JPH06216497A - Stripping method of board after transfer in transfer apparatus - Google Patents

Abstract

PURPOSE:To provide a stripping method wherein a pattern on a board for pattern transfer is stripped with good accuracy after the pattern has been transferred to a board to be transferred. CONSTITUTION:A board F for pattern transfer and a board G to be transferred are compression-bonded. Then, after they have been compression-bonded and when the board F for pattern transfer is stripped, a plate 21 which is used to fix the board G to be transferred and to which the board G to be transferred has been fixed is supported in a free state so that an unreasonable force is not exerted when the board is stripped.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of separating a pattern transfer substrate in a transfer device, and in particular, after transferring a transfer pattern formed on the pattern transfer substrate to the transfer substrate, the pattern transfer substrate is transferred. The present invention relates to a method for peeling a pattern transfer substrate in a transfer device that efficiently peels the substrate.

[0002]

2. Description of the Related Art In the manufacture of wiring patterns for precision electronic parts, it is necessary to accurately form a fine pattern for forming an electric circuit or a device on a workpiece (eg, polyimide, glass substrate, silicon wafer).

In the production of this conductor circuit board, for example, a resist ink is directly printed on a work piece, or a print ink layer which blocks ultraviolet rays in a predetermined shape is printed on a work piece on which a photoresist layer is applied in advance. After that, a method of forming a fine pattern for an electric circuit or an element structure by adopting a printing method of exposing, developing, and then etching is considered.

Here, in order to accurately form a fine pattern such as an electric circuit by adopting the printing method, the adhesion strength between the material to be printed and the printing ink pattern is uniform, and
It is necessary to accurately align the printing pattern already formed on the printing medium with the printing ink pattern to be newly printed.

However, in the conventional so-called parallel plate type printing apparatus (transfer apparatus), the pattern transfer flat plate on which the printing ink pattern is formed and the printing medium (printing flat plate) are adhered to each other over the entire surface of both flat plates. Since it is carried out simultaneously over a period of time, local poor adhesion tends to occur, and it has been difficult to achieve uniform adhesive strength.

Further, generally, the alignment between the printing medium and the printing ink pattern is adjusted by performing preliminary printing in advance, and in order to transfer the printing ink pattern onto the printing medium when a good result is obtained, Even if the positional relationship between the material to be printed and the printing ink pattern is changed, it is customary to continue the operation as it is. Therefore, the alignment accuracy and the reproducibility of the printing ink pattern transferred onto the printing medium by the conventional printing device is limited to 20 to 30 μm, and is required for the conductive fine pattern of the thin film semiconductor device, for example. The level of alignment accuracy and its reproducibility was not reached.

Therefore, the applicant of the present application has previously proposed an "alignment transfer method" which solves such inconvenience (Japanese Patent Application No. 3-245574). In this proposal, the pattern transfer substrate is arranged to face the transfer substrate supporting plate supporting the transfer substrate with a predetermined gap, and the pattern is sequentially pressed onto the transfer substrate by a rotating roll to transfer the pattern. Is. By doing so, the inconvenience can be solved.

[0008]

However, in the above-mentioned proposal, there is provided a step of peeling the pattern transfer substrate from the transfer substrate after the pattern transfer, but the pattern transferred to the transfer substrate at this peeling step is provided. It was not possible to completely prevent the occurrence of "rubbing".

Therefore, the present invention has been made to solve the above problems, and when the pattern transfer substrate after pattern transfer is peeled from the transfer target substrate, the pattern after transfer causes "rubbing". It is an object of the present invention to provide a method for separating a post-transfer substrate in a transfer device that does not exist.

[0010]

In order to achieve the above-mentioned object, the present invention is characterized in that after a flexible pattern transfer substrate having a transfer pattern and a transfer target substrate are pressure-bonded to each other, In a method for peeling a substrate after transfer in a transfer device for peeling a transfer pattern by peeling from a substrate to be transferred, when the substrate for pattern transfer after pattern transfer is held and the substrate for pattern transfer is peeled from the substrate to be transferred. In addition, the transfer substrate fixing member to which the transfer substrate is fixed is supported in a free state and peeled off.

[0011]

The transfer target substrate is fixed to the transfer target substrate fixing member, and the pattern transfer substrate is pressed onto the fixed transfer target substrate to transfer the pattern. After pattern transfer, the pattern transfer substrate is peeled from the transfer substrate by holding one end of the pattern transfer substrate. Since the transfer substrate fixing member is supported in a free state at the time of this peeling. In addition, an unreasonable force is not applied at the time of peeling, and the pattern can be peeled without "rubbing".

[0012]

The present invention will be described below with reference to the illustrated embodiments. Embodiment FIG. 1 is an external perspective view of a transfer device 1 used in this embodiment.

As shown in FIG. 1, the transfer device 1 is of a vertical type, and includes a pedestal 2 and frame portions such as columns 3a and 3b erected on both sides of the front surface of the pedestal 2 and a center of an upper surface of the frame portion. A drive unit such as ball screws 4a and 4b arranged along the attached main motor 5 and the columns 3a and 3b and driven by the main motor, and flat plate clamps 9a and 9b that support the flat plate F for pattern transfer, A glass substrate fixing plate 21 for fixing the transferred substrate G and a pressure roll for vertically moving the pattern transfer flat plate F to the glass substrate G by the ball screws 4a and 4b and a peeling used for peeling after transfer. A roll unit 70 including a roll and the like, a work stage 50 that also serves as an optical observation system unit and an alignment unit arranged on the back surface of the glass substrate fixing plate 21, and a transfer Is constituted by a traction device 100 or the like used upon the release of the substrate.

Two side plates from both sides of the pedestal 2 (only the front side plate 3d is shown, and the rear side plate is not shown).
Are erected opposite each other. A support plate 3c is laterally provided at the tip ends of the two columns 3a and 3b, and a main motor 5 as a drive source is fixed to the back surface of the central portion of the support plate 3c. A gear box 6 for decelerating and relaying the output of the main motor 5 is fixed to the support plate 3c, and drive shafts 7a and 7b extend from the left and right side surfaces of the gear box 6, respectively. Gearboxes 8a, 8b for converting the driving force of the drive shafts downward by 90 ° are provided at the respective tip portions of the drive shafts 7a, 7b.

A ball screw 4a for vertically driving a roll portion 70, which will be described below, is arranged along the inner side surface of the support column 3a. The tip end of the ball screw 4a is screwed onto the drive shaft 7a by the gear box 8a. Have been combined. Similarly, a ball screw 4b is arranged along the pillar 3b,
The tip of the ball screw 4b is connected to the gear box 8b.
Is screwed onto the drive shaft 7b.

As shown in FIG. 2, the pattern transfer flat plate (hereinafter, referred to as a pattern substrate) F has a printing ink or a printing ink on a substrate F _{0 made} of a rectangular flexible metal thin plate, a resin sheet or the like. A pattern P such as an electric circuit is formed by plating or the like, and both ends under the flat plate have long support plates 11,
It is fixed to 11 by pins 12, 12 ... 12 protruding from it. A plurality of positioning marks M _p are printed near the pattern P on the pattern substrate F. At both ends of the support plate 11, the traction device 10 is provided.
Locking holes 11a and 11b are provided for locking when 0 is used.

A clamp portion 9a for sandwiching and fixing the support plate 11 of the pattern substrate F is provided on the front side surface of the support plate 3c.
Is provided. A rear plate and a front plate of the clamp portion 9a are rotatably connected at an upper portion and fixed to a frame. Then, the glass substrate fixing plate 21 described next
The other supporting plate 1 of the pattern substrate F is located below
A clamp portion 9b for sandwiching and fixing 1 is provided, and the clamp portion 9b is supported by the frame in a free state via a spring (not shown).

The glass substrate fixing plate 21 is a transfer device 1.
An observation optical system (not shown) for alignment is arranged on the rear surface of the fixed board 21. In addition, as shown in FIG.
As shown in Figure 2, two guide rails with a U-shaped cross section
01a and 101b are provided. The first to fourth rollers 102a to 10 are provided on the left and right side surfaces of the fixed plate 21.
2d are projected, and these rollers 102a to 102d are
The fixed plate 21 is engaged with the inner surfaces of the guide rails 101a and 101b, and the fixed plate 21 is guided by the guide rails 101a and 101b.
It is configured to move up and down along. Further, coil springs 103a and 103b each having one end fixed to a frame (not shown) are arranged on the upper and lower side surfaces of the fixed plate 21,
The fixed platen 21 is supported vertically in a free state.

The pulling device 100 includes a roller 107c, a roller 107c, and a guide rail 106a.
Tow bar 107 supported vertically by 107d
On the inner side surface of the tow bar 107, a hooking member 1 hooked in the hooking holes 11a and 11b of the pattern substrate F.
07a and 107b are attached.

Spacer stages 30a and 30b, which are alignment devices for aligning the glass substrate and the pattern substrate to face each other at a predetermined interval, are arranged above and below the glass substrate fixing plate 21. The spacer stages 30a and 30b are arranged in front and rear directions. It is configured to be adjustable in direction.

The roll section 70 includes a horizontally long rigid frame 80, a pressure roll 71 made of an elastic member used when the pattern substrate F is pressure-bonded to the glass substrate G, and a metal for preventing the pressure roll 71 from bending. A compression assisting roll 72 made of a member, a peeling roll 73 used for peeling after transfer, and the like are attached, and nuts 81a and 81b formed on the left and right of a frame 80 are the ball screws 4
The entire roll portion 70 is configured to be movable up and down by being screwed into a and 4b.

Next, the operation of the transfer device 1 configured as described above will be described with reference to FIGS. As shown in FIG. 4, when the initial setting is first performed, the roll unit 70 is located at the lowermost end as shown in FIG. 1, and the main motor 5 and the like are in an operable state (step S1). Next, the operator vacuum-holds and fixes the glass substrate F on the glass substrate fixing plate 21 (step S2), opens the upper and lower clamp portions 9a and 9b (step S3), and supports the pattern substrates F on the support plates 11 and 11. Is fixed to the clamp portions 9a and 9b (step S4). Next, by adjusting the protrusion amount of the upper and lower spacers 30a and 30b, the pattern substrate F and the glass substrate G are opposed to each other with a uniform alignment gap H (step S5, FIG. 5).
(A)). The pattern substrate F and the glass substrate G may be attached after adjusting the alignment gap in advance. next,
The pattern substrate F and the glass substrate G are aligned (aligned) (step S6).

After the pattern substrate F and the glass substrate G are aligned as described above, the lower ends of the pattern substrate F and the glass substrate G are maintained while maintaining the alignment gap H as shown in FIG. 5 (B). The portions are sandwiched by pressure-bonding rolls 71 and closely fixed, and as shown in FIG. 5C, the roll portion 70 is lifted to bring the pattern substrate F and the glass substrate G into close contact (step S7). The pressure bonding roll 71 is moved from the lower end portion to the upper end portion and locally pressed while the alignment gap H is maintained, whereby pressure bonding can be performed while achieving uniform adhesion strength.

Then, after the pattern substrate F and the glass substrate G are pressure-bonded as described above, the upper clamp portion 9a is opened (step S8), and an operator, as shown in FIG. 11a, 11b at the ends of the
(See FIG. 2), the traction member 107a of the traction device 100,
When 107b is hooked (step S9), the state shown in FIG.

Then, step S10 and step S11
6B, when the lowering of the peeling roll 73 of the roll unit 70 and the pulling of the pulling device 100 in the arrow X direction are synchronized, the pattern substrate F is peeled from the glass substrate G. . At the time of this peeling, since the glass substrate fixing plate 21 is supported by the springs 103a and 103b in a free state in the vertical direction, an unreasonable force is not applied to the pattern substrate F and the glass substrate G. The glass substrate G is peeled off without causing "rubbing" of the pattern, and as shown in FIG. 6C, the transfer pattern P is peeled off from the pattern substrate F and transferred to a predetermined position on the glass substrate G. Then, the lower clamp portion 9b is opened, and the pattern substrate F and the glass substrate G after the pattern transfer are removed from the transfer device 1 (step S12).

In this embodiment, as shown in FIG.
The glass substrate fixing plate 21 was supported at a substantially constant position while being supported in a vertically movable manner. However, as shown in FIGS. 7A to 7C, the pulling device 100 is moved leftward and the glass substrate fixing plate 21 is fixed. Even if the pattern substrate F and the glass substrate G are peeled off in synchronism with the upward movement of 21, it is possible to obtain the same effect as that of the present embodiment. Modified Example Although the above-described embodiment is a vertical type, this embodiment is a horizontal type.

As shown in FIG. 8 (A), the glass substrate fixing plate 21 is horizontally arranged, and the left and right side surfaces thereof are springs 110a,
It is supported in a free state by 110b. The glass substrate G is fixed on the glass substrate fixing plate 21, and the pattern substrate F which has already been pressure-bonded is placed on the glass substrate G. Both ends of the pattern substrate F are hooked on the tow bar 107A of the tow apparatus 100A. This tow bar 107A
Are horizontally supported in a free state.

When the towing device 100A is raised in this state, the two towing rods 107A move toward each other toward the center of the towing device 100A, as shown in FIGS. 8 (B) and 8 (C), and at the same time. The pattern substrate F and the glass substrate G are separated. Even in this case, the same effect as that of the above-described embodiment can be obtained. Other Modifications In the above modification, the case where both ends of the pattern substrate F are hooked and peeled is shown, but this modification is a case where one end of the pattern substrate F is hooked and peeled.

As shown in FIG. 9A, the pattern substrate F
Has one end hooked on the hook rod 107A. When the traction device 100B is lifted in this state, as shown in FIGS.
As shown in, the pattern substrate F is separated from the glass substrate G without causing "rubbing" of the pattern.

[0030]

As described in detail above, according to the present invention,
After transferring the pattern of the pattern transfer substrate to the transfer target substrate, when peeling, the transfer target substrate fixing plate that fixes the transfer target substrate is supported in a free state. A "rubbing" -free transfer can be performed without being added to the pattern.

[Brief description of drawings]

FIG. 1 is an external perspective view of a transfer device used in an embodiment of the present invention.

FIG. 2 is an external perspective view of a pattern board used in the embodiment.

FIG. 3 is a perspective view of a glass substrate fixing plate of the transfer device.

FIG. 4 is an operation flowchart in the embodiment.

FIG. 5 is a diagram explaining an operation process in the embodiment.

FIG. 6 is a diagram illustrating a peeling process in the operation process in FIG.

FIG. 7 is a diagram illustrating a modified example of the embodiment.

FIG. 8 is a diagram illustrating another modified example.

FIG. 9 is a diagram illustrating still another modification of the modification of FIG.

[Explanation of symbols]

F ... Pattern substrate (pattern transfer substrate) G ... Glass substrate (transfer target substrate) P ... Transfer pattern _Mp ... Pattern side alignment mark 1 ... Transfer device 4a, 4b ... Ball screw 5 ... Main motor 9a, 9b ... Clamp part 21 ... Glass substrate fixing board (transferred substrate fixing member) 30 ... Spacer stage 50 ... Work stage 70 ... Roll part 71 ... Pressing roll 73 ... Peeling roll 100 ... Traction device 101a-101d ... Guide rails 106a, 106b ... Guide rail 107 … Towbar

Claims (1)

[Claims] 1. A transfer in a transfer device in which a flexible pattern transfer substrate having a transfer pattern and a transfer target substrate are pressure-bonded and then the pattern transfer substrate is separated from the transfer target substrate to transfer the transfer pattern. In the subsequent substrate peeling method, when the pattern transfer substrate after pattern transfer is held and the pattern transfer substrate is peeled from the transfer substrate, the transfer substrate fixing member that fixes the transfer substrate is free. A method for peeling a substrate after transfer in a transfer device, characterized in that the substrate is peeled while being supported in a state.