JPH06216169A - Feeding device for semiconductor-chip to lead frame for manufacturing semiconductor component - Google Patents

Abstract

PURPOSE:To decrease the occurrences of defective products caused by the missing in alignment of semiconductor chips or the reversal of the semiconductor chip when a plurality of semiconductor chips in one line among many semiconductor chips, which are aligned in a checkerboard pattern with an aligning jig, is picked up and supplied to a plurality of lead terminals or land parts at the same time in a lead frame. CONSTITUTION:Alignment detecting means 6, 6a, 6b and 6c detect the semiconductor chips in the line, which is picked up with a collet head 7, among many semiconductor chips that are aligned with an alignment jig 4. A moving means moves the collet head 7 to the other line in the aligning jig in response to the defect signal of the semiconductor chip from the alignment detecting means. These means are provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame used for manufacturing a semiconductor component such as a diode or a transistor, and each lead terminal or land formed on the lead frame at a constant pitch along its longitudinal direction. The present invention relates to a device for supplying semiconductor chips one by one to a unit.

[0002]

2. Description of the Related Art Conventionally, when semiconductor chips are supplied one by one to each lead terminal or land portion in a lead frame, it is common to use a collet for picking up one semiconductor chip at a time. However, this product has a problem that the work efficiency is low because the semiconductor chips are picked up one by one and supplied.

Therefore, in order to improve work efficiency, the inventor of the present invention discloses, in Japanese Patent Laid-Open No. 4-137539, a large number of semiconductor chips in the lead frame on a side portion of a transfer path of the lead frame. Arrangement means arranged so as to be arranged in a grid pattern at the same pitch interval as each lead terminal or land portion, and one row parallel to the longitudinal direction of the lead frame among the large number of semiconductor chips arranged by this arrangement means A plurality of semiconductor chips arranged in a line are pitched up simultaneously by a collet head that reciprocates between the aligning means and the lead frame, and then a plurality of lead terminals or lands are formed on the lead frame. We proposed a feeder that feeds all at once.

[0004]

However, when a large number of semiconductor chips are aligned in a grid pattern by the aligning means, there is no semiconductor chip at a predetermined position or the semiconductor chips are turned upside down. It is something that occurs, in the state where there is no semiconductor chip in a predetermined place,
In other words, if the tooth gap is generated or the semiconductor chip is turned inside out, the semiconductor chip cannot be supplied to the lead terminal or the land portion of the lead frame corresponding to the tooth gap, and the lead frame In this case, a chip without a semiconductor chip will occur in each lead terminal or land portion in, or the semiconductor chip will be supplied in the reverse direction to each lead terminal or land portion in the lead frame, so that the semiconductor component is There was a problem that the defective product generation rate in manufacturing increased.

In the case where a collet head simultaneously picks up a plurality of semiconductor chips in one row among a large number of semiconductor chips arranged in a grid pattern by the aligning means, the plurality of semiconductor chips are also picked up. A pickup error occurs that a certain semiconductor chip cannot be picked up among the chips, and this pickup error also causes a chip without a semiconductor chip in each lead terminal or land portion in the lead frame. Therefore, the occurrence rate of defective products is further increased by the pickup error.

According to the present invention, a plurality of semiconductor chips in one row among a large number of semiconductor chips arranged in a grid pattern are simultaneously supplied to a plurality of lead terminals or lands of a lead frame. In this case, it is a first technical object to reduce the occurrence of defective products resulting from tooth gaps that occur when the semiconductor chips are aligned or inside-out of the semiconductor chips, and the second technical problem. In addition to the above-mentioned first technical problem, the problem is to reduce the occurrence of defective products due to a pickup error.

[0007]

To achieve this first technical object, the invention of claim 1 provides a lead frame in which lead terminals or lands are formed at a constant pitch along the longitudinal direction. A transfer path for transferring in the longitudinal direction, an aligning unit for aligning a large number of semiconductor chips in a grid pattern at the same pitch interval as the lead terminals or lands of the lead frame, and this aligning unit. A supply device comprising a collet head for picking up a plurality of semiconductor chips in a row parallel to the longitudinal direction of a lead frame among a plurality of semiconductor chips and supplying them to the lead frame all at once. , In a row picked up by the collet head among a large number of semiconductor chips aligned by the aligning means. Alignment detecting means for detecting each of the semiconductor chips, and transition means for displacing the collet head to another row in the aligning means in response to a defect signal of the semiconductor chip by the alignment detecting means. I made it up.

In order to achieve the second technical object, the invention of claim 2 is the same as that of the invention of claim 1, in which presence or absence of each semiconductor chip picked up by the collet head is checked. A pickup detecting means for detecting and a returning means for returning the collet head to the aligning means in response to a signal from the pickup detecting means indicating that there is no semiconductor chip are provided.

[0009]

[Operation] By configuring as in "claim 1," even one of the semiconductor chips in the row picked up by the collet head out of a large number of semiconductor chips aligned by the aligning means is missing, resulting in missing teeth. When
And if at least one semiconductor chip is turned over, or if there are many semiconductor chips that are chipped or turned over, the collet head, in accordance with the defective signal of the semiconductor chip by the alignment detection means, Without picking up each semiconductor chip in the row,
The transfer means transfers to another column, and picks up each semiconductor chip in this another column. That is, the collet head has all of the plurality of semiconductor chips to be picked up by the collet head, and the semiconductor chips are aligned in a constant direction, or is missing or turned over. Only when there are a few semiconductor chips, we will pick up each of these semiconductor chips all at once.
For each lead terminal or land in the lead frame,
It is possible to reliably reduce the occurrence of chipping of the semiconductor chip and the occurrence of reverse supply of the semiconductor chip due to missing teeth and turning over during the alignment.

According to the second aspect of the present invention, when a plurality of semiconductor chips are picked up by the collet head, one semiconductor chip or a large number of semiconductor chips among the semiconductor chips has a pick-up error. In this case, the collet head is returned to the aligning means by the returning means without moving in the direction of the lead frame in response to the signal from the pickup detecting means indicating that there is no semiconductor chip, and the pickup is repeated again. That is, since the collet head supplies each semiconductor chip to the lead frame only when a large number of semiconductor chips are picked up, each lead terminal or land portion in the lead frame is provided with a tooth at the time of alignment. It is possible to reliably reduce the occurrence of chipping of the semiconductor chip due to the omission and the pickup error.

[0011]

Therefore, according to the present invention, there is an effect that the rate of occurrence of defective products such as chipping of semiconductor chips can be greatly reduced when manufacturing semiconductor components using a lead frame.

[0012]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 shows a hoop-shaped lead frame A. The lead frame A is integrally provided with first lead terminals A ₁ at appropriate pitches P ₁ along the longitudinal direction.
A second lead terminal A ₂ paired with the first lead terminal A ₁ .
The second lead terminal A ₂ is connected to each of the first lead terminals A 2.
_In the area between _1, the narrow bar A _{6 is} attached to the section bar A ₅ which connects the side frames A ₃ and A ₄ to each other.
, So as to be integrally connected to each other, and while the lead frame A is being transferred along the longitudinal direction thereof as indicated by an arrow B ,. The tip of each second lead terminal A ₂ is bent into a stepped shape. ． The semiconductor chip A ₇ is die-bonded to the upper surface of the tip of each of the first lead terminals A ₁ . ． By reversing each of the second lead terminals A ₂ toward the first lead terminal A ₁ while twisting and deforming the narrow piece A ₆ as shown by the arrow C,
Each of the first lead terminals A ₁ and each of the second lead terminals A ₂ are stacked with the semiconductor chip A ₇ interposed therebetween. ． The tip portions of the two lead terminals A ₁ and A ₂ that are superposed on each other are packaged in a synthetic resin mold portion A ₈ and then separated from the lead frame A. As a result, a semiconductor component such as a diode is manufactured.

As shown in FIG. 2, the three hoop-shaped lead frames A, A ', A "formed as described above are arranged in parallel with each other at appropriate intervals W on the upper surface of the machine base 1. Along the upper surface of the support base 2 provided, as indicated by an arrow B, the support base 2 of the machine base 1 is configured to be intermittently transferred at intervals of an appropriate length L in the longitudinal direction thereof. At the side portions of the lead frames A, A ′, A ″, and the X direction parallel to the longitudinal direction of the lead frames A, A ′, A ″,
An XY table 3 is arranged so as to reciprocate in two directions, that is, the longitudinal direction of A ″ and the Y direction at a right angle.

Reference numeral 4 indicates an alignment jig which is placed on the upper surface of the XY table 3. This alignment jig 4
As shown in FIGS. 8 and 9, a state in which a base plate 4b and an alignment plate 4c are provided on the upper surface of an open top type box 4a, and a micromesh 4d in which a myriad of minute holes are formed between them is sandwiched therebetween. And an enclosing frame-like body 4e on the upper surface of the aligning plate 4c.
On the other hand, a plurality of aligning holes 4f having an inner diameter dimension in which only one semiconductor chip A ₇ is fitted are formed in the aligning plate 4c while being fixed by bolts or the like (not shown). a ', "the direction parallel to the longitudinal direction on the lead frame a of, a a', a" at the same pitch intervals P ₁ and each of the first lead terminal a ₁ in, the lead frames a, a ', a "of In the direction perpendicular to the longitudinal direction, an appropriate pitch interval P ₂ (however, this pitch interval P ₂ is an integer multiple of the P ₂ becomes equal to the interval W between the lead frames A, A ′, A ″). Are set in the above manner), and the base plate 4b is provided with a box 4a.
A through hole 4g communicating with the inside is provided at each of the alignment holes 4f in the alignment plate 4c, and the box 4a is further provided.
In addition, a vacuum suction through hole 4h to the vacuum pump 5 is provided.

Then, after supplying a large number of semiconductor chips A ₇ to the upper surface of the aligning plate 4c, the aligning jig 4 is vibrated in a state where the inside of the box 4a is vacuum-sucked, whereby The semiconductor chip A ₇ has an alignment plate 4c.
The semiconductor chips A ₇ are arranged in a checkered pattern so that the semiconductor chips A ₇ are fitted in the respective alignment holes 4 f in the above-mentioned manner one by one.

In this way, a large number of semiconductor chips A ₇
Are aligned with the alignment jig 4, the alignment jig 4
It is placed on the upper surface of the XY table 3. An alignment detection head 6 is disposed above the XY table 3, and the alignment detection head 6 is configured to move up and down by means such as a cylinder (not shown). , the lead frames a, a ', a plurality of probes 6a for abutment against each of the first lead frame a plurality of semiconductor chips to be supplied to the portion of the appropriate length L in a a ₇ of " And a plurality of probes 6b abutting on each of the plurality of semiconductor chips A ₇ supplied to the portion of the second lead frame A ′ having an appropriate length L,
A plurality of probes 6c abutting on each of the plurality of semiconductor chips A ₇ supplied to the portion of the third lead frame A ″ having an appropriate length L are provided.

Further, reference numeral 7 is constructed so as to reciprocate laterally above the XY table 3 and each lead frame A, A ', A ", and move up and down at both ends of the reciprocating motion. Showing the collet head,
On the lower surface of the collet head 7, a plurality of semiconductor chips A ₇ to be supplied to a portion of the lead frames A, A ′, A ″ having an appropriate length L in the first lead frame A _{7 are provided.}
A plurality of collets 7a that simultaneously vacuum-adsorb each of
A plurality of collets 7b for simultaneously vacuum-sucking each of the plurality of semiconductor chips A ₇ supplied to the portion of the second lead frame A ′ having an appropriate length L, and an portion of the third lead frame A ″ having an appropriate length L. At the same time each of the plurality of semiconductor chips a ₇ supplied to providing a plurality of collet 7c for vacuum suction.

Furthermore, the support base 2 and the XY table 3 are provided.
In the area between and, the presence / absence of a plurality of semiconductor chips A ₇ picked up by vacuum suction by the collets 7a, 7b, 7c of the collet head 7 is checked from the XY table 3 of the collet head 7 to the lead frame A. , A ′, A ″ is provided with pickup detecting means 8 for detecting during lateral movement.

In this structure, the alignment jig 4 on which the alignment of the large number of semiconductor chips A ₇ is completed is the XY table 3.
When placed on the upper surface of the alignment detection head 6, the alignment detection head 6 descends toward the alignment jig 4, so that each of the probes 6a, 6b, 6c on the lower surface of the alignment detection head 6 is aligned. Corresponding to each probe 6a, 6b, 6c by energizing each probe 6a, 6b, 6c in this state from the contact with the semiconductor chip A ₇ fitted in each alignment hole 4g in the jig 4 It is possible to check whether or not the semiconductor chip A ₇ is present at the position to be processed and whether or not each semiconductor chip A ₇ is turned upside down.

In this case, the alignment detecting head 6
Each probe 6a of the lower surface, 6b, when at least one of the semiconductor chips A ₇ of the semiconductor chip A ₇ is missing at the location in each of 6c, and Toka when inside out, or on whether inside out missing When there are a lot of semiconductor chips, the XY table 3 is moved in one or both of the X direction and the Y direction with the alignment detection head 6 slightly raised, and the detection operation is performed again. In each of the probes 6a, 6b, 6c of the alignment detection head 6, there is a semiconductor chip A _{7 at} all of the locations, and the semiconductor chips A ₇ are aligned in a constant direction, or Probe 6a,
The process is repeated until the number of semiconductor chips that are chipped or turned upside down in each of 6b and 6c is reduced.

Then, when the detection of the aligned semiconductor chips is completed in this way, the alignment detecting head 6 largely moves up, and the collet head 7 moves to this position and moves down to detect it. The plurality of semiconductor chips A ₇ are picked up all at once by vacuum suction by the collets 7a, 7b, 7c of the collet head 7.

The collet head 7 moves up when the above-mentioned pickup is performed, and then laterally moves to above the lead frames A, A ', A "to obtain the lead frames A, A', A. ”, The vacuum suction is released, and each lead frame A,
The semiconductor chips A ₇ are supplied all at once to each of the first lead terminals A ₁ in the portion of the appropriate length L in A ′ and A ″.

That is, the collet head 7 includes the collets 7a, 7b, 7c of the collet head 7.
Multiple semiconductor chips A to be picked up at
All ₇ is present, and, if the case where the semiconductor chips A ₇ are aligned in a direction at a constant, or only when the semiconductor chip A ₇ that is on whether inside out lacks small, the respective semiconductor chips A _{Since 7} will be picked up all at once, the lead frames A, A ', A "will have their respective first lead terminals A ₂ at the portions of appropriate length L caused by the missing teeth and turning over during the alignment. , Semiconductor chip A
_It is possible to reliably reduce the occurrence of chipping of _{7 and} the reverse supply of the semiconductor chip A ₇ .

The collet head 7 is connected to each lead.
Smell during lateral movement above the frames A, A ', A "
When passing the location of the pickup detection means 8,
Each collet 7a, 7b, 7 in the collet head 7
Semiconductor chip A picked up at c₇This
It is detected by the pickup detecting means 8 of. And this
By the detection by the pickup detecting means 8,
Of the collets 7a, 7b, 7c in the toe head 7
Semiconductor chip A in one collet ₇When there is a lack of
Or, for each collet 7a, 7b, 7c
Chip A that has been adsorbed by₇When the number of
The collet head 7 is the pickup detection hand.
Each lead according to the signal without the semiconductor chip by the stage 8
Figure without moving in the direction of frames A, A ', A "
In the direction of the alignment jig 4 by the returning means not shown.
Move back and repeat the above pickup.
It is done.

As a result, the collet head 7 is
Many semiconductor chips in each collet 7a, 7b, 7c of
A₇Only when you pick up the
Pu A ₇Is supplied to each lead frame A, A ', A "
Each lead frame A, A ′, A ″
Each first lead terminal A in₁At the time of the pickup
That the chip of the semiconductor chip may occur due to the mistake of
It can surely be reduced.

[Brief description of drawings]

FIG. 1 is a perspective view of a lead frame.

FIG. 2 is a plan view showing an embodiment of the present invention.

FIG. 3 is an enlarged side view taken along line III-III of FIG.

FIG. 4 is an enlarged sectional view taken along line IV-IV of FIG.

5 is a sectional view taken along line VV of FIG.

6 is an enlarged sectional view taken along line VI-VI of FIG.

7 is a sectional view taken along line VII-VII of FIG.

FIG. 8 is a perspective view of an alignment jig.

9 is an enlarged sectional view taken along line IX-IX of FIG.

[Explanation of symbols]

 A, A ', A "Lead frame 1 Machine stand 2 Lead frame support 3 XY table 4 Alignment jig 5 Vacuum pump 6 Alignment detection heads 6a, 6b, 6c Probe 7 Collet head 7a, 7b, 7c Collet 8 Pickup Detection means

Claims (2)

[Claims] 1. A transfer path for transferring a lead frame, which is formed by forming lead terminals or lands at a constant pitch along the longitudinal direction, in the longitudinal direction, and a large number of semiconductor chips. Aligning means arranged to be aligned in a grid pattern at the same pitch as the lead terminals or lands, and a plurality of semiconductor chips in the aligning means in at least one row parallel to the longitudinal direction of the lead frame. And a collet head adapted to simultaneously pick up the semiconductor chips and feed them to the lead frame, wherein the collet head picks up a large number of semiconductor chips aligned by the aligning means. Alignment detecting means for detecting each of the semiconductor chips in the row, and the alignment detecting means. Supplying apparatus for semiconductor chip to the semiconductor component manufacturing lead frame, characterized in that a transition section which is adapted to shift in a separate column in the alignment means the collet head according to defect signal of the semiconductor chip by means. 2. A pickup detecting means for detecting the presence or absence of each semiconductor chip picked up by the collet head, and the collet head returned to the aligning means in response to a signal indicating no semiconductor chip by the pickup detecting means. The device for supplying a semiconductor chip to a lead frame for manufacturing a semiconductor component according to claim 1, characterized in that the returning means is provided.