JPH06239668A - Soldering material for joining and its production - Google Patents

Soldering material for joining and its production

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Publication number
JPH06239668A
JPH06239668A JP2952493A JP2952493A JPH06239668A JP H06239668 A JPH06239668 A JP H06239668A JP 2952493 A JP2952493 A JP 2952493A JP 2952493 A JP2952493 A JP 2952493A JP H06239668 A JPH06239668 A JP H06239668A
Authority
JP
Japan
Prior art keywords
brazing material
bonding
auxiliary component
brazing
joining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2952493A
Other languages
Japanese (ja)
Inventor
Isao Okutomi
功 奥冨
Mikio Okawa
幹夫 大川
Shoji Niwa
昭次 丹羽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2952493A priority Critical patent/JPH06239668A/en
Publication of JPH06239668A publication Critical patent/JPH06239668A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To improve the bonding strength by uniformly and highly dispersing and attaching a bonding assistant component composed of Ti, Zr and/or Cr in a finely dispersed state to a solder material for substrate. CONSTITUTION:A solder material for substrate selected from Ag-based solder material, Au-based solder material, Pd-based solder material, Pt-based solder material, etc., having a thickness of about 0.1mm and having cleaned surface is placed in a vacuum chamber. A bonding assistant component consisting of at least one kind of substance selected from Ti, Zr and Cr is evaporated by heating at 1800-2600 deg.C with electron beam irradiation and uniformly deposited on at least a surface of the solder material for substrate in the form of uniformly dispersed particles having an average particle diameter of 0.01-5mum. The solder material for substrate is inserted between a ceramic member such as Al2O3 and a metallic member such as Ni-Fe alloy, placed in a vacuum chamber and heated in vacuum at a prescribed temperature to effect the soldering work and obtain a laminated product having high bonding strength.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、例えば金属部材/セラ
ミックス部材またはセラミックス部材/セラミックス部
材の接合に使用する接合用ロウ材に係り、特に接合強度
と気密接合性を改良したものに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a brazing filler metal used for joining, for example, a metal member / ceramics member or a ceramics member / ceramics member, and more particularly to a joint brazing material having improved joint strength and airtight jointability.

【0002】[0002]

【従来の技術】セラミックスは、優れた耐熱性、絶縁
性、気密性を有するため、その特性を生かして種々の電
気部品材料として用いられている。
2. Description of the Related Art Ceramics have excellent heat resistance, insulating properties and airtightness, and are used as various electric component materials by taking advantage of their characteristics.

【0003】特に、気密性容器の場合、内部を不活性ガ
スで満たした雰囲気、または真空で使用される。従っ
て、このような内部雰囲気を維持するために、厳密に気
密性を保ち得るものでなければならない。
Particularly, in the case of an airtight container, it is used in an atmosphere filled with an inert gas or in a vacuum. Therefore, in order to maintain such an internal atmosphere, the airtightness must be strictly maintained.

【0004】従来、例えば金属部材とセラミックス部材
とを基盤用銀ロウ材を介して接合するに際して、一般に
はセラミッサクス部材の端面に予めメタライズ層(例え
ば、Mo−Mn)を付与させ、このメタライズ層を介し
て銀ロウ付け接合を行っている。すなわち、セラミック
スの接合の方法としては、まずセラミックス部材にメタ
ライジングを施した後、金属とロウ付け接合する方法が
行われている。メタライジング方法としては、例えば下
記に示す方法がよく知られている。
Conventionally, for example, when joining a metal member and a ceramic member via a silver brazing material for a substrate, generally, a metallized layer (for example, Mo-Mn) is previously applied to the end surface of the ceramics member, and this metallized layer is formed. The silver brazing is performed through. That is, as a method of joining ceramics, a method of first metallizing a ceramic member and then brazing and joining it to a metal is used. As the metallizing method, for example, the following method is well known.

【0005】(1)セラミックス母材表面に、Mo又は
Wを主成分とする粉末を塗布し、還元雰囲気中で、例え
ば1400〜1700℃に加熱して、セラミックス母材
と反応させメタライズする方法であって、必要によりメ
タライズ層上にNiなどをメッキ処理する。 (2)セラミックス母材表面に、AuまたはPtを配
し、それらに圧力を加えながら加熱してメタライジング
する方法。
(1) A method in which a powder containing Mo or W as a main component is applied to the surface of a ceramic base material and heated to, for example, 1400 to 1700 ° C. in a reducing atmosphere to react with the ceramic base material and metallize. Therefore, Ni or the like is plated on the metallized layer if necessary. (2) A method of arranging Au or Pt on the surface of the ceramic base material and heating them while applying pressure to perform metallization.

【0006】(3)セラミックス母材上に、Ti,Zr
などの活性金属と、Ni,Cuなどの遷移金属を配し、
それらの合金の融点より高い温度で熱処理してメタライ
ジングする方法(特開昭56−163093号)。
(3) Ti, Zr on the ceramic base material
And active metals such as Ni and Cu, and transition metals such as
A method of heat-treating at a temperature higher than the melting points of those alloys for metallizing (JP-A-56-163093).

【0007】[0007]

【発明が解決しようとする課題】しかしながら、従来の
(1)の方法では、メタライジングに非常に高温度での
処理を必要とするなど、繁雑な工程に問題がある。処理
条件の僅かな変動でも十分な接合強度が得難く、強度的
にもばらつきが発生する。
However, in the conventional method (1), there is a problem in a complicated process such that the metallizing requires treatment at a very high temperature. Even a slight variation in the processing conditions makes it difficult to obtain sufficient bonding strength, and variations in strength occur.

【0008】また(2)の方法では、高価な貴金属を使
用するため、経済性に問題がある上に密着性を高める目
的で高い圧力を必要とし、変形を嫌う精密部品への適用
は好ましくない。また、生産性(圧力を得る為の加圧部
品がロウ付炉中である空間を占める)にも問題がある。
Further, in the method (2), since an expensive noble metal is used, there is a problem in economical efficiency, and a high pressure is required for the purpose of enhancing the adhesion, and it is not preferable to apply it to a precision part which is not susceptible to deformation. . There is also a problem in productivity (a pressurizing part for obtaining pressure occupies a space in the brazing furnace).

【0009】さらに(3)の方法では、活性金属がセラ
ミックス母材上を濡らすために加圧を殆ど必要とせず且
つ活性金属の効果により、セラミックス母材に対し強い
密着力でメタライジングすることができる。しかし、金
属部材とセラミックス部材とが十分に重なり合った所で
は銀ロウは良好な接合を示すが、金属部材とセラミック
ス部材との間に、極く僅かにでも隙間があったり十分に
重なり合っていない部分が存在すると、良好にメタライ
ジングされない場合があり、気密接合性に問題がある。
Further, in the method (3), the active metal hardly requires pressurization to wet the ceramic base material, and the effect of the active metal enables metallizing with a strong adhesion to the ceramic base material. it can. However, when the metal member and the ceramic member are sufficiently overlapped with each other, the silver solder shows good bonding, but there is a very small gap between the metal member and the ceramic member or the part is not sufficiently overlapped. If present, the metallization may not be performed well, and there is a problem in airtight bonding.

【0010】以上のように、上記(1)(2)(3)の
いずれにおいても、メタライジングを施した後に金属部
材とセラミックス部材とをロウ接合するので、工程が複
雑となったり、接合強度、気密接合性のいずれか又は両
者が問題となったりしている。この様に、メタライジン
グの工程と金属部材とのロウ接合とを別々に行う必要が
あり、工程が複雑となる欠点がある。そこで、予め上記
の様なメタライジングを施すことなく、金属部材をセラ
ミックス部材にロウ付けする技術が検討されるようにな
ってきた。
As described above, in any of the above (1), (2) and (3), since the metal member and the ceramic member are brazed after metallizing, the process is complicated and the joint strength is high. Either or both of the airtight bonding properties become a problem. As described above, it is necessary to separately perform the metallizing process and the brazing of the metal member, which is a disadvantage that the process is complicated. Therefore, a technique of brazing a metal member to a ceramic member without performing the above metalizing has been studied.

【0011】そこで、予めメタライジングを施すことな
く、金属部材とセラミックス部材とを接合する方法とし
て、例えば特開昭59−32628に記載されているよ
うな一段回接合法がある。
Therefore, as a method for joining a metal member and a ceramic member without performing metallization in advance, there is a one-step joining method as described in, for example, Japanese Patent Laid-Open No. 59-32628.

【0012】すなわち、活性金属として少なくともTi
又はZrを含むAgロウ材料を用いる(これを金属部材
とセラミックス部材との間に挿入して接合する)。或い
は、上記活性金属の薄板と上記Agロウ材とを積層した
Agロウ材料を用いる(これを金属部材とセラミックス
部材との間に挿入して接合する)。
That is, at least Ti is used as the active metal.
Alternatively, an Ag brazing material containing Zr is used (this is inserted between the metal member and the ceramic member and bonded). Alternatively, an Ag brazing material in which the thin plate of the active metal and the Ag brazing material are laminated is used (the Ag brazing material is inserted between the metal member and the ceramic member and bonded).

【0013】この一段回接合法はメタライジングを必要
としないから、工程を簡略化する事が出来る。しかしな
がら、この一段回接合法の場合でも、上記(3)で見ら
れたと同様の現象、すなわちAgロウ材料が金属部材や
セラミックス部材、特にセラミックス部材と十分密着し
ていないと、良好な接合強度と気密接合性が得られない
場合がみられる。十分な密着を得るためには加圧力の不
均一性を是正する必要があり、強大な加圧を要する。
Since this one-step joining method does not require metallizing, the process can be simplified. However, even in the case of this one-step bonding method, the same phenomenon as that observed in the above (3), that is, if the Ag brazing material is not sufficiently adhered to the metal member or the ceramic member, especially the ceramic member, good bonding strength is obtained. In some cases, airtight bonding cannot be obtained. In order to obtain sufficient adhesion, it is necessary to correct the non-uniformity of pressing force, and strong pressurization is required.

【0014】この欠点を改良した技術として、特開昭6
3−49758で記載されているように、加圧力の不均
一性を得る手段として、活性金属Ti又は/及びZr粉
末を使用し、これをセラミック部材面に塗布する。活性
金属を粉末化した事によって、Ti又は/及びZrが均
一にセラミックス部材に分布し且つ密着しているため、
接合強度と気密接合性とを兼備した接合状態を得てい
る。
As a technique for improving this drawback, Japanese Unexamined Patent Publication No. Sho 6-62
As described in 3-49758, active metal Ti or / and Zr powder is used as a means to obtain non-uniformity of the applied pressure, and this is applied to the ceramic member surface. By pulverizing the active metal, Ti and / or Zr are evenly distributed and adhered to the ceramic member,
A joint state having both joint strength and airtight joint property is obtained.

【0015】しかし、ポリビニールアルコール、エチル
セルローズなどのバインダを塗布したセラミックス部材
面に、前記活性金属Ti又は/及びZr粉末を塗布する
際に、エタノール、テトラリンなどの有機溶剤によって
前記活性金属粉末をペースト状態にするので、これらバ
インダや有機溶剤による環境問題の軽減化対策を図る必
要があった。
However, when the active metal Ti or / and Zr powder is applied to the surface of the ceramic member coated with a binder such as polyvinyl alcohol or ethyl cellulose, the active metal powder is treated with an organic solvent such as ethanol or tetralin. Since the paste is used, it is necessary to take measures to reduce environmental problems caused by these binders and organic solvents.

【0016】本発明の目的は、メタライジングと気密接
合を同時に行うことを可能とし、信頼性,経済性,環境
保全に優れた接合用ロウ材料及びその製造方法を提供す
ることにある。
An object of the present invention is to provide a brazing material for bonding which is capable of performing metallizing and airtight bonding at the same time and is excellent in reliability, economical efficiency and environmental protection, and a manufacturing method thereof.

【0017】[0017]

【課題を解決するための手段および作用】本発明は、上
記目的を達成すべく検討を重ねた結果、基盤用ロウ材料
の少なくとも一面に、チタン(Ti)、ジルコニウム
(Zr)、又はクロム(Cr)の少なくとも1つの接合
補助成分を付着させてなる事を特徴とする。
The present invention has been studied to achieve the above object, and as a result, titanium (Ti), zirconium (Zr), or chromium (Cr) is formed on at least one surface of a base brazing material. ) At least one bonding auxiliary component is attached.

【0018】好ましい実施態様は、基盤用ロウ材料の少
なくとも一面に、チタン(Ti)、ジルコニウム(Z
r)、又はクロム(Cr)の少なくとも1つの接合補助
成分を均一で高度に分散付着させてなる接合用ロウ材料
において、接合補助成分は、平均粒子直径(粒径)が
0.01μm〜5μmの粒子状を呈している事を特徴と
する。
In a preferred embodiment, titanium (Ti), zirconium (Z) is formed on at least one surface of the base brazing material.
r) or at least one bonding auxiliary component of chromium (Cr) is uniformly and highly dispersed and adhered, and the bonding auxiliary component has an average particle diameter (particle diameter) of 0.01 μm to 5 μm. It is characterized by having a particle shape.

【0019】他の好ましい実施態様は、基盤用ロウ材料
の少なくとも一面に、平均粒子直径(粒径)が0.01
μm〜5μmの粒子状を呈する接合補助成分を付着させ
てなる接合用ロウ材料であって、接合補助成分には、平
均粒子直径(粒径)が0.01μm〜5μmの粒子状を
呈するロウ材料構成成分(Ag,Cuなど)を含有して
いる事を特徴とする。
Another preferred embodiment has an average particle diameter (particle size) of 0.01 on at least one side of the base brazing material.
A brazing material for bonding formed by adhering a bonding auxiliary component having a particle size of μm to 5 μm, wherein the bonding auxiliary component has a particle shape having an average particle diameter (particle diameter) of 0.01 μm to 5 μm. It is characterized by containing constituent components (Ag, Cu, etc.).

【0020】他の好ましい実施態様は、基盤用ロウ材料
の構成成分の少なくとも1成分の一面に、チタン(T
i)、ジルコニウム(Zr)、クロム(Cr)の少なく
とも1つの接合補助成分を微細均一で高度に分散付着さ
せてなる事を特徴とする。
In another preferred embodiment, titanium (T) is provided on one surface of at least one of the constituents of the base brazing material.
i), at least one bonding auxiliary component of zirconium (Zr) and chromium (Cr) is finely uniformly and highly dispersed and adhered.

【0021】他の好ましい実施態様は、金属薄板状、線
状又は粉状などの形態を持つAg系ロウ材,Au系ロウ
材,Pd系ロウ材,Pt系ロウ材,Cu系ロウ材,Ni
系ロウ材の群から選択された1つである事を特徴とす
る。
Another preferred embodiment is an Ag-based brazing material, an Au-based brazing material, a Pd-based brazing material, a Pt-based brazing material, a Cu-based brazing material, Ni having a form such as a thin metal plate shape, a linear shape or a powder shape.
It is one selected from the group of brazing filler metals.

【0022】他の好ましい実施態様は、基盤用ロウ材料
の少なくとも一面に、接合補助成分を付着させてなる接
合用ロウ材であって、接合補助成分が存在する面には、
酸化或いは汚染を受けることを抑制する保護層を具備し
ている事を特徴とする。
Another preferred embodiment is a bonding brazing material in which a bonding auxiliary component is adhered to at least one surface of a base brazing material, and the surface on which the bonding auxiliary component is present is:
It is characterized by being provided with a protective layer which suppresses oxidation or contamination.

【0023】これらの接合用ロウ材構造を採ることによ
って、容易に金属部材/セラミックス部材、又はセラミ
ックス部材/セラミックス部材が機密性良く接合され、
本発明を完成するに至った。
By adopting these joining brazing material structures, the metal member / ceramic member or the ceramic member / ceramic member can be joined easily with good airtightness.
The present invention has been completed.

【0024】本発明においては、金属部材とセラミック
ス部材とを接合するに際して、予めTi,Zr,Cr粉
等の活性金属を基盤用ロウ材料に被着する。これは単な
る被着であって、特にメタライジング処理を行わない
点、及びTi,Zr,Cr粉等の活性金属を接合用ロウ
材料に被着する点で、従来の技術とは異なっている。す
なわち、予め形成されるのは活性金属層であってメタラ
イズ層ではなく、また活性金属の被着は、セラミックス
部材ではなく基盤用ロウ材料に被着するのである。
In the present invention, when the metal member and the ceramic member are joined together, an active metal such as Ti, Zr or Cr powder is applied to the base brazing material in advance. This is a mere deposition, and is different from the conventional technique in that metallizing treatment is not particularly performed and active metals such as Ti, Zr, and Cr powders are deposited on the brazing material for bonding. That is, it is the active metal layer that is formed in advance and not the metallized layer, and the deposition of the active metal is performed not on the ceramic member but on the base brazing material.

【0025】活性金属層の被着について、従来セラミッ
クス部材に行っていたのを、単に基盤用ロウ材料に置き
換えただけではなく、その内容、作用効果を大きく異に
する。ここで、本発明の接合用ロウ材料の作用について
説明する。
Regarding the deposition of the active metal layer, not only the conventional ceramic member is replaced with the base brazing material, but also the contents and working effects are largely different. Here, the function of the brazing material for bonding of the present invention will be described.

【0026】(1)被接合物であるセラミックス部材
は、大きさ、厚さがまちまちである上に、その形状も不
定のために品質管理上技術的問題が多い。そのため、活
性金属層を形状のまちまちなセラミックス部材に被着す
る場合不利益が多い。例えば、宇宙機器用部品や光学部
品では、幅1mm以下、厚さ0.3mm以下の微少面
積、微少厚さのセラミックス部材へのロウ付けが行われ
ている。この場合、セラミックス部材の被接合面へのT
i,Zr,Cr粉等の活性金属を被着する時の作業性、
メタライジング層の不均一性が課題となっている。ま
た、エネルギー機器用遮熱構造体では、長さ1m以上の
巨大面積のセラミックス部材へのロウ付けが行われてい
る。この場合、セラミックス部材の被接合面への活性金
属Ti,Zr,Cr粉等の被着においても、これらの不
均一性に係るメタライジング層の不均一性が課題となっ
ている。特に、前者の微少面積のセラミックス部材で
は、個々間にばらつきが見られ、後者の巨大面積のセラ
ミックス部材では、部材内の場所場所間でばらつきが見
られる。
(1) Ceramic members, which are objects to be joined, have various sizes and thicknesses, and their shapes are indefinite, and therefore there are many technical problems in quality control. Therefore, there are many disadvantages when depositing the active metal layer on ceramic members having various shapes. For example, in space equipment parts and optical parts, brazing is performed on a ceramic member having a width of 1 mm or less and a thickness of 0.3 mm or less and a minute area and a minute thickness. In this case, T on the surface to be joined of the ceramic member
Workability when depositing active metals such as i, Zr, and Cr powder,
The non-uniformity of the metallizing layer is a problem. Further, in the heat shield structure for energy equipment, brazing is performed on a ceramic member having a length of 1 m or more and having a huge area. In this case, even when the active metal Ti, Zr, Cr powder or the like is deposited on the surfaces to be joined of the ceramic member, the non-uniformity of the metalizing layer due to the non-uniformity becomes a problem. In particular, in the former ceramic member having a small area, variations are found among the individual members, and in the latter ceramic member having a large area, variations are found between places in the member.

【0027】これらの課題に対して、基盤用ロウ材料を
活性金属層を有する接合用ロウ材料とする事によって、
ばらつき、不均一性を回癖した。これは基盤用ロウ材料
の少なくとも一面に、活性状態にある接合補助成分を微
細均一で高度に分散付着させた接合用ロウ材構造の効果
によって、良好な機密性と接合強度を得る。
To solve these problems, by using the base brazing material as a bonding brazing material having an active metal layer,
Variation and non-uniformity occurred. This is due to the effect of the bonding brazing material structure in which the bonding auxiliary component in the active state is finely and uniformly dispersed and adhered to at least one surface of the base brazing material, thereby obtaining good airtightness and bonding strength.

【0028】(2)セラミックス部材の被接合面へT
i,Zr,Cr粉等の活性金属を被着させる従来法の場
合では、被着させたのみではTi,Zr,Cr粉等の付
着強さが十分でなく、どうしてもメタライジング化のた
めの加熱処理を要する。
(2) T to the surface to be joined of the ceramic member
In the case of the conventional method of depositing an active metal such as i, Zr, Cr powder, the adhesion strength of Ti, Zr, Cr powder, etc. is not sufficient just by depositing, and heating for metallization is inevitable. Requires processing.

【0029】これに対して、基盤用ロウ材料の一面にT
i,Zr,Cr粉等の活性金属を被着させる本発明接合
用ロウ材料の場合では、基盤用ロウ材料の方がセラミッ
クス部材より遥かに軟質である事から、Ti,Zr,C
r等は基盤用ロウ材料に十分よく馴染み且つ密着するた
め、過度の加圧力なしにTi,Zr,Cr粉等は、基盤
用ロウ材料に微細均一で高度に付着分散する。その結
果、接合用ロウ材構造の効果によりメタライジング化の
ための加熱処理を必要としないで良好な機密性と接合強
度を得る。
On the other hand, T is formed on one surface of the base brazing material.
In the case of the joining brazing material of the present invention for depositing an active metal such as i, Zr, Cr powder, the base brazing material is much softer than the ceramic member, so that Ti, Zr, C is used.
Since r and the like are sufficiently well-adhered to and adhere to the base brazing material, Ti, Zr, Cr powder and the like are finely and uniformly adhered and dispersed to the base brazing material without excessive pressing force. As a result, due to the effect of the brazing material structure for joining, good heat tightness and joining strength can be obtained without the need for heat treatment for metalizing.

【0030】(3)本発明の接合用ロウ材料では、T
i,Zr,Cr粉等の接合補助成分は、平均粒子直径
(粒径)が0.01μm〜5μmの粒子状である。粒径
が0.01μm以下では、粉体の活性度が著しく大とな
りロウ材としての取扱いの点で技術的な困難さがある。
粒径が5μm以上では、Ti,Zr,Cr等の接合補助
成分の存在状態が粗な分布となり好ましくない。
(3) In the brazing material for bonding of the present invention, T
The bonding auxiliary component such as i, Zr, and Cr powder is in the form of particles having an average particle diameter (particle diameter) of 0.01 μm to 5 μm. When the particle size is 0.01 μm or less, the activity of the powder is remarkably high, and there is a technical difficulty in handling as a brazing material.
When the particle size is 5 μm or more, the existence state of the bonding auxiliary component such as Ti, Zr, Cr or the like becomes coarse distribution, which is not preferable.

【0031】(4)代表的な基盤用ロウ材料として、7
79℃の溶融温度を持つ共晶銀ロウ(72Wt%Ag−C
u合金)が知られている。本発明の接合用ロウ材料の代
表的構成は、例えば厚さ0.1mmの板状の共晶銀ロウ
板の一面(両面でも可)に、Ti,Zr,Cr粉等の接
合補助成分を付着させてなっている。しかし、本発明で
はこの構造に限定されるものではなく、前記共晶銀ロウ
の構成成分Ag,Cuを別々にAg薄板、Cu薄板とし
て、このAg薄板に(またはCu薄板)、Ti,Zr,
Cr粉等を被着して積層一体化した後、72Wt%Ag−
Cu合金となるようにしたロウ材構造としても良い。
(4) 7 as a typical base brazing material
Eutectic silver wax with a melting temperature of 79 ° C (72 Wt% Ag-C
u alloy) is known. The typical constitution of the brazing material for bonding of the present invention is, for example, that a bonding auxiliary component such as Ti, Zr, Cr powder is attached to one surface (both surfaces are acceptable) of a plate-shaped eutectic silver brazing plate having a thickness of 0.1 mm. I am allowed to. However, the present invention is not limited to this structure, and the constituents Ag and Cu of the eutectic silver wax are separately prepared as Ag thin plates and Cu thin plates, and the Ag thin plates (or Cu thin plates), Ti, Zr,
72 Wt% Ag-
A brazing material structure made of a Cu alloy may be used.

【0032】基盤用ロウ材料としては銀系ロウ材料に限
ることはなく、本発明の接合用ロウ材料を採ることによ
って、Au系ロウ材,Pd系ロウ材,Pt系ロウ材,C
u系ロウ材,Ni系ロウ材であってもよい。
The base brazing material is not limited to the silver brazing material, but by adopting the joining brazing material of the present invention, Au based brazing material, Pd based brazing material, Pt based brazing material, C
It may be a u-based brazing material or a Ni-based brazing material.

【0033】(5)セラミックス部材の被接合面へT
i,Zr,Cr粉等の活性金属を被着させる従来法の場
合では、セラミックス部材の被接合面へ行うバインダ塗
布作業時にバインダが所定接合部分以外にも付着しやす
く、必要箇所以外に活性金属粉が被着する結果となる。
更に、活性金属粉は有機溶剤によってペースト状態とし
ているため、有機溶剤の濃度によってはセラミックス部
材の被接合面の所定接合部分以外にも流出する場合があ
り、同様に必要箇所以外に活性金属粉が被着する結果と
なる。これらを防止する方法として、従来法では接合不
必要部分に繁雑なマスキングを施している。本発明のロ
ウ材料では、接合必要部分にのみロウ材料が配置される
ので、工程の簡略化、信頼性向上が得られている。
(5) T to the surface to be joined of the ceramic member
In the case of the conventional method of depositing an active metal such as i, Zr, or Cr powder, the binder is likely to adhere to a portion other than the predetermined joint portion during the binder coating work performed on the joint surface of the ceramic member, and the active metal is not attached to a necessary portion. This results in the deposition of powder.
Furthermore, since the active metal powder is in a paste state with an organic solvent, it may flow out to a portion other than a predetermined joint portion of the surfaces to be joined of the ceramic member depending on the concentration of the organic solvent. Will result in deposition. As a method for preventing these, in the conventional method, complicated masking is applied to the unnecessary portions. In the brazing material of the present invention, the brazing material is arranged only in the bonding-required portions, so that the process is simplified and the reliability is improved.

【0034】(6)セラミックス部材の被接合面へT
i,Zr,Cr粉等の活性金属を被着させる従来法の場
合では、前記の様にペースト、有機溶剤を使用している
ので、加熱炉、排気装置の内部、被接合物の表面の汚染
が避けられないが、本発明方法ではペースト、有機溶剤
を使用していないため、これらの心配は生じない。
(6) T to the surface to be joined of the ceramic member
In the case of the conventional method of depositing an active metal such as i, Zr, or Cr powder, since the paste and the organic solvent are used as described above, the inside of the heating furnace, the exhaust device, and the surface of the article to be joined are contaminated. However, since no paste or organic solvent is used in the method of the present invention, these concerns do not occur.

【0035】(7)ロウ材面への活性金属の付着強度
は、ロウ材料としての安定性に影響を与えるため、ろう
付け接合後の接合強さ、気密性に重要である。この活性
金属の付着強度に及ぼす要因の1つとして、活性金属の
清浄度、被付着面の清浄度があげられる。しかし、一般
にセラミックス表面を完全に清浄化する事は困難である
上に、通常セラミックスは金属との濡れ性が著しく劣
る。このため、被付着面が従来法の場合に用いているセ
ラミックス部材では、付着強度が劣る。一方、被付着面
として本発明が対象としているロウ材料(金属)では、
良い濡れ性を示す事から、前記セラミックス部材に対す
るより高い付着強度を持つので、安定した接合結果が得
られる。次いで、本発明の接合用ロウ材構造を得る方法
などについて説明する。本発明の接合用ロウ材料の要旨
は、ロウ材の少なくとも一表面に、接合補助成分を微細
均一で高度に分散付着させてなる事にある。したがっ
て、どのような条件の接合補助成分を、どのような手段
で基盤用ロウ材表面に付着させて、接合用ロウ材構造と
するかがポイントである。
(7) The adhesion strength of the active metal to the brazing material surface affects the stability as a brazing material, and is therefore important for the bonding strength and airtightness after brazing. One of the factors affecting the adhesion strength of the active metal is the cleanliness of the active metal and the cleanliness of the adhered surface. However, in general, it is difficult to completely clean the surface of ceramics, and usually ceramics have remarkably poor wettability with metals. For this reason, the adhesion strength is inferior in the ceramic member used in the conventional method for the adherend surface. On the other hand, with the brazing material (metal) targeted by the present invention as the surface to be adhered,
Since it has good wettability, it has a higher adhesion strength to the ceramic member, so that a stable joining result can be obtained. Next, a method for obtaining the joining brazing material structure of the present invention will be described. The gist of the brazing material for bonding of the present invention is that a bonding auxiliary component is finely and uniformly dispersed at a high degree on at least one surface of the brazing material. Therefore, the point is what kind of condition the joining auxiliary component is made to adhere to the surface of the base brazing material to form the joining brazing material structure.

【0036】前記の様に、基盤用ロウ材の一表面にある
接合補助成分は、Ti,Zr,Crなど平均粒子直径が
0.01μm〜5μmの粒子状の活性金属粉より成る。
この様な条件の接合補助成分は、Ti,Zr,Crを蒸
気状とした後、別途用意した基盤用ロウ材板(Ag−C
u板等)、又は基盤用ロウ材構成成分板(Ag−板、C
u板等)に誘導し凝固,被着させる。活性金属を蒸気状
とする手段は、高エネルギー密度のビーム、例えばエレ
クトロンビーム加熱、レーザ加熱やアーク加熱、抵抗加
熱などのように、所定の蒸気温度を得る事ができれば良
く、加熱の手段は問題としない。加熱の雰囲気は、活性
金属が酸化燃焼するのを防止するために、真空中、高純
度ガス中など不活性雰囲気中で行う。
As described above, the joining auxiliary component on one surface of the base brazing material is made of particulate active metal powder such as Ti, Zr, Cr having an average particle diameter of 0.01 μm to 5 μm.
The joining auxiliary components under such conditions are made of vaporized Ti, Zr, and Cr, and then prepared separately as a base brazing material plate (Ag-C).
u plate, etc.) or base brazing material component plate (Ag-plate, C)
u plate, etc.) to solidify and adhere. The means for vaporizing the active metal is a high energy density beam, such as electron beam heating, laser heating, arc heating, resistance heating, etc., as long as it can obtain a predetermined vapor temperature, and the heating means is a problem. Not. The heating atmosphere is an inert atmosphere such as a vacuum or a high-purity gas in order to prevent oxidative combustion of the active metal.

【0037】なお、活性金属粉の被着量は気密性、接合
強度の確保に極めて重要であって、前記Ti,Zr,C
rの蒸気温度、蒸発源から基盤用ロウ材板付着面までの
移送距離・時間、基盤用ロウ材板付着面の温度などによ
って制御する。
The amount of active metal powder deposited is extremely important for ensuring airtightness and bonding strength.
It is controlled by the vapor temperature of r, the transfer distance and time from the evaporation source to the base brazing material plate adhering surface, and the temperature of the base brazing material plate adhering surface.

【0038】ところで、原材料となる活性金属とこれを
被着させる基盤用ロウ材板とを同一の容器室内に配置し
ても良く、またはこれらを別個の容器室内に配置して容
器室間を連結部で接続するように配置した構成としても
良い。
By the way, the active metal as a raw material and the base brazing material plate to which the active metal is adhered may be arranged in the same container chamber, or they may be arranged in separate container chambers to connect the container chambers. It is also possible to adopt a configuration in which they are arranged so as to be connected by parts.

【0039】また、蒸発源から基盤用ロウ材板付着面へ
の誘導中の活性金属に対して、電界、磁界、気体などを
印加して移送中の活性金属を加速させることは、ロウ材
板付着面への活性金属の付着量や付着分布を制御した
り、付着強度を高めたりするのに有効となる。
Further, to accelerate the active metal being transferred by applying an electric field, a magnetic field, a gas or the like to the active metal being guided from the evaporation source to the base brazing material plate adhering surface, It is effective in controlling the amount and distribution of the active metal deposited on the adhesion surface and enhancing the adhesion strength.

【0040】この様にして、活性金属を蒸発源から基盤
用ロウ材板付着面へ移送被着させることによって得たロ
ウ材板付着面の活性金属粉は、ロウ付け作業に好ましい
程度の清浄度と活性度とを維持している。活性金属粉を
セラミックス部材の被接合面に塗布する従来法、あるい
はロウ材板に塗布する方法では、ロウ付け作業に好まし
い程度の清浄度と活性度とを確保することができない。
In this way, the active metal powder on the brazing material plate adhering surface obtained by transferring and depositing the active metal from the evaporation source to the base brazing material plate adhering surface has a cleanliness level suitable for brazing work. And maintain activity. The conventional method of applying the active metal powder to the surfaces to be joined of the ceramic member, or the method of applying the active material powder to the brazing material plate cannot secure the cleanliness and the activity which are preferable for the brazing work.

【0041】[0041]

【実施例】実施例を説明する前に、評価方法について説
明する。
EXAMPLES Before explaining the examples, the evaluation method will be described.

【0042】接合強度、気密性の評価方法として、気密
性の評価は、製作した40本の気密容器の総てについ
て、製作直後の気密容器内部の真空度測定、30日間放
置後の気密容器内部の真空度測定を行い、気密性を判断
した。
As a method for evaluating the bonding strength and the airtightness, the airtightness was evaluated by measuring the vacuum degree inside the airtight container immediately after the production for all of the 40 airtight containers produced, and the inside of the airtight container after being left for 30 days. The degree of vacuum was measured to determine the airtightness.

【0043】評価接合強度の評価は、気密性の評価が終
了してから実施する。アルミナ円筒の上端面の42%N
i−Fe合金円板と下端面の42%Ni−Fe合金円板
とに、予め溶接法で取付けてある引張り金具をインスト
ロン万能試験機で引張りテストを行い、その破壊強さ、
破壊箇所、破壊破面状況によって、接合強度を判断し
た。破壊破面状況などは、先の気密性評価の判断の参考
にもする。以下、本発明の実施例を表1〜表4を参照し
て説明する。(実施例:1〜3,比較例:1〜3)
Evaluation The bonding strength is evaluated after the airtightness is evaluated. 42% N of the top surface of the alumina cylinder
Tensile metal fittings preliminarily attached by a welding method to the i-Fe alloy disk and the lower end 42% Ni-Fe alloy disk were subjected to a tensile test with an Instron universal testing machine, and their breaking strength,
The joint strength was judged based on the fracture location and fracture surface condition. The fracture surface condition is also referred to in the judgment of the airtightness evaluation. Hereinafter, examples of the present invention will be described with reference to Tables 1 to 4. (Examples: 1 to 3, comparative examples: 1 to 3)

【0044】(1)金属部材として、接合時の熱応力を
低減するために、熱膨張率がセラミックスのそれと近似
している直径60mm、厚さ7mmの42%Ni−Fe
合金製の円板を用意する。一方の円板には排気用コック
を備え、他方は円板のままとして1対とした。 (2)セラミックス部材として、端面の表面粗さを0.
1μmに仕上げた外径60mm、肉厚5mmで純度9
6.2%のテスト用アルミナ円筒を用意する。
(1) As a metal member, in order to reduce the thermal stress at the time of joining, 42% Ni-Fe having a diameter of 60 mm and a thickness of 7 mm whose coefficient of thermal expansion is similar to that of ceramics.
Prepare an alloy disc. One disc was equipped with an exhaust cock, and the other disc was left as a pair to form a pair. (2) As a ceramic member, the surface roughness of the end face is 0.
Finished to 1 μm, outer diameter 60 mm, wall thickness 5 mm, purity 9
Prepare a 6.2% test alumina cylinder.

【0045】(3)基盤用ロウ材料として、水素雰囲気
中で熱処理して表面を清浄化した厚さ0.1mm、外径
60mm、内径50mmの共晶銀ロウ板(JIS,BA
G−8、組成72%Ag−Cu)を用意する。
(3) As a base brazing material, a eutectic silver brazing plate (JIS, BA) having a thickness of 0.1 mm, an outer diameter of 60 mm and an inner diameter of 50 mm, the surface of which has been cleaned by heat treatment in a hydrogen atmosphere.
G-8, composition 72% Ag-Cu) is prepared.

【0046】(4)接合用ロウ構造を有するロウ材料と
して、下記条件のロウ材を用意する。すなわち、真空容
器の中に設置した直径10mmで深さ5mmの被溶解原
料収納部を持つ水冷銅ルツボ中に高純度スポンジTiを
入れ、電子ビーム照射によってTiを約2000℃〜2
200℃(ルツボの温度)に加熱した。蒸発したTi蒸
気を前記ロウ材料面に被着させて、新規の接合用ロウ構
造を得た。被着面を走査型電子顕微鏡で観察したとこ
ろ、そのTi粒子形状はほぼ球形を呈し、且つその平均
的大きさは、約0.01〜0.1μmの直径を有してい
た(実施例−1)電子ビームの照射エネルギー、ルツボ
/ロウ材料間の距離、真空度を調節しながらルツボの温
度を約1800℃〜2600℃の間で変化させ、Ti粒
子を前記共晶銀ロウ板上に被着させ観察したところ、各
Ti粒子は平均的大きさが約0.01μm以下(比較例
−1)、約0.1〜1μm(実施例−2)、1〜5μm
(実施例−3)、及び5μm以上(比較例−2)である
接合用ロウ構造のロウ材料を得た。参考として、セラミ
ックス部材にTi粉を塗布する従来法によって同様の気
密容器を製作した。(比較例−3)。
(4) A brazing material having the following conditions is prepared as a brazing material having a brazing structure for joining. That is, high-purity sponge Ti was placed in a water-cooled copper crucible having a melted raw material storage portion having a diameter of 10 mm and a depth of 5 mm installed in a vacuum container, and the Ti was irradiated with an electron beam to a temperature of about 2000 ° C to 2 ° C.
It was heated to 200 ° C. (crucible temperature). Evaporated Ti vapor was deposited on the brazing material surface to obtain a new brazing structure for bonding. When the surface to be adhered was observed by a scanning electron microscope, the shape of the Ti particles was almost spherical, and the average size thereof was about 0.01 to 0.1 μm (Example- 1) The temperature of the crucible was changed between about 1800 ° C. and 2600 ° C. while adjusting the irradiation energy of the electron beam, the distance between the crucible / wax material, and the degree of vacuum, and the Ti particles were coated on the eutectic silver brazing plate. When deposited and observed, each Ti particle has an average size of about 0.01 μm or less (Comparative Example-1), about 0.1 to 1 μm (Example-2), 1 to 5 μm.
(Example-3) and a brazing material having a brazing structure for bonding having a thickness of 5 μm or more (Comparative Example-2) were obtained. As a reference, a similar airtight container was manufactured by a conventional method of applying Ti powder to a ceramic member. (Comparative example-3).

【0047】また、ロウ接合作業については次の通りで
ある。すなわち、高周波加熱コイルを備えた真空容器の
中に、前記セラミックス部材(アルミナ円筒)の上端面
と下端面とを前記金属部材(42%Ni−Fe合金円
板)で蓋をするようにして設置した。セラミックス部材
と金属部材との間に、前記接合用構造を有する各ロウ材
料を別々に挿入配置し、気密容器を製作した(セラミッ
クス部材/ロウ材料/金属部材なる構成)。配置に際し
ては、片面のみにTi被着を施したロウ材料において
は、Ti被着面がセラミックス部材と接するように配置
した。真空度10-6Torr温度830℃なる条件で容
器内部を排気しながらロウ接合作業を行ない、気密容器
を製作した。同様の条件で40本の気密容器を製作した
が、製作時における環境問題などは何ら生じなかった。
得られた気密容器について、アルミナ円筒と42%Ni
−Fe合金円板との間の接合強度、気密性について評価
し、その結果を表に示した。
The soldering work is as follows. That is, the ceramic member (alumina cylinder) is placed in a vacuum container equipped with a high-frequency heating coil so that the upper end surface and the lower end surface of the ceramic member are covered with the metal member (42% Ni—Fe alloy disc). did. Each brazing material having the above-mentioned bonding structure was separately inserted and arranged between the ceramic member and the metal member to manufacture an airtight container (ceramic member / brazing material / metal member). In the disposition, in the brazing material having only one surface coated with Ti, the brazing material was disposed so that the surface coated with Ti was in contact with the ceramic member. An airtight container was manufactured by performing a brazing process while exhausting the inside of the container under the condition that the degree of vacuum was 10 −6 Torr and the temperature was 830 ° C. Forty airtight containers were produced under the same conditions, but no environmental problems occurred during production.
About the obtained airtight container, alumina cylinder and 42% Ni
The bonding strength with the -Fe alloy disc and the airtightness were evaluated, and the results are shown in the table.

【0048】活性金属の粒径が約0.01μm〜5μm
の範囲で良好な接合強度、気密性を示した(実施例:1
〜3)。しかし、活性金属の粒径が約0.01μm以下
の場合には、接合強度が十分でない上に気密性も著しく
劣った。接合後の界面の調査の結果、活性金属が微細過
ぎたことに起因した活性金属の量的な不足が原因と考え
られた(比較例:1)。一方、活性金属の粒径が約5μ
m以上の場合にも、30日間放置後に少量のリークが発
見された(比較例:1)。
The particle size of the active metal is about 0.01 μm to 5 μm.
In the range of, good bonding strength and airtightness were exhibited (Example: 1
~ 3). However, when the particle diameter of the active metal is about 0.01 μm or less, the bonding strength is not sufficient and the airtightness is significantly deteriorated. As a result of examination of the interface after joining, it was considered that the active metal was too fine and the quantitative lack of the active metal was the cause (Comparative Example: 1). On the other hand, the particle size of the active metal is about 5μ
Even in the case of m or more, a small amount of leak was found after standing for 30 days (Comparative Example: 1).

【0049】参考として、ポリビニールアルコールのエ
チレングリコール溶液中に混合した直径1μmのTi粉
を、前記セラミックス部材(アルミナ円筒)の上端面と
下端面とに塗布した。セラミックス部材を前記金属部材
(42%Ni−Fe合金円板)で、蓋をするようにして
設置、セラミックス部材端面と金属部材との間に共晶銀
ロウ板(JIS,BAG−8)を挿入配置した後、真空
度10-6Torr.温度830℃なる条件で容器内部を
排気しながらロウ接合作業を行ない、気密容器を製作し
た。同様の条件で40本の気密容器を製作した。得られ
た気密容器について、アルミナ円筒と42%Ni−Fe
合金円板との間の接合強度、気密性について評価した
(比較例:3)が、特性的には問題がなかった。しか
し、製作時に使用したバインダ(ポリビニールアルコー
ルのエチレングリコール溶液)による真空炉内部の汚染
や有機溶剤(エタノール)による真空炉室周辺の環境汚
染が生じ、好ましくない。(実施例:4〜6)
As a reference, Ti powder having a diameter of 1 μm mixed in an ethylene glycol solution of polyvinyl alcohol was applied to the upper end surface and the lower end surface of the ceramic member (alumina cylinder). A ceramic member is installed with the metal member (42% Ni-Fe alloy disc) as a lid, and a eutectic silver brazing plate (JIS, BAG-8) is inserted between the end face of the ceramic member and the metal member. After the placement, the degree of vacuum is 10 −6 Torr. A brazing process was performed while exhausting the inside of the container at a temperature of 830 ° C. to manufacture an airtight container. Forty airtight containers were manufactured under the same conditions. About the obtained airtight container, an alumina cylinder and 42% Ni-Fe
The bonding strength with the alloy disc and the airtightness were evaluated (Comparative Example: 3), but there was no problem in terms of characteristics. However, this is not preferable because the inside of the vacuum furnace is contaminated by the binder (ethylene glycol solution of polyvinyl alcohol) used at the time of manufacture and the environment around the vacuum furnace chamber is caused by the organic solvent (ethanol). (Example: 4 to 6)

【0050】前記実施例(1〜3),比較例(1〜3)
では、水冷銅ルツボ中にTiのみをいれたケースについ
て示したが、本発明ではこれに限ることなく、Tiと共
に他の構成元素、例えばAg,Cuなどを一緒に混合し
て同様な操作によってTi、Ag,Cuなどを同時に被
着させた接合用ロウ構造を有するロウ材料としても良い
(実施例:4)。この場合においても、被着した粒子直
径は、前記活性金属Tiと同時の0.01〜5μmの範
囲が好ましい。
Examples (1 to 3) and Comparative Examples (1 to 3)
In the above, the case where only Ti was put in the water-cooled copper crucible was shown, but the present invention is not limited to this, and Ti and other constituent elements such as Ag and Cu are mixed together, and Ti is obtained by the same operation. , Ag, Cu, etc. may be simultaneously deposited to form a brazing material having a brazing structure for bonding (Example: 4). Also in this case, the diameter of the deposited particles is preferably in the range of 0.01 to 5 μm at the same time as the active metal Ti.

【0051】前記実施例:4では、1個の水冷銅ルツボ
中にTiとAg,Cuとを同時に入れて加熱したケース
について示したが、TiとAg,Cuとでは蒸気圧が大
幅に異なっているため、基盤用ロウ材料上の被着状況
(比率、被着量)が一定とならず、ある程度各々の蒸発
速度を制御させる事を要した。これに対して、水冷銅ル
ツボを複数個設置する方法によれば、各ルツボの加熱温
度を制御する事によって基盤用ロウ材料上の被着状況を
容易に制御できる(実施例:5)。
In the above-mentioned Example 4, the case was shown in which Ti, Ag, and Cu were put into one water-cooled copper crucible at the same time and heated, but the vapor pressures were significantly different between Ti, Ag, and Cu. Therefore, the deposition condition (ratio, deposition amount) on the base brazing material was not constant, and it was necessary to control each evaporation rate to some extent. On the other hand, according to the method of installing a plurality of water-cooled copper crucibles, the deposition condition on the base brazing material can be easily controlled by controlling the heating temperature of each crucible (Example 5).

【0052】一方、前記実施例:4〜5では、複数個の
水冷銅ルツボを同時に加熱させて接合用ロウ構造を有す
るロウ材料を製作したが、本発明のロウ材料はこの様に
同時に加熱させて製作するのみでなく、別々に被着させ
ても良い。すなわち、一方の水冷銅ルツボにTiを入
れ、別のルツボにNiを入れ、初めにTiを基盤用ロウ
材料上に被着し、所定時間後NiをTiの上に被着させ
る。これによって基盤用ロウ材料上に被着した活性度の
高いTiを安定化させることができる(実施例:6)。
(実施例:7〜8)
On the other hand, in the above-mentioned Examples 4 to 5, a plurality of water-cooled copper crucibles were simultaneously heated to produce a brazing material having a brazing structure for joining. However, the brazing material of the present invention is simultaneously heated in this way. Not only can it be manufactured, but it can also be attached separately. That is, Ti is put in one water-cooled copper crucible, Ni is put in another crucible, Ti is first deposited on the base brazing material, and after a predetermined time, Ni is deposited on Ti. This makes it possible to stabilize highly active Ti deposited on the base brazing material (Example: 6).
(Example: 7-8)

【0053】前記実施例:1〜5,比較例:1〜3で
は、活性金属としてTiを代表例として示したが、本発
明の接合用ロウ構造を有するロウ材料はTiに限ること
なく、Zr,Crであっても、ほぼ同等の接合強度、気
密性を得る事ができる(実施例:7〜8)。(実施例:
9〜12)
In the above Examples: 1 to 5 and Comparative Examples: 1 to 3, Ti was shown as a representative example, but the brazing material having the brazing structure for bonding of the present invention is not limited to Ti, and Zr may be used. , Cr, it is possible to obtain almost the same bonding strength and airtightness (Examples: 7 to 8). (Example:
9-12)

【0054】前記実施例:1〜8,比較例:1〜3で
は、基盤用ロウ材料として共晶銀ロウ板を代表例として
示したが、本発明の接合用ロウ構造を有するロウ材料は
基盤用ロウ材料としてAg系ロウ材に限ることなく、A
u系ロウ材,Pd系ロウ材,Pt系ロウ材,Cu系ロウ
材,Ni系ロウ材であっても、接合強度、気密性に対し
て同様の効果を得る事ができる(実施例:9〜12)。
In the above Examples: 1 to 8 and Comparative Examples: 1 to 3, the eutectic silver brazing plate was shown as a typical example as the base brazing material, but the brazing material having the bonding brazing structure of the present invention is the base. The brazing material for use is not limited to Ag-based brazing material,
Even if it is a u-based brazing material, a Pd-based brazing material, a Pt-based brazing material, a Cu-based brazing material, or a Ni-based brazing material, the same effect can be obtained with respect to the bonding strength and airtightness (Example: 9). ~ 12).

【0055】[0055]

【表1】 [Table 1]

【0056】[0056]

【表2】 [Table 2]

【0057】[0057]

【表3】 [Table 3]

【0058】[0058]

【表4】 [Table 4]

【0059】[0059]

【発明の効果】以上のように第1の発明によれば、基盤
用ロウ材料の少なくとも一面に、Ti,Zr,Crのう
ち少なくとも1種からなる接合補助成分を微細均一で高
度に分散付着させたので、メタライジングを不要とし、
接合強度と気密接合性、環境保全に優れた接合用ロウ材
料を得ることができる。
As described above, according to the first aspect of the present invention, the bonding auxiliary component composed of at least one of Ti, Zr and Cr is finely and uniformly dispersed and adhered to at least one surface of the base brazing material. So no need for metalizing,
It is possible to obtain a brazing material for bonding which is excellent in bonding strength, airtight bonding and environmental protection.

【0060】また第2発明によれば、Ti,Zr,Cr
のうち少なくとも1種からなる接合補助成分を不活性雰
囲気中で加熱し、この加熱した接合補助成分を基盤用ロ
ウ材料に被着させたので、製造工程を簡略化でき、前述
のような接合用ロウ材料を得ることができる。
According to the second invention, Ti, Zr, Cr
At least one of the bonding auxiliary components is heated in an inert atmosphere, and the heated bonding auxiliary component is applied to the base brazing material, so that the manufacturing process can be simplified and the bonding A brazing material can be obtained.

Claims (8)

【特許請求の範囲】[Claims] 【請求項1】 基盤用ロウ材料の少なくとも一面に、T
i,Zr,Crのうち少なくとも1種からなる接合補助
成分を微細均一で高度に分散付着させたことを特徴とす
る接合用ロウ材料。
1. A T material on at least one surface of a base brazing material.
A brazing material for joining characterized in that a joining auxiliary component comprising at least one of i, Zr and Cr is finely and uniformly dispersed and adhered.
【請求項2】 前記接合補助成分は、平均粒径が0.0
1〜5μmの粒子状であることを特徴とする請求項1記
載の接合用ロウ材料。
2. The bonding auxiliary component has an average particle size of 0.0.
The brazing material for bonding according to claim 1, wherein the brazing material has a particle size of 1 to 5 μm.
【請求項3】 前記接合補助成分は、平均粒径が0.0
1〜5μmの粒子状である前記基盤用ロウ材料の成分を
含有してることを特徴とする請求項1または請求項2の
いずれかに記載の接合用ロウ材料。
3. The bonding auxiliary component has an average particle size of 0.0.
The brazing material for joining according to claim 1 or 2, which contains the component of the brazing material for a substrate in the form of particles of 1 to 5 µm.
【請求項4】 前記基盤用ロウ材料の成分のうち、少な
くとも1成分の一面に、前記接合補助成分を均一で高度
に分散付着させたことを特徴とする請求項1〜請求項3
のいずれかに記載の接合用ロウ材料。
4. The bonding auxiliary component is uniformly and highly dispersed and adhered to one surface of at least one of the components of the base brazing material.
The brazing material for joining according to any one of 1.
【請求項5】 前記基盤用ロウ材料は、金属薄板状、線
状または粉状のいずれかの形態のAg系ロウ材,Au系
ロウ材,Pd系ロウ材,Pt系ロウ材,Cu系ロウ材,
Niロウ材の群から選択された1種であることを特徴と
する請求項1〜請求項4のいずれかに記載の接合用ロウ
材料。
5. The base brazing material is an Ag brazing material, an Au brazing material, a Pd brazing material, a Pt brazing material, a Cu brazing material in any of a thin metal plate shape, a linear shape or a powder shape. Material,
The brazing material for joining according to any one of claims 1 to 4, which is one kind selected from the group of Ni brazing materials.
【請求項6】 前記接合補助成分は、保護層が形成され
ていることを特徴とする請求項1〜請求項5のいずれか
に記載の接合用ロウ材料。
6. The bonding brazing material according to claim 1, wherein the bonding auxiliary component has a protective layer formed thereon.
【請求項7】 基盤用ロウ材料の少なくとも一面に、T
i,Zr,Crのうち少なくとも1種からなる接合補助
成分を微細均一で高度に分散付着させた接合用ロウ材料
の製造方法であって、前記接合補助成分を不活性雰囲気
中で加熱し、この加熱した接合補助成分を前記基盤用ロ
ウ材料に被着させたことを特徴とする接合用ロウ材料の
製造方法。
7. A T material on at least one surface of the base brazing material.
A method for producing a brazing material for bonding, in which a bonding auxiliary component comprising at least one of i, Zr, and Cr is finely and uniformly dispersed and adhered, wherein the bonding auxiliary component is heated in an inert atmosphere. A method for producing a brazing material for bonding, characterized in that a heated bonding auxiliary component is applied to the brazing material for a substrate.
【請求項8】 前記加熱した接合補助成分に電界,磁界
または気体を印加して、前記基盤用ロウ材料に被着させ
たことを特徴とする請求項7記載の接合用ロウ材料の製
造方法。
8. The method of manufacturing a brazing material for bonding according to claim 7, wherein an electric field, a magnetic field or a gas is applied to the heated auxiliary component for bonding to deposit the brazing material for substrate.
JP2952493A 1993-02-19 1993-02-19 Soldering material for joining and its production Pending JPH06239668A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2952493A JPH06239668A (en) 1993-02-19 1993-02-19 Soldering material for joining and its production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2952493A JPH06239668A (en) 1993-02-19 1993-02-19 Soldering material for joining and its production

Publications (1)

Publication Number Publication Date
JPH06239668A true JPH06239668A (en) 1994-08-30

Family

ID=12278500

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100355119B1 (en) * 1999-07-12 2002-10-11 미쓰비시덴키 가부시키가이샤 Insulating operating rod and manufacturing method therefor
US7047635B2 (en) * 2000-03-15 2006-05-23 Matsushita Electric Industrial Co., Ltd. Connecting material and connecting method
CN115026458A (en) * 2022-06-17 2022-09-09 温州宏丰电工合金股份有限公司 Ag-based alloy powder slurry, Ag-based alloy active solder and preparation method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100355119B1 (en) * 1999-07-12 2002-10-11 미쓰비시덴키 가부시키가이샤 Insulating operating rod and manufacturing method therefor
US7047635B2 (en) * 2000-03-15 2006-05-23 Matsushita Electric Industrial Co., Ltd. Connecting material and connecting method
CN115026458A (en) * 2022-06-17 2022-09-09 温州宏丰电工合金股份有限公司 Ag-based alloy powder slurry, Ag-based alloy active solder and preparation method thereof

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