JPH06244030A - Lc composite component - Google Patents

Abstract

PURPOSE:To combine a capacitor and a coil into a compact unit and to realize an LC composite component of high selectivity regarding a combination of L and C values. CONSTITUTION:A flat type coil device 14 comprising spiral coil patterns 24 on both sides of a substrate 22 is fixed to one surface of a chip type capacitor device 12, and a first LC composite part 10 is obtained by electrically connecting a second extraction electrode 18 formed on one end of the chip type capacitor device 12 through a conductive path 32 to one end of the flat type coil device 14.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LC composite component in which a coil and a capacitor are integrated, which is used as a noise countermeasure for a signal circuit.

[0002]

2. Description of the Related Art Conventionally, a coil is connected in series to a signal circuit and a capacitor is connected in parallel in order to remove noise that enters the signal circuit. Since such a coil is generally constructed by winding a conductor wire around a toroidal ferrite core or the like, there is a drawback in that the size becomes large, and it is necessary to connect a capacitor separately from the coil. Therefore, the overall shape is further increased and the connection work is complicated.

Therefore, as described in Japanese Unexamined Patent Publication No. 59-212013, first and second lead wires are provided near both ends of either one of the two strip-shaped conductors such as copper foil or aluminum foil. The third lead wire is connected to the other strip-shaped conductor, and these two strip-shaped conductors are superposed with a strip-shaped insulator such as capacitor paper interposed therebetween, and are wound into a tubular shape. Noise filter elements have been proposed. In this noise filter element, an air-core coil is formed between the first lead wire and the second lead wire, and a capacitor is formed in a distributed constant manner throughout the coil. Although it is an integrated element, it can exhibit a noise suppressing effect.

[0004]

It is true that the above noise
The filter element has the advantage of being compact in overall shape. However, since the capacitor part and the coil part are inseparably formed integrally, it is difficult to freely select the values of the inductance of the coil part and the capacitance of the capacitor part (hereinafter referred to as “L, C values”). Met. For example, if the inductance is increased by increasing the number of turns of the band-shaped conductor, the electrostatic capacity will inevitably increase accordingly. On the contrary, the number of turns of the band-shaped conductor will be reduced to lower the electrostatic capacity. If so, the inductance will also decrease.

The present invention has been made in view of the above-mentioned drawbacks of the conventional example, and realizes an LC composite component in which a capacitor and a coil are compactly integrated and which has a high selectivity with respect to a combination of L and C values. The purpose is to

[0006]

In order to achieve the above object, an LC composite component according to the present invention comprises a flat type coil element in which a coil pattern is formed on the surface of a substrate on the surface of a chip type capacitor element. One of the extraction electrodes formed at both ends of the chip-type capacitor element is fixed and electrically connected to one of both ends of the flat-type coil element.

[0007]

As described above, since the chip-type capacitor element is used as the capacitor and the flat-type coil element is fixed to the surface of the chip-type capacitor element, the overall size can be reduced, and the space between both elements can be realized. Since they are integrated in the state where they are connected, the work of connecting to the circuit becomes easy. In addition, since the coil and the capacitor are not formed at the same time in the manufacturing stage, by appropriately combining elements adjusted to various values, an arbitrary L,
C value can be realized.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on the illustrated embodiments. FIG. 1 is a perspective view showing the outer appearance of a first LC composite component 10 according to the present invention. This first LC composite part 10
Is a chip type capacitor element 12 and a flat type coil element 14
The basic configuration is to integrate and.

In the chip type capacitor element 12, vapor deposition electrodes made of aluminum or the like are formed on both surfaces of a dielectric film made of polyphenylene sulfide or the like, and a thin dielectric film made of polyphenylene oxide or the like is formed on each vapor deposition electrode surface. Then, the first extraction electrode 16 and the second extraction electrode 18 are formed by applying a metallikon made of a tin-lead alloy to both side surfaces of a substantially rectangular parallelepiped-shaped laminate obtained by laminating hundreds of this film. Then, the insulating coating 20 is applied to the remaining surface. Then, the first lead electrode 16 has a first lead terminal
Twenty are connected via solder. The capacitance of the chip type capacitor element 12 can be set to an arbitrary value by appropriately adjusting the number of laminated films and the like.

As shown in FIG. 2, the flat coil element 14 has spiral coil patterns 24 formed on both sides of a substrate 22 made of polyimide film or the like and having a thickness of about 50 μm.
A second lead terminal is provided on each end of the coil pattern 24.
26 and the third lead terminal 28 are connected. The coil pattern 24 is formed by etching copper on the front surface and the back surface of the substrate 22 to form a plurality of filaments. It is formed by applying copper plating or solder plating on both sides and connecting them. At this time, since the polyimide film forming the substrate 22 has excellent heat resistance, it does not deform even when immersed in the solder bath together with the substrate 22. In order to prevent the connection portion between the filaments due to this plating from being damaged by friction or the like and impairing the continuity between the filaments, as shown in FIG.
It is desirable to form a concave portion 22b for accommodating the plating 30 on the side surface 22a of 22. The inductance of the flat coil element 14 can be set to an arbitrary value by appropriately adjusting the number of turns of the coil pattern 24 and the like.

The back surface of the flat type coil element 14 is closely attached to one surface of the chip type capacitor element 12 (where the first and second extraction electrodes 16 and 18 are not formed) with an adhesive agent. The second lead terminal 26 located on the back side of the element and the second lead electrode 18 of the chip-type capacitor element 12 are connected to each other via a conductive path 32 made of solder or the like. , The first LC composite component 10 is completed. FIG. 4 is an equivalent circuit diagram of the first LC composite component 10. Although not shown, it is desirable to provide an insulating exterior such as a resin mold on the surface of the first LC composite component 10.

FIG. 5 shows a second LC composite component according to the present invention.
FIG. 40 is a perspective view showing the appearance of 40. In addition, about the same part as the said 1st LC composite component 10, the same code | symbol is attached | subjected in a figure, and the description is abbreviate | omitted. This second LC
The composite part 40 has the flat coil element 14 fixed to one surface of the chip-type capacitor element 12 as well as the first LC composite part 10 and also has the flat coil element on the surface facing the flat coil element 14.
The feature is that 14 is fixed. Then, one end of each flat type coil element 14 and the second of the chip type capacitor element 12
Of the flat type coil elements 14 and 14 are connected to the extraction electrodes 18 of the flat type coil elements 14 and 14 via the conductive paths 32 and 32, and the fourth lead terminals 42 are connected to the other ends of the flat type coil elements 14 and 14, respectively. And a fifth lead terminal 44 are connected. Figure 6 shows this second
3 is an equivalent circuit diagram of the LC composite component 40 of FIG. Although illustration is omitted, it is desirable that the surface of the second LC composite component 44 is also provided with an insulating exterior such as a resin mold as in the case of the first LC composite component 10.

In each of the above-described embodiments, a so-called multilayer capacitor element is illustrated as the chip capacitor element 12, but the invention is not limited to this, and a wound capacitor element may be used. Further, copper is etched on both sides of the substrate 22 to form a line, and the line on both sides is connected through the plating 30 to form the coil pattern 24.
However, the zigzag coil pattern may be formed only on one surface of the substrate 22. Alternatively,
A conductive wire may be spirally wound around the substrate 22 to form a coil pattern. Further, the numbers of the chip-type capacitor element 12 and the flat-type coil element 14 are not limited to the above, and can be appropriately selected as needed. For example, a plurality of flat type coil elements 14 are stacked and mounted on one chip type capacitor element 12, or a plurality of chip type capacitor elements are stacked.
You may use what integrated 12 by connecting. In this case, the connection method between the respective elements can be arbitrarily selected. Further, as the material of the substrate 22 of the flat coil element 14,
A magnetic material such as ferrite or permalloy may be used. As a result, the inductance of the flat coil element 14 is increased, and the noise attenuation characteristic is improved.

[0014]

In the LC composite component according to the present invention, since the flat type coil element is fixed to the surface of the chip type capacitor element, the overall shape can be reduced, and both elements are connected. Since they are integrated in the state, connection work to the circuit is also easy. Further, by appropriately combining elements adjusted to various values, arbitrary L and C values can be realized.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of an LC composite component according to the present invention.

FIG. 2 is a plan view showing a flat coil element according to the above embodiment.

FIG. 3 is a partial enlarged view showing a side surface portion of a substrate forming the flat coil element.

FIG. 4 is an equivalent circuit diagram of the above embodiment.

FIG. 5 is a perspective view showing another embodiment of the LC composite component according to the present invention.

FIG. 6 is an equivalent circuit diagram of the above embodiment.

[Explanation of symbols]

 10 First LC composite component 12 Chip type capacitor element 14 Flat coil element 16 First extraction electrode 18 Second extraction electrode 22 Substrate 24 Coil pattern 40 Second LC composite component

Claims (3)

[Claims] 1. A flat type coil element having a coil pattern formed on the surface of a substrate is fixed to the surface of the chip type capacitor element, and one of extraction electrodes formed at both ends of the chip type capacitor element, and An LC composite component in which one of both ends of a flat coil element is electrically connected. 2. The LC composite component according to claim 1, wherein the flat coil element has a spiral coil pattern formed on both surfaces of the substrate. 3. The surface of the chip type capacitor element,
The LC composite component according to claim 1 or 2, wherein a plurality of flat type coil elements are fixed to each other.