JPH06224328A - Resin composition for sealing semiconductor - Google Patents

Abstract

PURPOSE:To increase the content of a filling material without damaging the fluidity of a semiconductor sealing resin composition and upgrade thermal expansion characteristics, thermal condition properties, moisture absorption resistance and bending strength. CONSTITUTION:The particle size distribution of a filling material blended in epoxy resin is specified: loads of the material whose particle size exceeds 48mum are 25wt.%, what is more, loads of the material whose particle sizes are below 48mum but 24mum and over, below 24mum but 12mum and over, below 12mum but 6mum and over, below 6mum but 3mum and over, below 3mum but 1.5mum and over, and below 1.5mum must range from 7 to 25wt.% respectively.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition used as a sealing material for electronic parts such as semiconductors.

[0002]

2. Description of the Related Art In recent years, in the field of electronic equipment, there is a strong demand for lightness, thinness, shortness, and miniaturization, and the use of surface mount devices characterized by small size and thinness has become dominant. And, along with this, the resin composition for encapsulation for resin encapsulating the semiconductor chip has low thermal expansion property, high thermal conductivity, high moisture absorption resistance,
Characteristics such as high bending strength are strongly demanded.

Particularly, in a thin package, when exposed to a high temperature during solder reflow while absorbing moisture, cracks easily occur due to the water vapor pressure generated inside, and it is the most important issue to suppress it. .

As one of effective measures against this problem, the content of the filler is increased. This is the most balanced measure that can prevent the occurrence and propagation of reflow cracks by reducing the amount of moisture absorption, improving the thermal expansion characteristics and increasing the bending strength. Furthermore, since this method can also improve the heat conduction characteristics, it can be said that this method can improve all of the above-mentioned characteristics such as thermal expansion, heat conductivity, moisture absorption resistance, and bending strength.

[0005]

However, when the content of the filler in the resin composition is increased, the fluidity of the resin composition is lowered, and a sealing failure occurs in the sealing step, and the manufacturing efficiency is improved. There was a problem that it decreased. Therefore, at present, the content of the filler is limited to about 70% in terms of volume percentage, and the above-mentioned improvement of the characteristics of the resin composition for semiconductor encapsulation was insufficient.

[0006] Therefore, an object of the present invention is to provide a resin composition for semiconductor encapsulation which is excellent in thermal expansion property, thermal conductivity, moisture absorption resistance and bending strength and is excellent in fluidity. .

[0007]

In order to solve the above-mentioned problems, in the present invention, in the resin composition for semiconductor encapsulation containing an epoxy resin and a filler as main components, the filler is (a). The blending amount of particles having a particle diameter of 48 μm or more is 25% by weight or less, (b) the blending amount of particles having a particle diameter of less than 48 μm of 24 μm or more is 7 to 25% by weight, and (c) the blending amount of particles having a particle diameter of less than 24 μm and 12 μm or more is 7 to 25% by weight,
(D) 7 to 25% by weight of a compound having a particle size of less than 12 μm and 6 μm or more, (e) 7 to 25% by weight of a compound having a particle size of less than 6 μm and 3 μm or more, and (f) 1.5 μm of a particle size less than 3 μm. The compounding amount of the above is 7 to 25% by weight,
(G) The compounding amount of particles having a particle diameter of less than 1.5 μm is 7 to 25
% Particle size distribution.

In a preferred embodiment of the present invention, the filler is fused spherical silica.

[0009]

The present inventors have studied the fluidity of the resin composition for semiconductor encapsulation using various fillers, and as a result, the fluidity has a large particle size distribution regardless of the shape of the filler. It was found to have an effect.

That is, it was found that the highest fluidity was exhibited when the compounding amounts of the respective particle sizes of the filler were substantially equal. However, there is currently no industrially inexpensive method for producing a filler having a completely uniform particle size distribution, and therefore it is necessary to control the particle size distribution within an appropriate range in order to improve fluidity. was there.

The proper range of the particle size distribution found by the present inventors is that the compounding amount of particles having a particle size of 48 μm or more is 25% by weight.
And having a particle size of less than 48 μm and 24 μm or more, a particle size of less than 24 μm and 12 μm or more, a particle size of 1
Less than 2 μm and 6 μm or more, particle size less than 6 μm 3 μm
The above, those having a particle size of less than 3 μm and 1.5 μm or more,
In addition, the compounding amount of each of the particles having a particle diameter of less than 1.5 μm is 7
~ 25% by weight.

Here, when even one of the particle size classifications excluding those having a particle diameter of 48 μm or more is less than 7% by weight, or when even one of the particle size classifications exceeds 25% by weight. Liquidity is significantly reduced. Further, when the particles having a particle diameter of 48 μm or more are not contained, the fluidity is good, but the slit thickness of the resin composition for semiconductor encapsulation is 50.
Since the problem that the burr property is deteriorated when the particle diameter is more than μm occurs, it is necessary to add an appropriate amount of particles having a particle diameter of 48 μm or more. However, since the fluidity is reduced, the compounding amount is 25
It is limited to not more than weight%.

In addition to the epoxy resin and the filler, the semiconductor encapsulating resin composition usually contains a curing agent, a curing accelerator, a release agent, a modifier, a surface treatment agent and the like. However, in the present invention, the fluidity is improved by controlling the particle size distribution of the filler, and the compounding amount of the filler can be increased. Therefore, other compositions can be used conventionally.

[0014]

Example Using each component (unit: parts by weight) of the composition shown in Table 1, a composition of an example of the present invention was obtained. As a production method, each component was mixed by a crusher, and after roll kneading, it was cooled and pulverized into a 10 mesh pass product. In addition, a comparative example in which each component was prepared by the same method was also shown. The composition excluding the filler is the same as that of the inventive example and the comparative example.

[0015]

[Table 1]

Table 2 shows the particle size distribution of the filler used in terms of volume percentage (substantially equal to weight percentage). In the table, the spherical silica is obtained by crushing and adjusting the particle size distribution of fused silica to obtain a spherical shape, and the prismatic silica is obtained by crushing a fused silica ingot to adjust the particle size distribution.

[0017]

[Table 2]

Table 3 shows the results of evaluation of the fluidity of each of the resin compositions for semiconductor encapsulation shown in Table 1 by the spiral flow test, and the thermal expansion coefficient, thermal conductivity, moisture absorption rate and bending strength of each. The measurement results are shown.

[0019]

[Table 3]

As is apparent from Table 3, in the examples of the present invention, sufficient fluidity can be obtained even when the content of the filler is increased, and at the same time, the low thermal expansion property and the high thermal conductivity can be obtained. It is possible to obtain a resin composition for semiconductor encapsulation having high properties, high moisture absorption resistance, and high bending strength.

[0021]

According to the resin composition for semiconductor encapsulation of the present invention,
Since the content of the filler can be increased without impairing the fluidity, it is possible to obtain a highly reliable semiconductor package having excellent thermal expansion characteristics, thermal conductivity characteristics, moisture absorption resistance, and bending strength.

Claims (2)

[Claims] 1. A resin composition for semiconductor encapsulation comprising an epoxy resin and a filler as main components, wherein the filler is (a) 25% by weight of a particle diameter of 48 μm or more.
Hereinafter, (b) the compounding amount of particles having a particle diameter of less than 48 μm and 24 μm or more is 7 to 25% by weight, (c) the compounding amount of particles having a particle diameter of less than 24 μm and 12 μm or more is 7 to 25% by weight, and (d) particle diameter less than 12 μm and 6 μm The compounding amount of the above is 7 to 25% by weight, and (e) the compounding amount of the particle size of less than 6 μm and 3 μm or more is 7
-25% by weight, (f) 7 to 25% by weight of particles having a particle size of less than 3 μm and 1.5 μm or more, and (g) 7 to 25% of particles having a particle size of less than 1.5 μm.
A resin composition for semiconductor encapsulation, which has a particle size distribution of 10% by weight. 2. The resin composition for semiconductor encapsulation according to claim 1, wherein the filler is fused spherical silica.