JPH06216597A - Visual inspection device for board - Google Patents
Visual inspection device for boardInfo
- Publication number
- JPH06216597A JPH06216597A JP50A JP707293A JPH06216597A JP H06216597 A JPH06216597 A JP H06216597A JP 50 A JP50 A JP 50A JP 707293 A JP707293 A JP 707293A JP H06216597 A JPH06216597 A JP H06216597A
- Authority
- JP
- Japan
- Prior art keywords
- board
- inspected
- substrate
- electronic component
- position information
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は基板上に実装された電子
部品の有無、位置ズレなどを検査する基板外観検査装置
に関し、特に検査基準位置の検出に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board appearance inspection apparatus for inspecting the presence or absence of electronic components mounted on a board, positional deviation, and the like, and more particularly to detection of an inspection reference position.
【0002】[0002]
【従来の技術】基板上に実装された電子部品の装着状態
を検査する従来の基板外観検査装置は、コンベアなどで
搬送されてきた被検査基板を、ITV(industrial tel
evision )カメラなどの検知手段の位置まで移動させる
XYテーブルに移し、XYテーブル上に設けられた基準
ピンを前記被検査基板の基準孔に嵌合させる基準ピン機
構により前記被検査基板の位置決めを行い、その位置決
めされた基準孔を基準位置として被検査基板が載ってい
るXYテーブルを前記カメラなどの検知手段の位置まで
移動し、画像処理などにより電子部品の有無、位置ズレ
などを検査する構造であった。2. Description of the Related Art A conventional board appearance inspecting apparatus for inspecting a mounting state of electronic components mounted on a board uses an ITV (industrial tel
evision) Move to the position of the detecting means such as a camera, move to the XY table, and position the inspected board by the reference pin mechanism that fits the reference pin provided on the XY table into the reference hole of the inspected board. The structure is such that the XY table on which the substrate to be inspected is placed with the positioned reference hole as a reference position is moved to the position of the detection means such as the camera, and the presence or absence of electronic components and the positional deviation are inspected by image processing or the like. there were.
【0003】[0003]
【発明が解決しようとする課題】しかしながら、このよ
うな従来構成の基板外観検査装置では、位置決めするた
めのXYテーブルや基準ピン機構およびそれらを制御す
るためのものが必要となり、複雑で非常に高価となって
いた。また、基準ピンで位置決めする場合、基板形状の
違う基板毎に基準ピンの位置を変更する作業が必要とな
り、被検査基板の機種変更が多い場合、作業効率が悪い
という問題があった。However, such a conventional board appearance inspecting apparatus requires an XY table for positioning, a reference pin mechanism, and those for controlling them, which is complicated and very expensive. It was. In addition, when positioning with the reference pin, it is necessary to change the position of the reference pin for each board having a different board shape, and there is a problem that work efficiency is poor when the model of the board to be inspected is changed frequently.
【0004】本発明はこのような問題を解決するもの
で、安価で作業性の良い基板外観検査装置を提供するこ
とを目的とするものである。The present invention solves such a problem, and an object of the present invention is to provide a substrate appearance inspection apparatus which is inexpensive and has good workability.
【0005】[0005]
【課題を解決するための手段】上記問題を解決するため
に本発明の基板外観検査装置は、電子部品が実装された
被検査基板を所定箇所に固定する固定手段と、前記電子
部品および前記被検査基板の位置情報を記憶する記憶手
段と、前記電子部品の装着状態および前記被検査基板の
外観を検知する検知手段と、この検知手段を前記電子部
品の位置情報に基づき前記被検査基板に対して相対的に
移動させる移動手段と、前記検知手段からの検知信号と
前記被検査基板の位置情報とにより被検査基板の基準と
なる箇所である基板基準位置を検出してこの基板基準位
置を検査基準位置として設定し、この検査基準位置に基
づく位置情報と前記検知手段からの検知信号とから電子
部品の有無および位置ズレを判断する判断手段とを備え
たものである。In order to solve the above problems, a board appearance inspection apparatus according to the present invention comprises a fixing means for fixing a board to be inspected on which an electronic component is mounted at a predetermined position, the electronic component and the object to be inspected. Storage means for storing the position information of the inspection board, detection means for detecting the mounting state of the electronic component and the appearance of the inspection board, and the detection means for the inspection board based on the position information of the electronic component The relative position of the substrate to be inspected by the moving means for relatively moving the substrate and the detection signal from the detecting means and the position information of the substrate to be inspected to detect the substrate reference position which is a reference point of the substrate to be inspected. It is provided with a judging unit which is set as a reference position and judges presence / absence of an electronic component and a positional deviation from position information based on the inspection reference position and a detection signal from the detecting unit.
【0006】[0006]
【作用】上記構成により、電子部品の装着状態を検知す
る検知手段により被検査基板の外観も検知して、検知手
段からの検知信号と被検査基板の位置情報とにより基板
基準位置を検出するため、基準ピン機構などの基板基準
位置検出手段を別途に設けることなく、検査基準位置を
検知することができ、この検査基準位置に基づいて基板
の外観検査を行うことができる。With the above structure, the detecting means for detecting the mounting state of the electronic component also detects the appearance of the board to be inspected, and the board reference position is detected by the detection signal from the detecting means and the position information of the board to be inspected. The inspection reference position can be detected without separately providing the substrate reference position detecting means such as the reference pin mechanism, and the appearance inspection of the substrate can be performed based on the inspection reference position.
【0007】[0007]
【実施例】以下、本発明の実施例を図面に基づき説明す
る。図1は本発明の一実施例を示す基板外観検査装置の
斜視図である。この基板外観検査装置は、電子部品の有
無および位置ズレを検査する検査部1と、この検査部1
を制御して判断を行う判断手段としての制御部2とで構
成されている。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a board appearance inspection apparatus showing an embodiment of the present invention. This board appearance inspection apparatus includes an inspection unit 1 for inspecting the presence or absence of electronic components and a positional deviation, and an inspection unit 1
And a control unit 2 as a judgment means for controlling the judgment.
【0008】検査部1は、基台6の上にある被検査基板
3上に実装された電子部品4および被検査基板3の外観
を検出する検出手段8と、この検出手段8を移動させる
ための移動手段としての互いに直交したX軸ロボット9
およびY軸ロボット10と、被検査基板3を搬送するコ
ンベア7と、搬送されてきた被検査基板3が検査位置に
到着したことを検出する基板到着確認センサ13と、到
着した被検査基板3を検査するときに固定する基板固定
ガイドの可動部11および固定部12とから構成されて
いる。The inspecting section 1 detects the appearance of the electronic component 4 and the inspected substrate 3 mounted on the inspected substrate 3 on the base 6, and the moving means 8 for moving the detecting means 8. Mutually orthogonal X-axis robots 9 as means for moving
The Y-axis robot 10, the conveyor 7 that conveys the inspected substrate 3, the board arrival confirmation sensor 13 that detects that the conveyed inspected board 3 has arrived at the inspection position, and the arrived inspected board 3 It is composed of a movable part 11 and a fixed part 12 of a substrate fixing guide which is fixed when inspecting.
【0009】ここで、電子部品4を検出する検出手段8
としては、例えば光学式変位センサが用いられており、
検出手段8はX軸ロボット9により矢印X方向に、また
Y軸ロボット10により矢印Y方向に移動可能に設けら
れている。制御部2にはパーソナルコンピュータが用い
られている。この制御部2には電子部品4を検査するた
めの部品形状とその位置情報および被検査基板3の概略
の基板基準位置情報が予め内部の記憶部に入力され、記
憶手段としても機能している。また制御部2は検査部1
の検出手段8とX軸ロボット9、Y軸ロボット10との
インターフェイス回路を内蔵しており、これらは信号ケ
ーブル14でX軸ロボット9、Y軸ロボット10に電気
的に接続されている。Here, the detection means 8 for detecting the electronic component 4
For example, an optical displacement sensor is used,
The detecting means 8 is provided so as to be movable in the arrow X direction by the X-axis robot 9 and in the arrow Y direction by the Y-axis robot 10. A personal computer is used for the control unit 2. A component shape for inspecting the electronic component 4, its position information, and general substrate reference position information of the substrate 3 to be inspected are input to the internal storage unit in advance in the control unit 2 and also function as a storage unit. . The control unit 2 is the inspection unit 1.
The interface circuit between the detecting means 8 and the X-axis robot 9 and the Y-axis robot 10 is built in, and these are electrically connected to the X-axis robot 9 and the Y-axis robot 10 by a signal cable 14.
【0010】図2の(a),(b)は変位センサからな
る検出手段8による電子部品の変位の検出原理を示す図
である。この検出手段8はいわゆる三角測距方式による
もので、投光部8aより照射された光は被検査基板3や
被検査基板3上に実装された電子部品4で反射し、受光
素子8bのどの位置に反射光が返ってくるかを検出する
ことによって変位置を検出している。すなわち、被検査
基板3を基準面として考えた場合、被検査基板3上の電
子部品4の受光素子8bへの反射光は被検査基板3上よ
り受光素子8bのa側に集光され、その変位量を検出す
ることにより検出手段8から電子部品4までの変位が検
出できる。この場合変位は小さくなる。また、被検査基
板3上に基板基準孔5などがあると反射光は被検査基板
3上より受光素子8bのb側に集光され、変位は大きく
なる。そして検出手段8を矢印Y方向に走査させること
により高さの波形20を得ることができる。なお、この
波形20は検出手段8から電子部品4などの対象物まで
の変位が小さくなる方を高さが「高い」、変位が大きく
なる方を高さが「低い」と表している。以下、高さに関
する表現については同様に表す。FIGS. 2A and 2B are diagrams showing the principle of detecting the displacement of the electronic component by the detecting means 8 comprising a displacement sensor. This detection means 8 is based on a so-called triangulation method, and the light emitted from the light projecting portion 8a is reflected by the substrate 3 to be inspected or the electronic component 4 mounted on the substrate 3 to be inspected, and the light receiving element 8b. The variable position is detected by detecting whether the reflected light returns to the position. That is, when the substrate 3 to be inspected is considered as a reference surface, the reflected light of the light receiving element 8b of the electronic component 4 on the substrate 3 to be inspected is focused on the side a of the light receiving element 8b from the substrate 3 to be inspected, The displacement from the detection means 8 to the electronic component 4 can be detected by detecting the displacement amount. In this case, the displacement is small. Further, when the substrate reference hole 5 and the like are provided on the inspected substrate 3, the reflected light is condensed on the inspected substrate 3 to the side b of the light receiving element 8b, and the displacement becomes large. The height waveform 20 can be obtained by scanning the detecting means 8 in the direction of the arrow Y. In this waveform 20, the smaller displacement from the detection means 8 to the object such as the electronic component 4 is represented as “high”, and the larger displacement is represented as “lower”. Hereinafter, the expression regarding the height will be similarly expressed.
【0011】次に、この基板外観検査装置の動作につい
て説明する。図1に示すように、被検査基板3は前工程
側よりコンベア7により搬送され、基板到着確認センサ
13により被検査基板3の到着が検出される。そして、
被検査基板3の到着が検出されると基板固定ガイドの可
動部11が被検査基板3側に移動されて被検査基板3を
基板固定ガイドの固定部12に押し付け、被検査基板3
を検査するときに動かないように固定する。その後、検
出手段8が制御部2内の記憶部の概略の基板基準位置情
報に基づき移動され、基板基準位置のサーチが行われ
る。Next, the operation of the board appearance inspection device will be described. As shown in FIG. 1, the substrate 3 to be inspected is conveyed from the previous process side by the conveyor 7, and the arrival of the substrate 3 to be inspected is detected by the substrate arrival confirmation sensor 13. And
When the arrival of the board 3 to be inspected is detected, the movable portion 11 of the board fixing guide is moved to the side of the board 3 to be inspected, and the board 3 to be inspected is pressed against the fixing portion 12 of the board fixing guide.
Fix so that it does not move when inspecting. After that, the detecting means 8 is moved based on the general substrate reference position information in the storage unit in the control unit 2, and the substrate reference position is searched.
【0012】本実施例の基板基準孔による基板基準位置
サーチのフローチャートを図3に示し、また、そのとき
の検出手段8の走査方式の説明図を図4に示す。以下、
図3、図4を用いて基板基準位置検出の動作について説
明する。FIG. 3 shows a flow chart of the substrate reference position search by the substrate reference hole of this embodiment, and FIG. 4 is an explanatory view of the scanning system of the detecting means 8 at that time. Less than,
The operation of substrate reference position detection will be described with reference to FIGS. 3 and 4.
【0013】ステップ1では制御部2内の記憶部の概略
の基板基準位置情報を基にX軸ロボット9により−X方
向に検出手段8を走査し、ステップ2では被検査基板3
のエッジa点を検出、すなわち高さが「低い」状態から
基準面に変化する位置を検出する。ステップ3では検出
精度を上げるために走査速度を減速する。ステップ4で
はさらに検出手段8を−X方向に走査し、ステップ5で
は基板基準孔5のエッジb点の検出、すなわち高さが基
準面から「低い」状態に変化する位置を検出する。ステ
ップ6ではさらに検出手段8を−X方向に走査し、ステ
ップ7ではエッジa点と同様に基板基準孔5のエッジc
点を検出する。ステップ8では基板基準孔5のエッジb
点位置とc点位置とによりその中心であるd点位置を計
算する。ステップ9ではd点よりY軸ロボット10にて
Y方向に走査を行い、ステップ10ではエッジa点と同
様に基板基準孔5のエッジe点を検出する。ステップ1
1ではこのエッジe点を(X0,Y0+r)とする。た
だし、ここでrは基板基準孔5の半径、またf点(X
0,Y0)は基板基準孔5の中心座標である。このよう
にして基板基準位置を検出することにより、このf点を
検査基準位置とすることができる。In step 1, the detecting means 8 is scanned in the -X direction by the X-axis robot 9 based on the approximate substrate reference position information in the storage part in the control part 2. In step 2, the substrate 3 to be inspected is scanned.
Edge a point is detected, that is, the position where the height changes from the “low” state to the reference plane is detected. In step 3, the scanning speed is reduced to improve the detection accuracy. In step 4, the detecting means 8 is further scanned in the -X direction, and in step 5, the edge b point of the substrate reference hole 5, that is, the position where the height changes from the reference surface to the "low" state is detected. In step 6, the detecting means 8 is further scanned in the -X direction, and in step 7, the edge c of the substrate reference hole 5 is similarly to the point a.
Detect points. In step 8, the edge b of the substrate reference hole 5
The d point position which is the center of the point position and the c point position is calculated. In step 9, the Y-axis robot 10 scans from the point d in the Y direction, and in step 10, the edge e point of the substrate reference hole 5 is detected similarly to the edge a point. Step 1
In 1, the edge e point is set to (X0, Y0 + r). Here, r is the radius of the substrate reference hole 5, and f point (X
0, Y0) is the center coordinate of the substrate reference hole 5. By detecting the substrate reference position in this way, this point f can be set as the inspection reference position.
【0014】また、他の実施例として基板基準位置が基
板基準孔5のとき、前記エッジa、c、eの3点から基
板基準孔5の中心座標f点を求め、それを(X0,Y
0)とする方法がある。As another embodiment, when the substrate reference position is the substrate reference hole 5, the center coordinate f point of the substrate reference hole 5 is obtained from the three points of the edges a, c, and e, and it is (X0, Y
0) is available.
【0015】一方、制御部2の記憶部には電子部品4の
基板基準孔5の中心座標(X0,Y0)からの位置情報
および部品形状が格納されているため順次その情報を呼
び出し、この情報にしたがって被検査基板3に実装され
た電子部品4上を変位センサからなる検出手段8により
走査する。このとき、検出手段8から発生する高さ信号
を制御部2内の判断回路で高さのレベルとその高さレベ
ル変化点を判断することにより電子部品4の有無、位置
ズレの検査を行うことができる。On the other hand, since the storage unit of the control unit 2 stores the position information from the central coordinates (X0, Y0) of the board reference hole 5 of the electronic component 4 and the component shape, the information is sequentially called, and this information is called. Then, the electronic component 4 mounted on the board 3 to be inspected is scanned by the detecting means 8 including a displacement sensor. At this time, the presence / absence of the electronic component 4 and the displacement of the electronic component 4 are inspected by determining the height level and the height level change point of the height signal generated from the detection means 8 by the determination circuit in the control unit 2. You can
【0016】なお、本実施例では基板基準孔5を基板基
準位置として用いたが、基板端面や電子部品検出手段を
ITVカメラなどにすれば銅箔パターンマークなども基
板基準位置として使用可能である。Although the substrate reference hole 5 is used as the substrate reference position in this embodiment, a copper foil pattern mark or the like can also be used as the substrate reference position if the substrate end face or the electronic component detecting means is an ITV camera or the like. .
【0017】[0017]
【発明の効果】以上のように本発明によれば、電子部品
の装着状態を検知する検知手段により被検査基板の外観
も検知して、検知手段からの検知信号と被検査基板の位
置情報とにより基板基準位置を検出するため、基準ピン
機構などの基板基準位置検出手段を別途に設けることな
く、簡単な構成で検査基準位置を検知して、この検査基
準位置に基づいて基板の外観検査を行うことができ、安
価な基板外観検査装置を得ることができる。また、単一
の検知手段により被検査基板の基準箇所と電子部品の位
置検出とを行うため、これら被検査基板の基準箇所と電
子部品の位置検出との相対誤差を無くすことができる。
また、基準ピンなどの機構によって位置決めしないた
め、被検査基板の形状が変わっても機構部の調整は不要
であるため作業性が良好となる。As described above, according to the present invention, the appearance of the board to be inspected is also detected by the detection means for detecting the mounting state of the electronic component, and the detection signal from the detection means and the position information of the board to be inspected are detected. Since the board reference position is detected by the above, the board reference position detecting means such as the reference pin mechanism is not separately provided, and the inspection reference position is detected with a simple configuration, and the appearance inspection of the board is performed based on this inspection reference position. Therefore, it is possible to obtain an inexpensive board appearance inspection device. Further, since the reference position of the board to be inspected and the position of the electronic component are detected by the single detecting means, it is possible to eliminate the relative error between the reference position of the board to be inspected and the position detection of the electronic component.
Further, since the positioning is not performed by a mechanism such as a reference pin, even if the shape of the substrate to be inspected is changed, adjustment of the mechanical portion is unnecessary, so that workability is improved.
【図1】本発明の一実施例を示す基板外観検査装置の斜
視図である。FIG. 1 is a perspective view of a board appearance inspection apparatus showing an embodiment of the present invention.
【図2】(a)および(b)は同基板外観検査装置の検
知手段の検査原理を説明する正面図および波形図であ
る。2 (a) and 2 (b) are a front view and a waveform diagram for explaining the inspection principle of the detection means of the same board appearance inspection apparatus.
【図3】同基板外観検査装置の基準位置サーチのフロー
チャートである。FIG. 3 is a flowchart of reference position search of the board appearance inspection apparatus.
【図4】同基板外観検査装置の検出手段の走査方式を示
すための図である。FIG. 4 is a diagram showing a scanning method of a detection means of the substrate visual inspection apparatus.
2 制御部(記憶手段および判断手段) 3 被検査基板 4 電子部品 5 基板基準孔 7 コンベア 8 検知手段 9 X軸ロボット(移動手段) 10 Y軸ロボット(移動手段) 11 基板固定ガイドの可動部 12 基板固定ガイドの固定部 2 control unit (storage unit and determination unit) 3 substrate to be inspected 4 electronic component 5 substrate reference hole 7 conveyor 8 detection unit 9 X-axis robot (moving unit) 10 Y-axis robot (moving unit) 11 movable unit of substrate fixed guide 12 Fixed part of board fixing guide
───────────────────────────────────────────────────── フロントページの続き (72)発明者 市川 巌 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 加藤 健二 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 藤田 隆之 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 根岸 重節 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 志賀 和広 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 森岡 学 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 中塚 茂樹 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Iwakawa Iwakawa 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Kenji Kato, 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. 72) Inventor Takayuki Fujita 1006 Kadoma, Kadoma-shi, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Shigefushi Negishi, 1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric Industrial Co., Ltd. 1006, Kadoma, Kadoma, Fuchu Matsushita Electric Industrial Co., Ltd. (72) Manabu Morioka, 1006 Kadoma, Kadoma, Osaka Prefecture (72) Shigeki Nakatsuka, 1006 Kadoma, Kadoma, Osaka Matsushita Denki Sangyo Co., Ltd.
Claims (1)
箇所に固定する固定手段と、前記電子部品および前記被
検査基板の位置情報を記憶する記憶手段と、前記電子部
品の装着状態および前記被検査基板の外観を検知する検
知手段と、この検知手段を前記電子部品の位置情報に基
づき前記被検査基板に対して相対的に移動させる移動手
段と、前記検知手段からの検知信号と前記被検査基板の
位置情報とにより被検査基板の基準となる箇所である基
板基準位置を検出してこの基板基準位置を検査基準位置
として設定し、この検査基準位置に基づく位置情報と前
記検知手段からの検知信号とから電子部品の有無および
位置ズレを判断する判断手段とを備えた基板外観検査装
置。1. A fixing means for fixing an inspected board on which an electronic component is mounted at a predetermined position, a storage means for storing positional information of the electronic component and the inspected board, a mounting state of the electronic component, and the Detection means for detecting the appearance of the board to be inspected, moving means for moving the detection means relative to the board to be inspected based on the position information of the electronic component, a detection signal from the detection means and the object to be detected. The board reference position, which is a reference point of the board to be inspected, is detected based on the position information of the inspection board, the board reference position is set as the inspection reference position, and the position information based on the inspection reference position and the detection unit A board appearance inspection device comprising: a determination unit that determines the presence or absence of an electronic component and a positional deviation from a detection signal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50A JPH06216597A (en) | 1993-01-20 | 1993-01-20 | Visual inspection device for board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50A JPH06216597A (en) | 1993-01-20 | 1993-01-20 | Visual inspection device for board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06216597A true JPH06216597A (en) | 1994-08-05 |
Family
ID=11655881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50A Pending JPH06216597A (en) | 1993-01-20 | 1993-01-20 | Visual inspection device for board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH06216597A (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS587900A (en) * | 1981-07-06 | 1983-01-17 | 株式会社東芝 | Method of detecting chip element |
JPS6159900A (en) * | 1984-08-31 | 1986-03-27 | 日本電気株式会社 | Printed board package assembly evaluating system |
JPS63251863A (en) * | 1987-04-08 | 1988-10-19 | Sharp Corp | Recognizing device for position of base mounted parts |
JPH02251200A (en) * | 1989-02-27 | 1990-10-08 | American Teleph & Telegr Co <Att> | Board acsembling method, board inspection method and device |
JPH06185994A (en) * | 1992-12-18 | 1994-07-08 | Taiyo Yuden Co Ltd | Inspecting device for mounted substrate |
-
1993
- 1993-01-20 JP JP50A patent/JPH06216597A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS587900A (en) * | 1981-07-06 | 1983-01-17 | 株式会社東芝 | Method of detecting chip element |
JPS6159900A (en) * | 1984-08-31 | 1986-03-27 | 日本電気株式会社 | Printed board package assembly evaluating system |
JPS63251863A (en) * | 1987-04-08 | 1988-10-19 | Sharp Corp | Recognizing device for position of base mounted parts |
JPH02251200A (en) * | 1989-02-27 | 1990-10-08 | American Teleph & Telegr Co <Att> | Board acsembling method, board inspection method and device |
JPH06185994A (en) * | 1992-12-18 | 1994-07-08 | Taiyo Yuden Co Ltd | Inspecting device for mounted substrate |
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