JPH062126A - Method for joining target material for sputtering - Google Patents

Abstract

PURPOSE:To easily braze a target material to a cooling member hard to braze by vapor-depositing Ti-Pt-Au on both the target material and the cooling member before brazing. CONSTITUTION:Vapor-deposited films 2 of Ti-Pt-Au are formed on a target material 1 and a cooling member 4 made of stainless steel to modify the surfaces. A brazing filler metal 3 is interposed between the target material 1 and the cooling member 4 and brazing is carried out by heating and cooling to obtain a target material for sputtering with a formed tough intermetallic compd. not causing exfoliation. The Au in the outermost surfaces of the modified target material 1 and the modified cooling member 4 is easily wettable even with In-contg. solder and easy brazing is attained.

Description

Detailed Description of the Invention

[0001]

The present invention relates to a target material and SUS.
And a cooling member, which is a difficult-to-join material, are brazed together.

[0002]

2. Description of the Related Art Conventionally, as disclosed in Japanese Patent Application No. 3-177964, a cooling member is generally made of copper, which has good thermal conductivity. It has the property of getting wet easily. Therefore, it is necessary to consider joining only when the target is a difficult-to-join material.

Further, the coefficient of thermal expansion of copper and the target material is
Since they are different, JP-A 1-262088 and JP-A 1-262089
As disclosed in Japanese Patent Application Laid-Open No. 2-11759, the warpage caused by the difference between the thermal expansion and the heating of the target material and the cooling member at the same shrinkage amount in the cooling process of the brazing, Brazing is performed while giving a warp according to the amount of warp in the direction.

However, it is practically difficult to control the temperature and to give a proper warp in the opposite direction.

The object of the present invention is to bond not only copper, but also a cooling member including SUS material which is a more difficult material than copper.

[0006]

It is customary to bond a sputtering target material to a cooling member made of copper or a copper alloy, mount it on a sputtering apparatus, and cool it with water before use. However, in some devices, stainless steel may be used as the cooling member instead of copper.

[0007] Generally, most brazing filler metals are hard to get wet with stainless steel, and joining is difficult. Also, the brazing filler metal does not spread by wetting unless a special flux is used. However, when it is used for a sputtering target used in a high vacuum state, there is a problem that harmful gas is generated and it cannot be applied in practice.

An object of the present invention is to provide a joining method applicable to difficult-to-join materials such as SUS materials.

[0009]

Generally, for SUS materials which are difficult to join, Ti- which is applied to ceramics as well.
Pt-Au is vapor-deposited to modify the surface.

According to this method, since no special flux is used, no harmful gas is generated even in a high vacuum state.

Further, similar Ti-Pt-Au vapor deposition is also performed on the target material to be joined to modify the surface. The Au on the outermost surface is very easily wetted by the In-based solder and can be easily joined.

[0012]

[Function] The SUS material and the target material, which are difficult to be wet with the brazing material, are easily wet with any brazing material, Ti-Pt-Au
The vapor-deposited film is formed to improve the surface and facilitate brazing.

[0013]

[Examples] When vapor deposition was carried out on a SUS TP material with Ti / Pt / Au vapor deposition film thickness of 0.1μ / 0.2μ / 0.2μ, the adhesive strength was confirmed by a tape peeling test.
No peeling was observed at all.

Similarly, Ti / Pt / Au was vapor-deposited on a 20TP material of a permalloy (Ni-Fe) target, and a tape peeling test was carried out.
It was not recognized at all.

As a result of the preliminary test, it was confirmed that there was no problem in vapor deposition property and adhesive strength to SUS and permalloy.

Next, φ130 / φ70 × 12tSUS3
04 cooling member and φ240 × 6t permalloy (Ni-F
e) The target was joined.

Since the SUS304 cooling member has a ring shape, a mask is prepared so that vapor deposition is performed only on the bonding surface, and Ti / Pt / Au is added to each of 0.1 / 0.2 / 0.2.
A vapor-deposited film was formed with a film thickness of μm 2.

Next, a vapor deposition mask is also formed on the target, and Ti / Pt / is formed only on the joint surface between the target and SUS.
Au was vapor-deposited with the same film thickness.

On the bonding surface of the target after vapor deposition, I
An n solder foil is placed, the target material is heated to 180 to 200 ° C., and molten In solder is spread thinly on the entire surface of the bonding surface.

Similarly, In solder is applied also to the SUS cooling member.

Next, the vapor deposition and the In solder application were laminated without any deviation, and a weight of about 10 kg was placed thereon, and the ambient temperature was 2
Put it in a furnace at 00 to 230 ° C. and hold it for about 30 minutes.

As a result of joining in this way, peeling
It was possible to join without deformation.

As a result of the radiation inspection of the joined product, the area ratio of the joined portion was 95% or more, which was good. Up to now, it was possible to easily join the SUS material and the target material, which were difficult to join, without using a special jig or tool.

[0024]

According to the present invention, by performing Ti / Pt / Au vapor deposition on both, a difficult-to-join material can be easily formed, and it can be attached to a sputtering apparatus using stainless as a cooling member.

Even in the target material, the Co-based target is
Although it is a difficult material to bond, it can be easily bonded by using this method.

[Brief description of drawings]

FIG. 1 is an explanatory view showing a laminated state of each member before joining according to an embodiment of the present invention.

[Explanation of symbols]

1 ... Target material, 2 ... Ti / Pt / Au vapor deposition film, 3 ...
Brazing material 4, cooling member.

Claims (3)

[Claims] 1. A method of joining a sputtering target material, wherein a brazing material is interposed between a target material and a cooling member made of stainless steel such as SUS to heat and cool the same to perform brazing to join the target material and the cooling member. A method of joining a sputtering target material, which comprises vapor-depositing to enable the joining of a difficult-to-join material such as stainless steel and a target. 2. The method according to claim 1, wherein Ti—Pt—Au is vapor-deposited on stainless steel which is a difficult-to-join material, and the target material is also treated in the same manner, and there is no peeling through a brazing material. A method for joining sputtering target materials, which forms a strong intermetallic compound. 3. The method according to claim 1 or 2, wherein when the target material is a Co-based difficult-to-join material, the same vapor deposition is carried out, and the target material is placed between the target material and copper or a difficult-to-join stainless steel cooling member. A method for joining sputtering target materials, which forms a strong intermetallic compound through the materials.