JPH06216597A - Visual inspection device for board - Google Patents

Abstract

PURPOSE:To provide a visual inspection device for boards which is inexpensive and has improved working efficiency while inspecting presence or absence, positional deviation, etc., of electronic component mounted on a board. CONSTITUTION:A substrate 3 to be inspected is fixed by substrate fixing guides 11 and 12, the position information of electronic components 4 and the board 3 to be inspected is stored by a control part 2, the appearance of the board 3 to be inspected and the fitting state of the electronic parts 4 are detected by a detection means 8 consisting of a displacement sensor, and then the detection means 8 is moved in X- and Y-directions based on the position information of the electronic components 4. Then, the center of a board reference hole 5 which is a reference of the board 3 to be inspected is detected by the detection signal from the detection means 8 and the position information of the board 3 to be inspected and then this position is set as an inspection reference position by the control part 2 and then the detection signal from the detection means 8 and the position information of the electronic components 4 are compared based on the inspection reference position, thus judging presence or absence of the electronic components 4 and positional deviation.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board appearance inspection apparatus for inspecting the presence or absence of electronic components mounted on a board, positional deviation, and the like, and more particularly to detection of an inspection reference position.

[0002]

2. Description of the Related Art A conventional board appearance inspecting apparatus for inspecting a mounting state of electronic components mounted on a board uses an ITV (industrial tel
evision) Move to the position of the detecting means such as a camera, move to the XY table, and position the inspected board by the reference pin mechanism that fits the reference pin provided on the XY table into the reference hole of the inspected board. The structure is such that the XY table on which the substrate to be inspected is placed with the positioned reference hole as a reference position is moved to the position of the detection means such as the camera, and the presence or absence of electronic components and the positional deviation are inspected by image processing or the like. there were.

[0003]

However, such a conventional board appearance inspecting apparatus requires an XY table for positioning, a reference pin mechanism, and those for controlling them, which is complicated and very expensive. It was. In addition, when positioning with the reference pin, it is necessary to change the position of the reference pin for each board having a different board shape, and there is a problem that work efficiency is poor when the model of the board to be inspected is changed frequently.

The present invention solves such a problem, and an object of the present invention is to provide a substrate appearance inspection apparatus which is inexpensive and has good workability.

[0005]

In order to solve the above problems, a board appearance inspection apparatus according to the present invention comprises a fixing means for fixing a board to be inspected on which an electronic component is mounted at a predetermined position, the electronic component and the object to be inspected. Storage means for storing the position information of the inspection board, detection means for detecting the mounting state of the electronic component and the appearance of the inspection board, and the detection means for the inspection board based on the position information of the electronic component The relative position of the substrate to be inspected by the moving means for relatively moving the substrate and the detection signal from the detecting means and the position information of the substrate to be inspected to detect the substrate reference position which is a reference point of the substrate to be inspected. It is provided with a judging unit which is set as a reference position and judges presence / absence of an electronic component and a positional deviation from position information based on the inspection reference position and a detection signal from the detecting unit.

[0006]

With the above structure, the detecting means for detecting the mounting state of the electronic component also detects the appearance of the board to be inspected, and the board reference position is detected by the detection signal from the detecting means and the position information of the board to be inspected. The inspection reference position can be detected without separately providing the substrate reference position detecting means such as the reference pin mechanism, and the appearance inspection of the substrate can be performed based on the inspection reference position.

[0007]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a board appearance inspection apparatus showing an embodiment of the present invention. This board appearance inspection apparatus includes an inspection unit 1 for inspecting the presence or absence of electronic components and a positional deviation, and an inspection unit 1
And a control unit 2 as a judgment means for controlling the judgment.

The inspecting section 1 detects the appearance of the electronic component 4 and the inspected substrate 3 mounted on the inspected substrate 3 on the base 6, and the moving means 8 for moving the detecting means 8. Mutually orthogonal X-axis robots 9 as means for moving
The Y-axis robot 10, the conveyor 7 that conveys the inspected substrate 3, the board arrival confirmation sensor 13 that detects that the conveyed inspected board 3 has arrived at the inspection position, and the arrived inspected board 3 It is composed of a movable part 11 and a fixed part 12 of a substrate fixing guide which is fixed when inspecting.

Here, the detection means 8 for detecting the electronic component 4
For example, an optical displacement sensor is used,
The detecting means 8 is provided so as to be movable in the arrow X direction by the X-axis robot 9 and in the arrow Y direction by the Y-axis robot 10. A personal computer is used for the control unit 2. A component shape for inspecting the electronic component 4, its position information, and general substrate reference position information of the substrate 3 to be inspected are input to the internal storage unit in advance in the control unit 2 and also function as a storage unit. . The control unit 2 is the inspection unit 1.
The interface circuit between the detecting means 8 and the X-axis robot 9 and the Y-axis robot 10 is built in, and these are electrically connected to the X-axis robot 9 and the Y-axis robot 10 by a signal cable 14.

FIGS. 2A and 2B are diagrams showing the principle of detecting the displacement of the electronic component by the detecting means 8 comprising a displacement sensor. This detection means 8 is based on a so-called triangulation method, and the light emitted from the light projecting portion 8a is reflected by the substrate 3 to be inspected or the electronic component 4 mounted on the substrate 3 to be inspected, and the light receiving element 8b. The variable position is detected by detecting whether the reflected light returns to the position. That is, when the substrate 3 to be inspected is considered as a reference surface, the reflected light of the light receiving element 8b of the electronic component 4 on the substrate 3 to be inspected is focused on the side a of the light receiving element 8b from the substrate 3 to be inspected, The displacement from the detection means 8 to the electronic component 4 can be detected by detecting the displacement amount. In this case, the displacement is small. Further, when the substrate reference hole 5 and the like are provided on the inspected substrate 3, the reflected light is condensed on the inspected substrate 3 to the side b of the light receiving element 8b, and the displacement becomes large. The height waveform 20 can be obtained by scanning the detecting means 8 in the direction of the arrow Y. In this waveform 20, the smaller displacement from the detection means 8 to the object such as the electronic component 4 is represented as “high”, and the larger displacement is represented as “lower”. Hereinafter, the expression regarding the height will be similarly expressed.

Next, the operation of the board appearance inspection device will be described. As shown in FIG. 1, the substrate 3 to be inspected is conveyed from the previous process side by the conveyor 7, and the arrival of the substrate 3 to be inspected is detected by the substrate arrival confirmation sensor 13. And
When the arrival of the board 3 to be inspected is detected, the movable portion 11 of the board fixing guide is moved to the side of the board 3 to be inspected, and the board 3 to be inspected is pressed against the fixing portion 12 of the board fixing guide.
Fix so that it does not move when inspecting. After that, the detecting means 8 is moved based on the general substrate reference position information in the storage unit in the control unit 2, and the substrate reference position is searched.

FIG. 3 shows a flow chart of the substrate reference position search by the substrate reference hole of this embodiment, and FIG. 4 is an explanatory view of the scanning system of the detecting means 8 at that time. Less than,
The operation of substrate reference position detection will be described with reference to FIGS. 3 and 4.

In step 1, the detecting means 8 is scanned in the -X direction by the X-axis robot 9 based on the approximate substrate reference position information in the storage part in the control part 2. In step 2, the substrate 3 to be inspected is scanned.
Edge a point is detected, that is, the position where the height changes from the “low” state to the reference plane is detected. In step 3, the scanning speed is reduced to improve the detection accuracy. In step 4, the detecting means 8 is further scanned in the -X direction, and in step 5, the edge b point of the substrate reference hole 5, that is, the position where the height changes from the reference surface to the "low" state is detected. In step 6, the detecting means 8 is further scanned in the -X direction, and in step 7, the edge c of the substrate reference hole 5 is similarly to the point a.
Detect points. In step 8, the edge b of the substrate reference hole 5
The d point position which is the center of the point position and the c point position is calculated. In step 9, the Y-axis robot 10 scans from the point d in the Y direction, and in step 10, the edge e point of the substrate reference hole 5 is detected similarly to the edge a point. Step 1
In 1, the edge e point is set to (X0, Y0 + r). Here, r is the radius of the substrate reference hole 5, and f point (X
0, Y0) is the center coordinate of the substrate reference hole 5. By detecting the substrate reference position in this way, this point f can be set as the inspection reference position.

As another embodiment, when the substrate reference position is the substrate reference hole 5, the center coordinate f point of the substrate reference hole 5 is obtained from the three points of the edges a, c, and e, and it is (X0, Y
0) is available.

On the other hand, since the storage unit of the control unit 2 stores the position information from the central coordinates (X0, Y0) of the board reference hole 5 of the electronic component 4 and the component shape, the information is sequentially called, and this information is called. Then, the electronic component 4 mounted on the board 3 to be inspected is scanned by the detecting means 8 including a displacement sensor. At this time, the presence / absence of the electronic component 4 and the displacement of the electronic component 4 are inspected by determining the height level and the height level change point of the height signal generated from the detection means 8 by the determination circuit in the control unit 2. You can

Although the substrate reference hole 5 is used as the substrate reference position in this embodiment, a copper foil pattern mark or the like can also be used as the substrate reference position if the substrate end face or the electronic component detecting means is an ITV camera or the like. .

[0017]

As described above, according to the present invention, the appearance of the board to be inspected is also detected by the detection means for detecting the mounting state of the electronic component, and the detection signal from the detection means and the position information of the board to be inspected are detected. Since the board reference position is detected by the above, the board reference position detecting means such as the reference pin mechanism is not separately provided, and the inspection reference position is detected with a simple configuration, and the appearance inspection of the board is performed based on this inspection reference position. Therefore, it is possible to obtain an inexpensive board appearance inspection device. Further, since the reference position of the board to be inspected and the position of the electronic component are detected by the single detecting means, it is possible to eliminate the relative error between the reference position of the board to be inspected and the position detection of the electronic component.
Further, since the positioning is not performed by a mechanism such as a reference pin, even if the shape of the substrate to be inspected is changed, adjustment of the mechanical portion is unnecessary, so that workability is improved.

[Brief description of drawings]

FIG. 1 is a perspective view of a board appearance inspection apparatus showing an embodiment of the present invention.

2 (a) and 2 (b) are a front view and a waveform diagram for explaining the inspection principle of the detection means of the same board appearance inspection apparatus.

FIG. 3 is a flowchart of reference position search of the board appearance inspection apparatus.

FIG. 4 is a diagram showing a scanning method of a detection means of the substrate visual inspection apparatus.

[Explanation of symbols]

 2 control unit (storage unit and determination unit) 3 substrate to be inspected 4 electronic component 5 substrate reference hole 7 conveyor 8 detection unit 9 X-axis robot (moving unit) 10 Y-axis robot (moving unit) 11 movable unit of substrate fixed guide 12 Fixed part of board fixing guide

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Iwakawa Iwakawa 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Kenji Kato, 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. 72) Inventor Takayuki Fujita 1006 Kadoma, Kadoma-shi, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Shigefushi Negishi, 1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric Industrial Co., Ltd. 1006, Kadoma, Kadoma, Fuchu Matsushita Electric Industrial Co., Ltd. (72) Manabu Morioka, 1006 Kadoma, Kadoma, Osaka Prefecture (72) Shigeki Nakatsuka, 1006 Kadoma, Kadoma, Osaka Matsushita Denki Sangyo Co., Ltd.

Claims (1)

[Claims] 1. A fixing means for fixing an inspected board on which an electronic component is mounted at a predetermined position, a storage means for storing positional information of the electronic component and the inspected board, a mounting state of the electronic component, and the Detection means for detecting the appearance of the board to be inspected, moving means for moving the detection means relative to the board to be inspected based on the position information of the electronic component, a detection signal from the detection means and the object to be detected. The board reference position, which is a reference point of the board to be inspected, is detected based on the position information of the inspection board, the board reference position is set as the inspection reference position, and the position information based on the inspection reference position and the detection unit A board appearance inspection device comprising: a determination unit that determines the presence or absence of an electronic component and a positional deviation from a detection signal.