 36b always abuts against the lid plate 17 and has a function of defining a fulcrum when the armature 30 performs a seesaw operation. Further, the tip of the stopper projection 33a has a function of regulating the movement range of the armature 30 when the tip abuts against the base substrate 1 or a member fixed to the base substrate 1 when the armature 30 performs a seesaw operation. Therefore, the stroke of the armature 30 can be managed with high accuracy by managing the dimensions at which the fulcrum projection 36a and the stopper projection 33a protrude from the movable substrate 30a. Since the amateur block 3 is formed by applying a semiconductor microfabrication technology to a semiconductor substrate, it is easy to manage the processing accuracy of the fulcrum projections 36a and the stopper projections 33a even if the microrelay is downsized, and the stroke of the amateur 30 is accurate. Can be managed well. The stopper projection 33a and the fulcrum projection 36b are not limited to a quadrangular frustum shape, but may be a quadrangular prism shape.

  Each support spring 32 is formed in a meandering shape that reciprocates in the width direction of the movable substrate 30 a in the same plane as the movable substrate 30 a, and one end portion is continuous with the movable substrate 30 a and the other end portion is continuous with the frame 31. That is, at each side edge along the longitudinal direction of the movable substrate 30a, one end of the support spring 32 is continuous on both sides of the projecting piece 36, and is spaced apart from the one end of the support spring 32 in the width direction of the movable substrate 30a. Thus, the other end of the support spring 32 continues to the frame 31. The support spring 32 generates a restoring force when the amateur 30 performs a seesaw operation around the fulcrum described above. Moreover, since the length dimension is ensured by forming the return spring 32 in a meandering shape, the stress generated in the support spring 32 when the armature 30 performs a seesaw operation can be dispersed, and the support spring 32 can be damaged. Can be prevented.

  As described above, since the armature 30 performs a seesaw operation in a state where the frame 31 is joined to the base substrate 1 and the tip of the fulcrum protrusion 36b is in contact with the lid plate 17, naturally the movable substrate 30a is more than the frame 31. The thickness of the armature 30 is such that the armature 30 can be operated between the armature plate 30b provided on the armature 30 and the lid plate 17 in a state where the armature block 3 and the base substrate 1 are fixed. It is set so that a gap of such a degree is formed.

  By the way, a projecting piece 37 is projected from the frame 31 in a continuous and integrated manner at a part of the inner peripheral surface of the frame 31 facing the tip edge of the projecting piece 36 projecting from each side edge of the movable substrate 30a. Yes. In other words, the projecting piece 36 projecting from the movable substrate 30a and the projecting piece 37 projecting from the frame 31 are opposed to each other at their tip surfaces. A movement restricting projection 36a that is recessed from the leading edge in plan view is formed on the leading edge of each protruding piece 36 on the movable substrate 30a side, and the leading edge of each protruding piece 37 on the frame 31 side is seen in plan view. A movement restricting recess 37a into which the movement restricting protrusion 36a enters is formed. Therefore, the position of the movement restricting protrusion 36a is restricted by the movement restricting recess 37a, and the movement of the amateur 30 in the plane orthogonal to the thickness direction of the frame 31 is restricted. Note that there is play between the movement restriction recess 37a and the movement restriction protrusion 36a, and the seesaw operation of the amateur 30 is not hindered by the movement restriction protrusion 36a and the movement restriction recess 37a.

  The amateur block 3 is provided with a movable contact base 34 between each edge in the longitudinal direction of the amateur 30 and the frame 31. The surface of each movable contact base 34 facing the base substrate 1 (the lower surface in FIG. 2) protrudes below the lower surface of the armature 30, and the lower surface of each movable contact base 34 has a movable contact made of a conductive material. 39 is fixed. The total dimension of the thickness dimension (vertical dimension) of the movable contact base 34 and the thickness dimension of the movable contact 39 is such that the distance between the movable contact 39 and the fixed contact 14 maintains a desired insulation distance when the contact device is opened. Is set as follows.

  Each movable contact base 34 is connected to the movable substrate 30 a via two contact pressure springs 35. That is, one end of the contact pressure spring 35 is integrally connected to each side edge of one movable contact base 34, and the other end of each contact pressure spring 35 continuing to one movable contact base 34 is a movable substrate. Each of the side edges at the end in the longitudinal direction of 30a is integrally continuous. As described above, since the protrusions 33 protrude from the four corners of the movable substrate 30a, the contact pressure spring 35 is formed in a shape that bypasses the protrusion 33. Here, in the longitudinal direction of the movable base 30a, the movable contact base 34 is juxtaposed with the movable base 30a, and as a result, is farther from the fulcrum protrusion 36a than the edge of the armature plate 30b. That is, when the armature 30 performs a seesaw operation by receiving the magnetic force from the electromagnet device 2, the moving amount of the movable contact base 34 becomes larger than the end portion in the longitudinal direction of the armature 30. Further, the stopper projection 33a is located between the fulcrum projection 336a and the movable contact base 34 in the longitudinal direction of the movable base 30a. Therefore, when the armature 30 performs a seesaw operation, the moving amount of the movable contact base 34 is larger than the moving amount of the stopper projection 33a. That is, the movement of the armature 30 is regulated by the stopper projection 33a after the movable contact 39 fixed to the distal end surface of the movable contact base 34 contacts the fixed contact 14.

  As is apparent from the above description, among the elements constituting the amateur block 3, the frame 31, the movable substrate 30a, the support spring 32, the movable contact base 34, and the contact pressure spring portion 35 are formed from a semiconductor substrate to a semiconductor microfabrication technology. Formed by. As the semiconductor substrate, a silicon substrate having a thickness dimension of about 50 μm to 300 μm, preferably about 200 μm is used.

  The stopper projection 33a, the fulcrum projection 36a, and the movable contact base 34 provided on the amateur block 3 are formed integrally with the movable substrate 30a by applying a semiconductor fine processing technique such as etching to the semiconductor substrate. At least the stopper protrusion 33a and the fulcrum protrusion 36a are processed so as to be positioned on the same plane. In addition, the distal end surface of the movable contact base 34 is preferably processed so as to be positioned on the same plane. As described above, if the stopper projection 33a, the fulcrum projection 36a, and the movable contact base 34 are formed on the same plane, the stopper projection 33a, the fulcrum projection 36a, and the movable contact base 34 are simultaneously and under the same conditions. It becomes possible to process with, and manufacture becomes easy.

  Since the frame 31 of the amateur block 3 needs to be connected to the base substrate 1 and the cover 4, the metal 31 for joining over the entire circumference of the peripheral portion of the frame 31 of the amateur block 3 facing the base substrate 1. A thin film 38 b is formed, and a bonding metal thin film 38 a is formed over the entire periphery of the surface facing the cover 4. Further, a bonding metal thin film 15 to be bonded to the bonding metal thin film 38b is formed over the entire periphery of the surface of the base substrate 1 facing the armature block 3, and the cover 4 is opposed to the armature block 3. A bonding metal thin film 42 to be bonded to the bonding metal thin film 38a is formed on the entire periphery of the surface. Therefore, the bonding metal thin film 38b and the bonding metal thin film 15 are bonded together, and the bonding metal thin film 38a and the bonding metal thin film 42 are bonded, so that the base substrate 1, the armature block 3, and the cover 4 are pressed. Alternatively, since the housing hole 16 and the through hole 10 are closed by the cover plates 17 and 19, the armature 30 and the armature 30 are surrounded by the base substrate 1, the cover 4, and the frame 31. A space in which the contact device (the fixed contact 14 and the movable contact 39) is accommodated can be hermetically sealed. Note that the material of the bonding metal thin films 15, 38a, 38b, and 42 is selected from Au, Al—Si, and Al—Cu.

  Next, the operation of the above-described micro relay will be described. Although the micro relay of this embodiment is provided with the two coils 22, since both the coils 22 are connected in series or in parallel, it is equivalent to the case where one coil is provided. As shown in FIG. 1, the armature plate 30 b provided on the armature 30 is opposed to one magnetic pole of the permanent magnet 21 through the cover plate 17 at the central portion in the longitudinal direction, and the yoke 20 at both end portions in the longitudinal direction. It faces the front end surface of each leg piece 20b through the cover plate 17. When the coil 22 is energized, the magnetic flux generated by the coil 22 is in the same direction as the magnetic flux generated by the permanent magnet 21 in one leg piece 20b of the yoke 20, and is generated by the permanent magnet 21 in the other leg piece 20b. Since the direction is opposite to the magnetic flux, an attractive force acts between the front end surface of the one leg piece 20b and the armature plate 30b, and the end of the armature plate 30b in the longitudinal direction of the one leg piece 20b. Suctioned to the tip surface. That is, the armature 30 is inclined with the vicinity of a straight line connecting the tips of both fulcrum protrusions 36b as a fulcrum. At this time, the movable contact base 34 on one end side that receives the suction force from the leg piece 20b of the yoke 20 among the movable contact bases 34 provided at the portions corresponding to the respective end portions in the longitudinal direction of the amateur 30 Since it approaches the substrate 1, the movable contact 39 provided on the movable contact base 34 comes into contact with the pair of fixed contacts 14 facing each other, and the fixed contacts 14 are short-circuited between the movable contacts 39.

  When the movable contact 39 comes into contact with the fixed contact 14, the tip of the stopper projection 33a does not come into contact with the base substrate 1 (or the cover plate 19 fixed to the base substrate 1), and the armature 30 is further tilted to contact the pressure spring. 35 bends, and a contact pressure corresponding to an overtravel amount (amount of movement of the armature 30 after the movable contact 39 contacts the fixed contact 14) is generated between the movable contact 39 and the fixed contact 14. Thereafter, the tip of the stopper projection 33a abuts against the base substrate 1 or the lid plate 19 to restrict the movement of the armature 30. Even if energization of the coil 22 is stopped in this state, the armature plate 30b is kept attracted to the leg piece 20b by the permanent magnet 21, and the state where the movable contact 39 is in contact with the fixed contact 14 is maintained. .

  In order to open one movable contact 39 in the longitudinal direction of the amateur 30 from the corresponding fixed contact 14, a current in a direction opposite to the above-described direction is applied to the coil 22. If the direction of the current applied to the coil 22 is reversed, the magnetic flux generated by the coil 22 has the same direction as the magnetic flux generated by the permanent magnet 21 in the other leg piece 20b of the yoke 20. The armature plate 30b is attracted to 20b, and the movable contact 39 provided on the movable contact base 34 corresponding to the other end of the armature 30 in the longitudinal direction comes into contact with the pair of fixed contacts 14 facing each other. Also in this case, contact pressure is generated by the contact pressure spring 35, and the movement of the armature 30 is restricted by the stopper projection 33a. Also, the present embodiment operates bistable, and even at this position, the armature plate 30b is kept attracted to the other leg piece 20b by the magnetic force of the permanent magnet 21, and the movable contact 39 is a fixed contact. 14 is maintained.

  When the micro relay described above is mounted on a mounting board such as a printed board, four bumps 13 at the four corners and two bumps 24 at the center exposed on the outer surface of the case A (base substrate 1). May be connected to a conductor pattern formed on the mounting substrate. Alternatively, the case A is fixed to the mounting board with the front end surface of the cover 4 in contact with the mounting board, and the bumps 13 and 24 exposed from the case A are connected to the mounting board by wire bonding. Is also possible.

  In this embodiment, the base substrate 1 and the cover 4 are each formed by processing a glass substrate, but one or both of the base substrate 1 and the cover 4 may be formed by processing a silicon substrate. However, when the base substrate 1 and the cover 4 are each formed of a glass substrate and the semiconductor substrate used for the amateur block 3 is a silicon substrate, the amateur block 3 and the base substrate 1 and the cover 4 are hermetically sealed by anodic bonding. Since bonding is possible, the bonding metal thin films 15, 38a, 38b, and 42 can be omitted. The microrelay described above is divided into individual microrelays by a dicing process or the like after joining a wafer formed with a large number of amateur blocks 3, a wafer formed with a large number of base substrates 1, and a wafer formed with a large number of covers 4. It is possible to manufacture.

It is sectional drawing which shows embodiment of this invention. It is an exploded perspective view same as the above. It is a perspective view same as the above. It is a disassembled perspective view which shows the base substrate and lid plate which are used for the same as the above. It is a side view which shows the relationship between the yoke used for the same as the above, a permanent magnet, and a cover plate. The amateur block used for the above is shown, (a) is a plan view and (b) is a bottom view. It is a disassembled perspective view which shows the amateur block used for the same as the above. It is a perspective view which shows the cover used for the same as the above.

Explanation of symbols

2 Electromagnet Device 3 Amateur Block 14 Fixed Contact 20 Yoke 22 Coil 30 Amateur 30a Movable Substrate 30b Armature Plate 31 Frame 33a Stopper Projection 34 Movable Contact Base 35 Contact Pressure Spring 36b Support Projection 39 Movable Contact A Case

Claims (3)

Magnetic force acting between an electromagnet device having a yoke with a coil wound therein and housed in a case, and a frame-like frame fixed to the case, and being integrated with the frame and disposed inside the frame The armature block that has an armature that moves around the specified fulcrum, the fixed contact provided at a fixed position of the case, and the movable contact that moves away from the fixed contact by the movement of the end of the armature. The armature has a contact device that opens and closes, and the armature has a magnetic force that acts between a movable substrate made of a semiconductor material formed integrally with the frame and an electromagnet device stacked on at least one surface in the thickness direction of the movable substrate. The armature plate made of body material and the movable substrate can be connected in a direction that connects both ends of the amateur seesaw operation. A fulcrum projection that serves as a fulcrum for armature seesaw operation by projecting to one side in the thickness direction of the movable substrate at the intermediate portion in the longitudinal direction of the substrate and abutting the specified position of the case, is integrally integrated with the movable substrate. Thus, at the both ends of the movable substrate in the longitudinal direction, it protrudes to the one surface side in the thickness direction of the movable substrate, and when the amateur moves by the seesaw operation, the tip moves into contact with the specified position of the case, thereby restricting the movement range of the amateur. A stopper protrusion , a movable contact base that is arranged in parallel with the movable substrate and protrudes toward the one surface in the thickness direction of the movable substrate and has a movable contact on the tip surface, and the movable substrate and the movable contact base are continuously connected integrally. The surface on which the movable contact is provided on the movable contact base is located on the same plane as the tips of the fulcrum protrusion and the stopper protrusion. Micro relay, characterized in that. The micro relay according to claim 1, wherein the movable contact base is further away from the fulcrum protrusion in a longitudinal direction of the movable substrate than a portion of the armature plate that receives magnetic force from the electromagnet device . The stopper protrusions claim 1 or claim 2 micro relays according to, characterized in that disposed between the movable contact base and the fulcrum projection in the longitudinal direction of the movable substrate.

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