JPH06217392A - Terminal structure for surface mount type electronic component - Google Patents
Terminal structure for surface mount type electronic componentInfo
- Publication number
- JPH06217392A JPH06217392A JP518993A JP518993A JPH06217392A JP H06217392 A JPH06217392 A JP H06217392A JP 518993 A JP518993 A JP 518993A JP 518993 A JP518993 A JP 518993A JP H06217392 A JPH06217392 A JP H06217392A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- package
- soldering
- groove
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Piezo-Electric Transducers For Audible Bands (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、配線基板上に表面実装
する表面実装型電子部品の端子構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal structure for a surface mount type electronic component which is surface mounted on a wiring board.
【0002】[0002]
【従来の技術】表面実装方式は、電子部品を、配線基板
上に盛り付けたクリーム半田上に搭載し、クリーム半田
を溶融させ、電子部品に備えた端子を基板上の溶融半田
に浸し、そのまま固化して実装を完了する方式である。
この方式に用いる電子部品には、パッケージの底面に端
子が設けられているのが通例であるが、底面より側方に
張り出して端子が設けられている例もある。2. Description of the Related Art In the surface mounting method, an electronic component is mounted on a cream solder placed on a wiring board, the cream solder is melted, and the terminals of the electronic component are dipped in the molten solder on the board and solidified as it is. This is the method to complete the implementation.
The electronic components used in this method usually have terminals provided on the bottom surface of the package, but there are also cases where terminals are provided so as to project laterally from the bottom surface.
【0003】[0003]
【発明が解決しようとする課題】ところで、表面実装型
電子部品においては、一般に端子の半田付け面の面積が
小さく、配線基板上への半田付けの確実性がしばしば問
題となっている。By the way, in the surface mount type electronic component, the area of the soldering surface of the terminal is generally small, and reliability of soldering on the wiring board is often a problem.
【0004】本発明の目的は、端子への半田付けの確実
性を増大させた表面実装型電子部品の端子構造を提供す
ることにある。An object of the present invention is to provide a terminal structure for a surface mount type electronic component in which reliability of soldering to the terminal is increased.
【0005】[0005]
【課題を解決するための手段】上記目的を達成するた
め、本発明による表面実装型電子部品の端子構造におい
ては、電子部品のパッケージに端子を有する表面実装型
電子部品の端子構造であって、パッケージは、底面一部
に溝を有し、端子は、パッケージ内の素子に電気的に接
続され、半田付け面を有し、半田付け面は、板状をな
し、パッケージの溝を覆って重ね合わされたものであ
り、突子と凹部とを有し、突子は、前記溝内に係合して
パッケージからの脱出を阻止する抜け止めであり、凹部
は、突子の切り起し、又は変形により半田付け面の他面
に形成され、実装時のクリーム半田を受入れる窪みであ
る。In order to achieve the above object, the terminal structure of a surface mount type electronic component according to the present invention is a terminal structure of a surface mount type electronic component having a terminal in a package of the electronic component. The package has a groove in a part of the bottom surface, the terminals are electrically connected to the elements in the package, and have a soldering surface, and the soldering surface has a plate shape and is overlapped by covering the groove of the package. The protrusion has a protrusion and a recess, and the protrusion is a retaining member that engages in the groove to prevent the protrusion from the package, and the recess cuts and raises the protrusion, or It is a recess that is formed on the other surface of the soldering surface by deformation and receives the cream solder during mounting.
【0006】[0006]
【作用】端子の半田付け面に設けた凹部は、電子部品を
実装する際に、溶融したクリーム半田を受け入れ、半田
はそのまま固化するため、半田付けが強固となり、ま
た、この凹部の反対側の面に形成される突子は、パッケ
ージの溝内に係合して端子抜け落ち防止のストッパーと
して機能する。The concave portion provided on the soldering surface of the terminal receives the melted cream solder when the electronic component is mounted, and the solder is solidified as it is, so that the soldering becomes firm and the concave portion on the opposite side of the concave portion is provided. The protrusion formed on the surface engages with the groove of the package and functions as a stopper for preventing the terminal from falling off.
【0007】[0007]
【実施例】以下に本発明の実施例を図によって説明す
る。実施例は、圧電型発音体に適用した例を示す。発音
体Mは、振動子に電気信号を入力して発音させる電子部
品である。図1において、パッケージ1内に圧電振動子
2が内蔵され、該圧電振動子2には端子3が接続されて
いる。Embodiments of the present invention will be described below with reference to the drawings. The embodiment shows an example applied to a piezoelectric speaker. The sounding body M is an electronic component that inputs an electric signal to a vibrator to generate sound. In FIG. 1, a piezoelectric vibrator 2 is built in a package 1, and a terminal 3 is connected to the piezoelectric vibrator 2.
【0008】パッケージ1は、ケース4と、底板5との
組立体である。ケース4は、無底の円筒状であり、上面
に放音孔6が開口され、底部開口縁に切欠き7の対を向
き合わせに有し、図2のように内周面には段部8が形成
されている。The package 1 is an assembly of a case 4 and a bottom plate 5. The case 4 has a bottomless cylindrical shape, a sound output hole 6 is opened on the upper surface, and a pair of cutouts 7 are faced to each other on the opening edge of the bottom. As shown in FIG. 8 is formed.
【0009】底板5は、ケース4の開口内に嵌合させる
円盤状をなし、周縁一部には、ケースの切欠き7内に係
合させる角型の突縁9を向き合わせに有し、突縁9を除
く周縁部には、ケース4内に係止させる立上り部10が
一体に形成されている。The bottom plate 5 has a disk shape to be fitted in the opening of the case 4, and has a rectangular projecting edge 9 to be engaged with the notch 7 of the case on a part of the peripheral edge so as to face each other. A rising portion 10 to be locked in the case 4 is integrally formed on the peripheral edge portion except the protruding edge 9.
【0010】突縁9は、端子3を係止させる部分であ
り、突縁に対応する底板5の底面には図2のように溝1
1が開口されている。The projecting edge 9 is a portion for locking the terminal 3, and the groove 1 is formed on the bottom surface of the bottom plate 5 corresponding to the projecting edge as shown in FIG.
1 is opened.
【0011】端子3は、取付部12と、圧電振動子2の
電極に接触させる弾接片13とを一体に有し、取付部1
2は、底板5の突縁9に係止させる部分であり、コ型に
折曲げられ、その下縁が半田付け面14である。半田付
け面14には、図2,図3のように板面一部を切り起
し、又は変形させて上面に突子15を突出させ、下面に
凹部16を形成させる。凹部16は、突子の切り起しに
より板面に形成された窪みである。The terminal 3 integrally has a mounting portion 12 and an elastic contact piece 13 for contacting the electrode of the piezoelectric vibrator 2, and the mounting portion 1
Reference numeral 2 denotes a portion to be locked to the projecting edge 9 of the bottom plate 5, which is bent in a U shape, and the lower edge thereof is the soldering surface 14. As shown in FIGS. 2 and 3, part of the plate surface of the soldering surface 14 is cut and raised or deformed to project the protrusion 15 on the upper surface and form the recess 16 on the lower surface. The concave portion 16 is a dent formed on the plate surface by cutting and raising the protrusion.
【0012】図2において、圧電振動子2をケース4に
内装し、底板5の各突縁9に端子3の取付部12を噛み
合わせて弾接片13を底板5上に傾斜姿勢で保持し、次
いで突縁9をケースの切欠き7内に嵌合させるととも
に、立上り部10をケース4内に嵌合させると、圧電振
動子2は、ケース4の段部8と、底板5の立上り部10
との間に保持され、圧電振動子2の各電極に弾接片13
が接触する。In FIG. 2, the piezoelectric vibrator 2 is housed in a case 4, and the projecting edges 9 of the bottom plate 5 are engaged with the mounting portions 12 of the terminals 3 to hold the elastic contact pieces 13 on the bottom plate 5 in an inclined posture. Then, when the projecting edge 9 is fitted in the notch 7 of the case and the rising portion 10 is fitted in the case 4, the piezoelectric vibrator 2 becomes the step portion 8 of the case 4 and the rising portion of the bottom plate 5. 10
And the elastic contact piece 13 is attached to each electrode of the piezoelectric vibrator 2.
Come into contact with.
【0013】一方、端子3の取付部12の上面側は、突
縁9に支えられてケース4の切欠き7の内縁に圧接さ
れ、下面側の半田付け面14は、底板5の下面に重ねら
れ、突子15が溝11内に嵌入して端子3の脱出が阻止
される。On the other hand, the upper surface side of the mounting portion 12 of the terminal 3 is supported by the projecting edge 9 and pressed against the inner edge of the notch 7 of the case 4, and the soldering surface 14 on the lower surface side is superposed on the lower surface of the bottom plate 5. As a result, the protrusion 15 is fitted into the groove 11 to prevent the terminal 3 from coming off.
【0014】実装に際しては、発音体Mを配線基板P上
に所定位置に所定圧力で搭載すると、配線基板上に印刷
されたクリーム半田が端子3の半田付け面14の凹部1
6内に侵入し、半田付け炉を通過後、半田がそのまま固
化して配線上に端子3が強固に結合される。In mounting, when the sounding body M is mounted on the wiring board P at a predetermined position with a predetermined pressure, the cream solder printed on the wiring board is recessed in the soldering surface 14 of the terminal 3.
After penetrating into 6 and passing through the soldering furnace, the solder is solidified as it is, and the terminal 3 is firmly bonded onto the wiring.
【0015】以上実施例においては、圧電型発音体のパ
ッケージに適用した例について説明したが、本発明は、
一般の半導体素子,サーミスタ,バリスタはもとより、
抵抗器その他の素子のパッケージにも全く同様に適用で
きる。In the above embodiments, the example applied to the package of the piezoelectric type sounding body has been described.
In addition to general semiconductor devices, thermistors, and varistors,
The same applies to packages of resistors and other devices.
【0016】[0016]
【発明の効果】以上のように本発明によるときには、パ
ッケージの底に設けた溝を覆って端子を装着し、端子の
半田付け面の一部を切り起し、又は変形させて一面に突
子、他面に凹部を形成したため、突子を溝内に係合させ
て実装時にクリーム半田を受け入れる窪みを端子の半田
付け面に形成でき、凹部内に半田を侵入固化させて端子
を確実に配線基板上に固定できる。また、溝内に突子を
係合させたパッケージからの端子の抜け止めとしての効
果を得ることができる。As described above, according to the present invention, the terminal is mounted by covering the groove provided on the bottom of the package, and a part of the soldering surface of the terminal is cut and raised or deformed to form a protrusion on one surface. Since the recess is formed on the other surface, a recess can be formed on the soldering surface of the terminal that engages the protrusion in the groove and receives the cream solder during mounting, and the solder is inserted into the recess and solidified to ensure the wiring of the terminal. Can be fixed on the substrate. Further, it is possible to obtain the effect of preventing the terminal from coming off from the package in which the protrusion is engaged in the groove.
【図1】本発明の一実施例を示す分解斜視図である。FIG. 1 is an exploded perspective view showing an embodiment of the present invention.
【図2】要部拡大断面図である。FIG. 2 is an enlarged sectional view of a main part.
【図3】半田付け面を示す要部の底面図である。FIG. 3 is a bottom view of essential parts showing a soldering surface.
1 パッケージ 2 圧電振動子 3 端子 4 ケース 5 底板 6 放音孔 7 切欠き 8 段部 9 突縁 10 立上り部 11 溝 12 取付部 13 弾接片 14 半田付け面 15 突子 16 凹部 1 Package 2 Piezoelectric vibrator 3 Terminal 4 Case 5 Bottom plate 6 Sound emission hole 7 Notch 8 Step part 9 Projection edge 10 Rise part 11 Groove 12 Mounting part 13 Elastic contact piece 14 Soldering surface 15 Protrusion 16 Recess
Claims (1)
面実装型電子部品の端子構造であって、 パッケージは、底面一部に溝を有し、 端子は、パッケージ内の素子に電気的に接続され、半田
付け面を有し、 半田付け面は、板状をなし、パッケージの溝を覆って重
ね合わされたものであり、突子と凹部とを有し、 突子は、前記溝内に係合してパッケージからの脱出を阻
止する抜け止めであり、 凹部は、突子の切り起し、又は変形により半田付け面の
他面に形成され、実装時のクリーム半田を受入れる窪み
であることを特徴とする表面実装型電子部品の端子構
造。1. A terminal structure of a surface mount type electronic component having a terminal in a package of electronic component, wherein the package has a groove in a part of a bottom surface, and the terminal is electrically connected to an element in the package. , Having a soldering surface, the soldering surface having a plate-like shape and being stacked so as to cover the groove of the package, and having a protrusion and a recess, the protrusion engaging in the groove The recess is a recess that is formed on the other surface of the soldering surface by cutting and raising or deforming the protrusion and that receives the cream solder during mounting. The terminal structure for surface mount electronic components.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP518993A JPH06217392A (en) | 1993-01-14 | 1993-01-14 | Terminal structure for surface mount type electronic component |
JP2000005327A JP2000175296A (en) | 1993-01-14 | 2000-01-14 | Surface-mount type piezoelectric sounding body |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP518993A JPH06217392A (en) | 1993-01-14 | 1993-01-14 | Terminal structure for surface mount type electronic component |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000005327A Division JP2000175296A (en) | 1993-01-14 | 2000-01-14 | Surface-mount type piezoelectric sounding body |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06217392A true JPH06217392A (en) | 1994-08-05 |
Family
ID=11604279
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP518993A Pending JPH06217392A (en) | 1993-01-14 | 1993-01-14 | Terminal structure for surface mount type electronic component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH06217392A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006195734A (en) * | 2005-01-13 | 2006-07-27 | Sony Corp | Input/output device with tactile function, and electronic device |
JP2008258009A (en) * | 2007-04-05 | 2008-10-23 | Smk Corp | Electronic part with soldering terminal |
-
1993
- 1993-01-14 JP JP518993A patent/JPH06217392A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006195734A (en) * | 2005-01-13 | 2006-07-27 | Sony Corp | Input/output device with tactile function, and electronic device |
JP2008258009A (en) * | 2007-04-05 | 2008-10-23 | Smk Corp | Electronic part with soldering terminal |
JP4650769B2 (en) * | 2007-04-05 | 2011-03-16 | Smk株式会社 | Electronic component with solder terminals |
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