JPH06217309A - Picture inspection device for square chip electronic component - Google Patents

Abstract

PURPOSE:To increase the inspection speed while keeping check precision is kept high by selecting a lighting device at a period being a half of a vertical scanning period so as to extract a picture signal equivalent to two patterns and displaying the two patterns onto one screen with division. CONSTITUTION:The device 10 has a circuit section operated based on synchronizing signals HD and VD/2 and a circuit section processing a picture signal VID EO. The former gives a horizontal synchronizing signal HD from a synchronizing signal generating circuit 11 as it is and a vertical synchronizing signal VD/2 obtained from a vertical synchronizing signal VD from the circuit 11 through a 2-pattern processing circuit 12 to a CCD camera and a lighting changeover circuit 13 selects either of lighting devices X, Y switchingly based on the signal VD/2. On the other hand, a memory 14 of the latter stores a signal VIDEO from the camera, the stored picture signal is read and given to a position correction circuit 15, a window processing circuit 16 and a numerizing circuit 17, in which a pre-processing of discrimination of propriety of a work is executed and an output signal of the circuit 17 is given to a propriety discrimination circuit 18, which discriminates the propriety of the work.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for judging quality by a visual inspection of a rectangular plate type electronic component.

[0002]

2. Description of the Related Art For example, in a manufacturing process of a chip resistor, a chip capacitor and the like, there is an inspection item for judging quality by the appearance of a product. Then, conventionally, a skilled worker visually inspects the surface state to determine whether it is good or bad, and performs selection.

In recent years, such chip electronic components have become smaller and smaller, and a minimum size of 1.0 mm in length and 0.5 mm in width is widely used, which exceeds the limit of visual inspection.

Therefore, an image inspection apparatus using the area image sensor technology has recently been introduced.

[0005]

In order to configure the apparatus so as to satisfy the required inspection accuracy, the direction of illumination is switched between the long axis direction and the single axis direction of the chip component and the image pickup apparatus such as CCD camera. Thus, two inspection images are picked up for each one field, and these screens are processed separately. For this reason, in order to increase the inspection speed without lowering the inspection accuracy, two inspection stages are provided, and the inspection is performed using the images captured by each stage.

That is, in order to increase the inspection accuracy of the rectangular plate chip electronic component, in order to emphasize defects by the irradiation direction of the illuminator, the rectangular plate chip electronic component is illuminated in the major axis direction and the minor axis direction. As described above, the illumination devices are arranged so as to illuminate the four side faces of the chip component, and the illumination devices are sequentially switched between the two opposite side face illumination devices to obtain the inspection image for each two fields. Each image is processed as one image.

For this reason, it is necessary to use two inspection stages and two cameras, resulting in a high equipment cost and a large size. Further, since the visual inspection apparatus is often mounted as an additional function on other processing machines or measuring machines, the large size of the apparatus is inconvenient in terms of space.

The present invention has been made in consideration of the above points, and provides an image inspection device for a rectangular plate chip electronic component which has a high inspection speed while keeping the inspection accuracy sufficiently high and has a small external dimension. With the goal.

[0009]

In order to achieve the above object, according to the present invention, a plurality of illumination devices illuminate a rectangular plate chip component from a plurality of directions, and an image pickup device performs horizontal and vertical scanning to determine each direction. In the image inspection device for a rectangular plate-shaped electronic component, the image for external appearance inspection is captured, and the captured image is displayed on a display screen for inspection. An illumination control device that illuminates the rectangular plate chip component in each of two directions while switching in a cycle, and the chip electronic component illuminated by the illumination device is imaged by the imaging device and displayed on the display screen. An image processing device for displaying a screen as a divided image and an image signal of the rectangular plate chip electronic component obtained by the image pickup device are compared with a predetermined determination level to determine whether the image is good or bad. Determining device and an image inspection apparatus square plate shape chips electronic components, characterized in that it includes a, there is provided a.

[0010]

The chip component placed at a predetermined position is illuminated by the illumination device controlled by the illumination control device for each direction in two directions, that is, for each two opposite side surfaces. Each 2 of this
The side-by-side illumination is 1 of the vertical scanning period in the image pickup device.
It can be switched in 2 cycles. Therefore, the image pickup apparatus picks up one field in each of at least two directions and forms two one-field image signals. This 2
The two image signals are given to the image processing apparatus and combined so as to be divided and displayed on a single display screen. On the other hand, the image signal is given to the determination processing device and compared with the determination level, and the quality of the rectangular chip electronic component is determined.

[0011]

As described above, according to the present invention, the illumination control device uses the image pickup device to judge whether the image quality is obtained from the image signal obtained by photographing the rectangular plate chip electronic component while illuminating it from at least two directions. Since the illuminating device is switched for each direction in half cycle of the vertical scanning period to extract image signals for two screens and the image processing device displays these two screens separately on a single display screen. Two
It is possible to perform visual inspection of the rectangular plate type chip electronic component with efficiency twice as high as that of the inspection device which displays one screen for each direction. Moreover, as for the image signal, the image signal for one field captured as in the conventional case is used as it is for the display and the level judgment, so that the inspection speed can be doubled without lowering the inspection accuracy.

[0012]

1 is a block diagram showing the configuration of an embodiment of the present invention. In the figure, reference numeral 10 denotes an image inspection processing device, which applies illumination outputs X and Y to the illumination devices X1, X2 and Y1, Y2 to form a rectangular plate type electronic component (hereinafter, simply referred to as a work W) to a TV camera. Illumination is performed in order from diagonally upper directions in different directions, for example, in two directions orthogonal to each other, according to a cycle determined by a synchronization signal for image pickup by.

Further, the image inspection processing apparatus 10 sends the horizontal synchronization signal HD and the vertical synchronization signal V to the CCD camera 20.
Image signal V obtained by CCD camera 20 given D / 2
Get IDEO. The vertical synchronizing signal VD / 2 is a synchronizing signal having a half cycle of the original vertical synchronizing signal VD, and is used to divide one field into two in the vertical direction. Then, the image inspection processing apparatus 10 receives an image signal for one screen from the CCD camera 20 at each VD / 2 repetition cycle.

The image inspection processing device 10 receives the image signal V
The IDE is processed to determine the quality of the work W, the separation mechanism 30 is operated to eliminate the defective work, and the quality determination result is given to a sequencer (not shown).

The image signal VIDEO is subjected to appropriate processing by the image inspection processing device 10 and given to the monitor TV 40.

FIG. 2 shows a detailed configuration of the image inspection processing apparatus 10 in the apparatus shown in FIG. This device 10
Has a circuit portion that performs an operation based on the synchronization signals HD and VD / 2, and a circuit portion that processes the image signal VIDEO.

In the former case, the horizontal synchronizing signal HD from the synchronizing signal generating circuit 11 is kept as it is, and the vertical synchronizing signal VD from the synchronizing signal generating circuit 11 is also formed through the two-screen processing circuit 12 so that the vertical synchronizing signal of 1/2 cycle. CC to VD / 2
While being given to the D camera 20 (see FIG. 1), the illumination switching circuit 13 switches the illumination devices X and Y in accordance with the vertical synchronizing signal VD / 2.

On the other hand, the latter processes the image signal VIDEO to judge whether the work is acceptable or not. That is, the CCD camera 20
The image signal VIDEO from (see FIG. 1) is stored in the video memory 14, and the stored image signal is read out and given to the image signal processing loop including the position correction circuit 15, the window processing circuit 16 and the digitizing circuit 17, Pre-processing is performed to determine the quality.

The position correction circuit 15 performs necessary position correction while monitoring the edge of the work W (see FIG. 1) so as to be suitable for subsequent processing, and supplies the signal to the window processing circuit 16. The window processing circuit takes out only the part of the image signal that requires pass / fail judgment and supplies it to the digitization circuit 17. The digitizing circuit 17 converts the degree of the defect of the work W (see FIG. 1) into a digitizing signal and gives it to the pass / fail judgment circuit 18 to judge whether the work is suitable for use.

The result of this determination is given to the separating mechanism to separate the defective work, and to the sequencer for data processing. Furthermore, the image signal VIDE
It is given to the monitor TV together with O and displayed.

FIG. 3 shows the timing relationship between the vertical synchronizing signal VD and VD / 2 of its half cycle and the image signal in the image inspection processing apparatus 10 of FIG. The vertical synchronizing signal VD has a period of 1 field, but the inspection images 1 and 2 have 1/2 fields each, and both are 1
Configure the field screen.

The inspection image 1 is captured during the illumination period Tx in the X direction, and the inspection image 2 is captured during the illumination period Ty in the Y direction. Then, the inspection image 1 and the inspection image 2 are combined to form a 1-field 2-screen image.

FIGS. 4 (a) and 4 (b) show an image pickup screen by the CCD camera and how the screen is divided. The upper half of the screen corresponds to the lighting period Tx, and the lower half is the lighting period Tx.
Corresponds to y. Therefore, two images obtained by illuminating one screen from two different directions are combined.

FIG. 5 shows images 1 and 2 which are picked up by a CCD camera and given to a monitor through the image inspection processing device 10 and displayed on the monitor screen.

6 and 7 show a method of illuminating the work W. That is, FIG. 6 is a plan view thereof,
The illumination by the two illumination devices X1 and X2 facing in the X direction and the illumination by the two illumination devices Y1 and Y2 facing in the Y direction are performed in order. FIG. 7 shows two illumination devices X in the X direction.
The state of illumination of the work W by 1 and X2 is shown.

[Brief description of drawings]

FIG. 1 is a block diagram showing the configuration of an embodiment of the present invention.

2 is an image inspection processing apparatus 10 in the embodiment of FIG.
The block diagram which showed the detailed structure of FIG.

3 is a timing chart showing a timing relationship between a vertical synchronizing signal VD and VD / 2 of a half cycle thereof and an image signal in the image inspection processing device 10 of FIG.

FIG. 4 (a) is an explanatory view showing an image pickup screen by a CCD camera, and FIG. 4 (b) is an explanatory view showing how the screen is divided.

FIG. 5 is a diagram showing images 1 and 2 displayed on a monitor screen.

FIG. 6 is a plan view showing a method of illuminating a work W.

FIG. 7 is a side view showing a method of illuminating the work W.

[Explanation of symbols]

 Tx X-direction illumination period Ty Y-direction illumination period W Work X, Y illumination device HD Horizontal deflection synchronization signal VD Vertical deflection synchronization signal

Claims (2)

[Claims] 1. A visual inspection image for each direction is photographed while illuminating a rectangular plate-shaped chip component from a plurality of directions by a plurality of illumination devices and performing horizontal and vertical scanning by an imaging device,
An image inspection device for a rectangular chip electronic component, which displays a photographed image on a display screen and is used for inspection, wherein the rectangular chip is switched while switching the illumination device at a half cycle of the vertical scanning cycle. An illumination control device that illuminates a component in each of two directions, and an image processing device that captures an image of the chip electronic component illuminated by the illumination device by the imaging device and divides and displays the image on the display screen as two screens. A rectangular plate-shaped chip electronic component, comprising: a judgment device for judging whether the image signal of the rectangular plate-shaped electronic component obtained by the image pickup device is compared with a predetermined judgment level; Image inspection device. 2. The apparatus according to claim 1, wherein the image inspection apparatus further includes a sorting device that sorts the rectangular plate electronic components according to a determination result of the determining device. Image inspection system for electronic parts.