JPH06216020A - Substrate heat treatment device - Google Patents

Abstract

PURPOSE:To prevent heat dissipation from the side face of a substrate, and to obtain a heat-treatment device having excellent temperature distribution by providing a heat source, a heating platen provided with a conveying groove and a side plate, corresponding to the external shape of the substrate to be treated, with a conveying groove. CONSTITUTION:A heater 2 is properly arranged inside a hot plate 1, and the distribution of temperature is made uniform. The thickness 4 of a side plate 3 is made equal to or thicker than the thickness of a mask 9. Also, the side plate 3 is brought into contact with a hot plate 1 by its outer circumference only, and a spacer 6, having poor heat conduction, is inserted into the inner circumference. Also, the side plate 3 is fixed to the hot plate 1. The mask 9 is supported by hands 8a to 8d, it comes down from above a heat treatment device, the hands 8a to 8d enter turnout grooves 7a to 7d, and the mask 4 is placed on a hot plate 1a. When the baking operation is finished, the hands 8a to 8d move up, and the mask 9 is sucked up and taken out. Thus, the temperature distribution on the substrate is improved, and the distribution of the exposure sensitivity of the resist can be made uniform.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat treatment apparatus for baking or cooling a substrate coated with a resist in the process of manufacturing a mask for semiconductors and liquid crystal panels.

[0002]

2. Description of the Related Art As a mask, chromium is sputtered on a glass substrate, a resist is applied thereon, and then the mask is placed on a hot plate of a baking apparatus to evaporate a solvent contained in the resist.

After that, a pattern is selectively drawn by an electron beam drawing apparatus, followed by development, etching, and resist stripping to complete the process.

EBR-9 (trade name of Toray) is widely used as an electron beam resist. For this resist,
Since the exposure sensitivity of the resist changes depending on the in-plane temperature distribution of the mask during baking and subsequent cooling, the temperature distribution of the mask placed on the hot plate and the cooling plate must be uniform.

The size of the latest semiconductor mask is a square having a side of 150 mm and a thickness of 6.35 mm.

In the conventional method in which the mask is placed on the heating plate and baked, the thickness of the mask is large, so that the heat is largely dissipated from the side surface of the mask and the temperature of the outer periphery of the mask, especially the corner portion becomes low. There is a defect that.

FIG. 3 is a perspective view of a mask holder already devised to solve this defect.

The mask 21 is attached to the holder 20, and the mask 21 is moved together with the holder 20 and placed on the hot plate.
The heat dissipation from the side surface of the mask 21 is reduced.

However, this method has a drawback in that when a large number of masks are continuously baked, attachment and removal to and from the holder is complicated and automation is difficult.

In addition, since this method requires heating including the holder 20, the temperature of the hot plate easily changes,
In addition, a predetermined baking temperature (for EBR-9, 190
There is a defect that it takes a long time to reach (° C.).

Furthermore, this method has a defect that the load of the transfer robot becomes large because the mask is transferred together with the holder.

[0012]

SUMMARY OF THE INVENTION An object of the present invention is to provide a heat treatment apparatus which prevents heat from radiating from the side surface of the substrate and has a good temperature distribution.

It is another object of the present invention to provide a heat treatment apparatus which is small in size, has high production efficiency, and can be easily automated.

[0014]

The present invention is characterized in that it comprises a heat source, a hot plate having a transfer groove, and a side plate having a transfer groove and corresponding to the outer shape of a substrate to be processed.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to the drawings. Figure 1
(A) is a front view of the heat treatment apparatus of the first embodiment of the present invention,
FIG. 1B is a plan view.

The heater 2 is appropriately arranged inside the heating plate 1,
Make the temperature distribution uniform.

If the thickness 4 of the side plate 3 is equal to or thicker than the thickness of the mask 9, heat dissipation from the side surface of the mask 9 can be effectively reduced.

Further, by only contacting the outer periphery 5 of the side plate 3 with the heat plate 1 and sandwiching the spacer 6 having poor heat conduction on the inner periphery, for example, a fluororesin, the temperature change of the heat plate 1 is reduced and the temperature distribution is improved. can do.

Further, it is obvious that the present invention can be realized by removing the spacer 6 and forming a simple gap.

Further, since the side plate 3 is fixed to the hot plate 1 and remains at a high temperature, the temperature is stable. Reference numerals 7a to 7d are evacuation grooves into which a hand for conveying the mask is inserted. The groove width is 3 to 4 mm.

FIG. 2 shows a hand for carrying the mask. The mask 9 is supported by the hands 8a to 8d and descends from the top of the heat treatment apparatus, the hands 8a to 8d enter the evacuation grooves 7a to 7d, and eventually the mask 9 is placed on the hot plate 1. When the baking is completed, the hands 8a to 8d rise and the mask 9 is picked up and taken out.

FIG. 3 is a front view of the heat treatment apparatus of the second embodiment of the present invention. The spacer 10 having poor thermal conductivity is attached to the side plate 3
It adheres to the entire bottom surface of the to reduce the temperature change of the hot plate 1 due to the air flow. .

Further, in the above description, the case where the heat plate 1 has a rectangular shape has been described, but it is clear that the present invention can be realized in the same manner by making it a circular shape.

Further, in the above description, the heat source is the heater and the heat treatment apparatus for heating the substrate to be processed has been described. However, if low-temperature cooling water is used as the heat source, the temperature of the hot plate 1 becomes low and the substrate to be processed is cooled. Since it is cooled, the heat treatment apparatus can cool the substrate in exactly the same manner.

Further, in the above description, the case where the substrate is a mask has been described, but it is clear that the present invention can be realized in exactly the same manner as long as the substrate has a thickness of 1 mm or more.

[0026]

As described above, the present invention has the following effects.

The temperature distribution on the substrate is good and the exposure sensitivity distribution of the resist can be made uniform.

Further, it is possible to realize a heat treatment apparatus which is small in size, has high production efficiency, and can be easily automated.

[Brief description of drawings]

FIG. 1A is a front view of a substrate heat treatment apparatus according to a first embodiment of the present invention.

FIG. 1 (b) is a plan view of the substrate heat treatment apparatus of the first embodiment of the present invention.

FIG. 2 is a perspective view of a mask transfer hand of the substrate heat treatment apparatus according to the present invention.

FIG. 3 is a front view of a substrate heat treatment apparatus according to a second embodiment of the present invention.

FIG. 4 is a perspective view of a conventional mask holder.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Heat plate, 2 ... Heater, 3 ... Side plate, 4 ... Thickness, 5 ... Outer periphery, 6 ... Spacer, 7a-7d ... Evacuation groove, 8a-8d ...
Hand, 9 ... Mask, 10 ... Spacer, 20 ... Holder,
21 ... Mask.

Claims (5)

[Claims] 1. A heat treatment apparatus for baking or cooling a substrate coated with a resist, comprising a heat source, a hot plate having a transfer groove, and a side plate having a transfer groove and corresponding to the outer shape of the substrate to be processed. Characteristic substrate heat treatment equipment. 2. The substrate heat treatment apparatus according to claim 1, wherein a spacer having poor thermal conductivity is inserted between the side plate and the hot plate. 3. The substrate heat treatment apparatus according to claim 1, wherein the spacer is a fluororesin. 4. The substrate heat treatment apparatus according to claim 1, wherein the inner periphery of the side plate is not in contact with the hot plate. 5. The substrate heat treatment apparatus according to claim 1, wherein the thickness of the side plate is not smaller than the thickness of the substrate to be processed.