JPH0621271Y2 - 厚膜配線基板 - Google Patents
厚膜配線基板Info
- Publication number
- JPH0621271Y2 JPH0621271Y2 JP16480688U JP16480688U JPH0621271Y2 JP H0621271 Y2 JPH0621271 Y2 JP H0621271Y2 JP 16480688 U JP16480688 U JP 16480688U JP 16480688 U JP16480688 U JP 16480688U JP H0621271 Y2 JPH0621271 Y2 JP H0621271Y2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- thick film
- wiring board
- electrode
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 13
- 238000005476 soldering Methods 0.000 claims description 9
- 239000011810 insulating material Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP16480688U JPH0621271Y2 (ja) | 1988-12-19 | 1988-12-19 | 厚膜配線基板 | 
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP16480688U JPH0621271Y2 (ja) | 1988-12-19 | 1988-12-19 | 厚膜配線基板 | 
Publications (2)
| Publication Number | Publication Date | 
|---|---|
| JPH0284367U JPH0284367U (cs) | 1990-06-29 | 
| JPH0621271Y2 true JPH0621271Y2 (ja) | 1994-06-01 | 
Family
ID=31450726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| JP16480688U Expired - Lifetime JPH0621271Y2 (ja) | 1988-12-19 | 1988-12-19 | 厚膜配線基板 | 
Country Status (1)
| Country | Link | 
|---|---|
| JP (1) | JPH0621271Y2 (cs) | 
- 
        1988
        - 1988-12-19 JP JP16480688U patent/JPH0621271Y2/ja not_active Expired - Lifetime
 
Also Published As
| Publication number | Publication date | 
|---|---|
| JPH0284367U (cs) | 1990-06-29 | 
Similar Documents
| Publication | Publication Date | Title | 
|---|---|---|
| JPH0621271Y2 (ja) | 厚膜配線基板 | |
| JPH0258888A (ja) | 厚膜配線基板 | |
| JPH01171024U (cs) | ||
| JPS6417495A (en) | Double side soldering method | |
| JP2926982B2 (ja) | スルーホールの形成方法 | |
| JPH0730656Y2 (ja) | オゾン発生用放電体 | |
| JPS5852701Y2 (ja) | 厚膜混成集積回路 | |
| JP2643450B2 (ja) | スルーホール導体形成方法 | |
| JPH0355893A (ja) | 両面配線板 | |
| JPS6221298A (ja) | チツプ形電子部品の実装方法 | |
| JPH0612623Y2 (ja) | チツプジヤンパ | |
| JPH062243Y2 (ja) | チツプ抵抗 | |
| JPH0195595A (ja) | セラミック基板へのピン立設方法 | |
| JPH0193721U (cs) | ||
| JPH0636918Y2 (ja) | ペースト印刷用マスク | |
| JPH04126416U (ja) | 周波数調整用マスク | |
| JPS58219702A (ja) | チツプ抵抗器の製造方法 | |
| JPH0272690A (ja) | 厚膜回路印刷基板 | |
| JPS6457795A (en) | Manufacture of thick film circuit device | |
| JPH01189194A (ja) | 混成集積回路スルーホール形成方法 | |
| JPH0359674U (cs) | ||
| JPH0669061A (ja) | 表面実装部品 | |
| JPH0513903A (ja) | メタルコア基板及びその製造方法 | |
| JPH0548257A (ja) | プリント基板の製造方法 | |
| JPH0738242A (ja) | プリント基板 | 
Legal Events
| Date | Code | Title | Description | 
|---|---|---|---|
| EXPY | Cancellation because of completion of term |